KR101166420B1 - Cathode installation of exposure type - Google Patents

Abstract

The present invention relates to an exposure type deposition apparatus, which is capable of preventing contamination inside a roll-to-roll spurt system even in a compact configuration in which a cathode is exposed, and can cope with flexible films of various widths, and has a cooling function. The present invention relates to an exposure deposition apparatus that can prevent a phenomenon in which a flexible film is damaged.

Description

Exposure type deposition apparatus {Cathode installation of exposure type}

The present invention relates to an exposure type deposition apparatus, and more particularly, even in a compact configuration in which a cathode is exposed, contamination of the inside of a roll-to-roll spurt system can be sufficiently prevented, and a flexible film of various widths can be supported, and a cooling function This is provided with an exposure type deposition apparatus, which can prevent the phenomenon that the flexible film is damaged.

Hereinafter, a configuration and an operation example of the related art will be described with reference to the accompanying drawings.

1 is a cross-sectional view showing a roll-to-roll spurt system equipped with a metal deposition apparatus according to the prior art, Figure 2 is a perspective view showing a cover configured in the metal deposition apparatus according to the prior art, Figure 3 is a of FIG. 4 is an enlarged view showing part E of FIG. 3, and FIG. 5 is a cross-sectional view showing a roll-to-roll spurt system equipped with an exposure deposition apparatus according to the technique of the present invention. .

In general, the flexible film (F) is used to be coated on the LCD surface or the exterior material of the building is a metal material deposited on one side of the film of the synthetic resin material.

As such, an apparatus for depositing a metal material on one side of the film of the synthetic resin material is referred to as a roll-to-roll spurt system 1.

The roll-to-roll sputter system 1 is disposed on the side of the rewinding roll (not shown) and the rewinding roll in which the flexible film F is released in the chamber 10 capable of vacuum and vacuum release. The winding roll 13 to which F) is wound is comprised, and below the rewinding roll and the winding roll 13, the main roll 15 is comprised and the flexible film F unwound from the rewinding roll is the said main roll. It is configured to be wound on the winding roll 13 via (15).

And below the main roll 15 is a metal deposition apparatus 20 for depositing a metal material on the flexible film (F) passing through the main roll 15 is configured.

The metal deposition apparatus 20 has a cathode 21 fixed to one side in the chamber 10 to generate a plasma toward the flexible film F, and accommodates the cathode 21 and is opened upward. The cathode chamber 23 is configured and consists of a cover 24 covering the open top of the cathode chamber 23. The cover 24 is configured to be supported in the chamber 10 and attached to the left and right side plates 17 and 19 supporting the main roll 15.

The cathode 21 is generally mounted on the roll-to-roll spurt system 1, and a plate-shaped target 22 formed of gold, silver, copper, aluminum, or the like is exposed on the upper side, which can be known to those skilled in the art. Detailed description is omitted here.

The cover 24 has an arc-shaped plate shape along the main roll 15 and a plate-shaped window 25 having a through hole 26 through which the cathode 21 passes. The window 25 may be positioned above the cathode chamber 23 by attaching a flange 27 to the upper surface and fixing the flange 27 to the left and right side plates 17 and 19. In addition, a plate-shaped mask 28 that is spaced apart and fixed below the window 25 is configured. The mask 28 is also configured to allow the passage of plasma by forming another through hole 29 corresponding to the through hole 26. The mask 28 and the window 25 are configured with an axis S interposed to maintain the spaced apart state. Therefore, it is configured to prevent the phenomenon that the heat of the mask 28 is transferred to the window 25 to the maximum.

The operating principle of the roll-to-roll spurt system 1 is as follows.

After vacuuming the inside of the chamber 10, the flexible film F is released from the rewinding roll and wound around the winding roll 13 via the main roll 15 . In this case, when electricity is applied to the cathode 21 while injecting argon, which is an inert gas, above the cathode 21, through the through holes 26 and 29 of the window 25 and the mask 28, the flexible film ( A plasma is generated between F) and the target 22. Then, the cations formed while the electrons are released from the atoms constituting the inert gas collide with the target 22 having the cathode, and the metal atoms of the target 22 are separated and deposited on the surface of the flexible film F to form a thin film. To form.

The metal deposition apparatus according to the above configuration had the following problems.

