KR101173187B1 - Half pattern margin metalized plastic film capacitor and the product method thereof - Google Patents

Abstract

PURPOSE: A half pattern margin metalized plastic film condenser and a manufacturing method thereof are provided to distribute heating due to a current bottleneck by separately arranging adjacent fuse units. CONSTITUTION: A condenser device(160) is composed of a lead terminal(164) and is formed with a round type after a thermal process. The lead terminal is extended from an electrode to be electrically connected to metal for the electrode. The metal for the electrode is deposited on one side of the plastic film. The lead terminal is welded to metal particles sprayed on both ends of a winding hole to surround a hole with a radial type.

Description

Half Pattern Margin Metallized Plastic Film Capacitor and Manufacturing Method Thereof {HALF PATTERN MARGIN METALIZED PLASTIC FILM CAPACITOR AND THE PRODUCT METHOD THEREOF}

The present invention relates to a condenser, and more particularly, a half pattern margin metallized plastic film having a split electrode and a fuse formed thereon, wound or laminated with a plurality of sheets on a core, and formed to be electrically connected to an electrode metal. The present invention relates to a half pattern margin metallized plastic film capacitor composed of a capacitor using a capacitor device composed of a lead terminal, and a manufacturing method thereof.

A capacitor (CAPACITOR), which is an important element constituting an electronic circuit, is usually used to obtain capacitance, and is composed of an insulator (called a dielectric) between electrodes of two pole plates (inserting the insulator into an electrode).

These capacitors have different functions depending on the frequency or waveform of the applied voltage. Therefore, the capacitor should be selected in consideration of the dielectric strength of the used voltage in addition to the selection of the capacitance.

In particular, the film capacitor has a considerably low loss / high insulation property using a plastic film as a derivative, and is a plastic film such as cellophane resin, cellulose resin, polyethylene resin, or polypropyene resin. It is used to wind the metallized plastic film, which is deposited in high vacuum, zinc (Zn), aluminum (Al), aluminum alloy, etc., deposited metal on one side or both sides of the plastic film as an electrode.

Such a conventional product may cause a short circuit between the poles when the insulation force drops in the internal dielectric film, and a large amount of current flows instantaneously, and even if an explosion accident or self-recovery occurs, the insulation force may gradually fall and another problem may occur.

For the safety of these capacitors, a built-in safety device to shut off the capacitors from the power supply due to a gas generated by a temperature fuse, current fuse, or film capacitor accident, or by using a metalized plastic film thicker than 3㎛ ~ 5㎛ Here are some of the things that make it perform.

 FIG. 1 is a perspective view illustrating a security function plastic film, and FIG. 2 is a front view of an deposition site in the deposition metal shown in FIG. 1.

As shown in the figure, the metal is not deposited in a T-shape (T-shaped margin) at a constant pitch P in the longitudinal direction of the plastic film as a dielectric, and is deposited in the frontal areas A1 to A3 except for the T-shaped margin. It consists of the T-margin security film deposited by the structure which the connected areas are connected (fuse part F). Here, the margin part M is formed in the lower end of a plastic film.

In the example of the security function plastic film shown in FIG. 1, the deposition metal 2 is laminated on the plastic film 1, and the deposition metal 2 is fused while the split electrodes are formed through the separator 3. The part 7 is formed. That is, a small area when the voltage is increased or the current is increased by the plastic film 1 or the deposition metal 2, which is a dielectric material, in the partial deposition portion of the front area partially separated by the T-shaped non-deposited separator 3. By scattering the fuse part 7, which is a deposited metal of, the capacitor capacity as much as the area of the split electrode 5 is reduced, thereby preventing the explosion of the capacitor and continuing to perform the function of the capacitor.

For example, if the insulation force drops from the front face of the internal dielectric A3, a short circuit occurs between the poles. At this time, the fuse part F is opened (cut off), so that only the front face of A3 does not function as a capacitor. There is no abnormality in the part so that it can function as a capacitor.

The problem of such a T-margin plastic film, the film capacitor produced by the T margin, after checking the capacity after the continuous content test was a disadvantage that the defect occurs because it does not meet the Korean standard (KSC4805) standard.

As a result of the analysis, when the deposited front areas A1 to A3 are so large that the fuse part F operates, a problem is found in that the capacitor capacity decrease is very large.

To solve this problem, if the fuse part F is slightly raised, the fuse part F should operate when a short circuit occurs due to the insulation force dropping significantly in the internal dielectric film of the film capacitor, but the fuse part F has a large width. (F) does not work and short-circuit continues and heat is generated inside the capacitor. As the film shrinks due to the heat, a secondary disaster occurs due to a short phenomenon due to deterioration of the film.

The present invention to solve this problem is to reduce the area of the split electrode in the film width direction and to position the neighboring fuse portion to be spaced apart from each other during winding to disperse heat generated by the current bottleneck phenomenon in the fuse portion, overlapping the fuse portion It is an object of the present invention to provide a capacitor using a half pattern margin metallized plastic film and a method of manufacturing the same.

Another object of the present invention is to provide a capacitor using a metallized plastic film of a press type, a round type, and a box type by using a half pattern margin metallized plastic film. It is done.

The present invention for performing this task is to form a margin on the plastic film and one end is in contact with the margin (M) is not deposited metal 120 for the electrode and the other end of the rectangular split electrode 150 toward the film width direction And a half pattern margin formed by patterning the fuse unit 130 formed at one end of a portion where the split electrode 150 and the electrode metal 120 are in contact with each other at a predetermined interval along the length direction of the film. Pattern Margin) A capacitor consisting of a lead terminal extending a predetermined length from an anode electrode and a cathode electrode formed to be wound or laminated with a plurality of metallized plastic film and the metallized plastic film over the core, and electrically connected to the electrode metal. By including the device, it can be achieved.

The condenser element is heated for a predetermined time to maintain a round type, heat treated, a lead terminal is welded to cover the core hole from which the core of the condenser element is removed, and the element is taped to a bar, and then impregnated with wax or epoxy. It is configured by.

