KR101208401B1 - Flexible flat cable and fabricating method thereof - Google Patents

Abstract

PURPOSE: A flexible flat cable and a manufacturing method thereof are provided to electrically connect one or more electronic elements by interposing a conductive contact layer between both ends of a conducting wire exposed by one or more opening parts. CONSTITUTION: A plurality of conducting wires(11) are formed on a first insulating film(13). The conducting wires are arranged in parallel at regular intervals for not being contacted to each other. The conducting wires are made of a conductive metal thin film. A second insulating film(15) is bonded on the first insulating film for covering the plurality of conducting wires. The second insulating film has a smaller length than the length of the conducting wire. One or more opening parts(17) are formed to partially expose the neighboring two conducting wires among the plurality of conducting wires on the second insulating film.

Description

Flexible flat cable and fabricating method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible flat cable and a method for manufacturing the same, and more particularly, to a flexible flat cable for use as a relay cable of components in an electronic device product and the like and a method for manufacturing the same.

2. Description of the Related Art Generally, in a variety of electronic apparatuses such as a printer, a scanner, a TV, a PC, a notebook, a monitor and a multifunctional apparatus, a flexible flat cable (hereinafter referred to as FFC) is used as a relay cable for electrically connecting components have. Since the FFC is excellent in flexibility, it can be used for moving as flexure. It is used in a wide range of fields because it has a lower manufacturing cost than a flexible printed circuit (FPC) have.

However, the FFC has not conventionally required electrical characteristics such as characteristic impedance. Therefore, it is possible to satisfy the required specifications by simply pressing the insulating film made of synthetic resin on both sides of the FFC through a plurality of conductive wires arranged in parallel at regular intervals so that the conductive metal is formed in the form of conductive wire so that the conductive metal does not come into contact with each other. did.

On the other hand, in recent years, various kinds of electronic apparatuses such as a notebook-type personal computer or a digital scanner that realizes high-definition image quality have been developed, so that a high-speed signal transmission has been required. In addition, as digitization progresses in other electronic apparatus products, it has become a technical problem that speeding up of signal transmission is indispensable.

In general, a signal transmission cable is required to be compatible with high-speed transmission since a signal transmission speed becomes high and a resistance to noise is reduced. However, in such a cable, there is a problem of unnecessary electromagnetic interference (EMI) at the same time as increasing the signal transmission speed. That is, in signal transmission, when a signal becomes a high frequency, unnecessary electromagnetic waves are easily leaked into adjacent cables or the like, which causes adverse effects such as malfunction or transmission loss.

Accordingly, an FFC has been developed that can shield electromagnetic waves by depositing a shielding layer made of a conductive metal layer on the surface of an insulating film or by adhering a shielding tape.

FFC capable of shielding electromagnetic waves according to the prior art is disclosed in Korean Patent No. 10-0899107 (name of the invention: flexible flat cable).

Flexible flat cable according to the prior art is a plurality of conductive wires formed of a conductive metal arranged in parallel at a predetermined interval so as not to contact with each other and a heat-adhesive synthetic resin to be bonded to each other by laminating through the plurality of conductive wires First and second insulating films formed on one side of the plurality of wires, the first and second insulating films being shorter than the length of the plurality of wires and exposing both ends of the plurality of wires; A third insulating film adhered to one surface of the second insulating film to adjust impedance of the plurality of conductive wires, a fourth insulating film adhered to the surface of the third insulating film, and a surface of the fourth insulating film A conductive metal layer formed of a conductive metal to shield electromagnetic waves, and conductive on the conductive metal layer A conductive anti-oxidation layer formed by coating with a synthetic resin including a metal powder made of an alloy of metal or conductive metals to prevent oxidation while being electrically connected to the conductive metal layer, and formed to be shorter than a length of the first insulating film, so that the conductive And a fifth insulating film covering the anti-oxidation layer so that both ends thereof are exposed in the longitudinal direction to define the ground portion.

