KR101223958B1 - Led module combined with rod lens - Google Patents

Led module combined with rod lens Download PDF

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Publication number
KR101223958B1
KR101223958B1 KR1020110099908A KR20110099908A KR101223958B1 KR 101223958 B1 KR101223958 B1 KR 101223958B1 KR 1020110099908 A KR1020110099908 A KR 1020110099908A KR 20110099908 A KR20110099908 A KR 20110099908A KR 101223958 B1 KR101223958 B1 KR 101223958B1
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South Korea
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light
rod lens
led
coupled
lens
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KR1020110099908A
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Korean (ko)
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원철희
안효대
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원철희
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/008—Combination of two or more successive refractors along an optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/043—Refractors for light sources of lens shape the lens having cylindrical faces, e.g. rod lenses, toric lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: An LED module combined with a rod lens is provided to use linear beam in a scan method and to apply it to a large area. CONSTITUTION: A case includes an opening part for releasing light. An irradiation part irradiates the light of an UV LED to the opening part. A rod lens(170) is formed between the opening part and the irradiation part. The rod lens releases the light irradiated in the irradiation part to the opening part. A fixing member(180) fixes the rod lens.

Description

Ｒｏｄ렌즈가 결합된 ＬＥＤ조사모듈{LED MODULE COMBINED WITH ROD LENS}LED irradiation module with combined lens {LED MODULE COMBINED WITH ROD LENS}

본 발명은 Rod(봉)렌즈가 결합된 ＬＥＤ조사모듈에 관한 것으로, 보다 상세하게는 LED칩에서 발광되는 UV가 반구렌즈를 통과하면서 편광이 되고 Rod렌즈를 통해 집광이 되어 단위 조사 면적 당 조사 강도가 균일한 선형 빔(Linear Beam)이 피조사물에 조사되도록 하는 Rod렌즈가 결합된 LED조사모듈에 관한 것이다.
The present invention relates to an LED irradiation module in which a rod (rod) lens is combined. More specifically, UV light emitted from an LED chip is polarized while passing through a hemisphere lens and is focused through a rod lens, thereby irradiating intensity per unit irradiation area. The present invention relates to an LED irradiation module in which a rod lens is coupled so that a uniform linear beam is irradiated onto an irradiated object.

본 발명은 Rod(봉)렌즈가 결합된 LED조사모듈에 관한 것이다.The present invention relates to an LED irradiation module in which a rod (rod) lens is coupled.

기존의 UV LED경화장치의 LED 조사모듈은 LED칩에서 발광되는 UV를 집광하는 것 없이 그대로 피조사물에 조사하는 방식으로 램프식 경화기와 같이 UV확산에 따른 별도의 대책이 필요했으며, UV 수지 경화에 필요한 조사강도가 기대 이하이거나 요구되는 조사강도가 출력이 되더라도 빛을 집광해 피조사물을 향해 조사하기가 어려웠다.The LED irradiation module of the existing UV LED curing device is irradiated to the irradiated object without condensing the UV emitted from the LED chip. Therefore, a separate countermeasure according to the UV diffusion, such as a lamp curing machine, was needed. Even if the required irradiation intensity was less than expected or the required irradiation intensity was output, it was difficult to condense the light and irradiate it toward the subject.

따라서, LED 빛의 분산을 막고 조사강도를 최대로 원하는 범위에만 조사를 할 수 있는 기술이 필요했다.
Therefore, there was a need for a technology that prevents the dispersion of LED light and irradiates only to the desired range with the highest irradiation intensity.

상술한 바와 같은 문제점을 해결하기 위해 안출된 본 발명의 목적은, 다수의 UV LED가 Rod 렌즈의 외주면에 타원형상의 빛이 일부 중첩되며 조사되도록 이격 설치되고, 타원형상의 빛이 Rod렌즈를 통과하며 장타원형상 빛으로 피조사물에 조사되되, 장타원형상 빛의 일부가 중첩되어 빛의 강도가 일정한 선형 빔(Linear Beam)으로 피조사부에 조사됨으로써, 분산되는 UV를 집광시킬 수 있으며, 종래의 조사강도보다 10배 이상으로 강도가 높은 UV를 원하는 특정부분에만 자외선을 조사할 수 있는 Rod렌즈가 결합된 LED조사모듈을 제공하기 위함이다.An object of the present invention devised to solve the problems as described above, a plurality of UV LED is installed to be spaced apart so that the light of the elliptical shape overlaps with the outer peripheral surface of the rod lens, and the elliptical light passes through the rod lens It is irradiated to the irradiated object with elliptical light, and a part of the long elliptical light is overlapped and irradiated to the irradiated part with a linear beam having a constant light intensity, thereby condensing the dispersed UV, and the conventional irradiation intensity This is to provide an LED irradiation module combined with a rod lens that can irradiate ultraviolet rays only to a specific part that wants UV with a strength of 10 times higher.

또한, 본 발명의 다른 목적은, LED조사모듈과 Rod렌즈의 간격차이를 이용하여 빔의 크기(Beam Size)를 달리할 수 있으며 선형 빔(Linear Beam)으로 스캔 방식 조사를 이용해 경화 면적이 넓은 제품도 경화할 수 있는 Rod렌즈가 결합된 LED조사모듈을 제공하기 위함이다. In addition, another object of the present invention, by varying the beam size (Beam Size) by using the gap between the LED irradiation module and the rod lens (Linear Beam) by using a scan method irradiation with a linear beam wide product hardened area In order to provide a LED irradiation module combined with a rod lens that can be cured.

