KR101211839B1 - Pressure-sensitive adhesive compositions, pressure-sensitive adhesive films, dicing die-bonding films and semiconductor wafers comprising the same - Google Patents

Abstract

The present invention is a base resin; And a pressure-sensitive adhesive composition comprising a photochromic compound, a pressure-sensitive adhesive film, a dicing die-bonding film, and a semiconductor wafer produced using the same. The pressure-sensitive adhesive composition according to the present invention can be easily grasped whether or not the ultraviolet irradiation to the dicing film in the semiconductor packaging step by changing the color by irradiation such as ultraviolet rays. Accordingly, in the present invention, it is possible to provide an adhesive composition, an adhesive film, a dicing die bonding film, and a semiconductor wafer capable of reducing defects that may occur due to opacity of ultraviolet irradiation in a semiconductor packaging process.

Pressure-sensitive adhesive, pressure-sensitive adhesive composition, pressure-sensitive adhesive film, dicing die-bonding film, photochromic compound, photoinitiator, melting point

Description

Pressure-sensitive adhesive compositions, pressure-sensitive adhesive films, dicing die-bonding films and semiconductor wafers comprising the same

The present invention relates to an adhesive composition, an adhesive film produced using the above, a dicing die bonding film, and a semiconductor wafer.

The semiconductor packaging process is largely divided into a pre-process and a post-process, in which the pre-process is the process of grinding the back surface of the wafer to a desired thickness and forming a circuit, and the post-process divides the wafer on which the circuit pattern is formed into single chips. Then, the chip is bonded and wire bonded to the semiconductor substrate (ex. Lead frame) and then molded into an encapsulant.

The process of dividing the wafer into individual chips in a later step is referred to as a dicing step. At this time, an adhesive film used for supporting the wafer and the chip is called a dicing film.

Physical properties required for such a dicing film are as follows. That is, the dicing film should have a high peeling force so as to adhere well to the dicing ring during dicing so that chips do not scatter, and have a low peeling force so that the chip can be peeled off from the dicing film after dicing. The process of peeling a chip from a dicing film is called a pick-up process. Usually, the dicing film used in such a process includes an ultraviolet curable pressure-sensitive adhesive whose peeling force is reduced by irradiation of ultraviolet rays. That is, a dicing film is normally manufactured by apply | coating the adhesive composition containing a base resin and the photocurable compound containing a carbon-carbon double bond in a molecule | numerator to the base film which is transparent to an ultraviolet-ray.

Since the dicing film must be able to withstand the cutting impact by the blade used in the dicing process, and also withstand the water pressure of about 2kg / cm ² used for the purpose of cooling the blade and removal of the burr, Strong adhesion is required before ultraviolet irradiation, but peeling force should be reduced by ultraviolet irradiation after dicing.

That is, whether or not the dicing film is irradiated with ultraviolet rays has a high correlation with the pickup property, that is, the productivity of the semiconductor chip. However, it is difficult to visually determine whether ultraviolet rays are irradiated in the actual process. In addition, although the adhesive peeling force decreases at the portion where the wafer is attached, the peeling force may not decrease at the portion where the adhesive is exposed due to the interference of oxygen, etc. There is a disadvantage that cannot be easily determined.

The present invention has been made in consideration of the above-described problems, the pressure-sensitive adhesive composition, pressure-sensitive adhesive film prepared using the above, a dicing die-bonding film and It is an object to provide a semiconductor wafer.

The present invention provides a pressure-sensitive adhesive composition containing a base resin and a photochromic compound as a means for solving the above problems.

The present invention is another means for solving the above problems, a base film; And

It is provided on the said base film, and provides the adhesive film containing the said adhesive composition.

The present invention is another means for solving the above problems, the pressure-sensitive adhesive film of the present invention; And

It provides a dicing die-bonding film comprising an adhesive portion formed on the adhesive film.

The present invention is another means for solving the above problems, the adhesive portion of the dicing die bonding film of the present invention is attached to one surface of the wafer,

Provided is a semiconductor wafer in which the adhesive film is fixed to a wafer ring frame.

By changing the color of the pressure-sensitive adhesive composition according to the invention by ultraviolet irradiation, it is possible to easily grasp whether or not ultraviolet irradiation to the dicing film in the semiconductor packaging process. Accordingly, in the present invention, it is possible to provide an adhesive composition, an adhesive film, a dicing die bonding film, and a semiconductor wafer capable of reducing defects that may occur due to opacity of ultraviolet irradiation in a semiconductor packaging process.

The present invention is a base resin; And

It relates to a pressure-sensitive adhesive composition containing a photochromic compound.

Hereinafter, the pressure-sensitive adhesive composition of the present invention will be described in detail.

The type of the base resin that can be used in the present invention is not particularly limited, and a general adhesive resin known in the art may be used. In the present invention, for example, an acrylic copolymer having a weight average molecular weight of 200,000 to 1.5 million can be used. If the weight average molecular weight is less than 200,000, chip flying may occur in the dicing process. If the weight average molecular weight is more than 1.5 million, the peeling force may not decrease after ultraviolet irradiation, and pick-up may not be easily performed. There is.

The acrylic copolymer as described above may include, for example, a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer.

The kind of the (meth) acrylic acid ester monomer is not particularly limited, and alkyl (meth) acrylate can be used, for example. At this time, when the alkyl group contained in the monomer is too long, the cohesive force of the pressure-sensitive adhesive may be lowered, and the glass transition temperature and the adhesiveness may be difficult to control. Therefore, it is preferable to use a monomer having an alkyl group having 1 to 12 carbon atoms. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, or a mixture of one or more of n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate and decyl (meth) acrylate. However, it is not limited thereto. The (meth) acrylic acid ester monomer as described above is preferably included in the acrylic copolymer in an amount of 70 to 99 parts by weight. If the content is less than 70 parts by weight, there is a risk that the initial adhesive strength of the pressure-sensitive adhesive is lowered, if it exceeds 99 parts by weight, cohesive force may be lowered and it is difficult to control the peeling force.