In the above-described FFC, a plurality of conductive wires between the first and second insulating films are arranged in parallel at regular intervals such that a conductive metal such as copper or tin is formed in the form of a conductive wire and does not contact each other. The plurality of conductive wires are interposed between the first insulating film and the second insulating film when the first insulating film and the second insulating film are bonded together. That is, the first and second insulating films are bonded while passing through the joining machines continuously, and the plurality of conductive wires are unwound to have a predetermined interval while being wound on the respective rollers and the like, when the first and second insulating films are joined. It is interposed.

However, since the FFC according to the related art is bonded together with a plurality of conductors interposed between the first and second insulating films, there is a problem in that active or passive elements cannot be mounted on the same conductor or adjacent conductors. there was.

Accordingly, an object of the present invention is to provide a flexible flat cable capable of mounting an active device or a passive device on the same wire or adjacent wires.

Another object of the present invention is to provide a method of manufacturing a flexible flat cable capable of mounting an active device or a passive device on the same wire or adjacent wires.

A flexible flat cable according to an embodiment of the present invention for achieving the above object is formed of a thin film of a conductive metal to be arranged in parallel at a predetermined interval so as not to contact each other with the first insulating film and adjacent to the first insulating film. A plurality of conductive wires, a second insulating film bonded to the plurality of conductive wires on the first insulating film, and having a length shorter than the length of the plurality of conductive wires to expose both ends; and the second insulating film. Interposing a conductive contact layer on at least one opening formed to partially expose two adjacent ones of the plurality of conductive wires, and two adjacent ones partially exposed by the at least one opening of the plurality of conductive wires. And at least one electronic device mounted to be electrically connected to each other.

Flexible flat cable according to another embodiment of the present invention for achieving the above object is arranged in parallel at a predetermined interval so as not to contact each other with the first insulating film and the adjacent on the first insulating film and at least one is disconnected A plurality of conductive wires formed of a thin film of an electrically separated conductive metal, and bonded to cover the plurality of conductive wires on the first insulating film, but having a length shorter than that of the plurality of conductive wires to expose both ends; A second insulating film, at least one opening formed at both ends of the at least one disconnected lead of the plurality of conductors to the second insulating film, and a disconnection exposed by the at least one opening of the plurality of conductors Written on both ends of the conductive wires to be electrically connected to each other via a conductive contact layer 1 includes an electronic device.

In the above, the plurality of conductors are formed by any one of deposition, plating, and metal foil.

In the above, the plurality of conductive wires are plated with Ni / Au at exposed portions at both ends in the longitudinal direction of.

The electronic device is selected from a chip resistor, a resistor, a capacitor, an inductor, a transformer, a relay, an electromagnetic interference (EMI) filter, a light emitting diode (LED), and a laser diode (LD).

Method for manufacturing a flexible flat cable according to an embodiment of the present invention for achieving the above another object is a plurality of conductors in a thin film of a conductive metal to be arranged in parallel at regular intervals so as not to contact each other adjacent to the first insulating film And forming a second insulating film having at least one opening partially exposing adjacent ones selected from the plurality of conductive wires on the first insulating film such that both ends of the plurality of conductive wires are exposed. And mounting at least one electronic device to be electrically connected to each other by interposing a conductive contact layer on two adjacent ones exposed by the at least one opening.

Method for manufacturing a flexible flat cable according to another embodiment of the present invention for achieving the above another object is arranged in parallel at regular intervals so as not to contact each other adjacent to the first insulating film and at least one is disconnected and electrically separated Forming a plurality of conductive wires with a thin film of a conductive metal; and a second insulating film having at least one opening exposing both ends of the at least one disconnected conductive wire among the plurality of conductive wires on the first insulating film. Bonding at both ends of the plurality of conductive wires to be exposed and at least one electronic element on both ends of the disconnected conductive wire exposed by the at least one opening of the plurality of conductive wires, respectively; And mounting to be attached so as to be electrically connected.

In the process of forming a plurality of conductive wires to form a release agent layer to be exposed in parallel in the longitudinal direction on the first insulating film, and then deposit or plate the exposed conductive metal of the first insulating film and remove the release agent Form.

In the process of forming a plurality of conductive wires is formed by depositing or plating a conductive metal on the first insulating film and patterning in parallel in the longitudinal direction by a photolithography method.

