KR101188753B1 - Method for manufacturing conductive pattern and conductive pattern manufactured by the method - Google Patents

Abstract

The present invention, a) forming a conductive pattern on the substrate; And b) oxidizing the conductive pattern with a halogen gas to blacken the surface of the conductive pattern, and a conductive pattern manufactured by the method.

Conductive pattern, blackening

Description

Method of manufacturing a conductive pattern and a conductive pattern produced thereby {METHOD FOR MANUFACTURING CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN MANUFACTURED BY THE METHOD}

The present invention relates to a method for producing a conductive pattern capable of blackening the conductive pattern and a conductive pattern produced thereby. Specifically, the present invention relates to a method of manufacturing a conductive pattern capable of oxidizing a conductive pattern and blackening the surface of the conductive pattern, and a conductive pattern manufactured thereby.

In general, a display apparatus is a general term for a TV or a computer monitor, and includes a display assembly having a display panel for forming an image, and a casing for supporting the display assembly.

The display assembly includes display panels such as a cathode ray tube (CRT), a liquid crystal display (LCD), and a plasma display panel (PDP) for forming an image, a circuit board for driving the display panel, and a display panel disposed in front of the display panel. It includes an optical filter.

Optical filters include anti-reflective coatings that prevent external light from being reflected back to the outside, near-infrared shields that shield near-infrared rays from display panels to prevent malfunctions of electronic devices such as remote controls, and color adjustment dyes. By adjusting the color correction film to increase the color purity and the electromagnetic wave shielding film for shielding the electromagnetic waves generated in the display panel when driving the display device.

Wherein the electromagnetic shielding film is a substrate of a transparent material; And a conductive pattern made of a metal material having excellent electrical conductivity, such as silver and copper, and patterned by a photolithography process.

Since the conductive pattern is made of a metallic material having high gloss, external light incident from the outside may be reflected or image light from the display panel may be reflected, thereby reducing the contrast ratio. It is common to deal with it. That is, it is common to blacken a conductive pattern.

As an example of the blackening method of the conductive pattern, there is a method of adding carbon black or black dye to the conductive paste for forming the conductive pattern.

As another example of the blackening method of the conductive pattern, Korean Patent Laid-Open Publication No. 2004-0072993 and Japanese Patent Laid-Open Publication No. 2001-210988 form a mesh on top of a metal foil by photolithography and then use a chemical such as concentrated nitric acid. It describes the method of blackening.

However, since carbon black has a much higher specific resistance than metals contained in the conductive paste, and black dyes have no conductivity, when carbon black and black dyes are added to the conductive paste, they act as impurities. It may serve to provide blackening degree, but due to these, the sheet resistance is rather increased, thereby degrading electromagnetic shielding performance.

In addition, after the conductive pattern is formed, when the conductive pattern is treated with concentrated nitric acid and blackened, workability is deteriorated, and the processing time is long, and there is a problem in that sufficient blackening degree is not provided. In addition, there is a problem of increasing the sheet resistance affecting the electromagnetic shielding performance.

The present invention, a) forming a conductive pattern on the substrate; And b) oxidizing the conductive pattern with a halogen gas to blacken the surface of the conductive pattern.

It provides a conductive pattern produced by the manufacturing method according to the present invention.

It provides a film comprising a conductive pattern produced by the manufacturing method according to the present invention.

It provides an optical filter for a display device comprising a conductive pattern produced by the manufacturing method according to the present invention.

Provided is a display apparatus including a conductive pattern manufactured by the manufacturing method according to the present invention.

The present invention, a conductive pattern formed on the substrate; And a blackening layer formed on the surface of the conductive pattern by oxidizing the surface of the conductive pattern with a halogen gas.

According to the present invention, the conductive pattern can be sufficiently blackened to reduce the reflectivity of the conductive pattern. In addition, the blackening of the conductive pattern is easy to improve the productivity, it is possible to reduce the manufacturing cost.

