KR101184067B1 - Encapsulation Apparatus for Light Emitting Diode - Google Patents

Abstract

The present invention provides a first magnetic group and a first magnetic group installed in the pusher plate and the pusher block to prevent the oxygen and moisture permeating into the electroluminescent device by using the encapsulation device of the electroluminescent device to further improve the life of the electroluminescent device. We provide thing including 2 magnetic groups.

Pusher Plate, Pusher Block, Magnetic

Description

Encapsulation device of electroluminescent device {Encapsulation Apparatus for Light Emitting Diode}

1 is a perspective view showing an encapsulation device of an electroluminescent device, which is one example of the related art.

FIG. 2 is an enlarged side view illustrating a pusher plate, a pusher block, and a pusher rinker shown in FIG. 1.

3 is a view illustrating a process in which a metal cap and a mother substrate are bonded using the encapsulation device of the electroluminescent device illustrated in FIGS. 1 and 2.

FIG. 4 is a view illustrating an example occurring when a metal cap and a mother substrate are bonded to each other by an encapsulation device of the EL device illustrated in FIG. 3.

5 is a perspective view showing an encapsulation device of an electroluminescent device as a first embodiment according to the present invention;

FIG. 6 is an enlarged side view illustrating a pusher plate, a pusher block, and a pusher rinker shown in FIG. 5.

FIG. 7 is a view illustrating a process in which a metal cap and a mother substrate are bonded using the encapsulation device of the EL device illustrated in FIGS. 5 and 6.

FIG. 8 is an enlarged view illustrating in more detail a state in which a metal cap and a mother substrate are bonded by an encapsulation device of the EL device illustrated in FIG. 7. FIG.

9 is a perspective view showing an encapsulation device of an electroluminescent device as a second embodiment according to the present invention.

FIG. 10 is an enlarged side view of a pusher plate, a pusher block, and a pusher rinker shown in FIG. 9; FIG.

FIG. 11 is a view illustrating a process in which a metal cap and a mother substrate are bonded using the encapsulation device of the EL device illustrated in FIGS. 9 and 10.

The present invention relates to an encapsulation device of an electroluminescent element.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (hereinafter referred to as "LCDs"), field emission displays (FEDs) plasma display panels (hereinafter referred to as "PDPs") and electrophoresis. Luminescence (EL) table market values. In order to improve the display quality of such a flat panel display device and to attempt to make a large screen, researches are being actively conducted.

Among flat panel displays, PDP is attracting attention as the most advantageous display device because of its simple structure and manufacturing process, but it is light and simple, but has a high luminous efficiency, low luminance, and high power consumption. On the other hand, active matrix LCDs with thin film transistors ("TFTs") as switching elements are difficult to screen due to the use of semiconductor processes, but demand is increasing as they are mainly used as display elements in notebook computers. have. However, LCDs are difficult to make large areas and consume large power consumption due to the backlight unit. In addition, the LCD has a large optical loss and a narrow viewing angle due to optical elements such as a polarizing filter, a prism sheet, and a diffusion plate.

In contrast, EL display devices are classified into inorganic EL devices and organic EL devices according to the material of the light emitting layer, and are self-luminous devices that emit light by themselves and have a high response speed and high luminous efficiency, luminance, and viewing angle. There is this. Such an organic light emitting diode (OLED), which is an EL element using organic materials among the EL display elements, has a low DC driving voltage, thin film thickness, uniformity of emitted light, easy pattern formation, and light emission comparable to other light emitting devices. It has the advantages of efficiency, all color light emission in the visible region, and is a technical field that is very actively researched for application to display elements.

On the other hand, the organic electroluminescent device has a bottom-emission method and a top-emission method according to the direction in which light is emitted. In addition, the organic light emitting device is a passive matrix organic organic light emitting diode (PMOELD) and an active matrix organic organic light emitting diode (AMOELD) according to the driving method. Are distinguished.

Since the organic EL device is vulnerable to moisture and oxygen, research on the encapsulation manufacturing process for preventing the penetration of moisture and oxygen in the manufacturing process for manufacturing the organic EL device is continuously conducted. Here, an encapsulation apparatus of an electroluminescent device, which is one example of the prior art for bonding a mother glass substrate and a metal cap during an encapsulation manufacturing process, will be described with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view illustrating an encapsulation apparatus of an electroluminescent device, which is one example of the related art, and FIG. 2 illustrates a pusher plate, a pusher block, and a pusher linker shown in FIG. 1. An enlarged side view.