The crosslinkable functional group-containing monomer included in the copolymer imparts a functional group capable of reacting with a crosslinking agent or an ultraviolet curable compound to be described later to the copolymer, thereby controlling durability, adhesiveness, and cohesion of the pressure-sensitive adhesive.

Examples of the crosslinkable functional group-containing monomers include hydroxy group-containing monomers and carboxyl group-containing monomers. Examples of the hydroxy group-containing monomers above include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) Acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate, and examples of the carboxyl group-containing monomer include ( Meta) acrylic acid, 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid and male Acid anhydrides, but is not limited thereto. In the present invention, a mixture of one or more of the above can be used.

The crosslinkable functional group-containing monomer is preferably included in an amount of 1 to 30 parts by weight in the acrylic copolymer. When the content is less than 1 part by weight, it may be difficult to peel off the adhesive or add an ultraviolet curable compound, and when it exceeds 30 parts by weight, a gel may be formed when the pressure-sensitive adhesive is manufactured or the storage stability of the pressure-sensitive adhesive may deteriorate. have.

The acrylic copolymer may further include an ultraviolet curable compound bonded to the side chain of the main chain comprising a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer.

The kind of the above compound contains 1 to 5, preferably 1 to 2, photocurable functional groups (ex. Ultraviolet polymerizable carbon-carbon double bonds) per molecule, and is also included in the main chain. It does not restrict | limit especially as long as it has a functional group which can react with a functional group. In this case, examples of the functional group capable of reacting with the crosslinkable functional group of the main chain include an isocyanate group or an epoxy group, but are not limited thereto.

Specific examples of the ultraviolet polymerizable group-containing compound include a functional group capable of reacting with a hydroxyl group included in the main chain, and include (meth) acryloyloxy isocyanate, (meth) acryloyloxy methyl isocyanate, and 2- ( Meta) acryloyloxy ethyl isocyanate, 3- (meth) acryloyloxy propyl isocyanate, 4- (meth) acryloyloxy butyl isocyanate, m-propenyl-α, α-dimethylbenzyl isocyanate, methacryloyl Isocyanates or allyl isocyanates; An acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with 2-hydroxyethyl (meth) acrylate; An acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or polyisocyanate compound, a polyol compound and 2-hydroxyethyl (meth) acrylate; Or a functional group capable of reacting with a carboxyl group included in the main chain, but may be one kind or two or more kinds such as glycidyl (meth) acrylate or allyl glycidyl ether, but is not limited thereto.

The ultraviolet curable compound as described above may be included in the side chain of the base resin by substituting 5 mol% to 90 mol% of the crosslinkable functional groups included in the main chain. When the amount of substitution is less than 5 mol%, there is a concern that the peeling force decrease due to ultraviolet irradiation may not be sufficient, and when the amount of substitution exceeds 90 mol%, the cohesion force of the pressure-sensitive adhesive before ultraviolet irradiation may decrease.

The method for producing the acrylic copolymer as described above is not particularly limited and can be prepared, for example, through a general polymerization method such as solution polymerization, photopolymerization, bulk polymerization, suspension polymerization or emulsion polymerization. In the present invention, it is particularly preferable to use a solution polymerization method, and solution polymerization is preferably performed at a polymerization temperature of 50 ° C to 140 ° C by mixing an initiator in a state where each monomer is uniformly mixed. Examples of initiators that can be used include azo polymerization initiators such as azobis isobutyronitrile or azobiscyclohexane carbonitrile; And / or conventional initiators such as peroxides such as benzoyl peroxide or acetyl peroxide, and one or a mixture of two or more of them may be used.

In addition, a method of introducing an ultraviolet curable functional group into the side chain of the acrylic copolymer (main chain) prepared as described above is also not particularly limited. For example, the acrylic copolymer and the ultraviolet curable compound forming the main chain may be prepared at room temperature. It can be prepared by reacting for 4 hours to 48 hours at an atmospheric pressure of the temperature of 40 to 40 ℃. At this time, the reaction may be carried out using a catalyst such as organic tin in a solvent such as ethyl acetate.

The pressure-sensitive adhesive composition of the present invention is characterized by including a photochromic compound together with the base resin as described above. The term "photochromic compound" used in the present invention refers to a compound that is discolored by ultraviolet irradiation, so that the discoloration state can be maintained for a certain time. In the present invention, in particular, in consideration of the process time, it is possible to use a compound in which the discoloration state by ultraviolet irradiation is maintained for at least 8 hours, preferably at least 12 hours, more preferably permanently. The changing color of the compound may be varied, including yellow and blue, and the like, as long as the color can be distinguished by the human eye during the process, it is not particularly limited.

The kind of photochromic compound that can be used in the present invention is not particularly limited as long as it has the above physical properties. For example, in the present invention, spiropyrans, spirooxazines, spironapthoxazine, naphtopyrane, chromone, chromenes, fulgides, fulgimid (fulgides) fulgimides, diarylenthenes, spirodihydroindolizines, azo compounds, polycyclic aromatic compounds, anils, polycyclic quinones, bio One kind or two or more kinds of lozenges (viologens), triarylmethanes or perimidinespirocyclohezadienones, or one or more derivative compounds thereof may be used, but is not limited thereto.

The photochromic compound as described above is preferably included in the composition in an amount of 0.1 parts by weight to 10 parts by weight based on 100 parts by weight of the base resin. If the content is less than 0.1 part by weight, there is a fear that the discoloration phenomenon after the ultraviolet irradiation is not observed visually, if more than 10 parts by weight, the compatibility with the pressure-sensitive adhesive is poor, there is a risk of affecting the adhesive properties or peeling force.

The pressure-sensitive adhesive composition of the present invention may further include 900 parts by weight or less, preferably 5 parts by weight to 400 parts by weight of an ultraviolet curable compound, based on 100 parts by weight of the base resin. The type of ultraviolet curable compound that can be used at this time is not particularly limited, and for example, a polyfunctional compound (eg, urethane acrylate, polyfunctional acrylate monomer or oligomer, etc.) having a weight average molecular weight of about 500 to 300,000 may be used. Can be. The average person skilled in the art can easily select the appropriate compound according to the intended use.

