KR101214953B1 - Stamp apparatus having multi-faces and making method for the stamp apparatus - Google Patents
Stamp apparatus having multi-faces and making method for the stamp apparatus Download PDFInfo
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- KR101214953B1 KR101214953B1 KR1020120078580A KR20120078580A KR101214953B1 KR 101214953 B1 KR101214953 B1 KR 101214953B1 KR 1020120078580 A KR1020120078580 A KR 1020120078580A KR 20120078580 A KR20120078580 A KR 20120078580A KR 101214953 B1 KR101214953 B1 KR 101214953B1
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- Prior art keywords
- stamp
- rotation
- stamp device
- index number
- rotation angle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B1/001—Devices without movable or flexible elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0009—Forming specific nanostructures
- B82B3/0019—Forming specific nanostructures without movable or flexible elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
An object of the present invention is a stamping apparatus used in nanoimprint lithography, having a plurality of sides having a shape such as a polygonal pillar, and having a body having a stamp formed on each side, thereby imprinting a plurality of patterns with various stamps. The present invention provides a stamping device having a plurality of side surfaces and a method of manufacturing the stamping device, which facilitates alignment between stamps.
Description
The present invention relates to a stamping device having a plurality of side surfaces and a manufacturing method of the stamping device. More specifically, the present invention is a stamping apparatus used in nanoimprint lithography, having a plurality of sides having a plurality of sides formed in the shape of a polygonal pillar, etc. It relates to a stamping device having a plurality of sides, and a manufacturing method of the stamping device, which facilitates alignment between stamps when imprinting.
In general, in the semiconductor manufacturing process, a shape of a mask or a stamp is transferred to a substrate such as silicon and glass to produce a micrometer or a nanometer-sized microstructure in large quantities. Lithography, which transfers the shape of a mask or stamp onto a resin on a substrate, is commonly referred to as lithography. Lithography technology aligns a mask on a substrate on which a resist is applied, and then irradiates with light to cure the resist. Photo Lithography to form a pattern, and a method of arranging a stamp on a substrate on which a resist is applied, and then applying pressure in a state where the stamp and the substrate are in close contact with each other, and then heating or irradiating light such as ultraviolet rays. Imprint Lithography and the like, which form a pattern by curing a resist using, are used.
In particular, when imprint lithography is used to form nanoscale patterns, it is also referred to as nano-imprint lithography. In nanoimprint lithography, stamps are generally made in the form of wafers made of silicon and glass as well as substrates, provided that the stamp is made the same or smaller than the substrate.
In the past, nanoimprint lithography technology was used to form a single type of pattern in a single location with a single type of stamp. Currently, however, it has been developed in various forms such as step-and-flash imprint lithography (SFIL), which performs a process at various locations on a substrate using a single stamp, or multi-layer nanoimprint lithography, which performs a process multiple times on a single substrate. I'm going.
In nanoimprint lithography performed using multiple stamps having multiple patterns, the problem of overlay alignment caused by replacing the stamps has become an important technical issue. In the case of nanoimprint lithography, the size of the pattern itself is very precise at the nano level, so it is natural that the alignment of the stamp should be precise and accurate when replacing the stamp to ensure the quality of the manufactured pattern.
As described above, in order to align the stamp in the multi-imprint lithography process, conventionally, a pattern for aligning the stamp and the substrate is separately formed and measured by an optical method such that the relative position of the substrate and the stamp is used. Korean Patent Publication No. 1996-0002545 ("Electron Beam Lithography Apparatus and Multilayer Alignment Method Using The Same", 1996.01.26, Prior Art 1), Japanese Patent Publication No. 2006-216952 ("Alignment system for nanoimprint lithography and employing the same) Imprint lithography method ", 2006.08.17, prior art 2), Korean Patent Publication No. 2008-0054804 (" Method and apparatus for stamp alignment for nanoimprint lithography using resistance ", 2008.06.19, prior art 3), Korean patent Publication 2012-0001628 ("Multiple Patterning Lithography Using Spacer and Self-aligned Assist Patterns", 2012.01.04, prior art 4), and the like use an alignment scheme that uses a similar idea. More specifically, the
However, the alignment method of the above method has a problem in that the device configuration or the process design is difficult, and the process time increases, and accordingly, economic disadvantages increase due to the increase of various costs. In addition, when the stamp is replaced, there is a problem that a uniform process cannot be made due to a shape error caused by a difference in thickness, size, etc. between the stamps, and there was also a need for a more stable stamp replacement process.
