KR101184430B1 - Apparatus and method for selective plating using a plating resist - Google Patents

Abstract

The present invention relates to a partial plating apparatus and a partial plating method using an anti-plating film, the partial plating apparatus according to the present invention includes a plating preventing film forming unit capable of forming a plating preventing film on the surface to be plated; A laser beam irradiation unit capable of irradiating a laser beam in a predetermined pattern on the plated surface on which the plating prevention film is formed; A plating part including a plating solution for dipping the plated body; An anti-plating film removing unit capable of removing the anti-plating film formed on the surface to be plated; And a transfer member capable of transferring the plated body along the anti-plating film forming portion, the laser beam irradiating portion, the plating portion, and the anti-plating anti-plating film removal portion.

Plating, partial plating, laser, anti plating

Description

Partial Plating Apparatus and Partial Plating Method Using Plating Barrier Film {APPARATUS AND METHOD FOR SELECTIVE PLATING USING A PLATING RESIST}

The present invention relates to a partial plating apparatus and a partial plating method using a plating prevention film, and more particularly, to a partial plating apparatus and a partial plating method capable of forming a plating pattern using a laser.

Plating refers to the coating of a thin layer of another material for the purpose of improving the surface condition of an article, generally to the coating of a thin layer of another metal or alloy on a metal surface.

Types of plating include electroplating, anodizing, phosphate coating, electroless plating, and the like, generally referring to electroplating.

Electroplating is an electrochemical decomposition method in which a metal material to be plated is connected to an anode and a product to be plated is electrically connected to a cathode, thereby dissolving at the anode and depositing metal ions at the cathode.

Unlike electroplating, anodization is a method of artificially forming an oxide film by generator oxygen by placing a product on the anode. Phosphate coating is a process that does not use electricity. It is a method of forming a film by chemical action, and electroless plating is a method of forming a plating layer on the surface of a product by using an appropriate reducing material for the metal component contained in the plating liquid without using electricity.

The plating process on only a part of the surface of the object is called selective plating or selective plating. In the plating method, the plating solution is partially immersed in the plating solution, and the plating solution is partially used by using a nozzle. There existed a method of spraying a plating solution to a desired site using an absorber such as a spraying method or a nonwoven fabric, or a method of forming a plating pattern with a mask in advance and performing exposure and etching processes.

However, according to the conventional partial plating method as described above, it is impossible to immerse a minute portion of the plated body in the plating solution, it is impossible to spray to form a fine line using a nozzle, and to be buried in the minute portion using an absorber. Since this is impossible, there was a problem that a complicated pattern and a fine pattern of several μm cannot be formed.

In addition, there is a problem in that a mask is manufactured to perform plating treatment only on a part of the region, and a complicated process such as exposing, developing, and etching the plated body is required.

In addition, when the mask is manufactured and subjected to the exposure and etching process, in order to form various plating patterns, a plurality of masks must be manufactured separately for each plating pattern, which causes costly problems and problems of polluting the environment by using etching solutions. .

The present invention has been made to solve the above problems, and an object thereof is to provide a partial plating apparatus and a partial plating method capable of forming a complex pattern, a fine pattern of several μm.

Another object of the present invention is to provide a partial plating apparatus and a partial plating method capable of simplifying a conventional complicated partial plating process and easily implementing various plating patterns.

Another object is to provide a partial plating apparatus and a partial plating method which can prevent environmental pollution by not using an etching solution used in a conventional partial plating process.

Partial plating apparatus using the anti-plating film according to the present invention according to the above object is a plating prevention film forming portion capable of forming a plating prevention film on the surface to be plated; A laser beam irradiation unit capable of irradiating a laser beam in a predetermined pattern on the plated surface on which the plating prevention film is formed; A plating part including a plating solution for dipping the plated body; An anti-plating film removing unit capable of removing the anti-plating film formed on the surface to be plated; And a transfer member capable of transferring the plated body along the anti-plating film forming portion, the laser beam irradiating portion, the plating portion, and the anti-plating anti-plating film removal portion.

The laser beam irradiator further includes a cleaning unit capable of cleaning the plated body irradiated with the laser beam.

The type and intensity of the laser beam irradiated from the laser beam irradiation unit is set to remove the plating prevention layer, and the type of the laser beam is classified based on any one or more of the wavelength and type of the laser beam, and the laser beam The type of is classified into a pulse type or a continuous emission type, characterized in that further classified based on the pulse width when the type of the laser beam is the pulse type.

The laser beam irradiation unit includes a laser device for irradiating the laser beam, the laser device is characterized in that the two-dimensional plane or three-dimensional three-dimensional processing device.

The moving speed of the laser device is characterized in that the same as the moving speed of the transfer member.

The laser beam irradiation unit further includes a control unit for controlling the operation of the laser device according to a set pattern.