When content of the said ultraviolet curable compound exceeds 900 weight part, there exists a possibility that the cohesion force of the adhesive before ultraviolet irradiation may fall too much, or peeling with a release film etc. may not become easy.

The pressure-sensitive adhesive composition of the present invention may further include 0.05 parts by weight to 20 parts by weight of a photoinitiator based on 100 parts by weight of the base resin as described above. Such photoinitiator reacts by irradiation of ultraviolet rays and serves to reduce the peeling force of the pressure-sensitive adhesive. The kind of photoinitiator which can be used by this invention is not specifically limited, For example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether , Acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane- 1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1-one, 4- (2-hydroxyethoxy) phenyl 2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2 t-butyl anthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone Benzyldimethyl Dea, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl Or one or more kinds of diphenyl-phosphine oxide and the like.

In this invention, it is especially preferable to use the photoinitiator whose melting point is 70 degreeC or more as said photoinitiator. That is, in general, the dicing die-bonding film has a problem in that the peeling force is changed at the interface between the dicing film and the die-bonding film when stored for a long time at a temperature higher than room temperature, so that the pick-up property is poor in the packaging process. However, by using the photoinitiator having the characteristic melting point as described above, even when the pressure-sensitive adhesive is stored at room temperature can be provided a composition that can be suppressed the change in peel force with the adherend. The upper limit of the melting point of the photoinitiator is not particularly limited, for example, may be about 300 ℃.

As the type of photoinitiator having a melting point of 70 ° C. or higher as described above, a kind or heterologous compound such as α-amine ketone, monoacyl phosphine, bisacyl phosphine, or metallocene may be used. Such photoinitiators are commercially available under the trade names Igacure 369, Igacure 907, Icacure 2959, Icacure 1173, Igacure 819, Icacure 784, Darocur TPO or Darroque MBF. have.

The content of the photoinitiator is preferably 0.05 part by weight to 20 parts by weight based on 100 parts by weight of the base resin. If the content is less than 0.05 part by weight, the curing reaction by ultraviolet irradiation is not performed smoothly, there is a fear that the pickup properties. In addition, when the content exceeds 20 parts by weight, the crosslinking reaction proceeds in a short unit during curing, and the ultraviolet curable compound having a low molecular weight remains in the adhesive to cause residue of the adherend, or the peeling force after curing is excessively lowered, thereby picking up. There is a fear that the positioning of the chip becomes difficult.

The pressure-sensitive adhesive composition of the present invention may further include 2 to 40 parts by weight, preferably 2 to 20 parts by weight of a crosslinking agent, based on 100 parts by weight of the base resin. If the content of the crosslinking agent is less than 2 parts by weight, the cohesive force of the pressure-sensitive adhesive may be reduced or the pick-up property may be lowered. If the content of the crosslinking agent is more than 40 parts by weight, the peeling force before irradiation may be insufficient and chip scattering may occur. .

The kind of crosslinking agent which can be used by this invention is not specifically limited, For example, normal crosslinking agents, such as an isocyanate type compound, an aziridine type compound, an epoxy type compound, or a metal chelate type compound, can be used.

At this time, examples of the isocyanate compound include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate, naphthalene diisocyanate and any one of the above polyols ( ex. trimethylol propane); Examples of epoxy compounds include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine and glycerin diglycidyl ether. One or more selected from the group consisting of; Examples of aziridine compounds include N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxes) Mid), triethylene melamine, bisisoprotaloyl-1- (2-methylaziridine), and tri-1-aziridinylphosphine oxide. In addition, examples of the metal chelate-based compound may be a compound in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetyl acetone, ethyl acetoacetate, or the like. It is not limited.

The pressure-sensitive adhesive composition of the present invention may further contain, if necessary, one or more tackifiers such as rosin resin, terpene resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin or aliphatic aromatic copolymer based petroleum resin. It may further include, in addition, selected from the group consisting of epoxy resins, curing agents, ultraviolet stabilizers, antioxidants, colorants, reinforcing agents, fillers, antifoaming agents, surfactants and plasticizers in a range that does not affect the effects of the invention It may further comprise one or more additives.

The present invention also provides a base film; And

It is related with the adhesive film formed on the said base film, and containing the adhesive layer containing the adhesive composition which concerns on this invention mentioned above. Such an adhesive film of the present invention can be effectively used as a dicing tape in the semiconductor packaging process.

The kind of base film which can be used above is not specifically limited, For example, a low density polyethylene film, a linear polyethylene film, a medium density polyethylene film, a high density polyethylene film, an ultra low density polyethylene film, the random copolymer film of polypropylene, poly Block copolymer film of propylene, homopolypropylene, polymethylpentene, ethylene-vinyl acetate copolymer film, ethylene-methacrylic acid copolymer film, ethylene-methyl methacrylate copolymer film, ethylene-ionomer aerial And a film of one or more kinds such as a copolymer film, an ethylene-vinyl alcohol copolymer film, a polybutene film, a copolymer of styrene or an elastomer, and the like. The heterogeneous base film in the above means a film of a structure in which each base film is laminated in two or more layers or a film prepared from two or more kinds of blends of the above resins.

Such base films may also be subjected to conventional physical or chemical treatments, such as matt treatment, corona discharge treatment, primer treatment or crosslinking treatment, as necessary.

In the present invention, a film having similar biaxial stretching characteristics may also be used as the base film, and more specifically, the difference in elongation in the longitudinal direction (MD) and the width direction (TD) is 10% of the longitudinal direction (MD) elongation. Film, preferably within 5%, can be used.

The thickness of the base film as described above is not particularly limited as long as it satisfies the above relationship, and may be, for example, 30 μm to 300 μm, preferably 50 μm to 200 μm. If the thickness is less than 30 μm, the cutting depth may become unstable in the dicing process. If the thickness exceeds 300 μm, a large amount of burrs may be generated or the elongation is lowered in the dicing process. There is a fear that the expansion process may not be performed correctly.

In addition, the base film is preferably excellent in UV transmittance, for example, may have a UV transmittance of 70% or more, preferably 90% or more.