As shown in FIG. 1 and FIG. 2, the encapsulation apparatus 100 of the organic electroluminescent device, which is one example of the related art, includes a pusher plate 102, a pusher block 104, and a pusher linker ( Pusher Rinker, 106) and the like.

First, a plurality of the pusher plate 102 is installed on the pusher block 104 to be described later in a square shape, and is connected to the pusher linker 106 to be described later to make a surface contact with the pusher block 104. In order to achieve this, a predetermined hole 102a is formed in the inner center of the pusher plate 102.

Although not shown, the metal cap (not shown) formed with a sealant (not shown) is placed on the upper surface of the plurality of pusher plates 102 formed to support the mother glass (not shown) to be bonded to the substrate. Done.

In addition, the pusher block 104 is installed to be spaced apart from the pusher plate 102 so as to make a surface contact with the pusher plate 102, the hole formed in the inner center of the pusher plate 102 on the upper surface of the pusher block 104 At the position corresponding to 102a, the pusher block 104 is provided with a pusher linker 106 having a first elastic body 106a which is fixed and connected through the pusher plate 102.

Here, a process of attaching a mother substrate to a metal cap on which a sealant is formed using an encapsulation device of an electroluminescent device, which is one example of the related art, will be described in detail with reference to FIG. 3.

3 is a view illustrating a process in which a metal cap and a mother substrate are bonded by using the encapsulation device of the EL device illustrated in FIGS. 1 and 2.

As shown in FIG. 3A, a sealant 301 is formed on an upper surface of the pusher plate 102 provided in the encapsulation device of the EL device in order to bond the metal cap 303 and the mother substrate 305 to each other. ) Is placed on the metal cap 303 is formed.

Thereafter, as shown in (b), the pusher block 104 is pushed while pushing the entire pusher plate 102 in the direction of the mother substrate 305 fixed by the predetermined support means 307 such that the bonding is performed. do.

At this time, since the force distribution of the pusher block 104 presses the pusher plate 102 is different, the edge portions 102a ₁ and 102a ₂ of the plurality of pusher plates 102 installed on the pusher block 104 are different. Since the pusher plate 102 located in the central portions 102a ₃ , 102a ₄ , 102a ₅ is relatively narrower than the contact area pressed by the pusher plate 102 located in the center portions 102a ₃ , 102a ₄ , 102a ₅ . Since the contact between the pusher plate 102 and the pusher block 104 located at the portions 102a ₁ and 102a ₂ is not smooth, the electroluminescent element located at the corner of the mother substrate 305 as shown in FIG. 4. Oxygen and moisture can penetrate into the cell, thereby shortening the lifespan of the electroluminescent device.

In addition, when the encapsulation process is performed using the encapsulation device of the electroluminescent device, the production yield is lowered and the reliability of the device is lowered.

In order to solve the above problems, the present invention includes the first magnetic group, the second magnetic group, the pusher plate, and the pusher block in the encapsulation device of the electroluminescent device, thereby preventing the oxygen and moisture penetrating into the electroluminescent device, thereby electroluminescent. The object is to provide a device capable of improving the life of the device.

Another object of the present invention is to provide an encapsulation device for an electroluminescent device that can increase production yield and improve device reliability during an encapsulation process.

In order to achieve the above object, the present invention provides a pusher plate spaced apart from a mother substrate and provided with a first magnetic group at least a portion of which a metal cap is disposed and supports a metal cap. One side corresponding to the first magnetic group on the upper surface of the pusher block and the pusher block that is spaced apart from the pusher plate and moves in the direction of the mother substrate is the same as the first magnetic group. And a pusher linker fixed to the second magnetic group having a polarity and a pusher plate and connected to the pusher block.

According to another feature of the invention, the pusher block (Pusher Block) is installed on the lower portion of the mother (Mother) substrate, the second magnetic group is installed on the upper surface of the pusher block (Pusher Block) to correspond to the first magnetic group, the second The pusher linker (Pusher Rinker) is installed between the magnetic group, the upper surface of the pusher linker (Pusher Rinker) is characterized in that it is installed in connection with the pusher plate (Pusher Plate) provided with a first magnetic group therein.

According to another feature of the invention, the pusher block (Pusher Block) is installed on the lower portion of the mother (Mother) substrate, the second magnetic group is installed on the upper surface of the pusher block (Pusher Block) to correspond to the first magnetic group, A pusher linker is installed between the two magnetic groups, a pusher plate is fixed to an upper surface of the pusher linker, and a first magnetic group is installed below the pusher plate.