The laser device includes a spot size variable module, a focus variable module, and a laser energy homogenizer.

The partial plating apparatus may include a supply buffer capable of controlling supply of the plated body; A pretreatment unit capable of washing the plated body before the anti-plating layer forming unit; And a recovery buffer for controlling the recovery of the plated body.

Partial plating method using a plating prevention film according to the present invention according to the above object (A) forming a plating prevention film on the surface to be plated; (B) irradiating a laser beam in a predetermined pattern on the anti-plating film of the plated body; (C) dipping the plated body in a plating solution; (D) cleaning the plated body; (E) removing the plating prevention film.

Step (B) is characterized in that it further comprises the step of washing the plated body, after irradiating the laser beam.

The type and intensity of the laser beam irradiated on the anti-plating layer are set to remove the anti-plating layer, and the type of the laser beam is classified based on any one or more of the wavelength and type of the laser beam, and the laser beam The type of is classified into a pulse type or a continuous emission type, characterized in that further classified based on the pulse width when the type of the laser beam is the pulse type.

The partial plating apparatus and the partial plating method using the anti-plating film according to the present invention as described above has the following effects.

The partial plating apparatus and the partial plating method using the anti-plating film according to the present invention forms a plating pattern by irradiating a laser beam through a laser apparatus including a spot size variable module, a focus variable module, and a laser energy homogenizer, thereby forming a complex pattern. There is an effect that can form a pattern, a fine pattern of several μm with a uniform thickness.

In addition, the partial plating apparatus and the partial plating method using the anti-plating film according to the present invention can simplify the conventional complex partial plating process by partial plating using a laser beam, it is possible to easily implement a variety of plating patterns, masks There is no effect to reduce the cost because it is not manufactured separately.

In addition, the partial plating apparatus and the partial plating method using the anti-plating film according to the present invention does not use the etching liquid used in the conventional partial plating process, there is an effect that can prevent environmental pollution.

In addition, there is an effect that the production speed and efficiency can be increased by performing each step of the partial plating continuously by the transfer member.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the partial plating apparatus using a plating film according to the present invention.

1 is a view showing an embodiment of a partial plating apparatus using a plating prevention film according to the present invention.

In the partial plating apparatus using the anti-plating film according to the present invention, as shown in Figure 1, the anti-plating film forming portion 104, which can form the anti-plating film on the plated surface of the plated body, the plated surface on which the anti-plating film is formed A laser beam irradiator 106 capable of irradiating a laser beam in a predetermined pattern on the substrate, a plating unit 108 including a plating solution for immersing the plated body, and an anti-plating film removing unit capable of removing the anti-plating film formed on the surface to be plated. It consists of 110.

In the anti-plating layer forming unit 104, an anti-plating material is coated on the entire surface to be plated of the plated body to form a anti-plating layer. In this case, various kinds of inks may be used as the anti-plating material according to the type and the plating method of the plated body, including the ketone base ink.

The laser beam irradiation unit 106 forms a plating pattern by irradiating a laser beam on the plating prevention film of the plated body. At this time, the laser beam is irradiated according to a predetermined pattern, and the type and intensity of the laser beam are set so as not to affect the plated body while removing the anti-plating film. At this time, the type of laser beam is classified based on the wavelength, type (pulse type or continuous emission type) of the laser beam, and pulse width in the case of the pulse type.

The laser beam irradiation unit 106 further includes a laser device for irradiating the laser beam and a control unit for controlling the movement of the laser device. In this case, the laser device is preferably a two-dimensional plane or three-dimensional three-dimensional processing device, and when a predetermined pattern is input through the control unit, the laser device irradiates a laser beam on the two-dimensional plane or three-dimensional stereoscopic according to the input pattern do. Therefore, when the changed pattern is inserted into the control unit of the laser beam irradiation unit 106 to change the plating pattern, the control unit controls the movement of the laser device according to the changed pattern, so that the plating pattern can be easily changed. As described above, only the portion of the laser beam irradiation unit 106 that is desired to be plated is removed, so that only a portion of the portion where the anti-plating layer is removed may be partially plated.

The laser device includes a spot size variable module, a focus variable module, and a laser energy homogenizer. The spot size variable module reduces the focus spot through the process of increasing the size of the laser beam irradiated by the focusing lens of the laser device. Through this, the line width to which the laser beam is irradiated can be adjusted. The variable focus module corrects an error in the optical path through the correction optical system to correct the light reflected from the reflector of the laser device, and adjusts the light emitted from the correction optical system to focus on a desired portion through the focusing lens. This allows you to accurately focus the protrusion or depression. The laser energy homogenizer makes the energy distribution of the cross section of the laser beam uniform. Through this, the thickness of the center and the outer portion of the portion irradiated with the laser beam may be constant.

