KR101202545B1 - Plastic substrate and method for manufacturing the same - Google Patents

Abstract

The present invention provides a semiconductor device comprising: a substrate layer; A metal thin film layer provided on one surface or both surfaces of the substrate layer; And a coating film provided on the metal thin film layer or provided on the base layer and the metal thin film layer, respectively.

Plastic substrate, base material layer, metal thin film layer, coating layer

Description

PLASTIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

The present invention provides a plastic substrate comprising a metal thin film layer capable of simplifying the manufacturing process and reducing the manufacturing cost and providing perfect gas barrier properties, and a method of manufacturing the same, which is excellent in chemical resistance, surface flatness, surface hardness, and heat resistance. It relates to a plastic substrate and a method of manufacturing the same.

When manufacturing organic or inorganic light emitters, display devices, solar power generators, etc., it is necessary to block and protect their internal electrical devices from external chemicals such as oxygen and moisture. According to the prior art, the glass plate is used as the substrate material or the cover plate to protect the internal electric element vulnerable to chemicals. Such glass plates have satisfactory characteristics in light transmittance, thermal expansion coefficient, chemical resistance, etc., but they are heavy, fragile and hard, requiring careful handling, and thus acting as a limiting factor in product design.

Attempts have been made to replace the glass plates used as substrate materials for electric devices with plastics, which are light, excellent in impact resistance, and flexible. However, currently commercially produced plastic films have a number of drawbacks compared to glass plates, and thus need to be supplemented with physical properties. In particular, the gas barrier property of the plastic film is in urgent need of improvement compared with the properties of the glass plate.

In general, in order to supplement the gas barrier property of the substrate for the electric device, organic or inorganic materials are coated and laminated by various methods such as sputtering, chemical vapor deposition, and sol-gel coating. Increasing the thickness of the coating layer laminated on the substrate increases the gas barrier property, but light transmittance decreases, and the residual stress gradually increases with the thickness, so that cracks easily occur over a certain thickness and attenuate the flexibility of the plastic material. There is a drawback to this.

In order to overcome this disadvantage, a gas barrier layer structure in which an inorganic material layer and a polymer material layer are alternately stacked several times has been devised (Barix ^™ ), but there is a disadvantage that peeling occurs easily between the stacked inorganic material layer and the organic material layer.

As such, when the inorganic material layer is formed as the gas barrier layer on the polymer material layer, a process of forming the inorganic material layer is complicated, and manufacturing costs are increased by using expensive equipment.

In addition, even if the gas barrier layer is formed by the conventional method described above, there is a problem that it is impossible to block 100% of water and oxygen under various environments.

SUMMARY OF THE INVENTION An object of the present invention is to include a metal thin film layer which can provide a perfect gas barrier property while simplifying the manufacturing process and reducing the manufacturing cost, and has excellent chemical resistance, surface flatness, surface hardness, and heat resistance, and a plastic substrate. To provide a way.

The present invention provides a semiconductor device comprising: a substrate layer; A metal thin film layer provided on one surface or both surfaces of the substrate layer; And a coating layer provided on the metal thin film layer or provided on the base layer and the metal thin film layer, respectively.

The plastic substrate according to the present invention may be a substrate for a display device, a substrate for an illumination device, or a substrate for a solar cell.

It provides a display device, a lighting device or a solar cell comprising a plastic substrate according to the present invention.

The present invention, forming a metal thin film layer on one side or both sides of the base layer; And it provides a method for producing a plastic film comprising the step of forming a coating layer by coating a coating layer forming composition on the metal thin film layer or the metal thin film layer and the base layer, respectively.

According to the present invention, there is provided a plastic substrate and a method for producing the same, which provide gas barrier properties equivalent to, or higher than, and preferably 100% of existing glass, and which are excellent in chemical resistance, surface flatness, surface hardness and heat resistance.