Accordingly, the present invention has been made to solve the problems of the prior art as described above, the object of the present invention is a stamping device used in nanoimprint lithography, consisting of a polygonal pillar, etc. The present invention provides a stamping apparatus having a plurality of sides and a manufacturing method of the stamping apparatus having a body having a stamp formed on a side thereof, which facilitates alignment between stamps when imprinting a plurality of patterns with a plurality of stamps.
A stamping apparatus having a plurality of side surfaces of the present invention for achieving the above object is a
At this time, the
In addition, the
At this time, the
In addition, the
In addition, the
In addition, the
In addition, the
In addition, the manufacturing method of a stamping device having a plurality of side surfaces of the present invention, the
At this time, the manufacturing method of the stamping device, b1) the
According to the present invention, there is a great effect to solve the alignment problem caused during stamp replacement during multiple imprint lithography much easier than in the prior art. More specifically, in the related art, since alignment is performed by using a separate alignment pattern when replacing a stamp, there is a problem in that a device configuration or a process design becomes complicated and process time increases. However, in the present invention, by using a stamp device having a plurality of sides made of a shape such as a polygonal pillar having a stamp formed on each side, so as to replace the stamp by simply rotating the body, There is a big effect that sorting can be done very easily without the need for a separate sorting operation.
In other words, according to the present invention, by improving the structure of the stamping device itself, the problem of positional displacement that may occur due to the replacement of a plurality of stamps is solved at the source, and a process requiring a plurality of stamps under more stable conditions is performed. There is a great effect that can be performed continuously (without process interruption). In particular, the stamp of the present invention can be easily applied to a multi-nanoimprint lithography process to be used by replacing a plurality of stamps, and of course, can greatly increase the process efficiency when applied.
1 is a stamp device of the present invention.
Figure 2 is a detailed view of the body of the stamp device of the present invention.
3 shows several embodiments of a body cross section of the stamp device of the present invention.
Figure 4 is a body mounting and detachment state of the stamp device of the present invention.
5 is a conceptual diagram of a processing method of the manufacturing method of the stamp device of the present invention.
Figure 6 is a body rotation step during processing of the manufacturing method of the stamp device of the present invention.
7 is a flow chart of a processing method of the manufacturing method of the stamp device of the present invention.
8 is a positional relationship between the body central axis and the stamp surface in the stamp device of the present invention.
9 is a conceptual diagram of a polishing method of the manufacturing method of the stamp device of the present invention.
10 is a flow chart of a polishing method of the manufacturing method of the stamp device of the present invention.
Hereinafter, a stamping apparatus having a plurality of side surfaces and a manufacturing method of the stamping apparatus according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.
First, the structure of the stamping apparatus which has a some side surface of this invention is demonstrated. 1 shows one embodiment of a stamping device of the invention, FIG. 2 shows a detailed view of the body of the stamping device of the invention, and FIG. 3 shows several embodiments of a body cross section of the stamping device of the invention. will be.
The
The
The principle of performing multiple imprint lithography using the
As described above, the
2 and 3 will be described in more detail with respect to the structure of the
First of all, in the drawings, the
As described above, in order to replace the stamp by the rotation of the
The
As such, when the
The most important feature of the
As shown in FIG. 1, the
The fixing
The fixing
The
The
In addition, the
Hereinafter, the manufacturing method of such a stamping apparatus of the present invention, and more specifically, the manufacturing method of the
5 is a conceptual view of a processing method of the manufacturing method of the stamping device of the present invention, Figure 6 is a body rotation step during processing of the manufacturing method of the stamping device of the present invention, Figure 7 is a processing of the manufacturing method of the stamping device of the present invention A flowchart of the method.
The processing of the stamping apparatus of the present invention will be described with reference to FIG. 7. First, as shown in FIG. 5, the
Next, a3) the
After processing of the k-th stamp surface is completed, a4) it is determined whether the index number k is larger than n (SA4). At this time, a5) when the index number k is not greater than n (SA4-no), the
Through this method of processing, the stamp surface of the stamp surface of the
9 is a conceptual diagram of a polishing method of the manufacturing method of the stamping apparatus of the present invention, and FIG. 10 is a flowchart of the polishing method of the manufacturing method of the stamping apparatus of the present invention. The polishing method also proceeds in the same manner as the processing method.
Referring to FIG. 10, a polishing process of the stamping apparatus of the present invention is described. A1) As shown in FIG. 9, the
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.