Method for producing a conductive pattern according to the present invention, a) forming a conductive pattern on the substrate; And b) oxidizing the conductive pattern with a halogen gas to blacken the surface of the conductive pattern.

In the step a), the substrate may be a film formed of a glass substrate or a polymer resin.

When the substrate is a glass substrate, the substrate may be a glass substrate of a glass optical filter disposed in front of the plasma display panel (PDP), or the substrate may be a plasma display panel itself. In this case, when the substrate is the plasma display panel itself, a conductive pattern is directly formed on the surface of the plasma display panel.

When the base material is a film formed of a polymer resin, the base material is a film substrate of a film-type optical filter disposed in front of the plasma display panel, or the base material of the electromagnetic shielding film comprising a resin layer and a conductive pattern formed on the resin layer It may be a resin layer.

When using the film formed from the said polymeric resin as a base material, polyacrylic-type resin, a polyurethane-type resin, polyester-based resin, polyepoxy resin, polyolefin resin, polycarbonate resin, a cellulose resin, polyimide resin, and poly One or more resins selected from ethylene naphthalate (PEN) may be used. Here, the substrate in the form of a film may be rigid or flexible.

In the step a), the conductive pattern may include at least one metal selected from copper, silver, gold, and aluminum. Here, the conductive pattern may be formed using a conductive paste containing the metal.

The conductive paste may be formed by dispersing the powder of the metal in an appropriate organic solvent, and a polymer binder may be added to the organic solvent.

The metal powder is a powder of the metal having excellent electrical conductivity, and can be variously applied in addition to the metal, but it is preferable to use silver powder having the lowest resistivity among the aforementioned metals.

Butyl carbitol acetate, carbitol acetate, cyclohexanone, cyclohexanone, cellosolve acetate, terpineol, and the like may be used as the organic solvent.

When the polymer binder is added and the conductive paste is printed by the offset printing method, the polymer binder serves to have a viscosity suitable for the offset printing method, and serves to improve adhesion between the conductive pattern formed by the conductive paste and the substrate.

The polymer binder may be a polyacrylic resin, a polyurethane resin, a polyester resin, a polyepoxy resin, a polyolefin resin, a polycarbonate resin, a cellulose resin, a polyimide resin, and a polyethylene naphthalate (Poly Ethylene Naphthalate, PEN) In addition to the material similar to the base material can be variously applied.

The conductive paste may further include a glass frit to improve adhesion between the conductive paste and the glass substrate when the glass substrate is used as the substrate.

For example, the conductive paste may be prepared by dissolving a polymer binder in an organic solvent to prepare an organic binder resin solution, adding glass frit to it, finally adding metal powder, kneading the same, and then using a three-stage roll mill. Metal powder and glass frit may be prepared to be uniformly dispersed.

In the step a), the conductive pattern may be a silver (Ag) conductive pattern formed by directly printing a conductive paste containing silver (Ag) powder on the substrate.

The conductive paste may be a high temperature calcined silver (Ag) conductive paste when the substrate is a glass substrate. Here, the high temperature may be 450 ° C. or more, and may be 550 ° C. or more similarly to glass strengthening conditions.

When the substrate is a film formed of the polymer resin, a low temperature calcined silver (Ag) conductive paste may be used. Here, the low temperature may be 200 ° C. or less, and when the substrate is a poly ethylene terephthalate (PET) film, it may be 150 ° C. or less.

In the step a), the conductive pattern may be formed by printing the conductive paste on the substrate by any one method selected from an offset printing method, a screen printing method, a gravure printing method, and an inkjet printing method. In addition, the conductive pattern may be formed on the substrate by using the photolithography method in addition to the printing method described above.

The offset printing method of the printing method comprises the steps of filling the conductive paste in the recess formed in the recess plate; Contacting the printing blanket with the recess plate to transfer the conductive paste from the recess of the recess plate to the printing blanket; And contacting the printing blanket to the substrate, and transferring the conductive paste from the printing blanket to the substrate to form the conductive pattern on the substrate.