It is preferable that the said adhesive layer contained in the adhesive film of this invention shows high peeling force before ultraviolet irradiation, and peeling force is effectively reduced after ultraviolet irradiation. Accordingly, the pressure-sensitive adhesive layer of the present invention has a peeling force of 100 gf / in or more, preferably 150 gf / in or more before ultraviolet irradiation, and the peeling force may be reduced to 10 gf / in or less after ultraviolet irradiation.

The thickness of the pressure-sensitive adhesive layer as described above is not particularly limited, and may be, for example, 1 μm to 50 μm, preferably 5 μm to 40 μm. If the thickness of the pressure-sensitive adhesive layer is less than 1 µm, the peeling force may be inferior, and scattering of chips may occur.

The method for forming the pressure-sensitive adhesive layer as described above is not particularly limited, and for example, after applying the pressure-sensitive adhesive composition of the present invention directly on a base film, and then applying or drying the pressure-sensitive adhesive composition on a peelable base material once And the method of transferring an adhesive layer onto a base film using the said peelable base material can be used.

At this time, the method of coating and drying the pressure-sensitive adhesive composition is not particularly limited, and for example, the composition is diluted as it is or diluted with a suitable organic solvent, and applied by a known means such as a comma coater, gravure coater, die coater or reverse coater. Then, a method of drying the solvent for 10 seconds to 30 minutes at a temperature of 60 ℃ to 200 ℃ can be used. In addition, in the above process, an aging process for advancing a sufficient crosslinking reaction of the pressure-sensitive adhesive may be further performed.

The present invention also, the adhesive film according to the present invention; And

It relates to a dicing die-bonding film comprising an adhesive portion formed on the adhesive film.

The adhesive part included in the dicing die bonding film preferably has a reflectance of 0.02% to 50% in a wavelength region of 350 to 390 nm. By controlling the reflectance in this manner, even when a small amount of ultraviolet light is irradiated for a short time during the process, a large peel force decreases, and the pick-up property of the chip can be improved. When the said reflectance is less than 0.02%, there exists a possibility that the reduction of the peeling force of the adhesive layer by ultraviolet irradiation may not arise easily, and when it exceeds 50%, the reduction of the peeling force of the adhesive layer by ultraviolet irradiation will become large too much, and a die bonding film The adhesion between the chip and the chip may be lowered, causing the chip to scatter during expansion or chipping during transportation.

The component which comprises such an adhesive bond layer of this invention is not specifically limited. However, the adhesive layer used for die bonding preferably satisfies both characteristics such as bending and stress relaxation of the chip and the semiconductor substrate in the package. Generally, the thermal expansion coefficient (CTE) of a semiconductor chip is about 4 ppm / ° C, and the thermal expansion coefficient (CTE) of a semiconductor substrate is about 10 to 15 ppm / ° C. There is a risk of cracking and the like. Therefore, it is preferable that the adhesive bond layer used by this invention is excellent in physical properties, such as adhesive force and heat resistance, preventing the bending of the said product, etc., and excellently controlling stress relaxation characteristics etc. at high temperature.

In the present invention, the component included is not particularly limited as long as the adhesive layer satisfies the above characteristics. For example, in the present invention, a composition in which two or more kinds of resins having different elasticities are mixed to coexist with soft segments and hard segments can be used, and as a result, a difference in thermal expansion coefficients of a semiconductor chip and a substrate can be used. It is possible to provide an adhesive having excellent physical properties such as adhesive strength and heat resistance while having stress relaxation characteristics that can prevent warpage.

That is, in this invention, the thing containing a high molecular weight flexible epoxy resin and a low molecular weight rigid epoxy resin can be used as said adhesive bond layer.

The high molecular weight flexible epoxy resin included in the adhesive layer of the present invention means a resin containing two or more epoxy groups in a molecule and having a glass transition temperature of 50 ° C or lower. The kind of high molecular weight flexible epoxy resin used in the present invention is not particularly limited as long as the above conditions are satisfied. For example, an epoxy resin containing an aliphatic repeating unit in the main chain forming the skeleton of the epoxy can be used. In the above, the inclusion of an aliphatic repeating unit in the main chain means that the main chain is composed of only aliphatic repeating units, or the long chain aliphatic repeating unit is included in the main chain. The long chain aliphatic repeating unit may be a long chain alkyl such as polyethylene, polypropylene, or polybutadiene; Long chain alkyl glycols such as polyethylene glycol (PEG) or polypropylene glycol (PPG); (Meth) acrylic acid esters such as ethylhexyl (meth) acrylate, butyl (meth) acrylate, n-octyl (meth) acrylate or n-dodecyl (meth) acrylate; It is preferred to include, but is not limited to, one or more polymer structures selected from the group consisting of vinyl acetate and styrene. The epoxy resin as described above does not occur at room temperature or low temperature after curing. Therefore, the flexible epoxy resin can be maintained in a film form without breaking before curing at high molecular weight, forms a crosslinked structure during the curing process, and has viscoelasticity even after the crosslinked product is formed.

The high molecular weight flexible epoxy resin as described above has its own glass transition temperature of -30 ° C to 50 ° C, preferably -20 ° C to 40 ° C, more preferably 0 ° C to 30 ° C, before curing. If the glass transition temperature is less than -30 ° C, the flowability may be increased at the time of film formation, and the handleability may deteriorate. If the glass transition temperature is higher than 50 ° C, the adhesion force with the wafer at low temperature may be low, and the chip may be removed during the dicing process. There is a fear of scattering or penetration of the wash water between the adhesive and the chip.

The high molecular weight flexible epoxy resin also has a weight average molecular weight of 100,000 to 1 million, preferably 100,000 to 800,000, more preferably 100,000 to 300,000. If the weight average molecular weight is less than 100,000, the film may be inferior in strength, poor in handleability and heat resistance, or may not be able to control flowability during circuit filling. In addition, when the weight average molecular weight exceeds 1 million, the elastic modulus and / or the flow inhibitory effect at the time of die bonding is too large, there is a fear to reduce the circuit filling and reliability of the film.

