KR101214182B1 - A breaking and grinding apparatus for htcc board - Google Patents

Abstract

PURPOSE: An apparatus for high temperature co-fired ceramic substrates is provided to automatically cut and grind high temperature co-fired ceramic substrates as a plurality of breaking units and grinding units are installed on a transfer rail. CONSTITUTION: An automatic cutting and grinding apparatus for high temperature co-fired ceramic substrates comprises a first breaking unit and a side grinding unit. The first breaking unit comprises a base(310), an upper fixing part(320), a cutting prop(330), and a pressing part(340). A cut high temperature co-fired ceramic substrate is settled on the base. The upper fixing part is placed above the base, and a fixing cylinder(321) of the upper fixing part horizontally moves to fix the cut high temperature co-fired ceramic substrate. The cutting prop is placed on one side of the base, and a prop moving cylinder horizontally moves to fix the lower row of the cut high temperature co-fired ceramic substrate. The pressing part is placed at the upper part of the cutting prop, and cuts the substrate by pressing the high temperature co-fired ceramic substrate to be cut. The side grinding unit comprises first and second grinding parts. The first grinding unit grinds one surface of the high temperature co-fired ceramic substrate which is cut in a row. The second grinding unit grinds the other surface of the high temperature co-fired ceramic substrate which is cut in a row.

Description

Automatic Cutting and Grinding Device for HTCC Boards {A Breaking and Grinding Apparatus for HTCC board}

The present invention relates to an automatic cutting and polishing apparatus for an HTCC substrate, and more particularly, a cutting portion for cutting an HTCC substrate of a camera module and a polishing portion for polishing an HTCC substrate are installed in a transfer rail to automatically cut and polish an HTCC substrate. It is possible to completely remove burrs generated on the outside of HTCC, which can greatly improve the quality of HTCC, and to automatically cut the HTCC substrate and keep the surrounding area clean. It relates to a cutting and polishing device.

In general, the camera module is a main component corresponding to the camera eye, and includes a lens, a sensor, an ISP, etc. Recently, as the performance of the camera has been strengthened, HTCC (High Temperature Co-fired Ceramics) of a high performance camera module has been developed and widely used. have.

The HTCC of the camera module is manufactured through a plurality of HTCC substrates arranged, and the cutting surface is polished by cutting a plurality of HTCC substrates arranged individually to mount the HTCC on the camera.

An apparatus for cutting and polishing such HTCC substrates individually has been developed and used. As an example, Korean Patent Application Publication No. 10-2010-59552 has been disclosed.

1 is a schematic view showing a conventional substrate cutting and polishing apparatus, and as shown, a conventional substrate cutting and polishing apparatus includes a loading unit 410 and an unloading unit 420, a transfer rail 500, and a plurality of substrates. It is formed of a polishing unit 800 consisting of a stage 600 and a plurality of polishing units 700.

The loading unit 410 receives the substrate DP of the liquid crystal display panel from the breaking unit (not shown) and transfers the loading unit 410 into the polishing unit 800 through the transfer rail 500, and the unloading unit 420. Transfers the substrate DP, which has been polished at the edge portion, to the outside, and the loading unit 410 and the unloading unit 420 are provided with a plurality of shafts ST, respectively. The substrate DP mounted on the upper portion of the shaft ST is horizontally moved in the transfer direction through the rotation of the ST, and is disposed adjacent to the transfer rail 500.

However, since the conventional substrate cutting and polishing apparatus rotates and polishes the rectangular substrate DP, the edge of the rotated substrate DP can be polished, but the side of the substrate DP cannot be polished. Due to the burrs on the side, there was a problem in that the board could not be seated in the proper position when assembling the board to the electronic product, resulting in poor contact. When cutting the board, the board could not be completely fixed. Since the cutting surface is irregular because the cutting surface is defective, there is a problem that the surroundings around the installation site of the substrate cutting and polishing apparatus with the chip generated when cutting the substrate.