Plastic substrate according to the present invention, the base layer; A metal thin film layer provided on the base layer; And a coating layer provided on the metal thin film layer.

The base layer may be a plastic film, and the plastic film may be a film formed of at least one selected from the group consisting of a single polymer, at least one polymer blend, and a polymer composite material containing an organic or inorganic additive.

As the plastic film formed of the single polymer or one or more polymer blend materials, for example, polyethylene terephthalate (PET), polyarylates, polyethersulfone (PES), polycarbonates, PC ), Polyethylenenaphthalates (PEN), polyimide (PI), and a film formed of one or more materials selected from epoxy resins.

When the plastic substrate according to the present invention is used as a substrate of a liquid crystal display device, since the manufacturing process for forming the thin film transistor and the transparent electrode is performed at a high temperature of 200 ° C. or higher, it is possible to withstand such high temperatures in the manufacture of the plastic film. It is preferable to use a polymer having heat resistance.

It is preferable to use polymers such as polynorbornene, aromatic florene polyester, polythersulfone, bisphenol A polysulfone, and polyimide as the polymer having such characteristics.

In addition, the recent research on lowering the temperature of the high temperature substrate process proceeds to use a polymer such as polyethylene terephthalate, polyethylene naphthalene, polyarylate, polycarbonate, cyclic olefin copolymer that can be used up to a temperature of around 150 ℃ It is preferable.

A plastic film in which organic or inorganic particles are dispersed in a polymer may be used as the plastic film formed of the polymer composite material containing the organic or inorganic additives.

Examples of the polymer composite material include polymer-clay nanocomposites, which have a small amount of clay compared to a conventional composite such as glass fiber due to the small particle size (<1 micron) and the large aspect ratio of the clay. The mechanical properties of the polymer, heat resistance, gas barrier properties, dimensional stability and the like can be improved. That is, in order to improve the physical properties, it is important to peel off the clay layer of the layer structure and disperse it well in the polymer matrix, and satisfying this is the polymer-clay composite.

Polymers that can be used in the polymer-clay composite include polystyrene, polymethacrylate, polyethylene terephthalate, polyethylene naphthalene, polyarylate, polycarbonate, cyclic olefin copolymer, polynorbornene, aromatic florene polyester, poly Susulfone, polyimide, epoxy resin, polyfunctional acrylate, and the like, and as the clay, laponite, montmorillonite, megadite and the like can be used.

In the plastic film formed of the polymer composite material containing the organic or inorganic additives, the inorganic material dispersed in the polymer is metal, glass powder, diamond powder, silicon oxide, clay, calcium phosphate, magnesium phosphate, barium sulfate, aluminum Fluoride, calcium silicate, magnesium silicate, barium silicate, barium carbonate, barium hydroxide, aluminum silicate and the like can be used.

A glass fiber, a glass fabric or a glass cloth is immersed in an organic-inorganic hybrid solution with a plastic film formed of a polymer composite material containing the organic or inorganic additive, The produced plastic film can be used.

The plastic film used as the base layer may be manufactured through a solution casting method or a film extrusion process, and may be briefly annealed for several seconds to several minutes near the glass transition temperature in order to minimize deformation due to temperature after the production.

After annealing, primer coating may be applied to the surface of the plastic film in order to improve the coating property and adhesion, or surface treatment may be performed by plasma treatment using corona, oxygen or carbon dioxide, ultraviolet-ozone treatment, ion beam treatment with a reaction gas, or the like. have.

The thickness of the plastic film used as the substrate layer may be 10 ~ 2,000㎛.

The metal thin film layer may be a thin film layer of at least one metal selected from stainless steel, copper, and aluminum.

The thickness of the metal thin film layer may be 1 ~ 50㎛.

As a method of providing the said metal thin film layer on the said base material layer, the casting method, the vapor deposition coating method, and the laminating method are mentioned, for example.