Figure 2a is a view showing the energy distribution of the laser beam cross section by the laser device according to the prior art, Figure 2b is a diagram showing the energy distribution of the laser beam cross section by the laser device according to the present invention. Referring to Figures 2a and 2b, the energy distribution of the cross section of the laser beam by the laser device according to the prior art has a high Gaussian distribution in the center portion and low peripheral portion, while the laser beam in the laser device according to the present invention The energy distribution of the cross section is represented uniformly throughout by the laser energy homogenizer.

In the plating unit 108, the plated body is immersed in the plating solution, and the plating layer is formed only on a selected portion where the anti-plating film is removed by various known methods such as electroplating, anodizing, phosphate coating, and electroless plating.

In the anti-plating film removing unit 110, the plated body is immersed in the anti-plating film removing liquid, and the anti-plating film remaining on the plated surface of the plated body is removed.

The partial plating apparatus using the anti-plating film according to the present invention may transfer the plated body along the anti-plating film forming unit 104, the laser beam irradiation unit 106, the plating unit 108, and the anti-plating film removing unit 110. And a conveying member (not shown). Therefore, the partial plating is performed while the plated body is moved by the transfer member.

The partial plating apparatus using the anti-plating film according to the present invention may further include a first cleaning part 120 before the anti-plating film forming part 104, and the third cleaning part 124 after the plating part 108. The laser beam irradiation unit 106 may further include a second cleaning unit 122. The first washing unit 120, the second washing unit 122, and the third washing unit 124 serve to wash the plated body. The first cleaning unit 120 may remove impurities on the outer surface of the to-be-plated body by washing the to-be-plated body before forming the anti-plating film on the to-be-plated body. The second cleaning unit 122 may easily remove the anti-plating material separated from the plated body by irradiating the laser beam by irradiating the plated body with the laser beam and then cleaning the plated body. The third cleaning unit 124 may easily remove the plating solution remaining on the plated body by removing the plated body from the plating solution and then washing the plated body.

It is preferable that the start end of the partial plating apparatus using the anti-plating film according to the present invention further comprises a supply buffer and a recovery buffer at the end. The supply buffer can control the supply of the plated body and the recovery buffer can control the number of the plated body, so that the plating process can be carried out continuously while the plated body moves smoothly by the transfer member.

The pre-plating unit may further include a pre-treatment unit before the anti-plating unit forming unit 104 of the partial plating apparatus using the anti-plating layer according to the present invention. We can prepare in state. In this case, the first cleaning unit 120 may be included in the pretreatment unit.

Partial plating apparatus using an anti-plating film according to an embodiment of the present invention is configured as a device that can be performed once partial plating, but the present invention is not limited to this, so that a plurality of partial plating may be formed of a plurality of layers A plurality of plating apparatuses may be connected and formed. In addition, the entire plating apparatus and the partial plating apparatus capable of plating the entire surface of the plated body may be combined to be formed.

Hereinafter, the partial plating method according to the present invention with reference to the accompanying drawings in detail as follows.

3A to 3H are cross-sectional views showing an embodiment of the partial plating method using the anti-plating film according to the present invention.

According to the partial plating method using the anti-plating film according to the present invention, as shown in Figure 3a, as the pre-treatment step to wash the plated body 210, impurities on the outer surface of the plated body 210 is removed.

As shown in FIG. 3B, an anti-plating material is coated on the entire surface of the plated body 210 to form the anti-plating film 212. In this case, various kinds of inks may be used as the anti-plating material according to the type and the plating method of the plated body, including the ketone base ink.

As shown in FIG. 3C, a plating pattern is formed by irradiating a laser beam 220 on the anti-plating film 212 of the plated body 210. At this time, the laser beam is irradiated according to a predetermined pattern, and the type and intensity of the laser beam are set so as not to affect the plated body while removing the anti-plating film. In this case, the type of laser beam is classified based on the wavelength, type (pulse type or continuous emission type) of the laser beam, and pulse width in the case of a pulse type.

The laser beam 220 is irradiated from a laser device (not shown), and the laser device is controlled to perform two-dimensional or three-dimensional solid processing by a controller (not shown). Accordingly, the plating prevention layer may be selectively removed only for a portion to be plated.

As shown in FIG. 3D, the plated body 210 is cleaned to remove the anti-plating material from the plated body in which the laser beam 220 is irradiated to remove the anti-plating film 212.

As shown in FIG. 3E, the plating body 210 is immersed in the plating solution 230, and the plating layer (not shown) is formed by various known methods such as electroplating, anodizing, phosphate coating, and electroless plating. Form.

As shown in FIG. 3F, the plated body 210 having the plating layer 240 formed on the portion to be plated is washed to remove the plating solution still remaining on the plated body 210.

