KR101145799B1 - A coil type heating element and method of manufacturing thereof and semiconductor heat treatment chamber including the heating element - Google Patents

Abstract

The present invention relates to a coil heating element, a method for manufacturing the same, and a semiconductor heat treatment chamber including the same, wherein the coil heating element is a heating element including a MoSi 2 (molybdenum disulfide) component, and is bent so that both ends face the same direction. A heating unit provided in a shape; First and second non-heating portions extending from both ends of the heat generating portion, respectively, and the ends of the first and second non-heating portions are configured with an aluminum coated terminal portion, and the heat generating portion includes a coil portion having a diameter D in plan view. And at least one of the heating elements installed in the semiconductor heat treatment chamber is installed as the coil type heating element.

As a result, a coil part is formed in the heating element mounted in the heat treatment chamber to maintain the temperature distribution in the heat treatment chamber uniformly, and the coil type heating element is simpler in structure than the existing 'W' type heating element. Can be provided.

In addition, it can be applied to any existing electric chamber without changing the structure, and can selectively provide the required amount of heat according to the number of coils wound, it is possible to overcome the temperature gradient of the lower end of the electric chamber.

In addition, the semiconductor heat treatment chamber including the coil-type heating element according to the present invention, by selectively installing the coil-type heating element having the number of windings of the different coil portion according to the installation position, the amount of heat discharged through the door and the amount of heat required at the lower end portion By replenishing, the temperature gradient inside the chamber can be reduced.

Heating element, heat density, heat radiation

Description

A coil type heating element and a method of manufacturing the same and a semiconductor heat treatment chamber including the same {A COIL TYPE HEATING ELEMENT AND METHOD OF MANUFACTURING THEREOF AND SEMICONDUCTOR HEAT TREATMENT CHAMBER INCLUDING THE HEATING ELEMENT}

The present invention relates to a coil-type heating element, a method for manufacturing the same, and a semiconductor heat treatment chamber including the same. More specifically, the coil part is formed on a heating element mounted in the heat treatment chamber to maintain a uniform temperature distribution in the heat treatment chamber. The present invention relates to a coil-type heating element, a method for manufacturing the same, and a semiconductor heat treatment chamber including the same.

In general, industrial heat treatment chambers can be classified into fossil fuel heat treatment chambers using kerosene, gas and the like and electric heat treatment chambers using electricity.

Here, in the case of most fossil fuel heat treatment chambers, high pressure oxygen or atmosphere is injected into the chamber together with fuel such as kerosene or natural gas for combustion.

At this time, forced convection occurs in the chamber due to the injected air pressure, and the temperature variation in the chamber is reduced by this convection.

However, in the fossil fuel heat treatment chamber using fossil fuel as the main heat source, defects such as coloration, stains, and damage are likely to occur in products heat treated by carbon components generated due to incomplete combustion. It is often used for structural products such as tiles, bricks and ceramics because it is not suitable for heat treatment of electronic components because it is sometimes damaged.

On the other hand, the electric heat treatment chamber using electricity can be divided into an electric chamber for vacuum or an inert gas, a reducing electric chamber for use in a reducing environment, and an oxidation electric chamber for use in an oxidizing environment, depending on the use environment.

In the inert gas, vacuum, and reducing electric chambers, most of the electric chambers need to be sealed, so there is a problem that the volume is small and the continuous operation is not easy, which is disadvantageous in mass production of the product.

On the other hand, the heating element used in the oxidizing environment has a disadvantage that the material components of the heating element such as SiC, MoSi2 because most of the material is oxidized at a high temperature.

In addition, the environment in the chamber is static because there is no injection in the chamber compared to the heat treatment chamber using fossil fuel, but the temperature of the upper end of the chamber is first heated by the convective phenomenon compared to the lower end of the chamber. It cools slowly compared to

As a result, the thermal history of the upper and lower portions of the chamber is changed, such that the shrinkage rate of the product is changed or only 70% of the chamber volume is used as the effective heat treatment volume without utilizing the entire interior of the chamber. There was a problem.

In particular, the doors of most electric chambers used in the atmosphere have poor airtightness, so that the air in the heated chamber is lost to the upper gap of the door and the external cold air is introduced to the lower side. Significantly large temperature variations will occur.

This problem of temperature variation in the chamber is an important problem because not only is it difficult to use the internal volume of the electric chamber efficiently, but also has a great influence on the quality of the heat treated product.

In particular, in an elevator-type chamber in which a product to be heat-treated is loaded at the bottom of the chamber and then placed inside the chamber by lifting means, the product after the heat treatment is cooled to room temperature, cooled, and then loaded again and placed inside the chamber. The temperature deviation of the lower end is much higher than the upper end so that the defective rate of the product is high, or there is a problem of using only a portion of the volume in the chamber.

In order to reduce the temperature gradient of the lower end of the chamber, attempts have been made to increase the temperature of the lower end of the chamber by changing the existing 'U' shaped heating element into a 'W' shape, but in part, the temperature gradient can be reduced. It was not, but it was not a fundamental solution.