In the step of filling the conductive paste into the recess formed in the recess, the conductive paste may be filled into the recess by injecting the conductive paste into the recess, or after the conductive paste is applied to the entire recess, the conductive paste may be filled only in the recess. The remainder may be scraped off with a blade to fill the recess with conductive paste.

Here, although the present invention has been described by applying the concave plate offset printing method, a flat offset printing method and a convex plate offset printing method are also applicable.

In addition, in order to improve adhesion between the conductive paste and the substrate, after coating a separate resin on the substrate, the conductive paste may be printed directly on the substrate.

In addition, any method of printing known in the art to which the present invention pertains may be applied to the method of printing the conductive paste on the substrate.

The method of manufacturing a conductive pattern according to the present invention may further include a) forming the conductive pattern on the substrate and then firing the conductive pattern. And after the firing step, it may further comprise the step of cooling it.

In the firing step, the conductive pattern may be baked at 550 to 800 ° C. for 30 seconds to 30 minutes. However, the present invention is not limited thereto.

In the cooling step, the method is allowed to stand at room temperature or to supply cool air and / or to supply cooling water. The fired conductive pattern can be cooled. However, it is not limited to this method.

In step b), the conductive pattern may be oxidized with halogen gas in a reactor containing halogen gas.

Here, the halogen gas may be formed by oxidizing a halogen aqueous solution containing a halogen element present as a diatomic molecule at room temperature in the reactor containing the air.

The halogen gas is iodine (I ₂ ) Gas, bromine (Br ₂ ) Gas and Fluorine (F ₂ ) It may be one or more gases selected from the gases.

In the step b), the halogen aqueous solution and the conductive pattern may be left together in the reactor to blacken the conductive pattern with the halogen gas generated from the halogen aqueous solution. Thus, the blackening layer is formed on the surface of the conductive pattern, the halogen solution is iodine (I ₂ ), bromine (Br ₂ ) And fluorine (F ₂ ) Of the selected halogen element and the conductive pattern is a silver (Ag) conductive pattern, the blackening layer formed may be silver iodide (AgI), silver bromide (AgBr) or silver fluoride (AgF).

The halogen aqueous solution, 1 to 30 parts by weight of the halogen element based on 100 parts by weight of the halogen aqueous solution; And it can be prepared by mixing 70 to 99 parts by weight of the water.

When using solid iodine (I ₂ ) as the halogen element contained in the aqueous halogen solution, the halogen aqueous solution is the iodine (I ₂ ) of the solid state It may further include potassium iodide (KI) having high solubility.

The halogen aqueous solution, based on 100 parts by weight of the halogen aqueous solution 70 to 99 parts by weight of water; 1 to 30 parts by weight of the potassium iodide (KI); And 1 to 30 parts by weight of the halogen element It can be prepared by mixing.

The method of blackening the conductive pattern with the halogen gas generated from the halogen aqueous solution will be described in detail as follows.

The container containing the aqueous halogen solution and the substrate on which the conductive pattern is formed are placed in a reactor forming a closed space and allowed to stand for a predetermined time.

When the halogen aqueous solution contained in the container is left inside the reactor to form an air-filled sealed space, halogen gas is generated, and the halogen gas oxidizes the metal included in the conductive pattern. The halide is formed on the surface of the conductive pattern as a blackening layer. Here, when the conductive pattern is a silver (Ag) conductive pattern, silver halide is formed.

In this way, the halide formed on the surface of the conductive pattern is to lose the gloss of the metal contained in the conductive pattern and the reflectivity is lowered.

For example, the conductive pattern is a silver (Ag) conductive pattern, and iodine (I ₂ ) having the highest oxidation power with respect to silver (Ag) as a halogen gas. When using gas, iodine (I ₂ ) As the gas oxidizes silver (Ag), a silver iodide (AgI) layer is formed as a blackening layer. ^{Here, AgI + e - = Ag +} I -, E 0 = -0.1519V; I ₂ + 2e ^- = 2I ^- because, E ⁰ = 0.535V, is a _{2Ag + I 2 → 2AgI, E} 0 = 0.7854V. Thus, it can be seen that this is a spontaneous reaction.