In this case, when the metal thin film is laminated on the base layer by using the laminating method, the metal thin film can be easily laminated on the base layer, thereby simplifying the manufacturing process and reducing the manufacturing cost.

As the deposition coating method, a sputtering method, a chemical vapor deposition method, an ion plating method, a plasma chemical vapor deposition method, a sol-gel method, or the like can be used.

The metal thin film layer is a gas barrier layer provided on the substrate layer to block gas such as oxygen and water vapor. In the plastic substrate according to the present invention, as the gas barrier layer is formed of a metal thin film, perfect gas barrier properties are achieved. Can provide.

The material of the coating layer is not particularly limited, but a monomer of an organic compound having two or more polymerizable unsaturated groups in a molecule; Oligomers having a weight average molecular weight of 100 to 1,000 having two or more polymerizable unsaturated groups in a molecule; And a coating layer-forming composition containing at least one selected from organic compounds having a weight average molecular weight of 1,000 to 500,000 having at least one polymerizable unsaturated group in the molecule.

The coating layer is (A) organosilane partial hydrolyzate alone selected from the group consisting of compounds represented by the following formula (1) to formula (3) alone; Or (A) at least one organosilane partial hydrolyzate selected from the group consisting of compounds represented by formulas (1) to (3) and (B) at least one metal selected from the group consisting of compounds represented by formula (4) It can be formed by curing the alkoxide partial hydrolyzate.

(R ¹ ) _m -Si-X _(4-m)

(R ¹ ) _m -O-Si-X _(4-m)

(R ¹ ) _m -N (R ² ) -Si-X _(4-m)

M- (R ³⁾ _z

In the above Chemical Formulas 1 to 3,

X may be the same or different from each other and is hydrogen, halogen, alkoxy of 1 to 12 carbon atoms, acyloxy, alkylcarbonyl, alkoxycarbonyl, or -N (R ² ) ₂ ,

R ¹ may be the same or different and is selected from the group consisting of alkyl, alkenyl, alkynyl, aryl, arylalkyl, alkylaryl, arylalkenyl, alkenylaryl, arylalkynyl, alkynylaryl, , Alkoxy of 1 to 12 carbon atoms, alkoxycarbonyl of 1 to 12 carbon atoms, sulfonic acid, phosphoric acid, acryloxy, methacryloxy, epoxy, Or a vinyl group,

R ² is hydrogen or alkyl having 1 to 12 carbon atoms,

m is an integer of 1 to 3,

In Chemical Formula 4,

M represents a metal selected from the group consisting of aluminum, zirconium, and titanium,

R ³ may be the same or different from each other and is halogen, alkyl having 1 to 12 carbon atoms, alkoxy, acyloxy,

Z is an integer of 3 or 4;

In addition, the coating layer may be formed using a material used to form an overcoat layer for flatness, but is not limited thereto.

The thickness of the coating layer may be 1 ~ 20㎛. When the thickness is thinner than 1 μm, the coating layer may be interrupted due to pinhole defects due to the irregularities of the metal thin film, and may experience a limitation in which leakage current appears later. In addition, when the thickness exceeds 20 μm, curing may occur. The warping phenomenon of the film may occur, and there may be a problem of surface irregularities in the coating layer uniformity.

Examples of the method of forming the coating layer on the metal thin film layer include a coating method, a lamination method, and a deposition method.

When the coating method is used, the coating layer may be obtained by coating and curing the coating layer forming composition on the metal thin film layer.

As the coating method, a method such as spin coating, roll coating, bar coating, dip coating, gravure coating, spray coating, or the like can be used.

The coating layer may be provided on the metal thin film layer to planarize the surface of the metal thin film layer, thereby improving surface flatness.

If the coating layer is not flat, the surface flatness Ra (average of roughness) is important because the current insulating property of the metal thin film layer may be lowered.