The present invention has been invented to solve the above problems, an object of the present invention is to install a plurality of braking parts for cutting the HTCC substrate of the camera module and a plurality of polishing parts for polishing the HTCC substrate in the transfer rail to automatically HTCC substrate HTCC can be cut and polished, and HTCC quality can be improved by completely removing burrs generated on the outside of HTCC, and HTCC substrate can be cut conveniently while keeping the surrounding area clean. An automatic cutting and polishing apparatus for a substrate is provided.

Automatic cutting and polishing apparatus for the HTCC substrate according to the present invention for achieving the above object is a substrate supply for supplying a high temperature Co-fired Ceramics (HTCC) substrate of the camera module, and the outside of the HTCC substrate supplied from the substrate supply The outer cutting part for cutting the cutting edge, the first breaking part for cutting the HTCC substrate cut in the outer row from the outer cutting part in one row, and the side grinding part for polishing the side of the HTCC substrate cut in one row from the first breaking part. And a buffer unit for moving and arranging a plurality of single-row HTCC substrates on both sides of the side polishing unit, and a front polishing unit for polishing the front surface of the HTCC substrate, which is arranged in plurality in the buffer unit and polished on both sides; A second braking part for cutting the first row HTCC substrate whose surface is polished at the front polishing part individually, and a back grinding part for polishing the rear surface of the HTCC cut individually at the second breaking part; In the back of the polishing part and the gripper, the HTCC substrate and automatic cutting and polishing for HTCC substrate consisting of a transfer rail for transferring the HTCC device for the plurality of collecting the back grinding HTCC inherent in the tray to be supplied from one side in,

The first braking part includes a base on which the HTCC substrate cut out is mounted, an upper fixing part having a fixing cylinder which is vertically moved to fix the HTCC substrate cut out at the top of the base, and at one side of the base. Pressing and cutting the cutting pedestal having a pedestal moving cylinder which is moved to the left and right to fix the lower row of the HTCC substrate cut the outer row, and the HTCC substrate to be cut in one row fixed in the cutting pedestal from the upper side of the cutting pedestal Comprising a pressing portion, the side polishing portion of the first polishing portion for polishing one side surface of the HTCC substrate cut in one row in the first breaking portion, and the one side surface of the HTCC substrate cut in one row of the first polishing portion It is characterized by consisting of a second polishing portion for polishing the other side.

The upper fixing part of the first breaking part is connected to the HTCC fixing part for close contact with the HTCC substrate to be cut in one row on the lower surface, and the upper and lower parts to close the HTCC connecting part for connecting between the HTCC substrate to be cut in one row to the outer end of the HTCC fixing part. An HTCC connection fixing part provided with a moving cylinder for transferring to the lower part is provided, and the lower end of the pressing part of the first breaking part cuts an HTCC substrate to be cut in a row fixed by the HTCC fixing part, and the HTCC fixed in the HTCC connection fixing part. Cutting blades are inclined upwardly to cut the connection portion, characterized in that the lower surface of the pressing portion is provided with a pressure cylinder connected to the ground to move the pressing portion up and down.

Inside the upper fixing part is formed a discharge passage for discharging the HTCC connection is cut while the cutting blade is moved to the upper side, and one side end of the discharge passage is provided with a discharge fan for sucking the discharged HTCC connection to the outside And, the inner end of the cutting support is provided with a plurality of fixed blades for fixing the lower side of the HTCC substrate cut in one row, the inclined cylinder to be connected to the ground on the lower surface of the pressing portion to move up and down so that the pressing portion inclined inward Is provided, the one side end of the base is formed with a concave-convex concave-convex portion is seated HTCC connecting portion, the inner side of the cutting blade is formed to form a concave concave concave confronting the concave convex portion to cut the HTCC connection portion It features.

Between the first polishing portion and the second polishing portion, a HTCC substrate cut in one row is provided on the upper surface in the longitudinal direction, and is provided with a transfer table which is connected to the transfer rail and moved, and an upper portion of the transfer table is provided. A pair of HTCC fixing rollers for pressurizing the HTCC substrate cut in one row from the upper side to polish the HTCC substrate cut in one row from the second polishing part and the first polishing part and the second polishing part are connected to the reducer. The polishing roller is rotated, and the surface of the polishing roller is surrounded by abrasive stones, and the rotation of the first polishing portion and the second polishing portion is rotated in a direction opposite to the traveling direction of the HTCC substrate cut in one row.