As described above, examples of the high molecular weight flexible epoxy resin having a glass transition temperature of −30 to 50 ° C. and a weight average molecular weight of 100,000 to 1 million before curing may include high molecular weight aliphatic epoxy or rubber modified epoxy, and the present invention. It is preferable to use a structure having excellent self-elasticity, including ether groups in the main chain.

The low molecular weight rigid epoxy resin used in the present invention means an epoxy resin having a glass transition temperature of more than 50 ° C. after curing. The low molecular weight rigid epoxy resin may be used without limitation as long as it contains two or more epoxy groups in the main chain and has a glass transition temperature exceeding 50 ° C. For example, a repeating unit having an aromatic structure in the main chain constituting the epoxy skeleton may be included. An epoxy resin can be used. Such epoxy resins form a crosslinked structure in the curing process and become hard, and have excellent adhesion, heat resistance and mechanical strength.

In this invention, it is preferable to use the polyfunctional epoxy resin whose average epoxy equivalent is 180-1000 as said low molecular weight rigid epoxy resin. If the equivalent is less than 180, the crosslinking density becomes too high, and the entire adhesive film tends to exhibit rigid properties. If the equivalent weight exceeds 1000, the glass transition temperature may be lowered as opposed to the characteristics of the present invention requiring high heat resistance. . It is preferable that the low molecular weight rigid epoxy resin also has a self-softening point of 50 to 100 ° C before curing. If the softening point is smaller than 50 ° C., the modulus of the A-stage state of the film may drop, the tack may increase, and the handleability may deteriorate. There may be a problem such as chip scattering. The term "A-stage" used above is a term indicating the degree of curing of the thermosetting resin. Thermosetting resins, such as epoxy resins, can be classified into A, B, and C-stages according to their curing conditions. In the case of A-stages, they are typically uncured, and FT-IR was used to measure the conversion rate due to curing of epoxy groups. When the progression of about 0% to 20%, the B-stage is about 20 to 60%, the C-stage is about 60% to 100% of the transition state.

Examples of such polyfunctional epoxy resins include cresol novolac epoxy resins, bisphenol A novolac epoxy resins, phenol novolac epoxy resins, tetrafunctional epoxy resins, biphenyl type epoxy resins, triphenol methane type epoxy resins, and alkyls. One or more selected from the group consisting of a modified triphenol methane epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, and a dicyclopentadiene modified phenol type epoxy resin, but is not limited thereto.

10 weight part-200 weight part are preferable with respect to 100 weight part of high molecular weight flexible epoxy resin, and, as for content of the low molecular weight rigid epoxy resin contained in the adhesive bond layer of this invention, 20 weight part-100 weight part are more preferable. If the content is less than 10 parts by weight, the heat resistance and handleability may be lowered. If the content is more than 200 parts by weight, the rigidity of the film may be too high, and workability and reliability may be reduced.

The adhesive layer may further include an elastic reinforcing resin having a weight average molecular weight of 50,000 or more in the form of an additive. Specific examples of the elastic reinforcing resin include polyester, polyvinyl alcohol, polyvinyl butyral, polyvinyl chloride, polystyrene, polyamide, polyimide, phenoxy, polyvinyl ether and / or polyethylene, and a rigid epoxy Phenoxy resins are preferred from the viewpoint of compatibility with the resins. In addition, synthetic rubbers such as butadiene rubber (BR), acrylonitrile butadiene rubber (NBR), acrylic rubber (AR) and / or styrene butadiene rubber (SBR) can also be used, in particular carboxyl group-modified acrylonitrile butadiene rubber Preference is given to using (CTBN). The content of the elastic reinforcement resin is preferably in the range of 50 to 1000 parts by weight based on 100 parts by weight of the high molecular weight flexible epoxy resin, but is not limited thereto.

The adhesive layer of the present invention may further comprise a curing agent. The type of the curing agent is not particularly limited as long as it can react with the high molecular weight flexible epoxy resin and / or the low molecular weight rigid epoxy resin to form a crosslinked structure, but may react with both components to form a crosslinked structure. It is desirable to have. Such a curing agent has a crosslinked structure with a high molecular weight flexible epoxy resin constituting a soft segment and a low molecular weight rigid epoxy resin constituting a hard segment, respectively, to improve heat resistance of the adhesive layer and at the interface of the two types of epoxy resins. It is preferable in that it can improve the reliability of the semiconductor package by acting as a link between the two resins.

The curing agent used in the present invention is not particularly limited as long as it can play such a role, but in terms of heat resistance, a polyfunctional phenol resin is preferable, and a polyfunctional phenol resin having a hydroxyl equivalent of 100 to 1000 is more preferable. If the hydroxyl equivalent is less than 100, the hardness of the cured product may be high, and the hygroscopic property may be lowered. If the hydroxyl equivalent is more than 1000, the glass transition temperature may be lowered and the heat resistance may be weak. Examples of such polyfunctional phenol resins include bisphenol A resin, phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, phenol aralkyl resin, polyfunctional novolak, dicyclopentadiene phenol novolak resin, amino Triazine phenol novolak resin, polybutadiene phenol novolak resin, biphenol type resin, or other polyfunctional resin is mentioned, These can be used individually or in mixture of 2 or more types.

The amount of the curing agent as described above is preferably 0.4 equivalent to 2.4 equivalents, more preferably 0.8 to 1.2 equivalents, relative to the total epoxy resin. In addition, the content of the curing agent is preferably 50 parts by weight to 150 parts by weight based on 100 parts by weight of the total epoxy resin. If the content is less than 50 parts by weight, a large amount of unreacted epoxy group remains, there is a concern that a high temperature or a long time of heat is applied to secure the glass transition temperature and the reaction of the remaining epoxy groups, if it exceeds 150 parts by weight There exists a possibility that a moisture absorption rate, storage stability, a dielectric characteristic, etc. may deteriorate by reaction hydroxyl group.