상기한 바와 같은 목적을 달성하기 위한 본 발명의 특징에 따르면, 본 발명은 Rod렌즈가 결합된 LED조사모듈에 있어서, 빛이 방출되는 개구부가 형성된 케이스; 상기 케이스 내부에 다수의 UV LED의 빛이 상기 개구부를 향하여 조사 가능하게 결합된 조사부와; 상기 개구부와 조사부의 사이에 결합되되, 상기 조사부에서 조사되는 빛이 일측 외주면에 조사되면 상기 빛을 집광하여 상기 개구부로 방출하는 원기둥 형상의 Rod렌즈; 및 상기 Rod 렌즈를 양측에서 고정하는 고정부재;를 포함하고, 다수의 상기 UV LED는, 각각 빛을 방출하되, 상기 Rod 렌즈의 외주면에 타원형상의 빛이 일부가 중첩되며 조사되도록 이격 설치되고, 상기 Rod 렌즈는, 상기 각각의 타원형상 빛을 집광하여 상기 개구부로 장타원형상 빛으로 각각 방출하되, 방출되는 장타원형상 빛의 일부가 중첩되어 상기 방출하는 빛의 강도가 일정한 선형 빛으로 피조사부에 조사되는 것을 특징으로 하고, 상기 조사부는, LED가 내장된 LED칩; 상기 LED칩의 하부에 부착되는 기판; 상기 LED칩의 하측 일부와 접촉되게 돌출부가 형성되고, 상기 돌출부 양측에 상기 기판이 안착되되, 상기 돌출부가 기판의 크기와 동일한 높이로 돌출된 받침부; 상기 LED칩의 상측에 결합되어 상기 LED의 빛 확산을 억제하며 집광시켜 조사되도록 하는 반구형상의 반구렌즈; 및 상기 반구렌즈가 삽입되어 고정되도록 고정공이 형성되며, 체결볼트로 상기 받침부와 체결되는 커버;를 포함하고, 상기 LED칩은, 상기 돌출부의 길이방향을 따라 일정간격 이격되어 다수개가 결합되고, 상기 받침부는, 상기 커버보다 열전도율이 높은 재료인 것을 특징으로 하며, 상기 돌출부는, 다수의 상기 LED칩을 각각 분리하며, 상기 LED칩의 양측 벽에 접촉되는 분리벽이 형성된 것을 특징으로 한다.According to a feature of the present invention for achieving the above object, the present invention provides a LED irradiation module coupled to the rod lens, the case is formed with an opening for emitting light; An irradiator coupled to the plurality of UV LED lights in the case so as to be irradiated toward the opening; A rod-shaped rod lens coupled between the opening and the irradiator, and configured to condense the light and emit it to the opening when the light irradiated from the irradiator is irradiated on one outer circumferential surface; And a fixing member for fixing the rod lens at both sides, wherein the plurality of UV LEDs emit light, respectively, and are disposed to be spaced apart so that a part of the elliptical light is overlapped and irradiated on the outer circumferential surface of the rod lens. The rod lens collects each of the elliptical lights and emits the elliptical lights to the openings, respectively, and a portion of the emitted elliptical lights overlaps the linear light with a constant intensity of the emitted light. Characterized in that the irradiation, the irradiation unit, LED chip built-in LED; A substrate attached to a lower portion of the LED chip; A protruding portion is formed to be in contact with a lower portion of the LED chip, and the support portion is mounted on both sides of the protruding portion, and the protruding portion protrudes at the same height as the size of the substrate; A hemispherical hemispherical lens coupled to an upper side of the LED chip to suppress light diffusion of the LED and to focus the irradiated light; And a fixing hole formed so that the hemisphere lens is inserted into and fixed to the hemisphere lens, and the cover is fastened to the support part by a fastening bolt. The LED chips are spaced apart at regular intervals along the length direction of the protrusion part, and a plurality of them are coupled thereto. The support portion is characterized in that the material having a higher thermal conductivity than the cover, wherein the projection portion is characterized in that separating the plurality of the LED chip, respectively, the partition wall is formed in contact with both walls of the LED chip.

또한, 상기 Rod 렌즈는, 일측 외주면에 조사되는 타원형상 빛의 확산을 억제하며 Rod 렌즈의 타측 외주면까지 집광시키며 직선으로 통과시키고, 상기 Rod 렌즈를 통과한 빛이 Rod 렌즈의 타측 외주면에서 방출될 때, 상기 Rod 렌즈의 길이방향으로 장축을 갖는 장타원형상 빛을 방출하는 것을 특징으로 한다.In addition, the rod lens, while suppressing the diffusion of the elliptical light irradiated to one outer peripheral surface and condenses to the other outer peripheral surface of the rod lens and passes in a straight line, when the light passing through the rod lens is emitted from the other outer peripheral surface of the rod lens , And emits an elliptic light having a long axis in the longitudinal direction of the rod lens.