A first roller base on which the polishing roller is seated, a first LM guide having a screw formed therein to move the first roller base from side to side under the first roller base, and the first roller base; A first moving motor which is connected to one side of the 1M guide and rotates is installed, and a second roller base on which the polishing roller is seated is installed below the second polishing part, and the second roller base is disposed below the second roller base. A second LM guide having a screw formed therein so as to move the roller base from side to side, and a second moving motor connected to one side of the second LM guide and rotated, are installed.

Thus, the effect of the automatic cutting and polishing apparatus for HTCC substrate according to the present invention is as follows.

First, by installing the first breaking part for cutting the first row of the HTCC substrate on the transfer rail, it is possible to completely cut the HTCC substrate to significantly improve the productivity,

Second, by installing side grinding parts for polishing both sides of one row of HTCC substrates on the transfer rail, HTCC substrates can be automatically cut and simultaneously polished to greatly improve productivity, and burrs are produced on the outside of HTCC substrates. Can be completely removed to significantly improve the quality of HTCC,

Third, by installing the discharge device for automatically cutting the HTCC substrate and discharging the chip (HTCC connection) generated at the same time, it is possible to cut the HTCC substrate and discharge the chip to the outside at the same time to keep the installation site clean.

1 is a schematic diagram showing a conventional circuit board cutting and polishing apparatus.
Figure 2 is a schematic diagram showing an automatic cutting and cutting device for HTCC substrate according to the present invention.
Figure 3 is a front view showing a first breaking part according to the present invention.
Figure 4 is a plan view showing a cutting blade of the first breaking portion according to the present invention.
5 is a schematic view showing a state of use of the first breaking unit according to the present invention.
Figure 6 is a front view showing a side grinding portion according to the present invention.
Figure 7 is a plan view showing a side grinding portion according to the present invention.
Figure 8 is an enlarged cross-sectional view showing the main part of the side grinding portion according to the present invention.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Automatic cutting and polishing apparatus for HTCC substrate according to the present invention, as shown in Figure 2, the substrate supply unit 100 for supplying a high temperature Co-fired Ceramics (HTCC) substrate (1) of the camera module, and the substrate First breaking for cutting the outline of the HTCC substrate (1) supplied from the supply section 100 and the HTCC substrate (1) cut the outline in the outer cutting unit 200 in one row The side 300, the side polishing portion 400 for polishing the side of the HTCC substrate 2 cut in one row in the first breaking portion 300, and the one side both sides polished in the side polishing portion 400 A buffer unit 500 for moving and arranging a plurality of thermal HTCC substrates 2 and a front polishing unit 600 for polishing a front surface of the HTCC substrate 2, which is arranged in a plurality of the buffer units 500 and polished at both sides thereof. ), A second breaking unit 700 which cuts the first row HTCC substrate 2 polished entirely from the front polishing unit 600, and the second breaking unit ( A gripper which collects a plurality of rear polishing parts 800 for polishing the back surface of the HTCC cut individually at 700, and a plurality of HTCCs whose back surface is polished at the rear polishing parts 800 and is embedded in a tray supplied from one side. 900, the HTCC substrate 1, the HTCC substrate 2 in one row, and a transfer rail 1000 for transferring individual HTCCs.

In FIGS. 3 and 5, the first breaking part 300 includes a base 310 on which the HTCC substrate 1 is cut, and an HTCC substrate 1 cut on the upper side of the base 310. Left and right to fix the lower row of the upper fixing part 320 is provided with a fixed cylinder 321 is moved up and down to fix the one row of the HTCC substrate (1) cut out of one side of the base (310) Pressing the cutting support 330 having a pedestal moving cylinder 331 to be moved to, and the HTCC substrate (2) to be cut in a row fixed by the cutting support 330 in the upper side of the cutting support 330 to cut It is composed of a pressing unit 340.