First, when plasma is irradiated from the cathode for a long time, the window and the mask are overheated to heat the flexible film. At this time, the heated flexible film is softened to cause wrinkles on the surface. In addition, there is a problem in that it is broken while being broken while being cooled while forming a hole or a hole is formed.

Second, the maintenance of the cathode chamber was difficult. When metal is deposited on the flexible film, metal atoms are also deposited and contaminated on the inner wall, the window, and the bottom of the mask of the cathode chamber. When the deposited metal atoms are left in this manner, oxygen is introduced into the chamber when the vacuum inside the chamber is released after rewinding, and oxygen atoms are attached to the deposited metal atoms of the chamber and the cover. do. After mounting the flexible film on the winding roll afterwards, if the inside of the chamber is in a vacuum state, oxygen attached to the metal atom again adheres to the metal atom deposited on the flexible film, causing oxidation and causing a defect. . Therefore, after separating the cathode from the cathode chamber and the cover (window, mask) from time to time, the deposited metal should be removed. Since the cover is detachable, it is possible to easily remove contaminants, but the cathode chamber is Since it was fixed inside the chamber, there was a hassle for the operator to enter the chamber and clean the inside of the cathode chamber.

Third, since the widths of the through holes of the window and the mask constituting the cover cannot be changed, there is an inconvenience in that the cover must be changed according to the width of the flexible film.

The exposure type deposition apparatus according to the present invention includes a cathode having a target exposed to the upper portion, a plate-shaped anode shield fixed around the target, and formed to extend along the width of the flexible film, and covering the upper portion of the cathode in the longitudinal direction thereof. The cover is configured, and the cathode is configured to be attached to the upper end of the finishing plate extending upward, the cover is a flat plate covering the upper surface of the cathode and the side plate extending downward from the longitudinal edge of the flat plate and the An end closure plate formed to cover the end portion of the cathode at an outer end of the side plate, a lower mask having a longitudinal long hole penetrated through the plate, and a side mask formed of a plate extending upward from a longitudinal edge of the long hole And brackets attached to both inner side surfaces of the side mask, and plate-shaped rods loaded on the brackets. A long hole in which the flange is extended downward to be fixed to the lower mask so as to cover between the both end portions of the side mask as a plate shape covering the long hole in the upper portion of the edge mask, and communicates with the long hole of the lower mask. A through-hole, a long hole penetrating the window is formed, and an upper mask formed through the window and spaced apart from the upper surface of the lower mask, and a cooling water channel interposed between the upper mask and the lower mask.

Since the exposure type deposition apparatus according to the present invention can cope with various widths of the flexible film due to the transfer of the edge mask, there is no inconvenience of replacing the cover with a different standard every time the flexible film is changed.

In addition, the upper mask and the lower mask are spaced apart up and down, and the cold water channel is interposed between the upper mask and the lower mask, it is possible to suppress the phenomenon that the heat of the cathode is transferred to the flexible film to the maximum. Therefore, the phenomenon in which the flexible film is softened by heat and wrinkles is prevented, and the soft film is cured while being softened after being softened, thereby preventing the phenomenon of breaking or forming holes.

In addition, the present invention has the effect that can prevent the phenomenon that the inside of the chamber is contaminated with metal deposits sufficiently without the cathode chamber, as in the prior art. Thus, a compact design is possible, and after the cover is removed, maintenance is completed only by removing the metal deposit deposited inside the cover, so that there is no need to enter the chamber and maintain the cathode chamber as in the prior art.

1 is a cross-sectional view showing a roll-to-roll spurt system equipped with a metal deposition apparatus according to the prior art.
Figure 2 is a perspective view showing a cover constituted by a metal deposition apparatus according to the prior art.
3 is a cross-sectional view taken along the line AA ′ of FIG. 1.
4 is an enlarged view of part E of FIG. 3;
5 is a cross-sectional view showing a roll-to-roll spurt system equipped with an exposure type deposition apparatus according to the technique of the present invention.
6 is a cross-sectional view taken along the line CC ′ of FIG. 7.
7 is a perspective view showing an exposure type deposition apparatus according to the technique of the present invention.
FIG. 8 is a cross-sectional view taken along the line FF ′ in FIG. 5.
Fig. 9 is a sectional view showing a cover constituted of the exposure type deposition apparatus according to the technique of the present invention.
FIG. 10 is an exploded perspective view illustrating a process in which an upper portion of a cathode is accommodated in a cover as an exposure type deposition apparatus according to the present invention. FIG.
FIG. 11 is an exploded perspective view illustrating a process of attaching an upper mask to a lower mask in a cover of the exposure type deposition apparatus according to the present invention. FIG.
FIG. 12 is an exploded perspective view illustrating a process in which an edge mask is supported on a side mask and a window is coupled to a lower mask of the exposure mask deposition apparatus according to the present invention.