In the process of forming a plurality of conductive wires is formed by bonding a foil of a conductive metal on the first insulating film and patterning in parallel in the longitudinal direction by a photolithography method.

The electronic device is selected from a chip resistor, a resistor, a capacitor, an inductor, a transformer, a relay, an electromagnetic interference (EMI) filter, a light emitting diode (LED), and a laser diode (LD).

The conductive contact layer is formed by reflowing solder between two adjacent ones and one electronic element exposed by the at least one opening.

In the above solder, tin (Sn) is used as a main component and a metal such as silver, copper, or nickel is added.

Accordingly, the present invention has the advantage that an active element or a passive element can be mounted between both ends of two adjacent conductors or disconnected conductors among a plurality of conductors.

1 is a plan view partially cut a flexible flat cable according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line AA of FIG.
3A to 3C are flowcharts illustrating a method of manufacturing a flexible flat cable according to an exemplary embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

1 is a partial cutaway plan view of a flexible flat cable according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line A-A.

The FFC according to the embodiment of the present invention includes a plurality of conductive wires 11, first and second insulating films 13 and 15, and at least one electronic device 21.

A plurality of conductive wires 11 are formed on the first insulating film 13. The plurality of conductive wires 11 are formed of a conductive metal such as aluminum, copper or tin. The plurality of conductive wires 11 are formed to be arranged in parallel at regular intervals so as not to contact each other with adjacent ones by a method such as vapor deposition or plating. The plurality of conductive wires 11 may be formed on the first insulating film 13 by forming a release layer (not shown) to expose a portion where the conductive wires are to be formed, and then may be formed by deposition or plating.

In addition, the plurality of conductive wires 11 may be formed by depositing or plating a metal to form the conductive wire on the first insulating film 13 and then patterning the same by a photolithography method. In addition, the plurality of conductive wires 11 may be formed by bonding a foil to form the conductive wires on the first insulating film 13 with an adhesive or an adhesive and then patterning the photolithography method.

In the above, the plurality of conductive wires 11 may be plated with Ni / Au or the like at both ends in the longitudinal direction, thereby preventing the resistance from increasing by oxidizing while improving conductivity.

The second insulating film 15 is bonded onto the first insulating film 13 to cover the plurality of conductive wires 11. The first insulating film 13 and the plurality of conductive wires 11 are the same length, but the second insulating film 15 is bonded to the first insulating film 13 in a shorter length than the plurality of conductive wires 11. It is formed to expose a plurality of conductive wires 11 both ends. In addition, at least one, for example, 1 to 10 openings 17 are formed in the second insulating film 15 to partially expose two adjacent ones of the plurality of conductive wires 11.

The first and second insulating films 13 and 15 are formed of a heat-adhesive synthetic resin having insulation, heat resistance, flexibility, and resilience while having mechanical strength such as tensile strength, and have a thickness of about 10 to 250 μm. . Therefore, the first and second insulating films 13 and 15 may be made of nylon, polyimide, polyvinylacetate, polyurethane, polyester, and polyethylene. Or it may be formed of a synthetic resin such as polypropylene.

The electronic element 12 conducts at least one of the plurality of conductive wires 11 to two adjacent portions partially exposed by, for example, 1 to 10 openings 17 formed in the second insulating film 15. It is mounted to each electrically connected by a contact layer 19. The electronic device 12 may be selected from a passive device such as a chip resistor and an electromagnetic interference (EMI) filter, and an active device such as a light emitting diode (LED) and a laser diode (LD). If the electronic element 21 is a chip resistor, the impedance can be adjusted to improve the transmission speed of the signal, and an electromagnetic interference (EMI) filter can shield electromagnetic waves. In addition, when the electronic device 21 is any one of a light emitting diode (LED), a laser diode (LD), and the like, the electronic device 21 emits light by an electric signal so that the operation state can be known.

In the above, the electronic element 21 is mounted to be attached by a conductive contact layer 19 formed by reflowing solder on two adjacent portions partially exposed by the openings 17 of the plurality of conductive wires 11. . The conductive contact layer 19 may be formed of a solder containing tin (Sn) as a main component and a metal such as silver, copper, or nickel.