100:
115: fixing part 120: fixing chuck
130: rotation drive unit 135: rotation angle measurement unit
140: linear drive unit 145: linear movement guide
150: base 155: protective cover
200: processing device 250: processing tool
300: polishing apparatus 350: polishing tool
Claims (11)
The stamp device 100 is
Fixing portions 115 are formed at both ends of the body 110 in the direction of the central axis of the body 110 to protrude,
A pair of fixing chucks 120 in which depressions having a shape corresponding to the fixing portions 115 are formed, into which the fixing portions 115 are inserted;
A rotation drive unit 130 connected to the fixing chuck 120 on one side to rotate the body 110;
A linear drive unit 140 connected to the fixing chuck 120 on the other side to linearly move the fixing chuck 120 to adjust a gap between the fixing chucks 120;
Stamp device having a plurality of side surfaces, characterized in that comprises a.
A stamping device having a plurality of side surfaces, characterized in that the cross section in a direction perpendicular to the central axis is formed into a regular polygon.
Stamp device having a plurality of sides characterized in that the polygonal pillar shape or polygonal pyramidal shape.
It is formed in a tapered shape, the central axis of the stamp device having a plurality of side, characterized in that disposed on the coaxial with the central axis of the body (110).
Rotation angle measuring unit 135 for measuring the rotation angle of the body 110;
Stamp device having a plurality of sides characterized in that it further comprises.
A linear movement guide 145 for guiding the linear movement of the linear driver 140;
Stamp device having a plurality of sides characterized in that it further comprises.
A base 150 on which the rotation driver 130 and the linear driver 140 are supported and fixed;
Stamp device having a plurality of sides characterized in that it further comprises.
A protective cover (155) connected to the base (150) and formed to surround at least one selected from the rotation driving unit (130) or the linear driving unit (140);
Stamp device having a plurality of sides characterized in that it further comprises.
a1) the stamp device (100) is disposed on the processing device (200) such that the reference surface on the work table of the base (150) and the processing device (200) are parallel (SA1);
a2) the body 110 is rotated by the rotation driving unit 130 and the rotation angle measuring unit 135 to initialize the rotation position, and inputting 1 to the index number (i) (SA2);
a3) the machining tool 250 of the processing apparatus 200 is moved in a direction parallel to the reference plane to process the side of the body 110, and adds 1 to the index number (i) (SA3);
a4) determining whether the index number i is greater than n (SA4);
a5) when the index number i is not greater than n (SA4-no), the body 110 is rotated by 360 / n ° by the rotation driving unit 130 and the rotation angle measuring unit 135 (SA5);
a6) steps a3) to a5) are sequentially repeated;
The manufacturing method of the stamp apparatus which has a some side characterized by including the.
b1) the step of placing the stamp device (100) on the polishing device (300) such that the reference surface on the work table of the base (150) and the polishing device (300) is parallel (SB1);
b2) the body 110 is rotated by the rotation driving unit 130 and the rotation angle measuring unit 135 to initialize the rotation position, and inputting 1 to the index number (i) (SB2);
b3) a step in which the polishing tool 350 of the polishing apparatus 300 moves in a direction parallel to the reference plane to polish the side of the body 110 and adds 1 to the index number (i) (SB3);
b4) determining whether the index number i is greater than n (SB4);
b5) If the index number (i) is not greater than n (SB4-no), the body 110 is rotated by 360 / n ° by the rotation drive unit 130 and the rotation angle measuring unit 135 (SB5);
b6) step b3) to step b5) are sequentially repeated;
The manufacturing method of the stamp device which has a some side characterized by including further.
Priority Applications (1)
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KR1020120078580A KR101214953B1 (en) | 2012-07-19 | 2012-07-19 | Stamp apparatus having multi-faces and making method for the stamp apparatus |
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KR1020120078580A KR101214953B1 (en) | 2012-07-19 | 2012-07-19 | Stamp apparatus having multi-faces and making method for the stamp apparatus |
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KR1020120078580A KR101214953B1 (en) | 2012-07-19 | 2012-07-19 | Stamp apparatus having multi-faces and making method for the stamp apparatus |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101201A (en) * | 2003-09-24 | 2005-04-14 | Canon Inc | Nano-imprint system |
JP2008284873A (en) * | 2007-03-19 | 2008-11-27 | Obducat Ab | Nano-imprinting apparatus and method |
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2012
- 2012-07-19 KR KR1020120078580A patent/KR101214953B1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101201A (en) * | 2003-09-24 | 2005-04-14 | Canon Inc | Nano-imprint system |
JP2008284873A (en) * | 2007-03-19 | 2008-11-27 | Obducat Ab | Nano-imprinting apparatus and method |
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