At this time, the lead terminal injects a metallic particulate spray to both ends of the core hole from which the core is removed, but sprayed so that the sprayed spray particles do not conduct the hole, and then radially at both ends of the hole of the condenser element. Each lead terminal is welded, but the lead terminal is configured to weld so as to surround the hole.

In addition, after applying the temperature and pressure of the capacitor element in the press plate of the heat press machine, the lead terminal is welded to surround the core hole from which the core of the capacitor element is removed, and the element is taped to the bar and then impregnated with wax or epoxy. It is also possible to manufacture a press type metallized plastic film capacitor.

In addition, after applying the temperature and pressure of the capacitor element in the press plate of the heat press machine, the lead terminal is welded so as to surround the core hole from which the core of the capacitor element is removed, and inserted into the case, and then the epoxy is injected into the case and cured. It is also possible to manufacture a box-type metallized plastic film capacitor.

When the box-type metallized plastic film capacitor is manufactured, the injection of epoxy may be completed by injecting epoxy into the case first, curing for a predetermined time, and then injecting epoxy into the second.

At this time, the split electrode is formed in the film width direction up to 1/2 to 3/4 of the film width, and the fuse part 130 overlaps the fuse part of the upper and lower ends adjacent to each other in the width direction of the film when wound or stacked. It is desirable to form at a position spaced apart from each other up to 1.5mm.

In addition, the width F of the fuse part is formed to be narrower than the width D of the electrode separation part 142 formed at the contact portion between the split electrode 150 and the electrode metal 120, and the length H of the electrode metal. ) Is shorter than 1/2 of the length in the film width A direction, and the pitch P of the split electrodes 150 is preferably shorter than the length H of the metal 120 for the electrode.

Meanwhile, a method of manufacturing a half pattern margin plastic film capacitor according to an embodiment of the present invention for performing such a task includes (a) a fuse formed at one end of a portion where the divided electrode 150 and the electrode metal 120 come into contact with each other. Winding the metallized plastic film patterned so that the unit 130 is continuously formed at a predetermined interval along the longitudinal direction of the film; and (b) winding or laminating the metallized plastic film several times on the core, and Generating a capacitor device comprising lead terminals each of which extends a predetermined length from an anode electrode and a cathode electrode formed to be electrically connected to the electrode metal; and (c) impregnating or casing the capacitor device generated in step (b). Step (d) After the step (c) and the first and second curing drying, the inspection step for the final inspection of the selected set by the structural inspection and automatic screening test and (e) after the inspection step Lead processing can be made.

In addition, the winding step is more specifically, (a-1) forming a margin on the plastic film, one end is in contact with the margin (M) where the electrode metal 120 is not deposited, the other end of the rectangular toward the film width direction Forming a split electrode 150, (a-2) forming a fuse part 130 at one end of a portion where the split electrode 150 and the electrode metal 120 come into contact with each other (a-3) The fuse part 130 is patterned to be continuously formed at a predetermined interval along the longitudinal direction of the film to generate a metallized plastic film and (a-4) winding the generated metallized plastic film It is preferable to make it.

On the other hand, the step of generating the capacitor element, in more detail (b-1) heat treatment for heating for a predetermined time without applying a press so that the round type capacitor element wound the film in step (a) to maintain the round type Step (b-2) Wrapping step to wrap the device so that the spray particles do not adhere to the surface of the device after the step (b-1), (b-3) After the step (b-2) the core is removed A metaconic step of injecting metallic particulate sprays at both ends of the holes to prevent the sprayed particles from conducting the holes; and (b-4) a lead terminal in a radial type at both ends of the holes of the capacitor element. Welded but the lead terminal welding and release treatment to weld the lead terminal to surround the hole to tape the device to the bar (Bar) and to constitute a welding tape step of setting the taped bar It is preferred.

In this case, in step (b-3), the spray particle size is sprayed using a metallic element for spraying larger than the spray particle size in manufacturing the press type, and the step (c) is performed after the welding tape step (c-1). Impregnating a wax or epoxy and (g) may further comprise a powder coating step of powder coating after the step (f).

On the other hand, the step (b) is a specific method (b-1) by pressing the temperature and pressure by using a press plate of the hot press to the round type (wound type) wound the film in the step (a) Step (b-2) Wrapping step of wrapping the device so that the spray particles do not adhere to the surface of the device after step (b-1), (b-3) After the step (b-2) of the hole is removed (B-4) a lead terminal for welding a lead terminal in a radial type to both ends of the hole of the capacitor element while welding the lead terminal to surround the hole; Welding and release may be performed to further include a welding taping step of taping the device on the bar and setting the taped bar.

The step (c) is a press type by making the step (c-1) further comprising impregnating wax or epoxy after the welding tapering step, and (g) powder coating step of powder coating after the step (f). The metallized plastic film capacitor can be prepared.

And, in order to manufacture a box-type metallized plastic film capacitor (b-1) step of applying a temperature and pressure to the device wound the film in the step (a) using a press plate of the hot press to press the capacitor element (b-1) And (b-2) a wrapping step of wrapping the device so that the spray particles do not adhere to the surface of the device after step (b-1), and (b-3) the core is removed after step (b-2). A meta- silicon step of spraying a metallic particulate spray on both ends of the hole, and (b-4) welding a lead terminal in a radial type on both ends of the hole of the capacitor element, but welding the lead terminal to surround the hole. Lead terminal welding and release treatment can be produced by further comprising a welding tape step of taping the device in the bar (Bar) and the set the taped bar.

In this case, the step (c) comprises (c-1) casing the capacitor device generated after the welding tape step, and (c-2) injecting resin after the step (c-1). It is more preferable.

As described above, according to the Half Pattern Margin metallized plastic film capacitor and a method of manufacturing the same, the electrode metal is deposited on one or both sides of the plastic film, the area of the split electrode is reduced, and the fuse unit is formed. By reducing the heat generation temperature by dissipating the heat generated by the current bottleneck at, the reliability of the capacitor can be improved by improving the lifespan, reducing the capacity reduction rate, and improving the reliability of the capacitor. It has the effect of providing a condenser that can be used even under.