The adhesive layer of the present invention may further include 0.1 to 10 parts by weight, preferably 0.5 to 3 parts by weight of a curing accelerator, based on 100 parts by weight of the total epoxy resin. When the content is less than 0.1 part by weight, crosslinking of the epoxy resin may be insufficient due to a decrease in reaction rate, resulting in a decrease in heat resistance. When it exceeds 10 parts by weight, a curing reaction may occur rapidly and storage stability may decrease. There is. Examples of the curing accelerator usable in the present invention include imidazole series, triphenylphosphine (TPP) or tertiary amines. In the present invention, it is preferable to use the above-mentioned imidazole series curing accelerator, and examples of such imidazole series curing accelerator are 2-methyl imidazole (2MZ), 2-ethyl-4-methyl imidazole (2E4MZ), 2- Phenyl imidazole (2PZ), 1-cyanoethyl-2-phenyl imidazole (2PZ-CN), 2-undecyl imidazole (C11Z), 2-heptadecyl imidazole (C17Z) or 1-cyanoethyl- 2-phenyl imidazole trimetalate (2PZ-CNS) is mentioned. In the present invention, one or two or more kinds of the above-mentioned curing accelerators can be used.

The adhesive layer of the present invention may also further contain a certain amount of colored material (colored filler or pigment) in view of reflectance control. By including such colored materials, it is possible to control the reflectance of the adhesive layer, and also to give a color to the adhesive layer, to facilitate the separation of the die bonding and dicing film, shortening the process time and reducing the defective rate And it has the advantage that can improve the work efficiency.

The type of colored material that can be used is not particularly limited, but it is preferable to use colored materials having an L * value of 30 or more in the CIE coordinate system. The CIE coordinate system is a color value defined by the International Lighting Institution (CIE), also called a CIE color space. The coordinate system is a uniform color space coordinate and is a coordinate system that is currently standardized worldwide because it shows a very close difference with the eyes. In the coordinate system, color coordinates are represented by numerical values of L *, a *, and b *, of which L * is a three-dimensional coordinate representing lightness. L * = 100 is completely white (more specifically the color of the light source) and L * = 0 is completely black. If the value of L * is less than 30, the reflectance of the colored material itself is too low, and there is a fear that the desired reflectance may not be obtained.

Examples of such colored materials include white carbon, calcium carbonate, alumina, aluminum hydrate, magnesium oxide, magnesium hydroxide, basic magnesium carbonate, natural silicate, synthetic silicate, silicon dioxide, barium sulfate, titanium oxide (TiO _2). ), Lithopone (ZnS + BaSO ₄ ), zincation (ZnO) or lead white (2PbCO ₃ Pb (OH) ₂ ); Iron oxide (Fe ₂ O ₃ ) or cadmium red (CdS + CdSe) as a red series; Cadmium yellow (CdS or CdS + ZnS), chromium yellow (PbCrO ₄ ) or titanium yellow (TiO ₂ ? NiO? Sb ₂ O ₃ ) as a yellow series; Chromium oxide (Cr ₂ O ₃ ) as a green series; Blue-based blue pigments (3NaAl? SiO ₄ ? Na ₂ S ₃ ), blue pigment (F24 [Fe (CN) ₆ ] ₃ ? NH ₂ O), cobalt blue (CoO? NAl ₂ O ₃ ), or cobalt purple (CoO MgO B ₂ O ₃ ); Brown pigments (FeO _3- MnO _2- Mn ₃ O ₄ ) and the like. In the present invention, one or two or more kinds of the above-described colored materials can be used.

In the present invention, the colored material as described above has an average particle diameter of 1 nm to 10 μm, preferably 1 nm to 1 μm. If the particle diameter is smaller than 1 nm, there is a fear that the material may aggregate in the adhesive layer, and the reflectance may not be uniform, but may be lowered. On the other hand, when the thickness exceeds 10 µm, the colored material protrudes from the surface of the adhesive layer, which may cause damage to the chip during thermocompression bonding with the wafer or inhibit the adhesion improving effect.

In the present invention, the colored material is preferably included in 0.1 part by weight to 100 parts by weight with respect to 100 parts by weight of the epoxy resin. However, the content is only one example of the present invention, in the present invention can be freely changed the content of the colored material according to the color, brightness and reflectance of the desired adhesive layer.

The adhesive layer of the present invention may also further comprise a coupling agent. The included coupling agent may improve the adhesion between the adhesive portion and the wafer. Moreover, the said coupling agent can improve adhesiveness and adhesiveness, and can also improve moisture-heat-resistant characteristics, without impairing the heat resistance of hardened | cured material by the organic functional group reacting with a resin component at the time of hardening reaction. Examples of the coupling agent that can be used include a silane-based, titanium-based or aluminum-based coupling agent, and a silane-based coupling agent is preferable in view of high cost-effectiveness. Examples of such silane coupling agents include one or more selected from the group consisting of amino silanes, epoxy silanes, mercapto silanes, ureido silanes, methacryloxy silanes, vinyl silanes and sulfido silanes.

The method for producing the adhesive part including the adhesive layer as described above is not particularly limited, and includes, for example, a first step of preparing a resin varnish by dissolving or dispersing a composition containing the above-described components in a solvent; A second step of applying the resin varnish to a base film or a release film; And

The resin varnish may be prepared by a method comprising a third step of removing the solvent by heating the base film or the release film is applied.

The first step is to prepare a resin varnish using the adhesive resin composition according to the present invention, the solvent is usually methyl ethyl ketone (MEK), acetone (Acetone), toluene (Toluene), dimethylformamide (DMF) Or a mixture of one or more kinds of methyl cellosolve (MCS), tetrahydrofuran (THF), N-methylpyrrolidone (NMP) or ethyl acetate can be used. In this case, in consideration of the heat resistance of the base film, a low boiling point solvent may be used, or a high boiling point solvent may be used in order to improve coating properties.

In the first step, a filler may also be used in view of shortening the process time and improving dispersibility, and in this case, the first step may include: (1) mixing a solvent, a colorant, and a coupling agent; (2) adding and mixing a low molecular weight rigid epoxy resin and a curing agent to the mixture of step (1); And

(3) may comprise mixing a high molecular weight flexible epoxy resin and a curing accelerator in the mixture of step (2).

Examples of the filler that may be used at this time may be a ball mill, bead mill, three rolls, or a combination of two or more kinds of high speed dispersers, or a material of the balls or beads. Glass, alumina or zirconium, and the like, and in particular, in view of dispersibility of particles, zirconium balls or beads are preferred.