When the I ₂ gas having the greatest oxidation power to silver (Ag) is used for the blackening of the silver (Ag) conductive pattern, the iodine aqueous solution generating the iodine (I ₂ ) gas may be water; Potassium iodide (KI); And iodine (I ₂ ) in a solid state.

At this time, the water 70 to 99 parts by weight based on 100 parts by weight of the iodine aqueous solution; 1 to 30 parts by weight of the potassium iodide (KI); And it can be prepared by mixing 1 to 30 parts by weight of the iodine (I ₂ ). Here, since solid iodine (I ₂ ) has a relatively low solubility in water, when dissolved in an excess of potassium iodide (KI) aqueous solution, it becomes I ₃ ⁻ and readily dissolves in water.

Accordingly, when the aqueous solution of iodine is left in air, gaseous iodine (I ₂ ) is generated, and this iodine (I ₂ ) When the gas meets silver (Ag) of the silver (Ag) conductive pattern, an oxidation reaction occurs, and silver iodide (AgI) is formed on the surface of the silver (Ag) conductive pattern, and the silver iodide (AgI) causes silver (Ag) glossiness to be formed. It will disappear and reflectivity will be lower.

The present invention provides a conductive pattern produced by the manufacturing method according to the present invention.

The present invention provides a film comprising a conductive pattern produced by the manufacturing method according to the present invention.

On the other hand, the film having a conductive pattern according to the present invention, the conductive pattern formed on the substrate; And a blackening layer formed on the surface of the conductive pattern by oxidizing the surface of the conductive pattern with a halogen gas. In the present embodiment, since all the contents of the above-described embodiment are applied, a detailed description thereof will be omitted.

Here, the film including the conductive pattern may be an electromagnetic shielding film.

The present invention provides an optical filter for a display device including a conductive pattern manufactured by the manufacturing method according to the present invention.

Here, the optical filter for the display device includes an anti-reflection film that prevents external light incident from the outside to be reflected back to the outside, a near-infrared shielding film for shielding near infrared rays, and a color adjustment dye to adjust color to increase color purity. It may further comprise one or more selected from the film. Here, the optical filter for the display device may be a glass or film optical filter.

The present invention provides a display device including a conductive pattern manufactured by the manufacturing method according to the present invention. Here, the plasma display device may be exemplified as the display device, but is not limited thereto.

The method of manufacturing a conductive pattern according to the present invention is applicable to various fields.

That is, the conductive pattern according to the present invention may be formed on a film formed of a polymer resin to provide an electromagnetic shielding film, and a conductive pattern may be directly formed on a plate surface of the display panel to provide a display panel on which a conductive pattern is formed. It may be formed on the glass substrate of the glass optical filter disposed in front of the panel to provide a glass optical filter, or may be formed on the film substrate of the film optical filter to provide a film optical filter, For example, the present invention will be described in detail by applying to an electromagnetic shielding film.

As shown in Figure 1, the electromagnetic shielding film 20 according to the present invention, the substrate 21; A conductive pattern 22 formed on the substrate 21; And a blackening layer 23 formed on the surface of the conductive pattern 22.

Electromagnetic shielding film 20, a) forming a conductive pattern 22 on the substrate 21; And b) oxidizing the conductive pattern 22 with halogen gas to blacken the surface of the conductive pattern 22.

In the step a), the conductive paste is printed on the substrate 21 by a concave plate offset printing method to form the conductive pattern 22 on the substrate 21.

After the step a), that is, after forming the conductive pattern 22 on the substrate 21, it may further include the step of firing and cooling.

In step b), the container 21 containing the aqueous halogen solution and the substrate 21 on which the conductive pattern 22 is formed are placed in a reactor forming a closed space and allowed to stand for a predetermined time.