In addition, the present invention manufactures a press type (round type) and a box type (box type) capacitor excellent in the prevention of ignition because it uses the above-mentioned half pattern margin metallized plastic film can do.

1 is a perspective view showing a conventional security function plastic film,
FIG. 2 is a view showing an arrangement of frontal deposition sites in the deposition metal shown in FIG. 1;
3 is a view showing the front deposition sites arranged in the deposition metal shown;
4 is a perspective view showing a half pattern margin metallized plastic film according to an embodiment of the present invention;
5 is a view showing the capacity reduction rate of the T margin film capacitor,
6 schematically shows the dimensions of a metallized plastic film arranged in two rows;
7 is a cross-sectional view of a structure in which a half pattern margin metallized plastic film of the present invention is wound or laminated;
8 is a flowchart illustrating a method of manufacturing a half pattern margin metallized plastic film capacitor of the present invention;
FIG. 9 is a diagram illustrating an example of a capacitor device in which a half pattern margin metallized plastic film of the present invention is wound;
10 and 11 are views for comparing the press type and the round type at the time of lead terminal welding, respectively;
12 is a perspective view illustrating a half pattern margin metallized plastic film according to another embodiment of the present invention;
FIG. 13 is a view showing an arrangement of frontal deposition sites in the deposition metal shown in FIG. 12;
FIG. 14 is a view schematically showing the specifications of a half pattern margin metallized plastic film arranged in two rows.

It is to be understood that the words or words used in the present specification and claims are not to be construed in a conventional or dictionary sense and that the inventor can properly define the concept of a term in order to describe its invention in the best possible way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. In addition, the terms “… unit”, “… unit”, “module”, “device”, and the like described in the specification mean a unit that processes at least one function or operation, which is implemented by a combination of hardware and / or software. Can be.

Definitions of terms used in the present invention are as follows.

"Round Type Capacitor" means a round type capacitor formed by winding a plastic film in a core hole and performing heat treatment without applying a press.

"RADIAL TYPE" means that when welding the lead terminal to the capacitor element, the welded direction of the lead terminal is welded and shaped in the same direction instead of welding in different directions.

BOX TYPE CONDENSOR is a type of capacitor that is sealed by inserting a capacitor element in a box or rectangular case, and is a CMPP (X-2 class film capacior) type and BMPP (Box-type Metalized). Capacitors include Polypropylene Film Capacitor (TYPE) TYPE and Box-type Metalized Polyester Film Capacitor (BMPE) TYPE.

"Condenser element" is a form in which a half pattern margin metallized plastic film on which an electrode metal is deposited is rolled up, pressed or heat-treated, and external electrodes are formed as lead terminals on both sides of the plastic film. It means powder impregnation or casing before composing the appearance of the device.

"Half Pattern Margin Metallized Plastic Film" is a metallized plastic film having a split electrode with a fuse and a margin formed on the plastic film. If insulation breakdown occurs in the area of the split electrode, the fuse It means a metallized plastic film that can be disconnected from the power source by scattering the negative deposition metal.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 3 is a perspective view showing a half pattern margin metallized plastic film according to an embodiment of the present invention, and FIG. 4 is a front view showing arrangements of frontal deposition sites on the deposited metal shown in FIG. 3. And FIG. 6 schematically shows the specifications of a metallized plastic film arranged in two rows.

As shown, the half pattern margin metallized plastic film used in the present invention deposits the deposition metal 120 for the electrode on one side of the plastic film 110, the left and right within the deposition metal 120 The split electrode 150 including the separator 140 and the electrode separator 142 is formed, and two fuse parts 130 are formed for each split electrode 150.

Plastic film 110 is a cellophane (cellophane) resin, cellulose (cellolose) resin, PE (polyethylene) resin, PP (polypropyene) resin, etc. The electrode deposition metal 120 is mainly composed of aluminum, zinc or aluminum alloy In addition, silver, copper, nickel, chromium, etc. can be used as a nucleus body (side).

Split electrode 150 is a dielectric plastic film in the deposition portion of the front (A1 ~ A3) partly separated by the electrode separation unit 142 and the left and right separation unit 140 is not deposited a substantially "" shaped metal When the voltage rises or the current increases by the 110 or the deposition metal 120, the fuse unit 130 connected to the split electrodes 150 having a small area is scattered to cut off the split electrodes 150 from the power supply of the capacitor. Characterized in that the configuration to make.

That is, when insulation breakdown occurs in the area of the split electrode 150, the fuse unit 130 scatters the deposition metal of the fuse unit 130 by the current at this time so as to be cut off from the power source.

At this time, the capacitor capacity as much as the area of the divided electrode 150 may be reduced, but if the front area (A1 to A3) is configured so as not to affect the capacity change of the capacitor, it is possible to ensure the capacity stability of the capacitor and to prevent the explosion of the capacitor. It is designed to prevent and continue to function as a capacitor.

These results were measured as satisfactory experimental results in the following experiments. That is, referring to the drawing showing the capacity reduction rate of the Half Pattern Margin metallized plastic film according to an embodiment of the present invention of FIG. 5, the capacity reduction rate of the present invention is rated based on the Korean standard (KSC4805). Based on the test results applied continuously at a voltage of 1.25 times (563 VAC) and 85, the capacity reduction rate is 0.00% for initial value (24Hr), -2.48% for 200Hrs, -3.52% for 400Hrs, and -4.12% for 600Hrs. It can be seen that it is reasonable within 7%.

It can be seen that even though the fuse unit 130 operates because the deposited A1 to A3 frontal area is smaller than the area of the deposited metal 120 while maintaining the insulating force, a substantial reduction in capacity of the capacitor occurs.

In addition, in the test of increasing the voltage step by step, it was very safe without the sample with the breakdown voltage until the capacity of the capacitor was reduced by 95%.