Since devices such as ITO used in the LCD process or the OLED process are deposited directly on the coating layer, these devices cannot function due to the concentration of current when the flatness is high. Current trends require better flatness in OLEDs, the next generation of displays rather than LCDs. Therefore, in the present invention, the surface flatness of the coating layer is preferably about 1 nm, and more preferably within 1 nm, so as to satisfy these conditions. Specifically, the flatness may have a Ra value of 0.1 to 1.2 nm. In this case, the lower the flatness value, the higher the characteristics and the lifespan of the display element.

As such, the coating layer may improve surface flatness while protecting the metal thin film layer, impart excellent chemical resistance and scratch resistance to the metal thin film layer, and provide excellent surface hardness.

The plastic substrate according to the present invention may further include an additional coating layer provided on the bottom surface of the base layer.

The coating layer provided on the lower surface of the base layer may improve the adhesion between the plastic film and the metal thin film layer by alleviating the difference in the coefficient of linear expansion between the plastic film and the metal thin film layer, and by appropriately adjusting the composition of organic and inorganic materials. Play a role.

The coating layer provided on the lower surface of the substrate layer may flatten the surface of the plastic film.

Specifically, the flatness Ra (average of roughness) of the coating layer provided on the lower surface of the base layer is important, if the layer is not flat when the metal thin film layer is formed on the base layer of the metal thin film layer Gas barrier properties may be lowered. Accordingly, the surface flatness of the coating layer provided on the lower surface of the substrate layer is preferably about 1 nm, and more preferably within 1 nm. Specifically, the flatness may have a Ra value of 0.1 to 1.2 nm. Here, the lower the flatness value, the lower the result shows that the barrier property increases.

In addition, the plastic substrate according to the present invention may further include an additional metal thin film layer provided between the additional coating layer and the base layer.

The plastic substrate according to the present invention may be a substrate for a display device, a substrate for an illumination device, or a substrate for a solar cell.

On the other hand, the present invention provides a display device, a lighting device or a solar cell comprising the plastic substrate.

Examples of the display device include a liquid crystal display device and an OLED display device. The display device may include a liquid crystal display (LCD) or an OLED as a display device provided on the plastic substrate and the plastic substrate according to the present invention.

The plastic substrate according to the invention can also be used as a reflector of an OLED.

The lighting device may include a plastic substrate according to the present invention and an OLED which is provided on the plastic substrate and emits white light.

The Taeang battery includes a plastic substrate according to the present invention, and the other components of the solar cell may be the same as those generally known, and thus, a detailed description thereof will be omitted.

Since the contents described above for the substrate layer, the metal thin film layer, and the coating layer are all applied to the following, specific descriptions will be omitted below.

Method for producing a plastic substrate according to the present invention, a) forming a metal thin film layer on the base layer; And b) coating the composition for forming a coating layer on the metal thin film layer to form a coating layer.

The method of manufacturing a plastic substrate according to the present invention may further include forming an additional coating layer by coating a composition for forming a coating layer on a lower surface of the base layer.

In addition, the method may further include forming an additional metal thin film layer positioned between the additional coating layer and the substrate layer.

Plastic substrate according to the present invention, the base layer; A metal thin film layer provided on an upper surface of the base layer; A first coating layer provided on a lower surface of the base layer; And a second coating layer provided on the metal thin film layer.

Method for producing a plastic substrate according to the present invention, a) forming a metal thin film layer on the base layer; And b) forming a first and a second coating layer by coating and curing a composition for forming a coating layer on the lower surface of the base layer and the metal thin film layer.

The forming of the first coating layer on the lower surface of the substrate layer and the forming of the second coating layer on the metal thin film layer may be performed in one step or may be divided into two steps.

Plastic substrate according to the present invention, the base layer; First and second metal thin film layers provided on both sides of the base layer; And first and second coating layers provided on the first and second metal thin film layers.

Method for producing a plastic substrate according to the present invention, a) forming a metal thin film layer on both sides of the base layer; And b) forming a first and a second coating layer by coating and curing a composition for forming a coating layer on the lower surface of the base layer and the metal thin film layer.