또한, 상기 선형 빛은, 상기 Rod 렌즈가 방출하는 다수의 장타원형상 빛의 일부가 중첩될 때, 서로 다른 장타원형상 빛의 장축방향 단부끼리 중첩되어 상기 Rod 렌즈의 길이방향으로 빛의 강도가 일정한 선형상으로 피조사부에 조사되는 것을 특징으로 한다.In addition, the linear light, when a part of a plurality of long elliptic light emitted by the rod lens overlap, the long-axis end of the different long elliptic light overlap each other and the intensity of light in the longitudinal direction of the rod lens The irradiated portion is irradiated to a certain linear shape.

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또한, 상기 받침부는, 구리(Cu)이고, 상기 커버는, 알루미늄(Al)인 것을 특징으로 한다.Moreover, the said support part is copper (Cu), The said cover is characterized by being aluminum (Al).

또한, 상기 반구렌즈는, 상기 LED칩의 상측에 결합되되, 다수개의 LED칩에 대응되게 결합되는 것을 특징으로 한다.
In addition, the hemispherical lens is coupled to the image side of the LED chip, it characterized in that coupled to the plurality of LED chips.

이상 살펴본 바와 같은 본 발명에 따르면, 다수의 UV LED가 타원형상의 UV가 일부 중첩되어 조사되도록 이격 설치되고, 타원형상의 UV가 Rod 렌즈를 통과하며 선형타입의 빛으로 피조사물에 조사되되, 장타원형상 빛의 일부가 중첩되어 단위 조사 범위 당 조사강도가 균일한 선형 빛으로 피조사부에 조사됨으로써, 분산되는 LED의 빛을 집광시킬 수 있으며, 종래의 조사강도보다 10배 이상으로 높은 강도의 UV를 원하는 부위에 균일하게 조사할 수 있는 Rod렌즈가 결합된 LED조사모듈을 제공할 수 있다.According to the present invention as described above, a plurality of UV LED is installed to be spaced apart so that the UV of the elliptical part overlaps, the elliptical UV passes through the rod lens and is irradiated to the irradiated object with a linear type of light, long oval shape Part of the light is superimposed and irradiated to the irradiated part with a uniform linear light with a uniform irradiation intensity per unit irradiation range, and it is possible to focus the light of the dispersed LED, and wants a high intensity UV of 10 times or more than the conventional irradiation intensity It is possible to provide an LED irradiation module coupled to the rod lens that can be irradiated uniformly to the site.

또한, 본 발명의 다른 목적은, LED조사모듈과 Rod렌즈의 간격차이를 이용하여 빔의 크기(Beam Size)를 달리할 수 있으며 선형 빔(Linear Beam)으로 스캔 방식 조사를 이용해 경화 면적이 넓은 제품도 경화할 수 있는 Rod렌즈가 결합된 LED조사모듈을 제공할 수 있다.
In addition, another object of the present invention, by varying the beam size (Beam Size) by using the gap between the LED irradiation module and the rod lens (Linear Beam) by using a scan method irradiation with a linear beam wide product hardened area It is also possible to provide an LED irradiation module coupled to the rod lens that can be cured.

도 1은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 사시도,
도 2는 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 내부를 나타낸 사시도,
도 3은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 분해 사시도,
도 4 및 도 5는 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 측면 단면도,
도 6 및 도 7은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 빛이 피조사물에 조사되는 것을 나타낸 도면,
도 8은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 실험결과를 나타낸 그래프이다.1 is a perspective view showing an LED irradiation module coupled to a rod lens according to an embodiment of the present invention,
Figure 2 is a perspective view showing the inside of the LED irradiation module coupled to the rod lens according to a preferred embodiment of the present invention,
3 is an exploded perspective view showing an LED irradiation module coupled to a rod lens according to an embodiment of the present invention;
4 and 5 are side cross-sectional views showing an LED irradiation module coupled to a rod lens according to an embodiment of the present invention;
6 and 7 is a view showing that the light irradiated to the irradiated object of the LED irradiation module coupled to the rod lens according to a preferred embodiment of the present invention,
8 is a graph showing the experimental results of the LED irradiation module coupled to the rod lens according to an embodiment of the present invention.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.Advantages and features of the present invention, and methods of achieving the same will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

이하, 본 발명의 실시예들에 의하여 Rod렌즈가 결합된 LED조사모듈을 설명하기 위한 도면들을 참고하여 본 발명에 대해 설명하도록 한다.Hereinafter, the present invention will be described with reference to the drawings for explaining an LED irradiation module in which a rod lens is coupled by embodiments of the present invention.

도 1은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 사시도, 도 2는 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 내부를 나타낸 사시도, 도 3은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 분해 사시도, 도 4 및 도 5는 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈을 나타낸 측면 단면도, 도 6 및 도 7은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 빛이 피조사물에 조사되는 것을 나타낸 도면, 도 8은 본 발명의 바람직한 실시예에 따른 Rod렌즈가 결합된 LED조사모듈의 실험결과를 나타낸 그래프이다.1 is a perspective view showing an LED irradiation module coupled to a rod lens according to a preferred embodiment of the present invention, Figure 2 is a perspective view showing the inside of the LED irradiation module coupled to a rod lens according to a preferred embodiment of the present invention, Figure 3 Is an exploded perspective view showing an LED irradiation module coupled to a rod lens according to a preferred embodiment of the present invention, Figures 4 and 5 are side cross-sectional view showing an LED irradiation module coupled to a rod lens according to a preferred embodiment of the present invention, 6 and 7 is a view showing that the light of the LED irradiation module coupled to the rod lens according to a preferred embodiment of the present invention to the irradiated object, Figure 8 is a LED combined with a rod lens according to a preferred embodiment of the present invention This graph shows the experimental results of the survey module.