The upper fixing part 320 is moved along the fixed cylinder 321 on the lower surface of the HTCC fixing part 322 for close contact with the HTCC substrate 2 to be cut in one row, and on the outer end of the HTCC fixing part 322. The HTCC connection fixing part 323 is provided with a moving cylinder 323a for vertically transferring the HTCC connection part 5 connecting between the HTCC substrates 2 to be cut in one row.

The HTCC substrate 2 to be cut in one row fixed at the HTCC fixing part 322 is cut at the lower end of the pressing part 340 of the first breaking part 300 and fixed at the HTCC connecting fixing part 323. A cutting blade 341 protrudes inwardly and is inclined upwardly to cut the HTCC connection part 5, and is connected to the ground on the lower surface of the pressing part 340 to move the pressing part 340 up and down. The cylinder 342 is installed.

In addition, an inner side of the upper fixing part 320 is formed with a discharge passage 324 for discharging the HTCC connecting portion 5 is cut while the cutting blade 341 is moved upward, one side of the discharge passage 324 At the end, the discharge fan 325 for sucking the HTCC connecting portion 5 to be cut and discharged to the outside is provided.

The inner end of the cutting support 330 is provided with a plurality of fixed blades 332 for fixing the lower side of the HTCC substrate 2 cut in one row, the lower surface of the cutting support 330 is connected to the ground and the cutting An inclined cylinder 333 for moving up and down to incline the pedestal 330 is provided.

In FIG. 4, one side end of the base 310 is formed with a concave-convex portion 311 having a concave-convex shape in which the HTCC connecting portion 5 is seated, and the concave-convex portion 311 inside the cutting blade 341. A connection cutout portion 341a is formed to face the HTCC connection portion 5 so that the HTCC connection portion 5 is cut.

6 to 8, between the first polishing part 410 and the second polishing part 420, the HTCC substrate 2 cut in one row is seated on the upper surface in the longitudinal direction and connected to the transfer rail 1000. And a transfer table 430 which is reciprocated, and the HTCC substrate 2 cut in one row from the first polishing portion 410 and the second polishing portion 420 is polished on the transfer table 430. The HTCC fixing roller 440 pressurizing the HTCC substrate 2 cut in one row so as to be connected to the side surfaces of the first polishing part 410 and the second polishing part 420, respectively.

The first polishing unit 410 and the second polishing unit 410 is provided with a polishing roller 401 is rotated in connection with the reducer (P), the abrasive stone 402 on the outer peripheral surface of the polishing roller 401 This wrap, the rotation of the first polishing unit 410 and the second polishing unit 410 is rotated in the direction opposite to the traveling direction of the HTCC substrate 2 cut in one row.

A first roller base 411 on which the polishing roller 401 is seated is installed below the first polishing part 410, and the first roller base 411 below the first roller base 411. A first LM guide 412 having a screw formed inside to move the left and right, and a first moving motor 413 rotated in connection with one side of the first LM guide 412,

 A second roller base 421 on which the polishing roller 401 is seated is installed below the second polishing part 420, and the second roller base 421 below the second roller base 421. A second LM guide 422 is formed inside the screw to move the left and right, and the second moving motor 423 is connected to one side of the second LM guide 422 is rotated.

Looking at the operation of the automatic cutting and polishing device for HTCC substrate according to the present invention made of the configuration as described above are as follows.

In the automatic cutting and polishing apparatus for the HTCC substrate according to the present invention, as shown in FIG. 2, when the HTCC substrate 1 is supplied through the substrate supply unit 100, the outer cut portion 200 is cut out, and the outer edge is cut. The cut HTCC substrate 1 is transferred to the first breaking part 300 and cut one by one.

As shown in FIG. 3 and FIG. 5, the first breaking part 300 is mounted on the cut portion of the HTCC substrate 1 at the base 310, and the outside of the first breaking part 300 is mounted on the base 310. The cut HTCC substrate 1 moves the upper fixing part 320 facing the base 310 downward from the upper side by the fixed cylinder 321 to fix the cut HTCC substrate 1.