For this function, one end of the split electrode 150 is in contact with the marginal portion M on which the electrode deposition metal 120 is not deposited, and the other end is rectangular to 1/2 to 3/4 of the film width toward the film width direction. The split electrode 150 is formed, and the fuse part 130 is formed at one end of the electrode separator 142 where the split electrode 150 is in contact with the metal for the electrode, and the pattern is continuously formed at a predetermined interval along the length direction of the film. Make it angry.

In this case, when the split electrode 150 is smaller than 1/2 of the film width, the capacity decrease may be reduced, but heat generation may not be suppressed, and when the split electrode 150 is larger than 3/4 of the film width, the capacitance change may occur when the fuse 130 is scattered. This increases the stability of the capacitor.

Therefore, the length (H) of the deposited metal for the electrode should be shorter than half of the length in the direction of the film width (A).

In addition, since the fuse unit 130 is composed of a single fuse, the fuse unit 130 at the time of winding or lamination is overlapped with each other based on the center in the width direction of the film in the width direction of the adjacent upper and lower ends and spaced apart from each other by 0.2 mm to 0.6 mm. To form.

If the overlap width of the fuse part 130 is 0.2 mm or less, the temperature rise due to the overlap of the fuse parts cannot be prevented. If the overlap width of the fuse part 130 is 0.6 mm or more, the area of the split electrode 150 is widened. A short circuit will result in a decrease in capacity.

Therefore, it is preferable to configure it to have an overlap width of about 1 mm.

In addition, the width F of the fuse unit 130 should be narrower than the width D of the electrode separation unit 142 formed at the portion where the split electrode 150 is in contact with the electrode deposition metal 120.

In other words, it is to improve the electrical characteristics and safety of the capacitor by reducing the width of the fuse to facilitate the operation of the fuse during the use of the capacitor.

The pitch P of the split electrodes 150 may be shorter than the length H of the deposition metal for electrodes in order to reduce the capacity reduction rate and prevent heat generation.

That is, in order to prevent a large capacity decrease when the fuse units 130 of A1 to A3 operate, the fuse unit 130 is configured to minimize the change in the capacity even if the fuse unit 130 is scattered.

For reference, the dimensions for the Half Pattern Margin metallized plastic film of the present invention configured to satisfy these conditions are shown in Table 1.

Referring to Table 1, the width (A) of the film is 14mm ± 0.2, the width (M) of the margin portion is 1.5 ± 0.2mm, the width (C) of the first separation unit 140 is 0.3mm, electrode separation unit Width (D) of 0.3 (142), width (F) of fuse 130 is 0.2mm, pitch (P) of split electrode 150 is 6.3mm, length (H) of deposited metal is 6.7mm, The length AHD of the split electrodes 150 is a numerical example of the case where the length AHD is set to 5.5 mm.

Item Dimension (mm) A 14 ± 0.2 M 1.5 ± 0.2 C 0.3 D 0.3 F 0.2 P 6.3 G 1.0 H 6.7

The sprayed metal contact portion is formed on the other side in the width direction of the margin portion M, and the electrode deposition metal 120 is preferably formed to have a constant resistance per unit area.

In the present invention, the split electrode 150 is formed of a margin (M), the left and right separation unit 140 and the electrode separation unit 142 in a substantially rectangular form up to 1/2 to 3/4 of the film width and the electrode separation unit ( One fuse unit 130 is formed of a deposition metal on a portion of one end of the 142 and the left and right separation unit 140, and the split electrodes 150 of this type are continuously formed along the length direction of the film. will be.

Compared with the conventional FIG. 1, which is similar in shape to an embodiment of the present invention, FIG. 1 has a large area of the split electrodes 2, so that a large amount of current flows in the fuse unit 7 and the fuse unit 7 is centered on the capacitor. Since it is configured to concentrate on the structure, high temperature heat is generated in the center of the condenser, and the structure is inevitably shortened due to the decrease in insulation force due to the high temperature and the operating temperature of the condenser.

Another embodiment of such a split electrode is illustrated in Figures 12-14.

FIG. 12 is a perspective view illustrating a half pattern margin metallized plastic film according to another embodiment of the present invention, and FIG. 13 is a front view showing arrangements of frontal deposition sites on the deposited metal shown in FIG. 12. And FIG. 14 schematically shows the specifications of a metallized plastic film arranged in two rows.

In the following description, the same configuration will be avoided by using the same reference numerals.

As shown, the Half Pattern Margin metallized plastic film 100 according to another embodiment of the present invention deposits the deposition metal 120 for the electrode on one side of the plastic film 110 which is a dielectric material. In addition, the deposited metal 120 forms the split electrodes 150 through the left and right separators 140 and the electrode separators 142, and forms one fuse unit 130 for each split electrode 150. .

For this function, one end of the split electrode 150 is in contact with the marginal portion M on which the electrode deposition metal 120 is not deposited, and the other end is rectangular to 1/2 to 3/5 of the film width toward the film width direction. The split electrode 150 is formed, and the fuse part 130 is formed at one end of the electrode separator 142 where the split electrode 150 is in contact with the metal for the electrode, and the pattern is formed to be continuously formed at predetermined intervals along the length direction of the film. Make it angry.

In this case, when the split electrode 150 is smaller than 1/2 of the film width, the capacity decrease may be reduced, but heat generation may not be suppressed, and when the split electrode 150 is larger than 3/5 of the film width, the capacity change may occur when the fuse 130 is scattered. This increases the stability of the capacitor.

Therefore, the length (H) of the deposited metal for the electrode should be shorter than half of the length in the direction of the film width (A).

In addition, since the fuse unit 130 is composed of a single fuse, the fuse unit 130 at the time of winding or lamination is overlapped with each other based on the center in the width direction of the film in the width direction of the adjacent upper and lower ends and spaced apart from each other by 0.2 mm to 0.6 mm. To form.

If the overlap width of the fuse part 130 is 0.2 mm or less, the temperature rise due to the overlap of the fuse parts cannot be prevented. If the overlap width of the fuse part 130 is 0.6 mm or more, the area of the split electrode 150 is widened. A short circuit will result in a decrease in capacity.