In the flexible flat cable having the above-described configuration, a multilayer film including a dielectric for controlling impedance and a conductor for shielding electromagnetic waves may be bonded onto the second insulating film 15.

In another embodiment of the present invention, at least one of the plurality of conductive wires is disconnected, and at least one electronic element may be electrically connected to both ends of the disconnected portion.

3A to 3C are flowcharts illustrating a method of manufacturing a flexible flat cable according to an exemplary embodiment of the present invention.

Referring to FIG. 3A, a plurality of conductive lines 11 are formed on the first insulating film 13. In the above, the plurality of conductive wires 11 apply a release agent (not shown) to expose the first insulating film 13 in parallel in the longitudinal direction on the first insulating film 13. Then, a conductive metal such as aluminum, copper, or tin is deposited on the release agent, and the release agent is removed to form a plurality of conductive wires 11 in the exposed portion of the first insulating film 13. The plurality of conductive wires 11 may be formed by plating. In addition, the conductive metal may be deposited or plated on the first insulating film 13 and then patterned by photolithography.

In addition, a plurality of conductive wires 11 may be formed by adhering a foil to form the conductive wires on the first insulating film 13 with an adhesive or an adhesive and then patterning the photolithography method.

The first insulating film 13 is nylon (nylon), polyimide, polyvinylacetate, polyurethane (polyurethane) to have insulation, heat resistance, flexibility and resilience while having mechanical strength, such as tensile strength ), A heat-adhesive synthetic resin such as polyester, polyethylene, or polypropylene, and is formed to a thickness of about 10 to 250 μm.

Referring to FIG. 3B, the second insulating film 15 is bonded to the first insulating film 13 to cover the plurality of conductive wires 11. The second insulating film 15 should be short in length so that both ends of the plurality of conductive wires 11 are exposed. In addition, at least one, for example, 1 to 10 openings 17 are formed in the second insulating film 15 to partially expose two adjacent ones of the plurality of conductive wires 11.

As described above, the second insulating film 15 also has the same mechanical strength as that of the first insulating film 13, and has nylon, polyimide, and polyvinyl resin to have insulation, heat resistance, flexibility, and resilience. It is formed of a heat-adhesive synthetic resin such as acetate (polyvinylacetate), polyurethane (polyurethane), polyester (polyester), polyethylene (polyethylene) or polypropylene (polypropylene) to a thickness of about 10 ~ 250㎛.

Referring to FIG. 3C, two adjacent portions formed in the second insulating film 15 and partially exposed by at least one of the plurality of conductive wires 11, for example, 1 to 10 openings 17, respectively. A solder (not shown) in the form of a ball or cream is mounted on it. The electronic elements 12 are mounted on the solder and then reflowed. In the above, the solder is deformed into the conductive contact layer 19 during reflow so that two adjacent phases partially exposed by at least one of the plurality of conductive wires 11, for example, 1 to 10 openings 17. Each of the electronic elements 12 is mounted to be attached to each other so as to be electrically connected thereto.

The electronic device 21 may select any one of a passive device such as a chip resistor and an electromagnetic interference (EMI) filter, and an active device such as a light emitting diode (LED) and a laser diode (LD). It is also mounted to be attached by the conductive contact layer 19 formed by reflowing the solder. The solder for forming the conductive contact layer 19 may include tin (Sn) as a main component and a metal such as silver, copper, or nickel is added.

In addition, another embodiment of the present invention is formed by disconnecting at least one of the plurality of conductive wires on the first insulating film, and bonding the second insulating film having at least one opening exposing both ends of the disconnected conductive wires. Afterwards, at least one electrical element may be mounted to be electrically connected on both ends of the disconnected portion.

As described above, the present invention is merely an embodiment, and the present invention is not limited to the above-described embodiments, and various modifications may be made by those skilled in the art within the technical spirit of the present invention. .