As shown in FIG. 3G, the plated body 210 on which the plated layer 240 is formed is immersed in the anti-plating film removing liquid 250, and the anti-plating film 212 still present on the plated surface of the plated body 210 is removed. Remove

As shown in FIG. 3H, the plating layer 240 is formed on the surface to be plated of the plated body 210 to complete partial plating of a desired pattern.

In the partial plating method using the anti-plating film according to the embodiment of the present invention, before the anti-plating film 212 is formed, the laser beam 220 is irradiated onto the anti-plating film 212, and then, after the plating layer 240 is formed, each is washed. The process takes place, but this may be omitted and proceeded in some cases.

In the partial plating method using the anti-plating film according to an embodiment of the present invention is configured so that one partial plating can be made, but the present invention is not limited to this, the partial plating method so that a plurality of partial plating can be formed of a plurality of layers This can be done multiple times in succession. In addition, the entire plating method and the partial plating method that can be plated on the entire surface of the plated body may be combined.

The plated body and the plating liquid used in the partial plating apparatus and the partial plating method using the anti-plating film according to the present invention may use various metals, non-metals and the like according to the needs of the user.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains can be changed and modified within the scope of the present invention. .

1 is a view showing an embodiment of a partial plating apparatus according to the present invention

Figure 2a is a view showing the energy distribution of the laser beam cross section by the laser device according to the prior art

Figure 2b is a view showing the energy distribution of the laser beam cross section by the laser device according to the present invention

3A to 3H are cross-sectional views showing an embodiment of the partial plating method according to the present invention.

Claims (11)

An anti-plating film forming unit capable of forming an anti-plating film on the surface to be plated of the object to be plated; A laser beam irradiator including a laser device capable of irradiating a laser beam in a predetermined pattern on the plated surface on which the anti-plating film is formed; A plating part including a plating solution for dipping the plated body; An anti-plating film removing unit capable of removing the anti-plating film formed on the surface to be plated; And And a transfer member capable of transferring the plated body along the anti-plating film forming unit, the laser beam irradiating unit, the plating unit, and the anti-plating film removing unit, The moving speed of the laser device is the same as the moving speed of the transfer member, The laser beam irradiation unit, A focus variable module for changing a focal point of the laser according to the case where the plated surface is a protruding portion or a recessed portion; And Characterized in that it comprises a laser energy homogenizer for controlling the energy of the cross section of the laser beam, Partial plating device using plating prevention film. The method of claim 1, The laser beam irradiation unit further includes a cleaning unit for cleaning the plated body irradiated with the laser beam, Partial plating device using plating prevention film. The method of claim 1, The type and intensity of the laser beam irradiated from the laser beam irradiation unit is set to remove the plating prevention film, The type of the laser beam is classified based on any one or more of the wavelength and type of the laser beam, The laser beam is classified into a pulse type or a continuous emission type. When the type of the laser beam is the pulse type, characterized in that further classified based on the pulse width, Partial plating device using plating prevention film. The method of claim 1, The laser device is characterized in that the two-dimensional plane or three-dimensional solid-state processing device, Partial plating device using plating prevention film. delete The method of claim 1, The laser beam irradiation unit Further comprising a control unit for controlling the operation of the laser device according to a set pattern, Partial plating device using plating prevention film. The method of claim 1, The laser device further comprises a spot size variable module, Partial plating device using plating prevention film. The method of claim 1, A supply buffer for controlling supply of the plated body; A pretreatment unit capable of washing the plated body before the anti-plating layer forming unit; And Further comprising a recovery buffer for controlling the recovery of the plated body, Partial plating device using plating prevention film. (A) forming a plating preventing film on the surface to be plated of the body to be plated; (B) irradiating a laser beam in a predetermined pattern on the anti-plating film of the plated body by using a laser device; (C) dipping the plated body in a plating solution and then taking it out; (D) cleaning the plated body; (E) removing the plating prevention film, The moving speed of the laser device is the same as the moving speed of the transfer member for transferring the plated body, The laser device, A focus variable module for changing a focal point of the laser according to the case where the plated surface is a protruding portion or a recessed portion; And Characterized in that it comprises a laser energy homogenizer for controlling the energy of the cross section of the laser beam, Partial plating method using plating prevention film. The method of claim 9, Step (B) is After irradiating the laser beam, further comprising the step of washing the plated body, Partial plating method using plating prevention film. The method of claim 9, The type and intensity of the laser beam irradiated on the anti-plating film is set to remove the anti-plating film, The type of the laser beam is classified based on any one or more of the wavelength and type of the laser beam, The laser beam is classified into a pulse type or a continuous emission type. When the type of the laser beam is the pulse type, characterized in that further classified based on the pulse width, Partial plating method using plating prevention film.

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