Forming the metal thin films on both sides of the substrate layer may be performed in one process, or may be performed in two steps. In addition, the forming of the first and second coating layers on the lower surface of the base layer and the metal thin film layer may be performed in one step or may be performed in two steps.

Hereinafter, the present invention will be described in more detail with reference to FIGS. 1 to 3.

Plastic substrate according to the first embodiment of the present invention, as shown in Figure 1, the substrate layer; A metal thin film layer provided on the base layer; And it may include a coating layer provided on the metal thin film layer.

Plastic substrate according to a second embodiment of the present invention, as shown in Figure 2, the substrate layer; A metal thin film layer provided on an upper surface of the base layer; A first coating layer provided on a lower surface of the base layer; And it may include a second coating layer provided on the metal thin film layer.

Plastic substrate according to a third embodiment of the present invention, as shown in Figure 3, the substrate layer; First and second metal thin film layers provided on both sides of the base layer; It may include first and second coating layers provided on the first and second metal thin film layers.

As such, when the metal thin film layer is provided on the base layer and the coating layer is formed on the metal thin film layer, it is possible to provide a plastic substrate having excellent gas barrier properties, chemical resistance, surface flatness, surface hardness, and heat resistance.

Hereinafter, the present invention will be described in more detail with reference to Examples.

Example 1

A 150 μm-thick polymer composite film (500GA, LG Chemical) produced by impregnating and curing a glass cloth as a base material layer, and a copper foil of 18 μm as a metal thin film layer at 180 ° C. for 4 hours under reduced pressure. During high temperature compression, the copper foil was prepared polymer composite film attached to one side.

After mixing 20 parts by weight of tetraethoxysilane (TEOS) and 10 parts by weight of glycidoxypropyltrimethoxysilane (GPTMS), 7 parts by weight of distilled water, 20 parts by weight of ethanol and 0.01 parts by weight of HCl are added thereto, and 25 ° C. 100 parts by weight of an epoxy compound (trade name ERL-4221, Dow Chemical) on a sol prepared by partial hydrolysis for 24 hours in a catalyst, triarylsulfonium hexafluoro antimonite salts 6 parts by weight of mixed 50 w% in propylene carbonate) was prepared to prepare an organic-inorganic hybrid buffer composition for forming a coating layer.

After coating the organic-inorganic hybrid buffer composition of the composition on the copper foil surface of the polymer composite film on which copper foil is attached, the solvent is removed for 5 minutes in a 90 ° C convection oven, UV cured, and then in a 180 ° C convection oven. Heat curing for 1 hour to prepare a plastic substrate of Figure 1 structure.

At this time, the thickness of the coating layer measured by the alpha stepper after the curing reaction was 10㎛. The surface flatness (Ra) of the coating layer measured in the tapping mode of the AFM was 0.4 nm or less in a measuring area of 10 μm × 10 μm.

Example 2

In the polymer composite film having the copper foil of Example 1 attached to one side, the same composition as in Example 1 was further carried out in the same manner as in Example 1 on the side where the copper foil was not attached to form an additional coating layer. Except having formed, it manufactured by the same method as Example 1. The structure of the manufactured plastic substrate is as shown in FIG.

At this time, the thickness of the coating layer measured by the alpha stepper after the curing reaction was 10㎛. The surface flatness (Ra) of the coating layer measured in the tapping mode of the AFM was 0.4 nm or less in a measuring area of 10 μm × 10 μm.

Example 3

A 150 μm-thick polymer composite film (500GA, LG Chemical) produced by impregnating and curing a glass cloth as a base material layer, and a copper foil of 18 μm as a metal thin film layer at 180 ° C. for 4 hours under reduced pressure. After pressing at high temperature, a polymer composite film having copper foil attached to both sides was prepared.