11: Lead wire 13, 15: 1st and 2nd insulating film
17: opening 19: electrical bonding layer
21: electric element

Claims (13)

A first insulating film,
A plurality of conductive wires formed of a thin film of a conductive metal so as to be arranged in parallel at a predetermined interval so as not to contact each other on the first insulating film;
A second insulating film bonded to the plurality of conductive wires on the first insulating film, the second insulating film being shorter than the length of the plurality of conductive wires to expose both ends;
At least one opening formed to partially expose two adjacent ones of the plurality of conductive wires to the second insulating film;
And at least one electronic element mounted to be electrically connected to each other via the conductive contact layer on two adjacent portions partially exposed by the at least one opening of the plurality of conductive wires.
The flexible flat cable of claim 1, wherein the plurality of conductors are formed by any one of deposition, plating, and metal foil.
The flexible flat cable of claim 1, wherein exposed portions of both ends of the plurality of conductive wires are plated with Ni / Au in a length direction of the conductive wires.
The flexible flat cable of claim 1, wherein the electronic device is selected from a chip resistor, a resistor, a capacitor, an inductor, a transformer, a relay, an electromagnetic interference (EMI) filter, a light emitting diode (LED), and a laser diode (LD).
A first insulating film,
A plurality of conducting wires formed in a thin film of a conductive metal which are arranged in parallel at a predetermined interval so as not to be in contact with each other on the first insulating film and at least one is disconnected and electrically separated;
A second insulating film bonded to the plurality of conductive wires on the first insulating film, the second insulating film being shorter than the length of the plurality of conductive wires to expose both ends;
At least one opening formed in the second insulating film so that both ends of the at least one disconnected wire are exposed;
And at least one electronic element mounted on both ends of the disconnected conductor exposed by the at least one opening of the plurality of conductors to be electrically connected to each other via a conductive contact layer. Forming a plurality of conductive wires with a thin film of a conductive metal so as to be arranged in parallel at a predetermined interval so as not to contact each other on the first insulating film, and
Bonding a second insulating film having at least one opening to partially expose adjacent ones selected from the plurality of conductive wires on the first insulating film such that both ends of the plurality of conductive wires are exposed;
And mounting at least one electronic element to be electrically connected to each other by interposing a conductive contact layer on two adjacent ones exposed by the at least one opening.
The method of claim 6, wherein the forming of the plurality of conductive wires comprises forming a release agent layer on the first insulation film so as to be exposed in parallel in the longitudinal direction, and depositing or plating the exposed conductive metal of the first insulation film, and forming a release agent. Method for producing a flexible flat cable formed by removing the.
The method of manufacturing a flexible flat cable of claim 6, wherein the forming of the plurality of conductive wires is performed by depositing or plating a conductive metal on the first insulating film and patterning the conductive metal in parallel in the longitudinal direction by a photolithography method. The method of manufacturing a flexible flat cable of claim 6, wherein the forming of the plurality of conductive wires is performed by bonding a foil of a conductive metal on the first insulating film and patterning the same in parallel in the longitudinal direction by a photolithography method.
The method of claim 6, wherein the electronic device is selected from a chip resistor, a resistor, a capacitor, an inductor, a transformer, a relay, an electromagnetic interference (EMI) filter, a light emitting diode (LED), and a laser diode (LD).
The method of manufacturing a flexible flat cable according to claim 6, wherein the conductive contact layer is formed by reflowing solder between two adjacent ones and one electronic element exposed by the at least one opening.
The method of manufacturing a flexible flat cable according to claim 11, wherein the solder is one in which a metal of silver, copper, or nickel is added to tin (Sn).
Forming a plurality of conductive wires in a thin film of a conductive metal so that at least one is disconnected and electrically separated so as to be parallel to each other so as not to contact each other on the first insulating film;
Bonding a second insulating film having at least one opening to expose both ends of the at least one disconnected wire among the plurality of wires on the first insulating film such that both ends of the plurality of wires are exposed;
A flexible flat cable comprising a step of mounting at least one electronic element to be electrically connected to each other through a conductive contact layer on both ends of the disconnected wire exposed by the at least one opening of the plurality of wires. Manufacturing method.

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