Hereinafter, a configuration and an operation example of the present invention for solving the above problems with reference to the accompanying drawings are as follows.

5 is a cross-sectional view showing a roll-to-roll spurt system equipped with an exposure type deposition apparatus according to the technique of the present invention, FIG. 6 is a cross-sectional view taken along the line CC ′ of FIG. 7, FIG. 8 is a cross-sectional view taken along the line F-F 'of FIG. 5, FIG. 9 is a cross-sectional view showing a cover configured in the exposure-type deposition apparatus according to the technique of the present invention, FIG. An exploded perspective view showing a process in which an upper portion of a cathode is accommodated into a cover as an exposure type deposition apparatus according to the technique of the present invention, and FIG. 12 is an exploded perspective view illustrating a process of attaching to a mask, and FIG. 12 is an exploded perspective view illustrating a process in which an edge mask is supported on a side mask and a window is coupled to a lower mask formed in an exposure type deposition apparatus according to the present invention. Explain standing together.

In general, the flexible film (F) is used to be coated on the LCD surface or the exterior material of the building is a metal material deposited on one side of the film of the synthetic resin material.

As such, an apparatus for depositing a metal material on one side of the film of the synthetic resin material is referred to as a roll-to-roll spurt system 100.

The roll-to-roll sputter system 100 is disposed on the side of the rewinding roll 120 and the rewinding roll 120 in which the flexible film F is released in the chamber 110 capable of vacuum and vacuum release. Winding roll 130 is wound (F) is configured, the main roll 140 is configured below the rewinding roll 120 and the winding roll 130, the flexible film released from the rewinding roll 120 (F) is configured to be wound on the winding roll 130 via the main roll 140.

In addition, a metal deposition apparatus 200 configured to deposit a metal material on the flexible film F passing through the main roll 140 under the main roll 140 .

In the present invention, the metal deposition apparatus 200 is configured to expose the cathode 210 to facilitate the maintenance, while preventing the flexible film F from being damaged due to the heat generated from the cathode 210. It is characterized in that it is configured to be applicable to varying according to the width (V) of the various flexible film (F).

To this end, in the present invention, the metal deposition apparatus 200 is configured as follows.

First, the target 213 is exposed to the upper portion, the plate-shaped anode shield 217 is fixed around the target 213 and the cathode 210 formed along the width V of the flexible film F is configured. do. In addition, a cover 220 is formed to cover the upper side and the longitudinal side 212 and the outer end portion 214 of the cathode 210 spaced apart.

The cathode 210 is fixed to one side of the chamber 110 and is mounted to extend in the width (V) direction of the flexible film (F). The cathode 210 is configured by attaching a closing plate 219 extending upward to the upper surface of the inner end portion, which is fixed to the chamber 110, so that the lower mask 230 of the cover 220 will be described later. It is configured to block the open end (K) of the . In the above, the inner end portion refers to a portion where the open end K of the lower mask 230 is positioned while the cover 220 accommodates the cathode 210.

The cover 220, the lower mask 230 is first configured, look at the configuration of the lower mask 230 as follows. A flat plate 231 covering the upper surface of the cathode 210 and a side plate 235 extending downward from the longitudinal edge 233 of the plate 231 is formed, and outwardly from both opposing side plates 235. An end closure plate 236 covering the end portion 214 of the cathode 210 is formed at the end E of the relative direction of the closure plate 219. In other words, the end E is an end formed on the opposite side of the open end K.
Therefore, the lower mask 230 has a cylindrical shape in which the cathode 210 side and the lower side are open. In addition, a long hole 237 is formed through the plate 231.

In addition, the side mask 240, which is a plate formed extending upward from the longitudinal edges 239 facing each other in the long hole 237 of the lower mask 230, corresponds to each other as shown in FIG. 12.