The second step of the production of the adhesive film is a step of applying the prepared resin varnish to the base film (or release film), the coating method is not particularly limited, for example, knife coating method, roll coating method, spray coating The method, the gravure coat method, the curtain coat method, the comma coat method, the lip coat method, etc. can be used.

The third step of the production of the adhesive film is a step of removing the solvent by heating the base film (or release film) to which the resin varnish is applied. This process is preferably performed for 1 to 20 minutes at a temperature of 70 ℃ to 250 ℃, but is not limited thereto.

The method for producing a dicing die-bonding film using the adhesive prepared as described above is not particularly limited, and for example, may be prepared by laminating the adhesive film and the adhesive. At this time, a lamination method is not specifically limited, For example, a hot roll lamination or a lamination press method can be used. Among the above, the hot roll lamination method is preferable in terms of continuous processability and efficiency. The hot roll lamination method may be performed at a pressure of 0.1 Kg _f / cm ² to 10 Kg _f / cm ² at a temperature of 10 ° C to 100 ° C, but is not limited thereto.

In the present invention, the adhesive portion of the dicing die-bonding film according to the present invention is attached to one side of the wafer,

The adhesive film of the said dicing die-bonding film relates to the semiconductor wafer which is fixed to the wafer ring frame.

The semiconductor wafer as described above may be manufactured by attaching (laminating) the adhesive portion of the dicing die bonding film to the back surface of the wafer at a temperature of 0 ° C to 180 ° C and fixing the base film to the wafer ring frame. .

An example of the process of manufacturing a semiconductor device using such a semiconductor wafer is as follows. That is, the semiconductor wafer with the dicing die-bonding film described above is completely cut using a dicing apparatus and divided into individual chips. Thereafter, the pressure-sensitive adhesive is cured through ultraviolet irradiation. As mentioned above, the adhesive hardened | cured by the ultraviolet-ray reduces the adhesive force of an adhesive agent, and it becomes easy to pick up a chip in a post process. At this time, if necessary, an expanding process of tensioning the dicing die-bonding film may be performed to determine the spacing between the chips, and the pick-up may be facilitated by causing misalignment at the interface between the adhesive portion and the adhesive portion.

When the chip is picked up in the above state, the semiconductor wafer and the adhesive portion are peeled off from the adhesive portion, thereby obtaining a chip having only the adhesive layer. The obtained chip | tip with the said adhesive bond layer is affixed on the board | substrate for semiconductors. The adhesion temperature of the chip is usually 100 ° C to 180 ° C, the adhesion time is 0.5 seconds to 3 seconds, and the adhesion pressure is 0.5 kgf / cm ² to 2 kgf / cm ² .

After the above process, a semiconductor device is obtained through a wire bonding and molding process.

The manufacturing method of a semiconductor device is not limited to the said process, Arbitrary process may be included and the order of a process may be changed. For example, the process may proceed to an ultraviolet curing → dicing → expanding process, or may proceed to a dicing → expanding → ultraviolet curing process. It may further comprise a heating or cooling process after the chip attach process.

Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited to the examples given below.

Example  One.

Adhesive film ( Dicing  Film production)

2-ethylhexyl acrylate, methyl acrylate, methyl methacrylate and hydroxy ethyl acrylate were copolymerized to prepare an acrylic copolymer (weight average molecular weight: 800,000, glass transition temperature: -40 ° C). Subsequently, 5 parts by weight of Coronate L (manufactured by Nippon polyurethane), 10 parts by weight of PSY-750 (manufactured by Shinna Kamura) with a weight average molecular weight of 20,000, and 7 parts by weight of the multifunctional oligomer, based on 100 parts by weight of the copolymer prepared A negative photoinitiator (Darocur TPO, Ciba Co., Ltd.) was mixed to prepare an adhesive composition. Thereafter, 0.1 part by weight of the photochromic compound (Reversacol Solar Yellow (SY), JAMES ROBINSON (manufactured)) was mixed with respect to the base resin, and then the composition was dried on a release-treated polyester film (thickness: 38 μm). The coating was applied to a thickness of 10 μm, and dried at 110 ° C. for 3 minutes to prepare an adhesive layer. Subsequently, the prepared pressure-sensitive adhesive layer was laminated on a polyolefin film having a thickness of 100 μm to prepare an adhesive film (dicing tape).

Dicing Die bonding  Manufacture of film

75 parts by weight of high molecular weight aliphatic epoxy (molecular weight: 850,000, SG-P3, Nagase Chemtex) and cresol novolac epoxy (softening point 70 ° C, EOCN-1020, Japanese gunpowder) After mixing 25 parts by weight, phenol novolak resin (hydroxyl equivalent = 106, KPH-F2001, Kolon (manufacturer)) was mixed in the amount of 15 parts by weight based on the weight of the cresol novolak epoxy resin as a curing agent. Subsequently, 0.5 parts by weight of imidazole cure accelerator (2P4MHZ) was added based on 100 parts by weight of the mixture, followed by stirring for about 1 hour. Subsequently, as a colored filler, 10 parts by weight of silica having a particle size of 16 nm was mixed based on 100 parts by weight of the total mixture, stirred for about 3 hours, and then coated on a substrate to have a thickness of 20 μm after drying to prepare an adhesive film. Subsequently, the prepared adhesive film was laminated by the pressure-sensitive adhesive film and laminol heating to prepare a dicing die-bonding film.

Example  2.

A dicing die-bonding film was prepared in the same manner as in Example 1 except that the same photochromic compound was used in an amount of 10 parts by weight.

Comparative example  One.

Dicing die-bonding film was prepared in the same manner as in Example 1 except that no photochromic compound was used.

The physical properties of the dicing die-bonding films of Examples and Comparative Examples prepared above were evaluated by the following methods, and the results are shown in Table 1 below.

