KR101166111B1 - Stacked high pass filter for high frequency - Google Patents

Abstract

The present invention relates to a high frequency filter, and more particularly, to a multilayer high frequency high pass filter capable of integrating a circuit constituting a high pass filter using a low temperature co-fired ceramics (LTCC) method. It is about.
The present invention constitutes a right hand / left hand combination law (CRLH) transmission line by a low temperature co-fired ceramic process, and a plurality of CRLH cells which are integrally coupled to have a coupling capacitance (Cc) when they are mutually coupled, and the CRLH cells. And an input / output port cell integrally stacked at the top or bottom thereof to form an input port and an output port.

Description

Stacked High Frequency High Pass Filters {STACKED HIGH PASS FILTER FOR HIGH FREQUENCY}

The present invention relates to a high frequency filter, and more particularly, to a high frequency filter using a low temperature co-fired ceramics (LTCC) method to form a high pass filter to integrate a high frequency filter for a multilayer type high pass filter. It is about.

In general, pure left-handed (LH) transmission lines cannot be physically implemented because of the parasitic effect of right-handed (RH). Therefore, LH transmission line should be modeled as Composite Right / Left-Handed (CRLH) transmission line considering RH effect.

FIG. 1 is a diagram illustrating a configuration of a general CRLH transmission line, FIG. 2 is a diagram illustrating a case in which a general CRLH transmission line is configured as a microstrip transmission line having a mushroom structure, and FIG. 3 is a view of the CRLH transmission line of FIGS. 1 and 2. It is a figure which shows the dispersion characteristic with respect to.

The model of the CRLH transmission line may include a series RH inductor LR, a series LH capacitor CL, a parallel RH capacitor CR, and a parallel LH inductor LL as shown in FIG. 1. This circuit model can be represented by a microstrip transmission line of a mushroom structure as shown in FIG.

When making a circuit for constructing the CRLH transmission line as described above, a method of forming a plurality of active and passive elements on a substrate made of a substrate having a metal-plated connection pattern is common, but such a method is a obstacle to integration. Becomes In particular, the integration of passive devices such as resistors, capacitors and inductors is more difficult, which is the biggest obstacle to integration.

In addition, in the case of the microstrip transmission line as shown in FIG. 2, passive devices may be integrated as compared to the case in which the passive devices are directly formed on the substrate. However, as shown in the dispersion characteristic graph of FIG. There was a problem.

In addition, as electronic devices such as mobile phones, notebook computers, PDAs, and the like have been miniaturized and slimmed, technology for integrating various circuits composed of passive devices in the wireless communication field has been required.

The present invention provides a stacked high frequency high pass filter capable of integrating a circuit constituting a high pass filter using a low temperature co-fired ceramic (LTCC) method.

Laminated high pass filter using a low temperature co-fired ceramic according to the present invention; Input and output port cells forming an input port and an output port; And a first layer having a ground pattern to form ground, and a first inductance pattern having one side connected to a port not connected to another CRLH cell among the input port or output port and forming a series RH inductor LR. And a second layer disposed below the first layer and a first capacitance pattern, and disposed below the second layer, the series LH capacitor (CL) formed by the first inductance pattern and the first capacitance pattern. A fourth layer disposed under the third layer, and having a third layer forming a third layer), one end thereof connected to a ground pattern of the first layer, and having a second inductance pattern forming a parallel LH inductor. And a fifth layer having a two-capacitance pattern and disposed below the fourth layer and connected to the first capacitance pattern of the third layer to form a parallel RH capacitor. A plurality of CRLH cells which are integrally coupled to form a right hand / left hand combination law (CRLH) transmission line by a mixing process and have a coupling capacitor (Cc) when mutually coupled, wherein the port cell is the maximum of the CRLH cells. It is characterized in that integrally coupled to the top or bottom.

The number of CRLH cells is characterized by consisting of two first CRLH cells and second CRLH cells.

delete

The high pass filter is; Another CRLH cell is coupled to a fifth layer of another CRLH cell below the fifth layer.

The second inductance pattern is formed in a meandering shape.

Each of the first to fourth layers includes a first via hole at a position corresponding to one end portion and the one end portion of the fourth layer, and one side of the fourth layer by a via penetrating through the first via hole. The end portion and the ground pattern of the first layer are connected.

Each of the third to fifth layers includes a second via hole, and the conductance pattern of the third layer and the conductance pattern of the fifth layer are connected by vias passing through the second via hole.

According to the present invention, since a high pass filter having a conventional planar CRLH structure is formed in a stacked form by using LTCC technology, a circuit constituting the high pass filter can be integrated, thereby miniaturizing it.

In addition, by combining the CRLH unit cells formed in a stacked form in a cascade, a new type of high pass filter can be configured, thereby minimizing and diversifying the high pass filter.