According to another feature of the invention, the pusher block (Pusher Block) is characterized in that a hole is formed in the inner center, the pusher linker (Pusher Rinker) is connected through the hole (hole).

According to another feature of the present invention, a plurality of pusher plates are provided, and the amount of magnetic force between the plurality of pusher plates and the pusher block is the same.

According to another feature of the present invention, the pusher plate (Pusher Plate) is provided in plurality, the amount of magnetic force between the pusher plate (Pusher Plate) and the pusher block (Pusher Block) located in the corner portion (Pusher plate) It is characterized by more than the amount of magnetic force between the pusher plate) and the pusher block.

According to another feature of the invention, the first magnetic group and the second magnetic group is characterized in that two or more are installed symmetrically based on the Pusher Rinker (Pusher Rinker).

According to another feature of the present invention, the first magnetic group and the second magnetic group are symmetrical with respect to the pusher linker (Pusher Rinker), the size corresponding to the upper size of the pusher plate (Pusher Plate) Pusher plate (Pusher Plate) It is characterized in that it is installed integrally to be smaller or equal.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention in more detail.

≪ Embodiment 1 >

FIG. 5 is a perspective view illustrating an encapsulation device of an electroluminescent device as a first embodiment according to the present invention, and FIG. 6 is a pusher plate, a pusher block, and a pusher shown in FIG. 5. Side view showing an enlarged linker (Pusher Rinker). First, the encapsulation device of the EL device according to the present invention is installed in the same manner as the encapsulation device of the EL device described above with reference to FIG. 1. However, the encapsulation device of the EL device according to the present invention includes a first magnetic group provided in the pusher plate and a second magnetic group installed on the pusher block.

The function of each of the components provided in the encapsulation device of the EL device according to the present invention and the organic relationship therebetween are shown in FIG. 1. Since the functions of the components and the organic relations between them are the same, respective descriptions thereof will be omitted below.

However, in the encapsulation device of the EL device according to the present invention, the first magnetic group is provided inside the pusher plate, and the second magnetic group is provided on the upper surface of the pusher block to correspond to the first magnetic group. Herein, an encapsulation apparatus of an electroluminescent device, which is one example according to the present invention, will be described with reference to FIGS. 5 and 6.

5 and 6, the encapsulation device 500 of the EL device according to the present invention includes a pusher plate 102 and a pusher block provided with the first magnetic group 102b. 104), a pusher linker (106), and a second magnetic group (104b).

First, a plurality of pusher plates 102 are installed on the pusher block 104 to be described later in a square shape, and then connect the pusher block 104 to the pusher linker 106 to be described later. A predetermined hole 102a is formed in the inner center of the pusher plate 102 to push in the direction of 102.

At this time, although not shown, the pusher plate 102 is installed in two symmetrically with respect to the pusher linker 106 to be described later in order to magnetically support the metal cap (not shown).

In addition, the pusher block 104 is installed to be spaced apart from the pusher plate 102, the pusher block (104) on the upper surface of the pusher block 104 in a position corresponding to the hole (102a) formed in the inner center of the pusher plate (102) 104 is secured and is provided with a pusher linker 106 which is connected through the pusher plate 102.

At this time, the encapsulation device 500 of the electroluminescent device according to the present invention has a second magnetic group 104b is located on the upper surface of the pusher block 104 so that the first magnetic group (left and right symmetry with respect to the pusher linker 106). Two are installed corresponding to 102b). However, the present invention is not limited to this, but is not illustrated, the first magnetic group 102b is installed in two or more or integrally formed so as to be smaller than or equal to the pusher plate 102 in a size corresponding to the upper size of the pusher plate 102. It can also be installed as.

Here, the process of bonding the mother substrate to the metal cap on which the sealant is formed using the encapsulation device of the EL device according to the present invention will be described in detail with reference to FIG. 7.

FIG. 7 is a view illustrating a process in which a metal cap and a mother substrate are bonded by using the encapsulation device of the EL device illustrated in FIGS. 5 and 6.

As shown in FIG. 7A, a pusher plate including a first magnetic group 102b provided in an encapsulation device of an EL device in order to first bond the metal cap 303 and the mother substrate 305. The metal cap 303 on which the sealant 301 is formed is placed on the upper surface of the 102.

Thereafter, as shown in (b), the pusher block 104 is pushed while pushing the entire pusher plate 102 in the direction of the mother substrate 305 fixed by the predetermined support means 307 such that the bonding is performed. do.