In addition, as shown in FIG. 12, the bracket 250 supporting the edge mask 260 to be described later is attached to the opposite inner surface of the side mask 240. The bracket 250 is attached to both end portions of both side masks 240, and the brackets 250 attached to one side mask 240 and the opposite side mask 240 are configured to face each other.

In addition, a plate-shaped edge mask 260 loaded on the bracket 250 is configured. When the edge mask 260 is loaded on the briquette 250, two edge masks 260 are provided to be positioned at both end sides of the long hole 237. The edge mask 260 may be configured to be convex downward to have a shape corresponding to the main roll 140.

In addition, the flange 271 is downwardly formed to cover a gap between the two end portions 243 of the side mask 240 in a plate shape covering the long hole 237 of the lower mask 230 on the upper portion of the edge mask 260. Is extended to be fixed to the lower mask 230, and a window 270 through which another long hole 273 communicated with the long hole 237 of the lower mask 230 is formed.

Looking at the mutual configuration of the window 270 and the edge mask 260 in detail, since the edge mask 260 is located below the window 270, both ends of the long hole 273 of the window 270 The edge portion has a structure covered by the edge mask 260. Therefore, the length D of the long hole 273 of the window 270 can be freely adjusted according to the width V of the flexible film F by transferring the both edge masks 260. The window 270 is preferably bent to be concave downward to correspond to the main roll 140.

In addition, the long hole 273 penetrating the window 270 is formed, thereby forming an upper mask 280 configured to penetrate the window 270 from above and spaced apart from an upper surface of the lower mask 230. That is, the upper mask 280 has a plate shape and is formed in the shape of a frame by forming the long hole 273 to penetrate the window 270 to be positioned above the lower mask 230. In addition, flanges 271 and 272 fixed to side plates 155 and 157 supporting the main roll 140 are formed on the outside of the long hole 273 and extend upward. Thus, the cover 220 is fixed to the side plates (155, 157) can be mounted. And the cathode 210 is formed is fixed to one side of the chamber (110).

In addition, a space M is interposed between the upper mask 280 and the lower mask 230 to maintain a spaced state, and a coolant channel 290 configured to circulate the coolant in the spaced space.

Among the anode shields 217 of the cathode 210, the anode shield 217 facing the side plate 235 of the lower mask 230, that is, the anode shield 217 in the longitudinal direction, extends laterally to form a side plate ( 235). The proximity distance is preferably about 2 to 3 mm as an example, because the plasma does not pass in the proximity distance. In addition, the anode shield 217 may be attached to the side plate 235, but the reason for providing a close distance is to facilitate the assembly of the cover 220 and the cathode 210. That is, the proximity distance is a margin of tolerance.

According to the configuration, the side plate 235 of the lower mask 230 of the cover 220 covers the longitudinal side surface of the cathode 210, the end plate 236 is the outer end of the cathode 210 214 will be covered. Of course, at this time it is to cover the spaced apart state. In addition, the closing plate 219 may block the open end (K ) of the lower mask 230 to prevent the leakage of metal deposits to prevent the phenomenon of contaminating the inside of the chamber 110.

In addition, the lower mask 230 is configured to be spaced apart from the cathode 210 so that heat generated from the cathode 210 is not directly transmitted to the cover 220.

The coolant channel 290 is configured to be formed with an inlet and a drain to heat exchange after the coolant is introduced and then discharged.

Hereinafter, the operation of the present invention will be described.

After the flexible film F is released from the rewinding roll 120, the winding film 130 is wound around the winding roll 130 via the main roll 140. Then, the edge mask 260 is transferred so that the long hole length D of the window 270 corresponds to the width V of the flexible film F. That is, the window 270 and both edge masks 260 serve to limit the metal material to be deposited only as much as the width (V) of the flexible film (F).

In this state, when electricity is applied to the cathode 210 while supplying an inert gas such as argon to the upper portion of the cathode 210, between the flexible film F and the target 213 of the cathode 210. The plasma is generated. This is possible because of the fact that there is a long hole 237 of the lower mask 230 and a long hole 273 of the window 270. Then, the cations formed while the electrons are released from the atoms constituting the inert gas collide with the target 213 having the cathode, and the metal atoms of the target 213 are separated and deposited on the surface of the flexible film F to form a thin film. To form. In this case, the cover 220 may prevent the metal deposit from contaminating the inside of the chamber 110. In this case, the flanges 271 and 272 of the side mask 240 and the window 270 may prevent the plasma from leaking between the upper mask 280 and the lower mask 230 to prevent the metal deposit from flowing into the chamber 110. Prevent contamination.