본 발명에 따른 Rod렌즈가 결합된 LED조사모듈(200)은 케이스(200), 조사부(100), Rod(봉) 렌즈(170) 및 고정부재(180)를 포함한다.The LED irradiation module 200 coupled with the rod lens according to the present invention includes a case 200, the irradiation unit 100, the rod (rod) lens 170 and the fixing member 180.

케이스(200)는, 빛이 방출되는 개구부(220)가 형성되며, 내부에 후술할 조사부(100)와 Rod 렌즈(170) 및 고정부재(180)가 설치된다.The case 200 has an opening 220 through which light is emitted, and an irradiation part 100, a rod lens 170, and a fixing member 180 to be described later are installed therein.

또한, 조사부(100)는 케이스(200) 내부에 다수의 UV LED의 빛이 개구부(220)를 향하여 조사 가능하게 결합된다.In addition, the irradiation unit 100 is coupled to the irradiation of the plurality of UV LED light toward the opening 220 in the case 200.

조사부(100)는 LED칩(110), 기판(120), 받침부(130), 반구렌즈(140), 커버(150)를 포함한다.The irradiation part 100 includes an LED chip 110, a substrate 120, a support part 130, a hemisphere lens 140, and a cover 150.

먼저, 도 2 및 도 3을 참조하면, LED칩(110)은 UV LED(112)가 내장된 칩이다.First, referring to FIGS. 2 and 3, the LED chip 110 is a chip in which the UV LEDs 112 are embedded.

UV(Ultraviolet, 자외선) LED는 자외선을 방출하는 LED이다.UV (Ultraviolet) LEDs emit ultraviolet light.

기판(120)은 LED칩(110)의 하부에 부착된다.The substrate 120 is attached to the lower portion of the LED chip 110.

또한, 기판(120)은 외부로부터 전원을 공급받아, 공급받은 전원을 LED칩(110)에 공급하고, UV-LED 경화장치의 제어신호에 따라 제어된다.In addition, the substrate 120 receives power from the outside, supplies the supplied power to the LED chip 110, and is controlled according to a control signal of the UV-LED curing apparatus.

받침부(130)는, 상측에 LED칩(110)과 기판(120)이 결합된다.Support portion 130, the LED chip 110 and the substrate 120 is coupled to the upper side.

즉, 도 4 및 도 5를 참조하면, 받침부(130)는 LED칩(110)의 하측 면과 일부만 접촉되게 돌출되어 형성되는 돌출부(132)가 형성되고, 돌출부(132)의 양쪽에 기판(120)이 안착되며, 받침부(130)와 기판(120)에 LED칩(110)이 결합된다. 또한, LED칩(110), 기판(120) 및 받침부(130)가 서로 결합되는 순서는 상술한 것과 같이 한정하지 않는다.That is, referring to FIGS. 4 and 5, the supporting part 130 is formed with a protrusion 132 formed to protrude so as to contact only a portion of the lower surface of the LED chip 110, and the substrates (both on both sides of the protrusion 132). 120 is seated, the LED chip 110 is coupled to the support 130 and the substrate 120. In addition, the order in which the LED chip 110, the substrate 120, and the support 130 are coupled to each other is not limited as described above.

특히, 돌출부(132)는 양쪽에 결합된 기판(120)의 크기와 동일한 높이로 돌출된다. 이것은 LED칩(110)이 돌출부(132)의 상측 면과 기판(120)의 상측 면에 결합될 때, 수평을 유지하며 결합될 수 있도록 하기 위한 것이며, 수평을 유지하며 LED칩(110)에서 빛이 조사되어 안정적이다.In particular, the protrusion 132 protrudes to the same height as the size of the substrate 120 coupled to both sides. This is to ensure that when the LED chip 110 is coupled to the upper surface of the protrusion 132 and the upper surface of the substrate 120, the LED chip 110 can be coupled while maintaining the horizontal, the light is maintained in the LED chip 110 It is investigated and stable.

또한, LED칩(110)은 돌출부(132)의 길이방향을 따라 일정간격 이격되어 다수개가 결합된다.In addition, the LED chip 110 is spaced apart at regular intervals along the longitudinal direction of the protrusion 132 is coupled to a plurality.

그리고, 다수의 LED칩 즉, 다수의 UV LED는 각각 빛을 방출하되, Rod 렌즈(170)의 외주면에 타원형상의 빛이 일부가 중첩되며 조사되도록 이격 설치된다.(도 6 및 도 7의 Overlay 1 부분 참조)In addition, a plurality of LED chips, that is, a plurality of UV LEDs respectively emit light, and are installed to be spaced apart so that a portion of the elliptical light overlaps and is irradiated on the outer circumferential surface of the rod lens 170. (Overlay 1 of FIGS. 6 and 7) See)

한편, 돌출부(132)는 다수의 LED칩(110) 각각을 분리하며, LED칩(110)의 양측 벽에 접촉될 수 있도록 분리벽(134)이 돌출되어 형성된다.Meanwhile, the protrusion 132 separates each of the plurality of LED chips 110 and is formed by protruding the separation wall 134 so as to contact both walls of the LED chip 110.