At this time, when the pusher block 104 is pressed onto the mother substrate 305 by the pusher plate 102 and the metal cap 303 on which the sealant 301 is formed, all of the pusher plates 102 installed in plural number are firstly formed. The magnetic group 102b is provided and installed, and the second magnetic group 104b having the same polarity as the first magnetic group 102b is installed on the pusher block 104 so as to correspond to the first magnetic group 102b. Accordingly, the repulsive force between the plurality of pusher plates 102 (102a ₁ , 102a ₂ , 102a ₃ , 102a ₄ , 102a ₅ ) and the pusher block 104 acts to keep the amount of magnetic force between them constant to each other, as shown in FIG. 8. As shown in the drawing, it is possible to prevent the penetration of oxygen and moisture of the electroluminescent element positioned at the corner of the mother substrate 305, thereby improving the lifespan of the electroluminescent element.

In addition, the use of such an encapsulation device of the electroluminescent device improves the reliability of the device while increasing the production yield during the encapsulation process.

Here, the present invention is the amount of magnetic force between the pusher plates (102a ₁ , 102a ₅ ) and the pusher block 104 located in the corner portion and the pusher plates (102a ₂ , 102a ₃ , 102a ₄ ) and pusher block 104 located in the center portion. By processing more than the amount of magnetic force between the electrodes, it is also possible to further prevent the penetration of oxygen and moisture of the electroluminescent element and further improve the life of the electroluminescent element.

Meanwhile, by changing the structure of the encapsulation device of the EL device according to the present invention, the repulsive force acting between the pusher plate and the pusher block may be further strengthened. Referring to the encapsulation device of the EL device according to the present invention, 9 and 10 are as follows.

≪ Embodiment 2 >

FIG. 9 is a perspective view illustrating an encapsulation device of an EL device according to the second embodiment of the present invention, and FIG. 10 is a pusher plate, a pusher block, and a pusher linker shown in FIG. 9. (Pusher Rinker) is an enlarged side view. First, the encapsulation device of the EL device according to the present invention is provided in the same manner as the encapsulation device of the EL device described above with reference to FIGS. 5 and 6. However, in the encapsulation device of the EL device according to the present invention, a first magnetic group is installed below the pusher plate. Such an encapsulation apparatus of an electroluminescent device according to the present invention will be described with reference to FIGS. 9 and 10.

9 and 10, the encapsulation device 900 of the EL device according to the present invention includes a pusher plate 102, a first magnetic group 102a, and a pusher block 104. ), A second magnetic group 104b, a pusher linker 106, and the like.

First, the pusher plate 102 is installed in plural in a square shape on top of the pusher block 104 to be described later, and connects the pusher block 104 to the pusher linker 106 to be described later. A predetermined hole 102a is formed in the inner center of the pusher plate 102 to push in the direction of 102.

In this case, the encapsulation device 900 of the electroluminescent device according to the present invention is two symmetrically based on the pusher linker 106 to be described later, the first magnetic group 102b in the lower portion of the pusher plate 102 Is installed.

In addition, the pusher block 104 is installed to be spaced apart from the pusher plate 102, the pusher block (104) on the upper surface of the pusher block 104 in a position corresponding to the hole (102a) formed in the inner center of the pusher plate (102) 104 is secured and is provided with a pusher linker 106 which is connected through the pusher plate 102.

In this case, the second magnetic group 104b is positioned on the upper surface of the pusher block 104 so as to correspond to the first magnetic group 102b so as to be symmetrical with respect to the pusher linker 106. However, the present invention is not limited to this, but is not illustrated, the first magnetic group 102b is installed in two or more or integrally formed so as to be smaller than or equal to the pusher plate 102 in a size corresponding to the upper size of the pusher plate 102. It can also be installed as.

Here, the process of bonding the mother substrate to the metal cap on which the sealant is formed using the encapsulation device of the EL device according to the present invention will be described in detail with reference to FIG. 11.

FIG. 11 is a view illustrating a process in which a metal cap and a mother substrate are bonded by using the encapsulation device of the EL device illustrated in FIGS. 9 and 10.

As shown in FIG. 11A, the sealant 301 is formed on the upper surface of the pusher plate 102 provided in the encapsulation device of the EL device in order to bond the metal cap 303 and the mother substrate 305 to each other. ) Is placed on the metal cap 303 is formed. At this time, the first magnetic group 102b is installed on the lower surface of the pusher plate 102.

Thereafter, as shown in (b), the pusher block 104 is pushed while pushing the entire pusher plate 102 in the direction of the mother substrate 305 fixed by the predetermined support means 307 such that the bonding is performed. do.