1 is a view showing a model of a typical CRLH transmission line
2 is a diagram illustrating a case in which a general CRLH transmission line is constituted by a macro strip of a mushroom structure;
3 is a diagram illustrating dispersion characteristics of a general CRLH transmission line
4 is a block diagram illustrating a high pass filter in accordance with the present invention.
5 is a circuit diagram illustrating a high pass filter in accordance with the present invention.
6 is a view showing a pattern of each layer constituting the stacked high-pass filter according to the present invention.
7 is a perspective view of the red type high pass filter according to the present invention;
8 is a cross-sectional view of a stacked high pass filter according to the present invention;
Figure 9 is a simulation graph showing the S parameter size characteristics versus frequency of the stacked high pass filter according to the present invention.

The present invention utilizes Low Temperature Co-fired Ceramics (LTCC) technology. Low-temperature co-fired ceramic (LTCC) literally refers to the process technology and the results of co-fire the metal and its ceramic substrate at low temperature.

Recently, various technologies for integrating large devices such as inductors and capacitors to form thin films using the LTCC process have been developed. Therefore, in the present invention, a high pass filter is configured using the LTCC.

4 is a block diagram illustrating a high pass filter according to the present invention, and FIG. 5 is a diagram illustrating a circuit diagram of a high pass filter according to the present invention.

4 and 5, the stacked high pass filter according to the present invention includes a plurality of stacked right / left-handed combination (Cposite Right / Left-Handed: CRLH) cells (hereinafter referred to as “CRLH cells”).

In FIG. 4, the case of two CRLH cells is illustrated. In the following description, the case of two CRLH cells is described as an example.

As shown in FIG. 4, the CRLH cell 110 includes a series inductor LR1 having one end connected to an input port and a series capacitor CL1 having one end connected to the other end of the series inductor LR1 and the series capacitor CL1. A parallel inductor LL1 connected in parallel and a parallel capacitor CR1 connected in parallel to the parallel inductor LL1.

The CRLH cell 120 also includes a series inductor LR2, a capacitor CR2, a parallel inductor LL2, and a parallel capacitor CR2 connected in the same manner as the CRLH cell 110. However, the series inductor LR2 of the CRLH cell 120 is connected to the output port.

In addition, a coupling capacitor Cc is configured between the CRLH cell 110 and the CRLH cell 120 to connect the CRLH cell 110 and the CRLH cell 120.

6 is a view showing a pattern of each layer constituting the red type high pass filter according to the present invention, FIG. 7 is a view showing a perspective view of the red type high pass filter according to the present invention, and FIG. 8 is according to the present invention. 9 is a cross-sectional view illustrating a stacked high pass filter, and FIG. 9 is a simulation graph illustrating S parameter magnitude characteristics versus frequency of the stacked high pass filter according to the present invention. Hereinafter, a description will be given with reference to FIGS. 6 to 9.

The CRLH cell 110 or CRLH cell 120 according to the present invention is composed of a ground layer, a first inductance layer, a first capacitance layer, a second inductance layer, a second capacitance layer, and five layers. Therefore, a total of 10 layers and 11 layers in which input / output ports are formed are included. At this time, each layer of the CRLH cell 110 and the CRLH cell 120 is configured to face. For example, the ground layer of the CRLH 110 forms the first layer 1 disposed at the top, and the ground layer of the CRLH 120 forms the tenth layer 10 disposed at the bottom thereof. The eleventh layer 11, which is an input / output port layer, may be disposed below the tenth layer 100 or above the first layer.

Each layer is composed of an insulator sheet and a pattern formed on the insulator sheet, and the insulator sheet or the pattern may have via holes. The insulator sheet may be made of ceramic or the like. It should be noted that the via holes in FIG. 6 to FIG. 8 are given the same reference numerals when the via holes are formed at the same position for each layer.

Specifically, each of the first layer 1 and the second layer 10, which is a ground layer, includes a first ground pattern 12 and a second ground pattern 21 and is disposed at the uppermost and lowermost portions of FIG. 2. Form ground in the equivalent circuit.

A via hole 40-3 is provided below the first layer 1 at a position corresponding to the input port 22 of the eleventh layer, and is connected to the via hole 40-3 to form a first series inductor LR1. The second layer 2 having the first inductance pattern having a) is disposed.

Below the second layer 2, a third layer 3 including a first inductance pattern 13 of the second layer and a first capacitance pattern 14 forming a first series capacitor CL1 is formed. Is placed. The via hole 40-10 is included in the central portion of the first capacitance pattern 14 of the third layer 3.

The second inductance pattern 15 is formed in a meandering shape at a lower portion of the third layer 3 and has a via hole 40-10 disposed at the center portion and a via hole 40-5 disposed at the end portion of the meandering shape. The fourth layer 4 having is disposed.