즉, 분리벽(134)은 LED칩(110)이 작동하면서 발생되는 열을 용이하게 냉각시키기 위해서 받침부(130)와 접촉면적을 최대한 넓히기 위한 것이다.That is, the dividing wall 134 is to widen the contact area with the support 130 to the maximum in order to easily cool the heat generated while the LED chip 110 operates.

또한, 반구렌즈(140)는 LED칩(110)의 상측에 결합되어 LED 빛의 확산을 억제하며 집광시켜 조사되도록 하며, 반구형상으로 형성한다.In addition, the hemispherical lens 140 is coupled to the image side of the LED chip 110 to suppress the diffusion of the LED light to focus and irradiate, it is formed in a hemispherical shape.

또한, 반구렌즈(140)는 LED 빛의 확산을 억제하되, 반구렌즈(140)의 상측 면에 LED 빛이 집광되어 외부로 최대한 직선으로 조사되도록 한다.In addition, the hemisphere lens 140 to suppress the diffusion of the LED light, the LED light is focused on the image side of the hemisphere lens 140 to be irradiated to the outside as straight as possible.

이때, 반구렌즈(140)는 LED칩(110)의 상측에 결합되되, 다수개의 LED칩(110)에 대응되는 개수로 결합된다.At this time, the hemisphere lens 140 is coupled to the image side of the LED chip 110, it is coupled in a number corresponding to the plurality of LED chips (110).

커버(150)는 반구렌즈(140)가 삽입되어 고정되도록 고정공이 형성되며, 체결볼트(160)로 상기 받침부(130)와 체결된다.The cover 150 is formed with a fixing hole such that the hemisphere lens 140 is inserted and fixed, and is fastened to the support part 130 by a fastening bolt 160.

체결볼트(160)는 스크류볼트를 사용할 수 있으며, 이에 한정하지 않는다.The fastening bolt 160 may use a screw bolt, but is not limited thereto.

또한, 체결볼트(160)가 커버(150)에 형성된 체결공(162)에 삽입되어 체결될 때, 체결볼트(160)의 머리 부분이 돌출되지 않고 체결되는 것이 바람직하다.In addition, when the fastening bolt 160 is inserted into the fastening hole 162 formed in the cover 150 and fastened, it is preferable that the head of the fastening bolt 160 is fastened without protruding.

한편, 받침부(130)는 커버(150)보다 열전도율이 높은 재료인 것이 바람직하다.On the other hand, the support 130 is preferably a material having a higher thermal conductivity than the cover 150.

특히, 받침부(130)는 구리(Cu)이고, 커버(150)는 알루미늄(Al)인 것이 바람직하다.In particular, the support 130 is copper (Cu), it is preferable that the cover 150 is aluminum (Al).

따라서, 받침부(130)와 커버(150)의 열전도율이 다른 재료를 사용함으로써, LED칩(110)에서 발생되는 열을 상부, 즉, 반구렌즈(140)의 상부로 방열하지 않고, 하부 즉, 받침부(130)로 유도하여 방열될 수 있다.Therefore, by using a material having different thermal conductivity between the base portion 130 and the cover 150, the heat generated from the LED chip 110 is not radiated to the upper portion, that is, the upper portion of the hemisphere lens 140, but the lower portion, Induced by the support 130 may be radiated.

LED칩(110)의 열이 받침부(130)로 유도되어 방열되므로, 반구렌즈(140)의 과열을 방지하여 반구렌즈(140)의 변형을 방지할 수 있다. 또한, 반구렌즈(140)의 과열 현상을 미연에 방지할 수 있으므로 LED칩(110)에 가해지는 열이 감소되어 LED칩(110)의 손상을 방지하고 LED칩(110)의 발광효율을 증가시킬 수 있을 뿐만 아니라, 추후 유지보수가 용이하다.Since the heat of the LED chip 110 is guided to the base 130 to dissipate heat, it is possible to prevent the hemisphere lens 140 from overheating to prevent deformation of the hemisphere lens 140. In addition, since the overheating phenomenon of the hemisphere lens 140 can be prevented in advance, heat applied to the LED chip 110 is reduced to prevent damage to the LED chip 110 and increase the luminous efficiency of the LED chip 110. Not only can it be done, but it is also easy for future maintenance.

한편, 받침부(130)의 하측 면에는 방열판이 형성되거나 팬 또는 방열판과 팬 둘 다 형성되어 받침부(130)의 하부로 이동되는 열을 더욱 효과적으로 방열시킬 수도 있다.On the other hand, a heat sink is formed on the lower surface of the support 130, or both the fan or the heat sink and the fan may be formed to more effectively dissipate heat transferred to the lower portion of the support 130.

Rod 렌즈(170)는 개구부(220)와 조사부(100)의 사이에 결합되되, 조사부(100)에서 조사되는 빛이 일측 외주면에 조사되면 빛을 집광하여 개구부(220)로 방출하는 원기둥 형상으로 형성된다.Rod lens 170 is coupled between the opening 220 and the irradiation unit 100, when the light irradiated from the irradiation unit 100 is irradiated to one outer circumferential surface is formed in a cylindrical shape to emit light to the opening 220 do.