Therefore, it is preferable to comprise so that the overlap width of about 0.3 mm.

In addition, the width D of the fuse unit 130 should be formed to be narrower than the width C of the electrode separation unit 142 formed at the portion where the split electrode 150 is in contact with the electrode deposition metal 120.

In other words, it is to improve the electrical characteristics and safety of the capacitor by reducing the width of the fuse to facilitate the operation of the fuse during the use of the capacitor.

The pitch P of the split electrodes 150 may be shorter than the length H of the deposition metal for electrodes in order to reduce the capacity reduction rate and prevent heat generation.

That is, the front surface of A1 to A3 is configured to minimize the change in capacity even if the fuse unit 130 is scattered in order to prevent a large amount of capacity decrease when the fuse unit 130 operates.

The sprayed metal contact portion is formed on the other side in the width direction of the margin portion M, and the electrode deposition metal 120 is preferably formed to have a constant resistance per unit area.

A metallized plastic film having such a configuration is wound or laminated by stacking several sheets on the core, and the lead terminals are formed to extend from the anode and cathode electrodes formed to be electrically connected to the metal for the electrode, respectively.

Hereinafter, for convenience of description, a half pattern margin plastic film according to the first embodiment will be described.

The half pattern margin metallized plastic film in which the metal for electrode is deposited in high vacuum is wound in a cylindrical shape and pressed or heat-treated to form a pair of external electrodes to complete the capacitor element.

Referring to the drawings schematically showing the specifications of the two-row arrayed metallized plastic film of FIG. 6 and one cross-sectional view of a structure in which a half pattern margin metallized plastic film of the present invention of FIG. 7 is wound or laminated. As shown in the condenser wound with a half pattern margin metallized plastic film in a set (two sheets), the fuse unit 130 is arranged in two lines (by G interval) to generate heat to two places. It is dispersed to reduce the high temperature heat generation at the center of the condenser and wind the heat to be uniformly generated at low temperature as a whole.

That is, when the fuse unit 130 is located at the center of the metallized plastic film and is wound in two sets of metallized plastic films, two metallized film fuse units 130 are concentrated at the center of the capacitor. As a result, the heat generated by the current bottleneck in the fuse unit 130 is high, thereby preventing the phenomenon of lowering the breakdown voltage of the capacitor.

In addition, the marginal portion (M) without the deposition metal 150 and the sprayed metal contact portion (not shown) on the opposite end in the film longitudinal direction in succession, referring to the drawing the fuse unit 130 in the thermal sprayed metal contact portion Because of the considerable distance, the heat generation of the fuse 150 and the thermal spray metal contact parts overlap each other, and the temperature of the condenser rises. have.

As a result, according to the condenser element of the present invention, the heat generation of the condenser due to the bottleneck of the current is reduced, and the fuse unit 130 is collected at the center of the condenser during winding so that the condenser temperature is prevented from rising. Therefore, by reducing the high-temperature heat generation in the center of the condenser and uniformly generates a low temperature as a whole, the life of the condenser is long and can be configured to be used even under high temperature conditions.

That is, since the front surface of the deposited A1 to A3 is too small compared to the area of the deposited metal 120 while maintaining the insulating force, when the fuse unit 130 operates, the capacitor capacity decreases less. The test was very safe with no samples with breakdown voltage until the capacitor's capacity was reduced by 95%.

The condenser element 160 is wound around a metallized polypropylene film (METALLIZED POLYPROPYLENE FILM) by a spindle (that is, wound around the core) by setting the rotation speed and the width dimension along the winding capacity center through the winding machine to form a round type. Configure.

A condenser element having such a configuration is shown in FIG.

Hereinafter, the press type, the round type, and the box type will be collectively described, and different processes will be described in more detail in the manufacturing method.

The core 161 uses a smaller diameter (F) of the spindle size, but preferably 1 to 3 mm.

This is because large sizes break easily during operation.

The lead terminal 164 is attached to both ends of the wound metallized plastic film by welding, but is welded so that the directions of both terminals are formed in the same direction in a radial type.

The lead terminal 164 is welded after the spraying process of spraying metallic particles on both ends of the device by adjusting the spraying distance, the thickness, the pressure, the voltage, the current and the spraying speed before welding to both ends of the wound metallized plastic film. This is done.

In particular, when the lead terminal 164 is welded to both end surfaces of the round type condenser element, the lead terminal is welded to a point two-thirds the diameter of both end core holes 161 of the wound metallized plastic film.

 Referring to the drawings for comparing the press type and the round type at the time of welding the lead terminals of FIGS. 10 and 11, in the case of the press type, when welding the lead terminals, one third of the cross section where the welding part of the device is sprayed ( One-third), but in the round type, the device welding area shall be welded to two-thirds (2/3) of the hole.

This is to prevent the generation of the pin hole (PIN HOLE) in the core hole 161 in the drying step after the exterior coating, to partially seal the device hole in the welding step.

After the welding is completed, the mold is pre-dried and then preheated to dry the bar set, and the impregnated and impregnated steps of impregnating the preheated set with the wax or epoxy as an insulating material are completed. Stamp according to powder coating step and marking specifications for coating, stamping to remove resin through resin remover, resin removal process and primary and secondary curing drying to cure powder coated set, structural inspection and automatic The screening test performs a final inspection of the selected set, and determines whether there is a defect, thereby completing a half pattern margin metallized plastic film capacitor.

Hereinafter, a process of manufacturing such a half pattern margin metallized plastic film capacitor will be described with reference to the drawings.

8 is a flowchart illustrating a method of manufacturing a half pattern margin metallized plastic film capacitor of the present invention. As shown in FIG. 8, the winding step (S210) is a rotational speed according to a winding capacity center through a winding machine. A metallized plastic film patterned such that the fuse part 130 formed at one end of the portion where the split electrode 150 and the electrode metal 120 are in contact with each other by setting the width dimension is continuously formed at regular intervals along the length direction of the film ( The step 100 is wound around the spindle SPINDLE, that is, the winding core 161 to generate a round type condenser element 160.