In manufacturing the 'W' shaped heating element, the unit length was increased compared to the 'U' shaped heating element, and the manufacturing cost was increased. It is lowered and the working time is increased and the production efficiency is lowered.

In addition, the gap between both sides of the heating element becomes wider, which is disadvantageous in raising the temperature in the entire chamber, making it impossible to manufacture a large amount of electricity, and there is a problem in that the temperature increase rate is slow.

In addition, the MoSi2 heating element is a ceramic component, and has a brittle brittleness at low temperatures, so that the shape of the product is limited.

The present invention has been made to solve the above problems, an object of the present invention is to provide a coil-type heating element that can uniformly maintain the temperature distribution in the heat treatment chamber by forming a coil portion in the heating element mounted in the heat treatment chamber. There is.

Another object of the present invention is to provide a coil-type heating element that is simple in structure and easy to manufacture compared to the existing 'W' type heating element.

Still another object of the present invention is to provide a coil-type heating element and a method of manufacturing the same, which can be applied to any existing electric chamber without changing the structure.

Still another object of the present invention is to provide a coil-type heating element capable of selectively providing a required amount of heat according to the number of turns of the coil part, and overcoming a temperature gradient on the lower end of the electric chamber. have.

Still another object of the present invention is to selectively install a coil-type heating element having a different coil portion winding number depending on the installation position, thereby supplementing the amount of heat discharged through the door and the amount of heat required at the lower end portion, thereby reducing the temperature gradient inside the chamber. It is to provide a semiconductor heat treatment chamber comprising a coil-like heating element that can be made.

The object is, according to the present invention, a heat generating element comprising a MoSi 2 (molybdenum disulfide) component, the heat generating portion is provided in a curved shape so that both ends are directed in the same direction; a first extending from both ends of the heat generating portion, respectively And a second non-heating unit. The end of the first and second non-heating units includes an aluminum coated terminal unit, and the heat generating unit may be achieved by a coil type heating element including a coil unit having a diameter D in plan view.

Here, the terminal parts of the first and second non-heat generating parts may have the same height in cross section with respect to the front side.

The heat generating unit and the first and second non-heating units may be provided in a circular cross section, and the diameter of the heat generating unit may be provided at 0.4 to 0.6 times the diameter of the first and second non-heating units.

Here, the heat generating portion and the first and second non-heat generating portions are connected as a taper, and the taper may have a predetermined slope and may be provided to decrease in diameter toward the heat generating portion.

In addition, the first and second non-heating units may be provided in a '-' shape on a lateral basis, and may form the terminal portion at the end of the horizontal portion, and the taper may be connected to the end of the vertical portion.

Here, the coil winding number of the coil unit may be formed of 2 to 10.

In addition, the coil part may be formed at different heights on the basis of the front face, or may be formed along the width direction of the heat generating part on a plane basis.

Here, the winding pitch interval of the coil portion may be provided in the range of 2 ~ 100 (mm).

In addition, the diameter of the coil unit may be provided 5 to 15 times the diameter of the heating unit.

On the other hand, the object is, according to the present invention, a semiconductor heat treatment chamber in which a plurality of heating elements are installed therein, at least one of the heating elements is provided with a coil-type heating element, the coil-type heating element is elongated so that both ends face the same direction And a heat generating portion provided in a predetermined shape, and first and second non-heating portions extending from both ends of the heat generating portion, respectively, and end portions of the first and second non-heating portions are configured with an aluminum coated terminal portion. It can also be achieved by a semiconductor heat treatment chamber including a coiled heating element comprising a coil portion of diameter D.

Here, the terminal parts of the first and second non-heat generating parts may have the same height in cross section with respect to the front side.

In addition, in the semiconductor heat treatment chamber including the coil-type heating element, a coil-type heating element having a larger number of windings of the coil part may be installed toward the door direction of the chamber.

In addition, in the semiconductor heat treatment chamber including the coil-type heating element, a coil-type heating element having a larger number of windings of the coil part may be installed toward the lower direction of the chamber.

On the other hand, the above object, according to the present invention, in the method for producing a coil-like heating element, the heating part containing MoSi2 (molybdenum disulfide) component is plastically processed at a temperature of 1200 ~ 1700 (℃) to form a coil portion The radius of curvature of the coil part may be achieved by a method of manufacturing a coil-type heating element formed in a range of 2.5 to 7.5 times the diameter of the heating part having a circular cross section.

Here, the coil-type heating element, the heating portion is provided in a curved shape so that both ends are directed in the same direction; Each of the first and second non-heating portions extending from both ends of the heat generating portion and including an aluminum coated terminal portion at an end thereof may be provided, and may be manufactured by bonding the heat generating portion and the first and second non-heating portions.

Here, the heat generating part and the first and second non-heating parts are joined by a taper, and the taper may be manufactured to have a predetermined slope and decrease in diameter toward the heat generating part.