또한, 고정부재(180)는 Rod 렌즈(170)를 양측에서 고정한다.In addition, the fixing member 180 fixes the rod lens 170 on both sides.

이때, 고정부재(180)는 케이스(200)와 일체로 형성될 수 있으나, Rod 렌즈(170)의 굵기에 따라 케이스(200)의 내부에 고정되도록 교체 가능한 하나의 부품으로 형성되는 것이 바람직하다.In this case, the fixing member 180 may be integrally formed with the case 200, but it is preferable that the fixing member 180 is formed of one replaceable part to be fixed to the inside of the case 200 according to the thickness of the rod lens 170.

즉, Rod 렌즈(170)와 고정부재(180)를 자유롭게 변경가능하기 때문에, Rod 렌즈(170)의 굵기에 따라 Rod 렌즈(170)와 피조사부 사이의 간격을 조절하며, Rod 렌즈(170)와 피조사부 사이의 간격을 통해 빛의 강도를 조절할 수 있다.That is, since the rod lens 170 and the fixing member 180 can be freely changed, the distance between the rod lens 170 and the irradiated part is adjusted according to the thickness of the rod lens 170, and the rod lens 170 and The intensity of light can be adjusted through the gap between the irradiated portions.

또한, Rod 렌즈(170)는, 외주면에 조사되는 다수의 UV LED 각각의 타원형상 빛(310)을 집광하여 개구부(220)로 장타원형상 빛(320)으로 각각 방출하되, 방출되는 장타원형상 빛(320)의 일부가 중첩되어 방출하는 빛의 강도가 일정한 선형 빛(330)으로 피조사부에 조사된다.In addition, the rod lens 170 collects the elliptical light 310 of each of the plurality of UV LEDs irradiated on the outer circumferential surface and emits the elliptical light 320 to the opening 220, respectively. A portion of the light 320 overlaps the irradiated portion with the linear light 330 having a constant intensity of light emitted.

도면을 참조하여, Rod 렌즈(170)와 선형 빛(330)에 대해 상세하게 설명하면 다음과 같다.Referring to the drawings, the rod lens 170 and the linear light 330 will be described in detail as follows.

도 6 및 도 7을 참조하면, 반구렌즈(140)는 확산을 억제하며 집광시킨 UV LED의 빛을 Rod 렌즈(170)의 일측 외주면에 조사되도록 방출한다. Referring to FIGS. 6 and 7, the hemispherical lens 140 suppresses diffusion and emits the light of the focused UV LED to be irradiated to one outer peripheral surface of the rod lens 170.

또한, Rod 렌즈(170)는 일측 외주면에 조사되는 타원형상 빛(310)의 확산을 억제하며 즉, 2차적으로 확산을 억제하여 Rod 렌즈(170)의 타측 외주면까지 집광시키며 직선으로 통과시킨다. In addition, the rod lens 170 suppresses the diffusion of the elliptical light 310 irradiated onto one outer circumferential surface, that is, secondaryly suppresses the diffusion to condense to the other outer circumferential surface of the rod lens 170 and passes it in a straight line.

여기서, UV LED의 빛을 두 번에 걸쳐 확산을 억제하고 집광시켜 UV LED 빛을 집광시키는 것은 빛의 확산에 낭비되는 빛의 양을 줄이고, 빛의 강도를 높여 합착할 패널을 단시간에 합착시키기 위한 것이며, 이에 따라 소모되는 전력을 줄일 수 있고, 작업을 단시간에 이룰 수 있어 작업능률을 높일 수 있다.Here, condensing and condensing the UV LED light twice, condensing the UV LED light is to reduce the amount of light wasted in the light diffusion and to increase the intensity of the light in order to adhere the panel to be bonded in a short time. As a result, power consumption can be reduced, and work can be accomplished in a short time, thereby increasing work efficiency.

그리고, Rod 렌즈(170)를 통과한 빛이 Rod 렌즈(170)의 타측 외주면에서 방출될 때, 도 7에 도시된 바와 같이, Y방향으로만 집광시켜 Y방향으로 단축이 형성되고, Rod 렌즈(170)의 길이방향으로 즉, 도 6a 및 도 6b에서 X방향으로 장축이 형성되는 장타원형상 빛(320)을 방출하며, 방출되는 장타원형상 빛(320)의 일부가 중첩되면 선형 빛(330)으로 피조사물에 조사된다.And, when the light passing through the rod lens 170 is emitted from the other outer peripheral surface of the rod lens 170, as shown in Figure 7, condensing only in the Y direction to form a short axis in the Y direction, the rod lens ( 170 emits an elliptical light 320 having a long axis formed in the X direction in FIGS. 6A and 6B, and the linear light 330 when a portion of the emitted elliptic light 320 overlaps. ) Is irradiated to the subject.

한편, 선형 빛(330)은, Rod 렌즈(170)가 방출하는 다수의 장타원형상 빛(320)의 일부가 중첩될 때(도 6 및 도 7의 Overlay 2 참조), 서로 다른 장타원형상 빛(320)의 장축방향 단부끼리 중첩되어 Rod 렌즈(170)의 길이방향으로 빛의 강도가 일정한 선형상으로 피조사부에 조사된다.On the other hand, the linear light 330, when a part of the plurality of long elliptical light 320 emitted by the rod lens 170 overlap (see Overlay 2 of Figs. 6 and 7), the different elliptical light The long axis ends of the 320 are overlapped with each other and irradiated to the irradiated portion in a linear shape with a constant light intensity in the longitudinal direction of the rod lens 170.