One. Peel force  evaluation

After preparing the prepared adhesive film in 1 inch width, it adhered by reciprocating twice with a 2 kg roller using the die-bonding film as a to-be-adhered body. After 30 minutes after the application of ultraviolet light was irradiated, 180 ° peel force (peel rate: 300 mm / min) was measured by using a tensile analyzer (Texture Analyzer). The measurement was performed three times or more per one sample, the average value is shown in Table 1, wherein the ultraviolet irradiation conditions were as follows.

UV irradiation condition

Ultraviolet Irradiation Device: Dymax model 5000 flood

Lamp: 400 watt, metal halide type

Probe distance: 20 cm

Irradiation time: 0.1 second to 3 seconds

Dose: 100 mJ / cm ² Below

2. Chip Scattering rate  Measure

The prepared dicing film was laminated so that there was no bubble in the mirror wafer in a laminator at 60 ° C. Subsequently, the dicing process was performed using dicing equipment (NEON Co., Ltd.) under the following conditions, and the chip scattering rate was shown by calculating the number of chips scattered with respect to the whole chips as a percentage.

Dicing  Condition

Blade: 27HDDD

Blade Rotation Speed: 40,000 rpm

Speed: 20 mm / s

Chip size: 10 mm × 10 mm

Cut depth: 70 μm

The results measured by the above method are summarized in Table 1 below.

[Table 1]

Example 1 Example 2 Comparative Example 1 Discoloration after UV irradiation yellow yellow - Peel force after irradiation (gf / in) Before UV irradiation 224 156 275 After UV irradiation 8.9 9.9 8.6 Chip scattering rate (%) 2 3 One

As can be seen from the results of Table 1, in Examples 1 and 2 according to the present invention, it was confirmed that the color of the pressure-sensitive adhesive layer after the ultraviolet irradiation is discolored to ensure the ease of operation. In addition, in the embodiment of the present invention, the peeling force before and after UV irradiation compared to Comparative Example 1, which does not include a photochromic compound, does not have a problem in the process (before UV irradiation: 100 gf / in or more, after UV irradiation : 10 gf / in), it could be confirmed that the phenomenon that can cause defects such as chip scattering can be excellently suppressed.

Claims (23)

A base film; And a base resin formed on the base film; And a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition containing a photochromic compound; And an adhesive part formed on the pressure-sensitive adhesive film. The dicing die-bonding film according to claim 1, wherein the base resin is an acrylic copolymer having a weight average molecular weight of 200,000 to 1.50,000. The dicing die-bonding film according to claim 2, wherein the acrylic copolymer comprises a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer. The (meth) acrylic acid ester monomer is methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, pentyl (meth) acrylate. With hexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate and decyl (meth) acrylate Dicing die-bonding film, characterized in that at least one selected from the group consisting of. The dicing die-bonding film according to claim 3, wherein the crosslinkable functional group-containing monomer is a hydroxy group-containing monomer or a carboxyl group-containing monomer. The dicing die-bonding film according to claim 3, wherein the acrylic copolymer further comprises an ultraviolet curable compound bonded to the side chain of the main chain. The ultraviolet curable compound according to claim 6, wherein the ultraviolet curable compound is (meth) acryloyloxy isocyanate, (meth) acryloyloxy methyl isocyanate, 2- (meth) acryloyloxy ethyl isocyanate, 3- (meth) acryloyloxy Propyl isocyanate, 4- (meth) acryloyloxy butyl isocyanate, m-propenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, acryloyl monoisocyanate compound, glycidyl (meth) Dicing die-bonding film, characterized in that at least one selected from the group consisting of acrylate and allyl glycidyl ether. The photochromic compound according to claim 1, wherein the photochromic compound is selected from the group consisting of spiropyran, spiroxazine, spironaphthoxazine, naphthopyran, croman, fulzide, fulgimid, diarylethene, spirodihydroindolizine and azo compounds A dicing die-bonding film, characterized in that at least one selected from the group consisting of a polycyclic aromatic compound, an anionic compound, polycyclic quinone, biorogen, triarylmethane or perimidinespirocyclohezadienone. The dicing die-bonding film of claim 1, wherein the pressure-sensitive adhesive composition comprises 0.1 parts by weight to 10 parts by weight of a photochromic compound based on 100 parts by weight of the base resin. The dicing die-bonding film according to claim 1, wherein the pressure-sensitive adhesive composition further comprises an ultraviolet curable compound in an amount of 900 parts by weight or less based on 100 parts by weight of the base resin. The dicing die-bonding film according to claim 10, wherein the ultraviolet curable compound has a weight average molecular weight of 500 to 300,000. The dicing die-bonding film of claim 1, wherein the pressure-sensitive adhesive composition further comprises 0.05 part by weight to 20 parts by weight of a photoinitiator based on 100 parts by weight of the base resin. The dicing die-bonding film according to claim 12, wherein the photoinitiator has a melting point of 70 ° C or higher. The dicing die-bonding film of claim 1, wherein the pressure-sensitive adhesive composition further comprises a crosslinking agent in an amount of 2 to 40 parts by weight based on 100 parts by weight of the base resin. delete The dicing die-bonding film according to claim 1, wherein the base film has a difference in elongation in the longitudinal direction and in the width direction of 10% or less of the elongation in the longitudinal direction. delete The dicing die-bonding film of claim 1, wherein the adhesive portion has a reflectance of 0.02% to 50% in the wavelength region of 350 to 390 nm. The method of claim 1, wherein the adhesive portion comprises an epoxy resin having a glass transition temperature of −30 ° C. to 50 ° C. before curing, a weight average molecular weight of 100,000 to 1 million, and an epoxy resin having a glass transition temperature of 50 ° C. or higher after curing. Dicing die-bonding film, characterized in that. 20. The dicing die-bonding film of claim 19, wherein the adhesive portion further comprises a curing agent. 20. The dicing die-bonding film of claim 19, wherein the adhesive portion further comprises a curing accelerator. 20. The dicing die-bonding film of claim 19, wherein the adhesive part further comprises a colored material having a value of L * of 30 or more in a CIE coordinate system. A semiconductor wafer, wherein an adhesive portion of the dicing die bonding film according to claim 1 is attached to one side of the wafer, and the adhesive film of the dicing die bonding film is fixed to the wafer ring frame.