After coating the same composition as the organic-inorganic hybrid buffer composition of Example 1 on the outer surface of the copper foil located on the upper side of the polymer composite film, the solvent was removed and UV cured for 5 minutes in a convection oven at 90 ℃, and then Bar coating on the outer surface of the copper foil located on the lower side, after removing the solvent for 5 minutes in a 90 ℃ convection oven and UV-cured to form a coating layer, and then heat-cured in 180 ℃ convection oven for 1 hour to prepare a plastic substrate of Figure 3 It was.

At this time, the thickness of the coating layer measured by the alpha stepper after the curing reaction was 10㎛. The surface flatness (Ra) of the coating layer measured in the tapping mode of the AFM was 0.4 nm or less in a measuring area of 10 μm × 10 μm.

Comparative Example 1

On one surface of a 150 μm-thick polymer composite film (500GA, LG Chemical) produced by impregnating and curing a glass cloth in a polymer material, the same composition as in the organic-inorganic hybrid buffer composition of Example 1 was used. Coating in the same manner as 1, to prepare a plastic substrate having a coating layer formed on one surface.

Comparative Example 2

In the 150-μm-thick polymer composite film (500GA, LG Chem) prepared by impregnating and curing a glass cloth in a polymer material, the same composition as in the organic-inorganic hybrid buffer composition of Example 1 was used. In the same manner as in the above, the coating and curing on both sides of the polymer composite film to form a coating layer, 50 sccm of Ar gas is injected into the surface of the coating layer located on the upper side of the polymer composite film using an Atec system company's DC / RF magnetron sputtering machine 5 A silicon oxide (SiO _x , x = 1-4 integer) thin film was deposited by depositing at 1000 Watt of RF (13.56 MHz) power for 10 minutes under a mtorr pressure. The thickness of the silicon oxide thin film observed by SEM was 100 nm.

After coating the same composition as the organic-inorganic hybrid buffer composition of Example 1 on the silicon oxide thin film again, the solvent was removed for 3 minutes in a 90 ° C convection oven and cured using UV, followed by 1 hour in a 180 ° C convection oven. During the heat curing to form a coating layer to produce a multilayer film.

On the other hand, with respect to the plastic substrates according to Examples 1 to 3 and Comparative Examples 1 to 2, the oxygen transmittance, water vapor transmission rate, linear expansion coefficient and pencil hardness, which are the main required properties of the display device substrate, were measured and the results are shown in Table 1. . Each physical property measurement method is as follows, and applied in the same manner to Examples 1-3 and Comparative Examples 1-2.

1) Oxygen permeability: measured with a relative humidity of 0% at room temperature by the method of ASTM D 3985 using OX-TRAN 2/20 of MOCON.

2) Water vapor transmission rate: Using a PERMATRAN-W-3 / 33 was measured for 48 hours at room temperature with a relative humidity of 100% by the method of ASTM F 1249.

3) Coefficient of linear expansion: measured by thermomechanical analysis (TMA; Thermomechnical Analysis) based on ASTM D696 and heating up to 250 ° C. at 10 ° C. per minute under a stress of 5 gf. 4) Pencil hardness was measured by ASTM D3363 under 200 g load. Measured by.

All properties described are averaged for at least five measurements so that they can be statistically representative.

[Table 1]

Oxygen transmittance ^a)
(cc / ㎡ / day / atm) Water vapor transmission rate ^b)
(g / ㎡ / day) Coefficient of linear expansion
(ppm / K) Pencil hardness Example 1 Not measurable Not measurable 15 > 3H Example 2 Not measurable Not measurable 15 > 3H Example 3 Not measurable Not measurable 14 > 3H Comparative Example 1  21 4.2 21 2H Comparative Example 2  0.05  0.007 23 2H

In Table 1 above, a) the instrument measuring range is 0.05 cc / m 2 / day / atm and b) the instrument measuring range is 0.005 g / m 2 / day.