좀 더 상세하게 설명하면, 장타원형상 빛(320)의 강도는 중앙부분이 가장 세고, 장축방향의 단부는 중앙부분의 빛 강도보다 낮다.In more detail, the intensity of the long elliptical light 320 is the strongest in the center portion, the end of the long axis direction is lower than the light intensity of the central portion.

예를 들어, 장타원형상 빛(320)의 중앙부분 빛 강도를 100%이라 하면, 장타원형상 빛(320)의 단부 빛 강도가 약 45%로 피조사물에 조사되도록 다수의 UV LED 간격 및 Rod 렌즈(170)와 피조사물 간의 이격거리를 조절한다. 이때, 장타원형상 빛(320)의 단부 빛 강도가 약 45%로 다른 장타원형상 빛(320)의 단부 빛 강도 45%와 중첩되면서 약 90%에 해당하는 빛의 강도로 선형으로 이루어진 선형 빛(330)이 피조사물에 조사되는 것이다.For example, when the central light intensity of the long elliptical light 320 is 100%, the end light intensity of the long elliptical light 320 is about 45% so that a plurality of UV LED intervals and rods are irradiated to the irradiated object. Adjust the separation distance between the lens 170 and the irradiated object. At this time, the end light intensity of the long oval shape light 320 is about 45% and overlaps with the end light intensity 45% of the other ellipse shape light 320, and the linear light is linearly formed with the light intensity corresponding to about 90%. 330 is irradiated to the subject.

즉, 상술한 바와 같이, UV LED의 성능, Rod 렌즈(170)의 크기 및 볼록렌즈와 Rod 렌즈(170)의 광학시스템 등정해진 조건에서 다수의 UV LED 간격을 8mm로 이격 설치하고, Rod 렌즈(170)와 피조사물 간의 이격거리를 20mm로 하였을 때, 도 8a를 참조하면, UV LED의 빛 강도가 선형으로 1400mW/㎠로 일정하게 피조사물에 조사되며, 도 8b를 참조하면, UV LED의 수직방향으로 가장 강한 빛이 조사되고 있음을 알 수 있다.That is, as described above, the UV LED performance, the size of the rod lens 170 and the convex lens and the optical system of the rod lens 170 are installed in a plurality of UV LED intervals spaced apart by 8mm, Rod lens ( 170) and the distance between the irradiated object to 20mm, referring to Figure 8a, the light intensity of the UV LED is uniformly irradiated to the irradiated object at a linear 1400mW / ㎠, referring to Figure 8b, the vertical of the UV LED It can be seen that the strongest light is emitted in the direction.

따라서, 본 발명에 따른 Rod렌즈가 결합된 LED조사모듈(200)을 통해 다수의 UV LED의 빛을 집광시켜 선형 빛(330)으로 만들고, 선형 빛(330)을 통해 패널의 합착을 단시간에 이루어지게 함으로써, 작업능률이 향상될 뿐만 아니라 소비전력이 줄어드는 이점이 있다.Therefore, the LED lens module coupled to the rod lens according to the present invention by condensing the light of a plurality of UV LED to make a linear light 330, through the linear light 330 to make the panel in a short time By doing so, not only the work efficiency is improved but also the power consumption is reduced.

본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구의 범위에 의하여 나타내어지며, 특허청구의 범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.
It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

100 : 조사부 110 : LED칩
112 : LED 120 : 기판
130 : 받침부 132 : 돌출부
134 : 분리벽 140 : 반구렌즈
150 : 커버 160 : 체결볼트
162 : 체결공 170 : Rod 렌즈
180 : 고정부재 200 : UV-LED 경화장치
210 : 케이스 220 : 개구부
310 : 타원형상 빛 320 : 장타원형상 빛
330 : 선형 빛100: irradiation unit 110: LED chip
112: LED 120: substrate
130: base portion 132: protrusion
134: dividing wall 140: hemisphere lens
150: cover 160: fastening bolt
162: fastener 170: rod lens
180: fixing member 200: UV-LED curing device
210: case 220: opening
310: elliptical shape light 320: long oval shape light
330: linear light

Claims (7)