As described above, the half pattern margin metallized plastic film 100 forms a margin portion on the plastic film 110, and one end contacts the margin portion M on which the electrode metal 120 is not deposited. Forming a rectangular split electrode 150 in a silver film width direction, forming a fuse part 130 at one end of a portion where the split electrode 150 and the electrode metal 120 come into contact with each other; 130 is patterned to be continuously formed at predetermined intervals along the length direction of the film to produce a Half Pattern Margin metallized plastic film.

In this case, the length H of the electrode metal 120 is formed to be shorter than 1/2 of the length in the direction of the film width A, and the pitch P of the split electrode 150 is equal to the length of the metal for the electrode. The width F of the fuse part 130 is preferably shorter than the width D of the electrode separation part formed at the contact portion between the split electrode 150 and the electrode metal 120. Do.

After step S210, the capacitor is manufactured in a process selected according to the type of capacitor to be manufactured.

That is, it is possible to select whether to manufacture a round type capacitor, a press type capacitor, or a box type capacitor.

In the present invention, since a process of producing a capacitor device using the same Half Pattern Margin metallized plastic film is followed by some processes depending on which capacitor is manufactured by type, the type of capacitor can be selected as described above. will be.

First, a case in which a round type capacitor is to be manufactured in step S220 will be described.

When forming a condenser element 110 of a conventional PRESS TYPE, the diameter F of the spindle size is 2-7 mm, but the diameter F of the spindle size is pressed when forming the round type capacitor element. Use 1 ~ 3mm size smaller than the type.

Since the round type undergoes only a heat treatment process without applying a press, if the core part is broken, that is, if the winding state cannot be maintained, it may affect the capacity and electrical characteristics of the serving. Should be used.

The round type condenser element 160 generated in the winding step S210 is thermally aged by inserting a predetermined number of elements according to the specification in the heat treatment step S221.

That is, the round type capacitor device is characterized in that the heat treatment by applying a temperature for a predetermined time without undergoing a heat press process.

Therefore, the state of the element after aging maintains the shape of the round capacitor element.

The heat treated condenser device wraps the device in order to prevent the spray particles from being buried in the plane of the device in the wrapping step (S222), and enters the metaconic step (S223) after the wrapping step (S222).

Metalicone step (S223) is a spraying process, by spraying a spray of metallic particles on both ends of the device by adjusting the spraying distance, spray thickness, pressure, voltage, current, spraying speed.

In this case, the reason for increasing the injection particle size is to prevent a short from occurring by blocking part of both holes and preventing the spray particles from being connected through the core core 130.

Subsequently, the weak parts of the spray particles and the film adhered to the surface of the device are removed in the metalicon process, and the lead terminals 164 are welded and released in the welding tapering step S224 to tape the devices to the bar and tape the bars ( Bar) is set.

In this case, the welding of the lead terminal 164 is preferably formed in a radial type.

In particular, when the lead terminal 164 is welded to both end surfaces 120a and 120b of the round capacitor element 160, the diameter of the first and second electrodes 162a and 162b formed at both end surfaces of the capacitor element 110 is increased. The lead terminal 164 should be welded to the point of two quarters.

 Referring to the drawings for comparing the press type and the round type at the time of welding the lead terminals of FIGS. Up to 1/3) point In the present invention, the device welding part should be welded up to 2/3 (2/3) point to the hole.

This is to prevent the generation of the pin hole (PIN HOLE) in the core hole 130 in the drying step after the exterior coating to seal the device hole in the welding step to facilitate the exterior work and to prevent the pinhole.

Therefore, the round type capacitor of the present invention can reduce noise. When comparing the noise data of the press type and the noise data of the round type, the average press type is 72, the minimum and maximum data are 69 and 75, while the round type capacitor is 51 and the minimum and maximum data are 50 and 75, respectively. As for the round type, it was confirmed from the experimental data that the round type generated noise reduction effect of about 30-40% compared to the press type product.

When welding is completed, the mold coating process is performed after preheating and drying the bar set, and then impregnating step (S225) of impregnating the impregnating solution with wax or epoxy as an insulating material and powder coating step of powder coating the set after the impregnation step is completed. (S226), and the stamp according to the marking specifications, the resin to remove the resin through the resin remover and the resin removal process and the first and second curing drying to cure the powder-coated set, structural inspection and automatic screening inspection Through the inspection step (S227) for the final inspection of the selected set to determine whether there is a failure, and in step S228 can be made to include the step of performing a lead process if necessary.

The product is packaged and shipped (S229).

From the impregnation step (S225) to the shipment step (S229) is the same as the manufacturing process of a conventional metal film capacitor, detailed description thereof will be omitted.

Next, a method of manufacturing a press-type metallized plastic film capacitor in step S230 will be described.

As described above, the press type is slightly weaker than the round type, but when the metallized plastic film of the present invention is used, as described above, the heat generation of the capacitor due to the bottleneck of the current is reduced and the fuse unit 130 is wound up. Is collected at the center of the condenser to prevent the condenser temperature from rising, so the heat generation at the center of the condenser is reduced and the heat is uniformly generated at low temperature. It can be used because it can be configured to be used even under conditions.

First, in step S210, the half pattern margin metallized plastic film 100 is wound around a spindle, ie, the core 161, to generate a round type capacitor device 160, and then press step S231. Will press the capacitor.

When forming a conventional press type condenser element 160, the diameter F of the spindle size is 2-7 mm, and the round type condenser element 160 generated in the winding step S210 is used. TEMP AGING is performed by inserting a certain number of elements according to the specification of the heat treatment step.

The press type condenser element is subjected to a press process in which temperature and pressure are applied in the heat treatment step. The hot press is applied to the condenser element arranged up and down so that the core portion of the condenser element is compressed. In this case, it is preferable that the press type is pressurized for a predetermined temperature and a predetermined time.