Of course, both ends of the lower mask 230 of the cover 220 is an open structure, but the longer the length of the lower mask 230, the farther away from both ends of the cathode 210, the metal deposits are terminated on both sides. It is possible to prevent the phenomenon of spilling past the wealth. The reason for opening both ends of the lower mask 230 is to transfer the side to accommodate the cathode 210.

At this time, the cathode 210, in particular, the anode shield 217 heats the cover 220 while high heat is generated. However, by allowing the coolant to circulate through the coolant channel 290, the heat of the lower mask 230 and the upper mask 280 is absorbed and discharged. In addition, the heat of the bracket 250, the side mask 240, the edge mask 60, and the window 270 connected to the upper mask 280 and the lower mask 230 is also lower than the lower mask 230 and the upper mask 280. Heat transfer to the cooling water.

In particular, the upper mask 280 and the lower mask 230 are vertically spaced apart from each other, thereby suppressing the phenomenon that the heat generated from the cathode 210 is discharged upward. In particular, the effect is further enhanced by the coolant channel 290.

Therefore, according to the present invention, it is possible to cope with the width V of various flexible films F due to the transfer of the edge mask 260, and in particular, the coolant channel 290 and the upper mask 280 and the lower part. Since the mask 230 is doubled, the phenomenon in which the heat of the cathode 210 is transferred toward the flexible film F can be suppressed as much as possible. Therefore, the phenomenon in which the flexible film F is softened by heat and wrinkled is prevented, and the soft film is cured while being softened after being softened, thereby preventing the phenomenon in which breaks or holes are formed.

In addition, the present invention has the effect of preventing the phenomenon that the inside of the chamber 110 is sufficiently contaminated with a metal deposit without the cathode chamber (not shown) as in the prior art. Therefore, a compact design is possible, and since the maintenance is completed by removing only the metal deposit deposited inside the cover 220 after removing the cover 220, the cathode chamber (not shown) is maintained as in the prior art. There is no need to do it. Therefore, there is an advantage of easy maintenance.

110: chamber 120: rewinding roll
130: winding roll 140: main roll
155, 157: side plate 200: exposure type deposition apparatus
210: cathode 213: target
217: anode shield 220: cover
230: lower mask 231; reputation
235: side plate 237: long hole
240: side mask 250: bracket
260: edge mask 270: window
271, 272: flange 273: long hole
280: upper mask 281: long hole
285: flange 290: coolant channel

Claims (1)

The cathode 210 is exposed to the upper portion and the plate-shaped anode shield 217 is fixed around the target 213 and formed long along the width V of the flexible film F,
The cover 220 is formed to cover the longitudinal side and the top of the cathode 210,
The cathode 210 is configured to be attached to the closing plate 219 extending upwards on the upper end surface of the inner side,
The cover 220 may include a flat plate 231 covering an upper surface of the cathode 210 and a side plate 235 extending downward from a longitudinal edge 233 of the flat plate 231 and an outer direction of the side plate 235. An end closure plate 236 formed to cover the end portion 214 of the cathode 210 at the end E of the lower mask 230, and a lower mask 230 having a longitudinal hole 237 penetrating the plate 231. Wow,
A side mask 240 which is a plate formed extending upward from the longitudinal edge 239 of the long hole 237,
Brackets 250 attached to both inner side surfaces 241 of the side mask 240,
Plate-shaped edge mask 260 loaded on the bracket 250,
A plate shape covering the long hole 237 on the top of the edge mask 260, the flange 271, 272 extends downward to cover between the both ends 243 of the side mask 240, the lower mask A window 270 that is fixed to 230 and through which a long hole 273 communicated with a long hole 237 of the lower mask 230 passes;
An upper mask 280 formed through the window 270 and spaced apart from an upper surface 234 of the lower mask 230 through the window 270;
Exposed deposition apparatus comprising a coolant channel (290) interposed between the upper mask (280) and the lower mask (230).

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