In addition, the HTCC substrate 1, the outer surface of which is fixed by the base 310 and the upper fixing part 320 is cut, is fixed by the cutting support 330 fixing the lower side of the first row, and the cutting support 330 HTCC substrate (2) to be cut in a row by pressing the pressure unit 340 installed on the upper side opposite to the H) is cut in a row and transferred to the side polishing unit (400).

The lower side of the upper fixing part 320 is coupled to the HTCC fixing part 322 formed of a synthetic resin material for pressing the outer cut HTCC substrate (1) that the damaged HTCC substrate (1) is cut off when pressed To prevent and, the lower one side end of the upper fixing part 320 is in close contact with the HTCC connecting portion 5 for connecting between the HTCC substrate (1) to be cut in one row, and is connected to the moving cylinder (323a) to be transported up and down synthetic resin When the pressurizing part 340 moves downward while the HTCC connection fixing part 323 of the ash is connected, the HTCC connection fixing part 323 moves downward to close the HTCC connection part 5 and cut the outline. When one row of the HTCC substrate 1 is cut and the pressing part 340 moves upward, the HTCC connection fixing part 323 moves upward to cut the HTCC connecting part 5 by the pressing part 340. do.

That is, when the cutting edge 341 protrudes from the lower end of the pressing portion 340 so that the pressing portion 340 moves downward, the cutting blade 330 is engaged with the fixed blade 332 of the cutting support 330 and the HTCC substrate 1 Row 1 of is cut off.

At this time, as shown in Figure 4 and 5, the one side end of the base 310, the concave-convex portion 311 of the concave-convex shape on which the HTCC connecting portion 5 is seated protrudes, of the cutting blade 341 When the cutting edge 341 moves upwards, the connection cutting portion 341a of the concave-convex shape facing the connecting concave-convex portion 311 is formed on the inner side, so that the HTCC connecting portion 5 seated on the concave-convex portion 311 is connected. The concave-convex portion 311 and the connection cutting portion 341a are moved upward while being engaged to cut the HTCC connection portion 5.

In addition, a fixed blade 332 for fixing the lower side of the HTCC substrate 2 cut in one row is coupled to the inner end of the cutting support 330, the lower surface of the cutting support 330 is connected to the ground inwards Since the inclined cylinder 333 which is moved up and down to be inclined is installed, the pressing part 340 connected to one side by a hinge at an upper portion of the cutting support 330 is inclined when moved up and down, and is moved downward to be cut down. This inclined cutting is possible to easily cut the HTCC substrate (1).

In addition, a discharge passage 324 for discharging the cut HTCC connecting portion 5 is installed inside the upper fixing part 320, and a discharge fan suctioned into the HTCC connecting portion 5 inside the discharge passage 324. 325 is installed to discharge the cut HTCC connecting portion 5 which is moved to the discharge passage 324 to the outside to discharge the chip to the outside at the same time cutting the HTCC substrate can be kept clean around the installation site.

6 to 8, the HTCC substrate 2 cut into one row transferred to the side grinding part 400 is cut into one row through the first polishing part 410. One side of the substrate) is polished, and the other side of the HTCC substrate 2 cut in one row by the second polishing unit 420 is polished.

That is, a transfer table 430 connected to the transfer rail 1000 is installed between the first polishing unit 410 and the second polishing unit 420 to lengthen the HTCC substrate 2 cut in one row. HTCC substrate (2) cut in a row by mounting a pair of HTCC fixing rollers 440 to be mounted on the upper surface in the direction, the upper portion of the transfer table 430 to press the HTCC substrate (2) cut in one row from the upper side It is possible to fix the side surface of the HTCC substrate 2 cut in one row from the first polishing portion 410 and the second polishing portion 420.