When the halogen solution contained in the container is left inside the reactor to form a sealed space filled with air, halogen gas is generated, and the halogen gas oxidizes the metal included in the conductive pattern 22. Accordingly, a halide is formed on the surface of the conductive pattern 22 as the blackening layer 23. As an example, the conductive 22 pattern is a silver conductive pattern, and iodine (I ₂ ) having the highest oxidation power with respect to silver (Ag) as a halogen gas. When using gas, iodine (I ₂ ) As the gas oxidizes silver (Ag), a silver iodide (AgI) layer is formed as a blackening layer.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the scope of the present invention is not limited to the following examples.

Example  One

Concave plate offset printing silver conductive paste containing 75 parts by weight of silver powder, 12 parts by weight of ethyl cellulose as a binder, 12 parts by weight of butyl carbitol acetate as a solvent and 1 part by weight of glass frit Law The printed circuit board was printed on the glass substrate in a mesh pattern. Thus, a silver conductive pattern in the form of a mesh was obtained.

It was calcined at 600 ° C. for 10 minutes and then cooled to obtain a silver (Ag) conductive pattern having a printing width of 25 μm and having a mesh shape.

Next, 10 g of potassium iodide (KI) and iodine (I ₂ ) are added to 100 g of water. After dissolving 2 g, the mixture was stirred for about 10 minutes to prepare an aqueous iodine solution. The beaker containing the aqueous solution of iodine and the silver (Ag) conductive pattern in the mesh form were placed inside a reactor to form an air-filled sealed space, and left for 30 minutes. Therefore, the surface of the mesh-type silver (Ag) conductive pattern has iodine (I ₂ ) generated from an iodine solution. A silver iodide (AgI) layer was formed in the blackening layer by the gas.

Example  2

Except for using a silver conductive paste containing 75 parts by weight of silver powder, 12 parts by weight of acrylate as a binder, 12 parts by weight of α-terpineol as a solvent, and 1 part by weight of glass frit. And the same method as in Example 1.

Comparative example  One

Ag conductive paste containing 75 parts by weight of silver powder, 12 parts by weight of ethyl cellulose as a binder, 12 parts by weight of butyl carbitol acetate as a solvent, and 1 part by weight of glass frit. Intaglio offset printing By using, printed on the glass substrate in a mesh (pattern) pattern. Thus, a silver conductive pattern in the form of a mesh was obtained.

It was calcined at 600 ° C. for 10 minutes and then cooled to obtain a silver (Ag) conductive pattern having a printing width of 25 μm and having a mesh shape.

Comparative example  2

Except for using a silver conductive paste containing 75 parts by weight of silver powder, 12 parts by weight of acrylate as a binder, 12 parts by weight of α-terpineol as a solvent, and 1 part by weight of glass frit. And the same method as in Comparative Example 1.

Property evaluation

The sheet resistance (Ω / □) of the silver (Ag) conductive pattern in the mesh form according to the Examples and Comparative Examples was measured using Mitsubishi Chemical's MCP-T600, and the reflectivity (550 nm) of the silver (Ag) conductive pattern in the mesh form. Was measured using UV-3600 manufactured by Shimadzu, and blackening degree (L value) was calculated from the reflectance. This is shown in Table 1.

550nm reflectance (%) Blackening degree (L) Sheet resistance (Ω / □) Comparative Example 1
(All black cotton mesh surface) 11.3 40.2 0.27 Comparative Example 2
(All black cotton mesh surface) 11.6 40.8 0.27 Example 1
(Mesh surface after blackening) 8.0 34.2 0.32 Example 2
(Mesh surface after blackening) 7.2 33.1 0.30

As can be seen from Table 1, as Comparative Examples 1 and 2, the sheet resistance of the silver (Ag) conductive pattern before the blackening treatment was 0.27Ω / □, and iodine (I ₂ ) In Examples 1 and 2 in which a silver iodide (AgI) layer was formed of a silver conductive layer on a silver (Ag) conductive pattern using gas, sheet resistances of 0.32 Ω / □ and 0.30Ω / □ before blackening treatment (Comparative Examples 1,2 Slightly higher than).