빛이 방출되는 개구부가 형성된 케이스;
상기 케이스 내부에 다수의 UV LED의 빛이 상기 개구부를 향하여 조사 가능하게 결합된 조사부와;
상기 개구부와 조사부의 사이에 결합되되, 상기 조사부에서 조사되는 빛이 일측 외주면에 조사되면 상기 빛을 집광하여 상기 개구부로 방출하는 원기둥 형상의 Rod 렌즈; 및
상기 Rod 렌즈를 양측에서 고정하는 고정부재;를 포함하고,
다수의 상기 UV LED는, 각각 빛을 방출하되, 상기 Rod 렌즈의 외주면에 타원형상의 빛이 일부가 중첩되며 조사되도록 이격 설치되고,
상기 Rod 렌즈는, 상기 각각의 타원형상 빛을 집광하여 상기 개구부로 장타원형상 빛으로 각각 방출하되, 방출되는 장타원형상 빛의 일부가 중첩되어 상기 방출하는 빛의 강도가 일정한 선형 빛으로 피조사부에 조사되는 것을 특징으로 하고,
상기 조사부는,
LED가 내장된 LED칩;
상기 LED칩의 하부에 부착되는 기판;
상기 LED칩의 하측 일부와 접촉되게 돌출부가 형성되고, 상기 돌출부 양측에 상기 기판이 안착되되, 상기 돌출부가 기판의 크기와 동일한 높이로 돌출된 받침부;
상기 LED칩의 상측에 결합되어 상기 LED의 빛 확산을 억제하며 집광시켜 조사되도록 하는 반구형상의 반구렌즈; 및
상기 반구렌즈가 삽입되어 고정되도록 고정공이 형성되며, 체결볼트로 상기 받침부와 체결되는 커버;를 포함하고,
상기 LED칩은, 상기 돌출부의 길이방향을 따라 일정간격 이격되어 다수개가 결합되고,
상기 받침부는, 상기 커버보다 열전도율이 높은 재료인 것을 특징으로 하며,
상기 돌출부는,
다수의 상기 LED칩을 각각 분리하며, 상기 LED칩의 양측 벽에 접촉되는 분리벽이 형성된 것을 특징으로 하는 Rod렌즈가 결합된 LED조사모듈.
A case having an opening through which light is emitted;
An irradiator coupled to the plurality of UV LED lights in the case so as to be irradiated toward the opening;
A cylindrical rod lens coupled between the opening and the irradiator, for condensing the light and emitting the light to the opening when the light irradiated from the irradiator is irradiated to one outer circumferential surface; And
And a fixing member for fixing the rod lens at both sides.
The plurality of UV LEDs, respectively, emits light, but is installed to be spaced apart so that a portion of the elliptical light overlaps and irradiates on the outer circumferential surface of the rod lens,
The rod lens condenses the respective elliptical lights and emits the elliptical lights to the openings as long oval lights, respectively, and a portion of the elongated elliptical lights is superimposed so that the emitted light is a linear light having a constant intensity. Characterized in that to be investigated,
The irradiation unit,
LED chip with built-in LED;
A substrate attached to a lower portion of the LED chip;
A protruding portion is formed to be in contact with a lower portion of the LED chip, and the support portion is mounted on both sides of the protruding portion, and the protruding portion protrudes at the same height as the size of the substrate;
A hemispherical hemispherical lens coupled to an upper side of the LED chip to suppress light diffusion of the LED and to focus the irradiated light; And
A fixing hole is formed so that the hemisphere lens is inserted and fixed, and a cover which is fastened to the support part by a fastening bolt.
The LED chip is spaced apart at regular intervals along the longitudinal direction of the protrusions are coupled to a plurality,
The support portion is characterized in that the material having a higher thermal conductivity than the cover,
The protrusion,
The LED irradiation module coupled to the rod lens, characterized in that for separating each of the plurality of LED chips, the partition wall is formed in contact with both walls of the LED chip.
제1항에 있어서, 상기 Rod 렌즈는,
일측 외주면에 조사되는 타원형상 빛의 확산을 억제하며 Rod 렌즈의 타측 외주면까지 집광시키며 직선으로 통과시키고, 상기 Rod 렌즈를 통과한 빛이 Rod 렌즈의 타측 외주면에서 방출될 때, 상기 Rod 렌즈의 길이방향으로 장축을 갖는 장타원형상 빛을 방출하는 것을 특징으로 하는 Rod렌즈가 결합된 LED조사모듈.
The method of claim 1, wherein the Rod lens,
Suppresses the spread of elliptical light radiated onto one outer circumferential surface and condenses it to the other outer circumferential surface of the rod lens and passes it in a straight line. LED irradiation module coupled to the rod lens, characterized in that for emitting an elliptic shape light having a long axis.
제1항에 있어서, 상기 선형 빛은,
상기 Rod 렌즈가 방출하는 다수의 장타원형상 빛의 일부가 중첩될 때, 서로 다른 장타원형상 빛의 장축방향 단부끼리 중첩되어 상기 Rod 렌즈의 길이방향으로 빛의 강도가 일정한 선형상으로 피조사부에 조사되는 것을 특징으로 하는 Rod렌즈가 결합된 LED조사모듈.
The method of claim 1, wherein the linear light,
When a part of a plurality of long elliptic light emitted by the rod lens overlaps, long end portions of different long elliptic light overlap each other and the light intensity is constant in the linear direction of the rod lens. LED irradiation module is coupled to the rod lens, characterized in that the irradiation.
삭제delete 삭제delete 제1항에 있어서, 상기 반구렌즈는,
상기 LED칩의 상측에 결합되되, 다수개의 LED칩에 대응되게 결합되는 것을 특징으로 하는 Rod렌즈가 결합된 LED조사모듈.
The method of claim 1, wherein the hemisphere lens,
Is coupled to the upper side of the LED chip, LED irradiation module coupled to the rod lens, characterized in that coupled to correspond to a plurality of LED chips.
제1항에 있어서,
상기 받침부는, 구리(Cu)이고,
상기 커버와 고정부재는, 알루미늄(Al)인 것을 특징으로 하는 Rod렌즈가 결합된 LED조사모듈.The method of claim 1,
The support portion is copper (Cu),
The cover and the fixing member, the LED irradiation module coupled to the rod lens, characterized in that the aluminum (Al).
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