In addition, the first polishing unit 410 and the second polishing unit 420 of the side polishing unit 400 is the abrasive stone 402 is wrapped on the surface of the polishing roller 401 connected to the reducer P, so that the first, Sides of the HTCC substrate 2 cut in one row by the rotation of the second polishing parts 410 and 420 are polished, and the first polishing part 410 and the second polishing part 420 are cut in one row. When the HTCC substrate 2 cut in one row is moved by being rotated in the direction opposite to the traveling direction of 2), both sides are polished to improve the polishing efficiency.

In addition, a screw is provided at a lower portion of the first polishing unit 410 to move the first roller base 411 from side to side at a lower portion of the first roller base 411 on which the polishing roller 401 is seated. The formed first MP guide 412 is installed and a first moving motor 413 connected to one side of the first LG guide 412 is installed so that the polishing roller 401 is left and right by the first MP guide 412. It is possible to precisely polish the side polishing position of the HTCC substrate 2 cut in one row by easily adjusting the distance between the side of the HTCC substrate 2 cut in one row and the polishing roller 401.

In addition, by installing a second roller base 421, a second LM guide 422 and a second moving motor 423 in the lower portion of the second polishing portion 420 in the same manner as the first polishing portion 410. Both sides of the HTCC substrate 2 cut in one row can be easily adjusted to precisely polish the side polishing position of the HTCC substrate 2 cut in one row.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

1: HTCC substrate 2: 1 row HTCC substrate
5: HTCC connection part 100: substrate supply part
200: outer cutting part 300: first breaking part
310: base 311: connection uneven portion
320: upper fixing part 321: fixed cylinder
322: HTCC Fixed Government 323: HTCC Consolidated Government
323a: mobile cylinder 324: discharge passage
325: discharge fan 330: cutting support
331: base movement cylinder 332: fixed blade
333: inclined cylinder 340: pressure unit
341 cutting blade 341a: connection cutting portion
342: pressure cylinder 400: side grinding
401: polishing roller 402: abrasive stone
410: first polishing unit 411: first roller base
412: the first L-M guide 413: the first moving motor
420: second polishing unit 421: second roller base
422: the second L-M guide 423: the second moving motor
430: transfer table 440: HTCC fixed roller
500: buffer part 600: front polishing part
700: second braking part 800: rear polishing part
900: gripper 1000: transfer rail

Claims (9)