The heat treatment press type condenser element is subjected to the same lapping step (S222), meta silicon step (S223), and welding tape step (S224), which are the same processes as the above-described round type condenser element. In the case of the press type, the lead terminal is welded. The welds of the device shall be welded to one third (1/3) of the sprayed section.

After the welding is completed, the lead process is performed through the impregnation step (S225), the powder coating step (S226), and the inspection step (S227) in the same manner as the above-described round type capacitor device (S228), and the product The package is shipped (S229).

Meanwhile, in order to manufacture a BOX type capacitor device in step S240, first, in step S210, the metallized plastic film 100 is wound around a spindle, ie, the core 161, to generate a round type capacitor device 160, and then press In step S241, the capacitor is pressed.

The box type condenser element is subjected to a press process in which temperature and pressure are applied in the heat treatment step, and a hot press is applied to the condenser element arranged up and down so that the core portion of the condenser element is compressed. In this case, it is preferable that the press type is pressurized for a predetermined temperature and a predetermined time.

The condenser element pressed in this way wraps the device in order to prevent the spray particles from buried in the plane of the device in the wrapping step (S242), after the wrapping step (S242) enters the meta- silicon step (S243).

Metalicone step (S243) is a spraying process, by spraying the spray of metallic particles on both ends of the device by adjusting the spraying distance, spray thickness, pressure, voltage, current, spraying speed.

Subsequently, the weak parts of the spray particles and the film adhered to the device surface are removed in the meta- silicon process, and the lead terminal 164 is welded and released in the welding tapering step S244 to tape the device to the bar and tape the bar ( Bar) is set.

In this case, the welding of the lead terminal 164 is formed in a radial type, and when welding the lead terminal, the welding part of the device should be welded to one third (1/3) of the sprayed section.

In step S244, the casing is completed and the resin is injected into the capacitor capacitor welded (S245 ~ S246).

In the casing step (S245), first, the condenser element is coupled to the case, and the resin is first injected and dried in the resin injection step (S246), and then the secondary resin is injected and dried to complete.

At this time, the resin uses an automatic injection device (AUTOMATIC EPOXY INSERTING MACHINE) with epoxy and an automatic drying machine (AUTOMATIC DRYING MACHINE).

 When the injection and drying of the resin is completed in step S246, the seal is stamped on the case according to the marking specifications, the resin is removed through a resin remover and the resin removal process is performed through a structural inspection and an automatic screening test to finalize the selected set. The inspection step (S227) to check the presence or absence of defects, and if necessary in step S228 can be made including the step of performing a lead process.

The product is packaged and shipped (S229).

As a result, according to the Half Pattern Margin metallized plastic film capacitor of the present invention and a method of manufacturing the same, the heat generation of the capacitor due to a bottleneck of current is reduced, and the fuse unit 130 gathers in the center of the capacitor during winding to increase the capacitor temperature. In order to prevent the rise, the metallized plastic film produced at the position separated from each other in the center is used so that the heat generation at the center of the capacitor is reduced and the heat generation is uniformly generated at low temperature. It is possible to provide a capacitor that can be used.

In addition, using a half-patterned metallized plastic film having the above-described function, a round type metallized plastic film capacitor, a press type metallized plastic film capacitor, and a box type metallization, as necessary. Since a plastic film capacitor can be manufactured, there is an advantage that a capacitor having high stability can be manufactured.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art.

100: metallized plastic film 110: plastic film
120: electrode metal 130: fuse
140: left and right separator 142: electrode separator
150: split electrode M: margin portion
160: capacitor element 162a: first electrode
162b: second electrode 164: lead terminal

Claims (24)