In the case of blackening degree (L value), the smaller the value, the blacker it means. As Comparative Examples 1 and 2, the blackening degree (L value) of the silver (Ag) conductive pattern before blackening was 40.2 and 40.8, but iodine (I ₂ ) In Examples 1 and 2 in which a silver iodide (AgI) layer was formed on the silver (Ag) conductive pattern using a gas, the blackening degree (L value) was reduced to 34.2 and 33.1. It can be seen that the silver (Ag) conductive pattern 22 is sufficiently blacked.

As Comparative Examples 1 and 2, the reflectance (%) of the silver (Ag) conductive pattern before blackening was 11.3% and 11.6%, and iodine (I ₂ ) In Examples 1 and 2 in which a silver iodide (AgI) layer was formed as a blackening layer on a silver (Ag) conductive pattern using a gas, the reflectance (%) was 8.0% and 7.2% before the blackening treatment (Comparative Examples 1 and 2). It can be seen that about 30% lower.

As described above, in the case of Examples 1 and 2, the blackening degree is lowered and the reflectance is lowered. As can be seen in FIG. 2 showing the measurement result of measuring the surface of the pattern 22, it can be seen that it is due to the silver iodide (AgI) layer formed on the surface of the silver (Ag) conductive pattern. That is, the silver iodide (AgI) causes the silver (Ag) glossiness of the silver (Ag) conductive pattern to be lost and the reflectivity is lowered.

As described above, according to the present invention, after the conductive pattern is formed on the substrate and the conductive pattern is oxidized with halogen gas to blacken the surface of the conductive pattern, the conductive pattern can be sufficiently blacked and the reflectivity can be lowered. .

Further, even after the blackening treatment, not only the sheet resistance is slightly increased than before the blackening treatment, but also the manufacturing method thereof is simplified, so that the productivity is improved and the manufacturing cost is reduced.

According to the present invention, when the conductive paste is printed on the substrate by an offset printing method, the conductive pattern can be easily formed on the substrate, so that manufacturing is easy, productivity is improved, and manufacturing cost is reduced.

Meanwhile, the electromagnetic shielding film 20 according to the present invention may be applied to the optical filter 100 disposed in front of the plasma display panel of the plasma display apparatus.

For example, as illustrated in FIG. 3, the optical filter 100 disposed in front of the plasma display panel 50 having the rear panel 51 and the front panel 52 may include color adjustment dyes. A color correction film 40 for increasing color purity by adjusting; A near-infrared shielding film 30 stacked on the color correction film 40 and shielding the near-infrared light generated from the plasma display panel 50 to prevent malfunction of an electronic device such as a remote controller; An electromagnetic shielding film 20 according to the present invention stacked on the near-infrared shielding film 30 and shielding electromagnetic waves generated from the plasma display panel 50; And an anti-reflection film 10 laminated on the electromagnetic shielding film 20 to prevent the external light incident from the outside from being reflected back to the outside.

As such, when the optical filter 100 to which the electromagnetic shielding film 20 according to the present invention is applied is disposed in front of the plasma display panel 50, the optical filter 100 may be removed from the plasma display panel 50 by the gloss of a conductive pattern made of a metal material. The reflection of light and external light and the lowering of the contrast ratio of the display device are prevented by the blackening layer 23 formed on the conductive pattern 22 of the electromagnetic shielding film 20.

Here, although the present invention has been described by applying the plasma display panel 50, the present invention is not limited thereto, and the stacking order of the optical filter 100 disposed in front of the plasma display panel 50 is the color correction layer 40. FIG. ), The near-infrared shielding film 30, the electromagnetic shielding film 20, and the anti-reflection film 10 are described in this order, but the stacking order is not limited thereto.

1 is a cross-sectional view of an electromagnetic shielding film including a conductive pattern according to the present invention,

2 is a view showing the XRD measurement results before and after the blackening of the conductive pattern according to the present invention,

3 is a cross-sectional view of an optical filter for a display device including the electromagnetic shielding film according to the present invention.