In Comparative Examples 1 and 2, Table 1 and FIG. 5 (Comparative Example 2) show that gas barrier properties are lower than those of the present invention, and that physical properties such as linear expansion coefficient and dimensional stability are not satisfied at the same time.

However, the plastic film according to Examples 1 to 3 of the present invention, which is provided with a metal thin film layer on the base layer and a coating layer formed on the metal thin film layer through Table 1 and FIG. It is understood that the oxygen permeability and the water vapor transmission rate are low, thereby providing perfect gas barrier properties, satisfactory physical properties such as small linear expansion coefficient and dimensional stability, and excellent chemical resistance, excellent surface flatness, excellent surface hardness, and excellent heat resistance. Can be.

1 is a cross-sectional view of a plastic substrate according to Embodiment 1 of the present invention.

2 is a cross-sectional view of a plastic substrate according to Embodiment 2 of the present invention.

3 is a cross-sectional view of a plastic substrate according to Embodiment 3 of the present invention.

4 is a SEM photograph of a plastic substrate according to Example 3 of the present invention.

5 is a SEM photograph of a plastic substrate according to Comparative Example 2 of the present invention.

Claims (22)

A base layer; A metal thin film layer having a thickness of 18 to 50 μm provided on the substrate layer; And Plastic substrate comprising a coating layer provided on the metal thin film layer. The plastic substrate of claim 1, wherein the base layer comprises at least one selected from the group consisting of a single polymer, at least one polymer blend, and a polymer composite material containing an organic or inorganic additive. The plastic substrate of claim 1, wherein the metal thin film layer comprises one or more selected from stainless steel, copper, and aluminum. delete The method of claim 1, wherein the coating layer is a monomer of an organic compound having two or more polymerizable unsaturated groups in the molecule; Oligomers having a weight average molecular weight of 100 to 1,000 having two or more polymerizable unsaturated groups in a molecule; And UV-curing or thermosetting a composition for forming a coating layer containing at least one selected from organic compounds having a weight average molecular weight of 1,000 to 500,000 having at least one polymerizable unsaturated group in a molecule. The method according to claim 1, The coating layer, (A) organosilane partial hydrolyzate alone selected from the group consisting of compounds represented by the following formula (1) to formula (3) alone; Or (A) at least one organosilane partial hydrolyzate selected from the group consisting of compounds represented by formulas (1) to (3) and (B) at least one metal alkoxide selected from the group consisting of compounds represented by formula (4) Plastic substrate formed by curing partial hydrolyzate: (Formula 1) (R ¹ ) _m -Si-X _(4-m) (Formula 2) (R ¹ ) _m -O-Si-X _(4-m) (Formula 3) (R ¹ ) _m -N (R ² ) -Si-X _(4-m) (Formula 4) M- (R ³⁾ _z In the above Chemical Formulas 1 to 3, X may be the same or different from each other and is hydrogen, halogen, alkoxy of 1 to 12 carbon atoms, acyloxy, alkylcarbonyl, alkoxycarbonyl, or -N (R ² ) ₂ , R ¹ may be the same or different and is selected from the group consisting of alkyl, alkenyl, alkynyl, aryl, arylalkyl, alkylaryl, arylalkenyl, alkenylaryl, arylalkynyl, alkynylaryl, , Alkoxy of 1 to 12 carbon atoms, alkoxycarbonyl of 1 to 12 carbon atoms, sulfonic acid, phosphoric acid, acryloxy, methacryloxy, epoxy, Or a vinyl group, R ² is hydrogen or alkyl having 1 to 12 carbon atoms, m is an integer of 1 to 3, In Chemical Formula 4, M represents a metal selected from the group consisting of aluminum, zirconium, and titanium, R ³ may be the same or different from each other and is halogen, alkyl having 1 to 12 carbon atoms, alkoxy, acyloxy, Z is an integer of 3 or 4; The