A substrate supply unit 100 for supplying a high temperature co-fired ceramics (HTCC) substrate 1 of the camera module, and an outer cutting unit 200 for cutting an outline of the HTCC substrate 1 supplied from the substrate supply unit 100. ), And the first breaking part 300 for cutting the HTCC substrate cut in the first cutting part 300 in one row, and the HTCC substrate 2 cut in one row in the first breaking part 300. A side polishing portion 400 for polishing the side surface, a buffer portion 500 for moving and arranging a plurality of single-row HTCC substrates 2 polished at both sides from the side polishing portion 400, and the buffer portion 500 ), The front polishing part 600, which polishes the front surface of the HTCC substrate 2, which is arranged in plural and polished on both sides, and the first row HTCC substrate 2, which has been ground on the front polishing part 600, separately. A second braking part 700 to cut, a back grinding part 800 to polish the back of the HTCC cut individually from the second breaking part 700, and the back grinding The gripper 900 collects a plurality of HTCC polished on the rear surface at 800 and is embedded in a tray supplied from one side, and transfers the HTCC substrate 1 and the HTCC substrate 2 in a row and a single HTCC. In the automatic cutting and polishing apparatus for HTCC substrate composed of a rail (1000),
The first breaking part 300 moves up and down to fix the base 310 on which the HTCC substrate 1 is cut, and the HTCC substrate 1 cut on the outside of the base 310. An upper fixing part 320 having a fixed cylinder 321 to be provided, and a pedestal moving cylinder which is moved left and right to fix the lower row of one row of the HTCC substrate 1 whose outer edge is cut at one side of the base 310 ( 331 is provided with a cutting support 330, and the pressing portion 340 for pressing and cutting the HTCC substrate 2 to be cut in a row fixed by the cutting support 330 on the upper side of the cutting support 330. ,
The side polishing unit 400 is a first polishing unit 410 for polishing one side of the HTCC substrate 2 cut in a row in the first breaking unit 300, and the first polishing unit 410 An automatic cutting and polishing apparatus for an HTCC substrate, comprising a second polishing portion (420) for polishing the other side of the HTCC substrate (2) whose side is polished in one row.
The method of claim 1,
The upper fixing part 320 of the first breaking part 300 has an HTCC fixing part 322 for close contact with the HTCC substrate 2 to be cut in one row on the lower surface, and an outer end of the HTCC fixing part 322. HTCC substrate, characterized in that the HTCC connection fixing portion 323 is provided with a moving cylinder 323a for vertically conveying the HTCC connecting portion 5 for connecting between the HTCC substrate 2 to be cut by heat Automatic cutting and polishing equipment.
3. The method according to claim 1 or 2,
The HTCC substrate 2 to be cut in one row fixed at the HTCC fixing part 322 is cut at the lower end of the pressing part 340 of the first breaking part 300 and fixed at the HTCC connecting fixing part 323. A cutting blade 341 protrudes inwardly and is inclined upwardly to cut the HTCC connection part 5, and is connected to the ground on the lower surface of the pressing part 340 to move the pressing part 340 up and down. Automatic cutting and polishing device for HTCC substrate, characterized in that the cylinder 342 is provided.
The method of claim 3, wherein
An inner side of the upper fixing part 320 is formed with a discharge passage 324 for discharging the HTCC connecting portion 5 which is cut while the cutting blade 341 moves upward, and at one end of the discharge passage 324. Automatic cutting and polishing apparatus for an HTCC substrate, characterized in that the discharge fan 325 for sucking the discharged HTCC connection portion 5 is discharged to the outside.
The method of claim 1,
The inner end of the cutting support 330 is provided with a plurality of fixed blades 332 for fixing the lower side of the HTCC substrate 2 cut in one row, the lower surface of the cutting support 330 is connected to the ground and the cutting Automatic cutting and polishing apparatus for a HTCC substrate, characterized in that the inclined cylinder 333 for moving up and down so that the pedestal 330 is inclined inward.
The method of claim 3, wherein
One end of the base 310 is formed with a concave-convex concave-convex portion 311 in which the HTCC connecting portion 5 is seated, and the inner side of the cutting blade 341 is opposed to the concave-convex convex portion 311 to the Automatic cutting and polishing apparatus for an HTCC substrate, characterized in that the connection cutting portion (341a) is formed so that the HTCC connection portion 5 is cut.
The method of claim 1,
The transfer table 430 is connected between the transfer rail 1000 and the HTCC substrate 2 cut in one row between the first polishing unit 410 and the second polishing unit 420. A pair of pressurizing the upper side of the transfer table 430 to the top of the transfer table 430 so that the HTCC substrate 2 cut in one row from the first polishing portion 410 and the second polishing portion 420 is polished. Automatic cutting and polishing apparatus for HTCC substrate, characterized in that the HTCC fixing roller 440 is provided.
The method according to claim 6,
The first polishing unit 410 and the second polishing unit 410 is provided with a polishing roller 401 is rotated in connection with the reducer, the polishing stone 402 is wrapped on the surface of the polishing roller 401, the first Rotation of the first polishing unit 410 and the second polishing unit 410 is rotated in the direction opposite to the traveling direction of the HTCC substrate (2) cut in one row, HTCC substrate automatic cutting and polishing apparatus.
The method of claim 8,
The first roller base 411 on which the polishing roller 401 is seated and the first roller base 411 at the lower part of the first roller base 411 are disposed on the lower part of the first polishing part 410. A first LM guide 412 having a screw formed therein so as to move to the inside, and a first moving motor 413 rotated in connection with one side of the first LM guide 412 are installed.
A second roller base 421 on which the polishing roller 401 is seated and a lower portion of the second roller base 421 are left and right under the second polishing part 420. Automatically for the HTCC substrate, characterized in that the second LM guide 422, the screw is formed on the inside to move to, and the second moving motor 423 is rotated in connection with one side of the second LM guide 422 is installed. Cutting and polishing equipment.

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