At this time, when the pusher block 104 is pressed onto the mother substrate 305 by the pusher plate 102 and the metal cap 303 on which the sealant 301 is formed, both the lower portions of the pusher plate 102 are installed. The first magnetic group 102b is installed, and the second magnetic group 104b having the same polarity as the first magnetic group 102b is installed on the pusher block 104 to correspond to the first magnetic group 102b.

Accordingly, the repulsive force between the plurality of pusher plates 102 (102a ₁ , 102a ₂ , 102a ₃ , 102a ₄ , 102a ₅ ) and the pusher block 104 is shown in FIG. 102a ₁ , 102a ₂ , 102a ₃ , 102a ₄ , 102a ₅ ) and the pusher block (104 in FIG. 7) acts harder to maintain the amount of magnetic force between them, so as shown in FIG. It is possible to prevent the penetration of oxygen and moisture of the electroluminescent element located at the corner of the mother substrate (305 in FIG. 8), thereby improving the lifetime of the electroluminescent element.

In addition, the use of such an encapsulation device of the electroluminescent device improves the reliability of the device while increasing the production yield during the encapsulation process.

Here, the present invention is the amount of magnetic force between the pusher plates (102a ₁ , 102a ₅ ) and the pusher block 104 located in the corner portion and the pusher plates (102a ₂ , 102a ₃ , 102a ₄ ) and pusher block 104 located in the center portion. By processing more than the amount of magnetic force between the electrodes, it is also possible to further prevent the penetration of oxygen and moisture of the electroluminescent element and further improve the life of the electroluminescent element.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

According to the encapsulation device of the EL device of the present invention made as described above, the following effects can be obtained.

First, the encapsulation device of the EL device may include a first magnetic group, a second magnetic group, a pusher plate, and a pusher block, thereby preventing oxygen and moisture from penetrating the EL device, thereby improving life of the EL device. It works.

Second, the use of the encapsulation device of the electroluminescent device has another effect of increasing the production yield and improving the reliability of the device during the encapsulation process.

Claims (8)

A pusher plate spaced apart from a mother substrate, a pusher plate having a metal cap and having a first magnetic group provided on at least a portion supporting the metal cap; A pusher block spaced apart from the pusher plate so as to move in a direction of the mother substrate; A second magnetic group having an upper surface of the pusher block corresponding to the first magnetic group having the same polarity as that of the first magnetic group; Fixed to the pusher plate (Pusher Plate) and includes a pusher linker (Pusher Rinker) connected to the pusher block (Pusher Block), The pusher block is installed under the mother substrate, and a second magnetic group is installed on an upper surface of the pusher block to correspond to the first magnetic group, and between the second magnetic groups. An encapsulation device of an electroluminescent device, in which the pusher linker is installed. The method of claim 1, An encapsulation device of an EL device, characterized in that the upper surface of the pusher linker (Pusher Rinker) is installed in connection with the pusher plate (Pusher Plate) provided with the first magnetic group therein. The method of claim 1, The pusher plate is fixed to an upper surface of the pusher rinker, and an encapsulation device of an EL device, characterized in that a first magnetic group is installed below the pusher plate. The method of claim 2 or 3, The pusher block (Pusher Block) has a hole formed in the inner center, An encapsulation device of an EL device, characterized in that the pusher linker (Pusher Rinker) is connected through the hole (hole). The method of claim 2 or 3, The pusher plate (Pusher Plate) is provided with a plurality, the amount of magnetic force between the plurality of pusher plates (Pusher Plate) and the pusher block (Pusher Block), the encapsulation device of the electroluminescent device, characterized in that the same. The method of claim 2 or 3, The pusher plate (Pusher Plate) is provided in plurality, the amount of magnetic force between the pusher plate (Pusher Plate) and the pusher block (Pusher Block) located in the corner portion and the pusher plate (Pusher Plate) located in the center portion An encapsulation device for an electroluminescent device, characterized in that it is more than the amount of magnetic force between the pusher blocks. The method of claim 2 or 3, The first magnetic group and the second magnetic group encapsulation device of the electroluminescent device, characterized in that two or more are installed symmetrically with respect to the pusher linker (Pusher Rinker). The method of claim 2 or 3, The first magnetic group and the second magnetic group are symmetrical with respect to the pusher rinker and are smaller than or equal to the pusher plate in a size corresponding to the upper size of the pusher plate. Encapsulation device of the electroluminescent device, characterized in that it is installed integrally so that.

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