Description of the Related Art [0002]

10: antireflection film

20: electromagnetic shielding film

21: description

22: conductive pattern

23: blackening layer

30: near infrared shield

40: color correction film

50: plasma display panel

51: rear panel

52: front panel

100: optical filter

Claims (22)

a) forming a conductive pattern on the substrate; And b) oxidizing the conductive pattern with a halogen gas to blacken the surface of the conductive pattern Method of producing a conductive pattern comprising a. The method of claim 1, wherein in the step a), the substrate is a glass substrate or a film formed of a polymer resin. The method of claim 1, wherein the conductive pattern in step a) comprises at least one metal selected from copper, silver, gold, and aluminum. The method of claim 1, wherein in the step a), the conductive pattern is a conductive pattern characterized in that the silver (Ag) conductive pattern formed by printing a conductive paste containing silver (Ag) powder directly on the substrate Way. The method of claim 1, wherein in the step a), the conductive pattern is formed by printing a conductive paste on the substrate by any method selected from offset printing, screen printing, gravure printing, and inkjet printing. Method of producing a conductive pattern to the. The method according to claim 1, wherein in step b) the halogen gas is iodine (I ₂ ) Gas, bromine (Br ₂ ) gas and fluorine (F ₂ ) Method for producing a conductive pattern, characterized in that at least one gas selected from the gas. The method of claim 1, wherein in step b), the conductive pattern is oxidized with the halogen gas in a reactor containing the halogen gas. The conductive gas of claim 1, wherein in the step b), the halogen gas is formed by oxidizing and reacting a halogen aqueous solution containing a halogen element present as a diatomic molecule at room temperature in a reactor containing air. Method of making a pattern. The method according to claim 8, wherein in the step b), the halogen aqueous solution and the conductive pattern are left together inside the reactor, the conductive pattern characterized in that the blackening of the conductive pattern with the halogen gas generated from the halogen aqueous solution Manufacturing method. The method according to claim 8, wherein the halogen aqueous solution, 1 to 30 parts by weight of the halogen element based on 100 parts by weight of the halogen aqueous solution; And 70 to 99 parts by weight of water is prepared by mixing a conductive pattern. The method of claim 8, wherein the aqueous halogen solution further comprises potassium iodide (KI). The method according to claim 11, wherein the halogen aqueous solution, 70 to 99 parts by weight of water based on 100 parts by weight of the halogen aqueous solution; 1 to 30 parts by weight of the potassium iodide (KI); And 1 to 30 parts by weight of the halogen element is prepared by mixing. The method according to claim 8, wherein the halogen aqueous solution, 70 to 99 parts by weight of water based on 100 parts by weight of the halogen aqueous solution; 1-30 parts by weight of potassium iodide (KI); And 1 to 30 parts by weight of iodine (I ₂ ) to prepare a conductive pattern. A conductive pattern produced by the manufacturing method according to any one of claims 1 to 13. A film comprising the conductive pattern according to claim 14. Optical filter for display device comprising a conductive pattern according to claim 14. The method according to claim 16, Anti-reflection film; Near infrared shielding film; And at least one selected from a color compensating film. Display device including a conductive pattern according to claim 14. A conductive pattern formed on the substrate; And A blackening layer formed on the surface of the conductive pattern by oxidizing the surface of the conductive pattern with a halogen gas Film with a conductive pattern comprising a. The film having a conductive pattern of claim 19, wherein the conductive pattern comprises at least one metal selected from copper, silver, gold, and aluminum. The method of claim 19, wherein the halogen gas is iodine (I ₂ ) Gas, bromine (Br ₂ ) gas and fluorine (F ₂ ) A film having a conductive pattern, characterized in that at least one gas selected from the gas. The conductive pattern of claim 19, wherein the conductive pattern is a silver (Ag) conductive pattern, and the blackening layer is silver iodide (AgI) formed by oxidizing the silver (Ag) conductive pattern with iodine (I ₂ ) gas. Film with a pattern.

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