In the Half Pattern Margin Metallized Plastic Film Capacitor,
The electrode metal is deposited on one side of the plastic film, and the other side forms a margin, and in the deposited electrode metal, one end contacts the margin part and the other end forms a rectangular split electrode toward the film width direction. A half pattern margin metallized plastic film formed by forming a fuse part at a portion where the electrode and the metal for the electrode are in contact and patterning the fuse part at a predetermined interval along the longitudinal direction of the plastic film is wound around the core. A capacitor element composed of lead terminals each of which is wound or stacked in length and extended at a predetermined length from an electrode formed to be electrically connected to the electrode metal;
Half Pattern Margin metallized plastic film capacitor comprising a.
The method of claim 1,
The condenser element is heat-treated and formed into a round type, and the lead terminal is welded to surround the core hole from which the core is removed, and the half pattern margin formed by impregnating wax or epoxy after taping the element in the bar (Bar) Half Pattern Margin) Metallized plastic film capacitors.
The method of claim 2,
The lead terminal
Half welded to form metal particles sprayed to prevent conduction of the core hole at both ends of the core hole from which the core is removed, and to wrap the hole in a radial type on the metal particles injected at both ends of the core hole. Half Pattern Margin Metallized Plastic Film Capacitor.
The method of claim 1,
The condenser element
Half formed by applying temperature and pressure to the press plate of the heat press machine, forming a press type, welding the lead terminals to surround the core hole from which the core has been removed, and taping the element in the bar, and then impregnating wax or epoxy. Half Pattern Margin Metallized Plastic Film Capacitor.
The method of claim 4, wherein
The lead terminal
Half welded to form metal particles sprayed to prevent conduction of the core hole at both ends of the core hole from which the core is removed, and to wrap the hole in a radial type on the metal particles injected at both ends of the core hole. Half Pattern Margin Metallized Plastic Film Capacitor.
The method of claim 1,
The condenser element
Half formed by applying temperature and pressure in the press plate of the heat press and then forming a press type, welding the lead terminals to surround the core hole from which the core has been removed, and inserting into the case and injecting epoxy into the case to cure it. Half Pattern Margin Metallized Plastic Film Capacitor.
The method according to claim 6,
Injection of the epoxy
A half pattern margin metallized plastic film capacitor is completed by injecting epoxy into the case first, curing the predetermined time, and then injecting epoxy into the second.
The method of claim 1,
The split electrode
Half Pattern Margin Metallized Plastic Film Capacitor formed from 1/2 to 3/4 of the film width towards the film width direction.
The method of claim 8,
The fuse unit 130
A half pattern margin metallized plastic film capacitor formed at a position spaced apart from each other by 0.2 mm to 1.5 mm by overlapping in the width direction of the film with the adjacent upper and lower fuse parts when winding or laminating.
The method of claim 9,
The width F of the fuse part is
The Half Pattern Margin metallized plastic film capacitor is formed to be narrower than the width (D) of the electrode separator 142 formed in the contact portion between the split electrode 150 and the electrode metal 120.
The method of claim 10,
The length (H) of the electrode metal
Half Pattern Margin metallized plastic film capacitor formed shorter than 1/2 of the length in the film width (A) direction.
12. The method of claim 11,
The pitch P of the split electrode 150 is
Half pattern margin metallized plastic film capacitor formed shorter than the length (H) of the electrode metal (120).
In the manufacturing method of a half pattern margin metallized plastic film capacitor formed of a metal for electrodes deposited to form a split electrode on a plastic film,
(a) generating a metallized plastic film patterned such that the fuse part formed at one end of the portion where the split electrode is in contact with the metal for the electrode is continuously formed at a predetermined interval along the length direction of the film;
(b) winding or laminating a plurality of the metallized plastic films on the core, and generating a capacitor device including lead terminals extending a predetermined length from a cathode electrode and a cathode electrode formed to be electrically connected to the electrode metal; ;
(c) impregnating or casing the capacitor generated in step (b);
(d) an inspection step of performing the first and second curing drying after the step (c), and finally inspecting the selected set by the structural inspection and the automatic selection inspection; And
(e) performing lead processing after the inspection step;
Method for manufacturing a half pattern margin (metallic) plastic film capacitor comprising a.
The method of claim 13,
The step (a)
(a-1) forming a margin portion on the plastic film and forming a rectangular split electrode 150 at one end thereof in contact with the margin portion M on which the electrode metal 120 is not deposited and the other end thereof toward the film width direction;
(a-2) forming a fuse part 130 at one end of a portion where the split electrode 150 is in contact with the electrode metal 120;
(a-3) generating the metallized plastic film by patterning the fuse part 130 to be continuously formed at a predetermined interval along the longitudinal direction of the film; and
(a-4) winding up the produced metallized plastic film;
Method for manufacturing a half pattern margin metallized plastic film capacitor comprising a.
The method of claim 14,
In the step (a-1)
The length (H) of the metal for the electrode is a method of manufacturing a half pattern margin metallized plastic film capacitor configured to be formed shorter than half of the length in the film width (A) direction.
The method of claim 14,
In the step (a-1)
The method of manufacturing a half pattern margin metallized plastic film capacitor configured to form the pitch (P) of the split electrode to be shorter than the length (H) of the electrode metal.
17. The method of claim 16,
In the step (a-3)
The width (F) of the fuse portion is formed to be narrower than the width (D) of the electrode separation portion formed in the contact portion between the divided electrode and the electrode metal (Half Pattern Margin) manufacturing method of a metallized plastic film capacitor.
The method of claim 13,
Step (b) is
(b-1) a heat treatment step of heating a predetermined time without applying a press so that the round type capacitor device wound with the film in step (a) maintains the round type;
(b-2) a wrapping step of wrapping the device so that the spray particles do not adhere to the surface of the device after the step (b-1);
(b-3) after the step (b-2), the metallic particles are sprayed on both ends of the hole from which the core is removed, but not sprayed so that the sprayed particles do not conduct the hole; and
(b-4) A lead terminal is welded to the both ends of the capacitor element in a radial type, and the lead terminal is welded and released to weld the lead terminal to surround the hole. Weld taping to tape and set the taped bars;
Method for producing a half pattern margin (metallic) plastic film capacitor further comprises a.
19. The method of claim 18,
In the step (b-3)
A method of manufacturing a half pattern margin metallized plastic film capacitor, which is sprayed using a metallic element for spraying with a spray particle size larger than the spray particle size in press type manufacturing.
20. The method of claim 19,
Step (c) is
(c-1) impregnating wax or epoxy after the welding taping step; and
(c-2) powder coating step of powder coating after the step (c-1);
Method for producing a half pattern margin metallized plastic film capacitor further comprising a.
The method of claim 13,
Step (b) is
(b-1) applying the temperature and pressure using a press plate of a hot press to a round type device wound with a film in the step (a);
(b-2) a wrapping step of wrapping the device so that the spray particles do not adhere to the surface of the device after the step (b-1);
(b-3) after the step (b-2) the meta- silicon step of spraying a metallic particulate spray on both ends of the hole is removed; and
(b-4) A lead terminal is welded to both ends of the device in a radial type, but the lead terminal is welded and released to weld the lead terminal to surround the hole, and the device is taped to the bar. Welding tape to set the taped bar;
Method for producing a half pattern margin (metallic) plastic film capacitor further comprises a.
22. The method of claim 21,
Step (c) is
(c-1) impregnating wax or epoxy after the welding taping step; and
(c-2) powder coating step of powder coating after the step (c-1);
Method for producing a half pattern margin metallized plastic film capacitor further comprising a.
The method of claim 13,
Step (b) is
(b-1) applying the temperature and pressure to the device wound with the film in the step (a) by using a press plate of a hot press;
(b-2) a wrapping step of wrapping the device so that the spray particles do not adhere to the surface of the device after the step (b-1);
(b-3) after the step (b-2) the meta- silicon step of spraying a metallic particulate spray on both ends of the hole is removed; and
(b-4) A lead terminal is welded to the both ends of the capacitor element in a radial type, and the lead terminal is welded and released to weld the lead terminal to surround the hole. Weld taping to tape and set the taped bars;
Method for manufacturing a half pattern margin metallized plastic film capacitor further comprises a
24. The method of claim 23,
Step (c) is
(c-1) casing the condenser element generated after the welding taping step into a case; and
(c-2) injecting the resin after the step (c-1);
Method for producing a half pattern margin metallized plastic film capacitor further comprising a.

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