plastic substrate of claim 1, wherein the coating layer has a thickness of about 1 μm to about 20 μm. The plastic substrate according to claim 1, wherein the surface flatness (Ra) value of the coating layer is 0.1 to 1.2 nm. The plastic substrate of claim 1, further comprising an additional coating layer provided on the bottom surface of the substrate layer. The plastic substrate of claim 9, further comprising an additional metal thin film layer provided between the additional coating layer and the base layer. The plastic substrate according to any one of claims 1 to 10, wherein the plastic substrate is a display device, a lighting device or a substrate for a solar cell. a) forming a metal thin film layer having a thickness of 18 to 50 μm on the base layer; And b) coating a composition for forming a coating layer on the metal thin film layer to form a coating layer. The method of claim 12, wherein in the step a), the metal thin film layer is formed by a casting method, a deposition coating method, or a laminating method. The method of claim 12, wherein the metal thin film layer of step a) comprises at least one selected from stainless steel, copper, and aluminum. delete The method of claim 12, wherein in step b), the coating layer is formed by a coating method, a lamination method, or a deposition method. The method of claim 12, wherein the coating layer of step b) is a monomer of an organic compound having two or more polymerizable unsaturated groups in the molecule; Oligomers having a weight average molecular weight of 100 to 1,000 having two or more polymerizable unsaturated groups in a molecule; And forming a coating layer-forming composition containing at least one selected from organic compounds having a weight average molecular weight of 1,000 to 500,000 having at least one polymerizable unsaturated group in a molecule by UV curing or thermosetting. The method according to claim 12, wherein the coating of the b) step, (A) organosilane partial hydrolyzate alone selected from the group consisting of compounds represented by the following formulas (1) to (3); Or (A) at least one organosilane partial hydrolyzate selected from the group consisting of compounds represented by formulas (1) to (3) and (B) at least one metal selected from the group consisting of compounds represented by formula (4) Method for producing a plastic substrate formed by curing the alkoxide partial hydrolyzate: (Formula 1) (R ¹ ) _m -Si-X _(4-m) (Formula 2) (R ¹ ) _m -O-Si-X _(4-m) (Formula 3) (R ¹ ) _m -N (R ² ) -Si-X _(4-m) (Formula 4) M- (R ³⁾ _z In the above Chemical Formulas 1 to 3, X may be the same or different from each other and is hydrogen, halogen, alkoxy of 1 to 12 carbon atoms, acyloxy, alkylcarbonyl, alkoxycarbonyl, or -N (R ² ) ₂ , R ¹ may be the same or different from each other, alkyl, alkenyl, alkynyl, aryl, arylalkyl, alkylaryl, arylalkenyl, alkenylaryl, arylalkynyl, alkynylaryl, halogen, amide having 1 to 12 carbon atoms , Aldehyde, ketone, alkylcarbonyl, carboxy, mercapto, cyano, hydroxy, alkoxycarbon having 1 to 12 carbon atoms, alkoxycarbonyl having 1 to 12 carbon atoms, sulfonic acid, phosphoric acid, acryloxy, methacryloxy, epoxy , Or a vinyl group, R ² is hydrogen or alkyl having 1 to 12 carbon atoms, m is an integer of 1 to 3, In Chemical Formula 4, M represents a metal selected from the group consisting of aluminum, zirconium, and titanium, R ³ may be the same or different from each other and is halogen, alkyl having 1 to 12 carbon atoms, alkoxy, acyloxy, Z is an integer of 3 or 4; The method of claim 12, wherein in the step b), the coating layer is formed in a thickness of 1 ~ 20㎛. The method of claim 12, wherein the surface flatness (Ra) value of the coating layer is 0.1 to 1.2 nm. The method of claim 12, further comprising forming an additional coating layer on the lower surface of the substrate layer. The method of claim 21, further comprising forming an additional metal thin film layer between the additional coating layer and the base layer.

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