A fifth layer 5 having a second capacitance pattern 16 having the same shape as the third layer 3 is disposed below the fourth layer 4. However, no via hole is formed in the second capacitance pattern 16.

Vias are inserted into the via holes 40-10 formed at the centers of the third layer 4 and the fourth layer 4 so that the first capacitance pattern 14 and the fourth layer 4 of the third layer 3 are formed. The second inductance pattern 15 and the second capacitance pattern 16 of the fifth layer 5 are connected, and the first parallel capacitor CR1 is formed by the third layers 3 to 5. .

The CRLH cell 120 is disposed below the CRLH cell 110, that is, below the fifth layer 5, and the fifth layer of the CRLH cell 120 is the fifth layer 5 of the CRLH cell 110. And a coupling capacitor Cc by the second capacitance pattern 16 of the fifth layer 5 and the second capacitance pattern 17 of the sixth layer 6. 6 to 8, the fifth layer of the CRLH cell 120 becomes the sixth layer 6 when viewed in the configuration of the high pass filter.

Accordingly, the second inductance layer, which is the fourth layer of the CRLH cell 120, is disposed as the seventh layer 7 in view of the high pass filter, and the third layer of the CRLH cell 120 is the eighth layer 8 and the CRLH. The second layer of the cell 120 is arranged as the ninth layer 9, and the first layer of the CRLH cell 120 is arranged as the tenth layer 10.

The eleventh layer 11, which is an input / output layer (Foot layer), is disposed below the tenth layer 10.

The eleventh layer 11 includes an input port 22, an output port 23, and a ground port 25, and the ports may be configured as shown in FIG. 6. The input port 22 is connected to the first inductance pattern 13 of the second layer 2 through the via 41-2 as described above, and the output port 23 is formed of the ninth layer 9. The inductance pattern 20 is connected to the via pattern 41-6, and the ground port 25 is connected to the ground pattern 21 of the tenth layer 10 by the via 41-7.

The first layers 11 to 11 are integrally configured as described above to perform the function of the high pass filter.

The high pass filter configured as described above has the S parameter characteristics as shown in FIG. 9. As shown in FIG. 9, it can be seen that the high pass filter according to the present invention passes through only a high frequency band of about 800 MHz or more while being integrated and miniaturized.

"This study was carried out as part of the part material technology development project of the Ministry of Knowledge Economy."

Title: [10032543, FEM with Multiband Filter for Next Generation Convergence Terminal]

1 ~ 11: Layer 12, 21: Ground Pattern
13, 20: first inductance pattern 14, 19: first conductance pattern
15: second inductance pattern 16, 17: second conductance pattern
22: input port 23: output port
25: grounding port 40: via hole
41: Via

Claims (7)

Input and output port cells forming an input port and an output port; And
A first layer having a ground pattern to form a ground;
A second layer having a first inductance pattern connected to one of the input ports or an output port which is not connected to another CRLH cell and forming a series RH inductor LR, and disposed below the first layer;
A third layer having a first capacitance pattern and disposed under the second layer to form a series LH capacitor CL by the first inductance pattern and the first capacitance pattern;
A fourth layer having one end portion connected to the ground pattern of the first layer and having a second inductance pattern forming a parallel LH inductor and disposed below the third layer;
A fifth layer having a second capacitance pattern and disposed below the fourth layer and connected to the first capacitance pattern of the third layer to form a parallel RH capacitor; A left hand combination law (CRLH) transmission line, comprising a plurality of CRLH cells integrally coupled to have a coupling capacitor (Cc) when coupled together,
And the port cell is integrally coupled to the top or bottom of the CRLH cells.
The method of claim 1,
The number of CRLH cells is a stacked high-pass filter using a low-temperature co-fired ceramic, characterized in that consisting of two first CRLH cells and two second CRLH cells.
delete The method of claim 1,
Stacked high-pass filter using a low-temperature co-fired ceramic, characterized in that the other CRLH cells are combined so that the fifth layer of the other CRLH cells are disposed below the fifth layer.
The method of claim 1,
The second inductance pattern is a laminated high-pass filter utilizing a low temperature co-fired ceramic, characterized in that formed in a meandering shape.
The method of claim 1,
Each of the first to fourth layers includes a first via hole at a position corresponding to one end portion and the one end portion of the fourth layer, and one side of the fourth layer by a via penetrating through the first via hole. Multi-layered high-pass filter using a low-temperature co-fired ceramic, characterized in that the end and the ground pattern of the first layer is connected.
The method of claim 1,
The third to fifth layers may include a second via hole, and the capacitance pattern of the third layer may be connected to the capacitance pattern of the fifth layer by vias passing through the second via hole. Multi-layer high pass filter utilized.

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