In addition, the heat generating portion and the non-heating portion, in order to implement the shape of the coil portion, Mo and Si components preferably contain 80% or more of the total weight ratio, the molar ratio of Mo and Si is between 0.35 to 0.75 coil in post-processing It is preferable because plasticity can be imparted in processing into a mold.

According to the present invention, the coil portion is formed on the heating element mounted in the heat treatment chamber, so that the temperature distribution in the heat treatment chamber can be maintained uniformly.

In addition, compared to the existing 'W' type heating element, the structure is simple and can provide a coil-type heating element that is easy to manufacture.

In addition, it is possible to provide a coil-type heating element and a manufacturing method thereof that can be applied to any existing electric chamber without changing the structure.

In addition, it is possible to selectively provide the amount of heat required according to the number of turns of the coil portion, it is possible to overcome the temperature gradient on the lower end of the electric chamber.

In addition, by selectively installing a coil-type heating element having a different coil winding number depending on the installation position to compensate for the amount of heat discharged through the door and the amount of heat required at the lower end portion, it is possible to reduce the temperature gradient inside the chamber.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms used in the specification and claims should not be construed in a dictionary sense, but based on the principle that the inventor can appropriately define the concept of terms in order to explain his invention in the best possible way. Therefore, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

1 is a plan view of a coil type heating element according to the present invention, FIG. 2 is a plan view of a coil type heating element according to another embodiment of the present invention, and FIG. 3 is a plan view of a coil type heating element according to another embodiment of the present invention. .

1 to 3, the coil-type heating element according to the present invention is a heating element including a MoSi 2 (molybdenum disulfide) component, and a heating portion 10 provided in a curved shape so that both ends face the same direction. ; And first and second non-heating parts 20 and 30 extending from both ends of the heat generating part 10, respectively, and end portions of the first and second non-heating parts 20 and 30 are aluminum coated terminal parts 21, 31 is configured, and the heat generating part 10 may include a coil part 12 having a diameter D in plan view.

Here, the coil-type heating element is a kind of non-metal resistance heating element, and when the voltage applied to the terminal portions 21 and 31 is transferred from the non-heating portions 20 and 30 to the heating portion 10, the coil is generated by the resistance. The heat generating unit 10 is heated.

In addition, the non-heating unit (20, 30) is a name used to indicate the portion of the heat generated relatively less than the heat generating unit 10, and at the same time, the component is clear, even in the non-heating unit (20, 30) Note that a fever occurs.

Here, the terminal parts 21 and 31 of the first and second non-heat generating parts 20 and 30 are installed in a semiconductor heat treatment chamber, which will be described later, and are supplied with a voltage for generating the coil heating element, and have a relative height in cross section. May be provided to be the same.

This is configured to be used in a heat treatment chamber adopting a conventional 'U' type heating element, and forms any part of the first and second non-heat generating parts 20 and 30 to be inclined to form the terminal parts 21 and 31. The relative height can be formed in the same manner as in FIGS.

In addition, the relative heights of the terminal parts 21 and 31 may be equally provided by forming the coil part 12 and inclining any part of the extracted heat generating part 10. 12 may be formed to be inclined, so that the relative heights of the terminal parts 21 and 31 may be the same.

Here, the diameter (d) of the heat generating unit 10 may be provided as 0.4 to 0.6 times the diameter (d ') of the first, second non-heating unit (20, 30).

This is to increase the resistance of the heat generating part 10 by reducing the diameter d of the heat generating part 10, and the diameter d of the heat generating part 10 is the first and second non-heating parts 20. , The resistance acting on the heat generating portion 10 is quadrupled as it is reduced to approximately 1/2 of the diameter d 'of 30).

Therefore, the heat generating unit 10 may be provided to have a greater resistance than the first and second non-heat generating units 20 and 30 so as to effectively generate heat.

Here, the heat generating unit 10 and the first and second non-heat generating units 20 and 30 are connected as a taper 40, and the taper 40 has a predetermined slope toward the heat generating unit 10. The diameter may be provided to decrease.

Here, the taper 40 serves as a connecting portion for reducing the diameter (d ') of the first, second non-heating unit (20, 30) to the diameter (d) of the heat generating unit 10, Figure 1 As in the case of 3 to 3, the diameter may be provided to have a constant slope.

Here, the reason why the taper 40 has a constant slope and the diameter should be reduced is to appropriately correspond to the thermal stress generated when heat is generated by the resistance due to the voltage.

If the taper 40 is not formed to decrease in diameter at a constant slope, but is provided to have a step with a cylindrical connection portion having a constant diameter, the thermal stress acts on a portion where the diameter is discontinuously reduced. If the thermal stress is severe, the possibility of breakage of the product increases.

Therefore, the taper 40 has a constant slope and is provided to decrease in diameter toward the heat generating part 10, so as to interconnect the first and second non-heat generating parts 20 and 30 and the heat generating part 10. It must be prepared.

Here, the first, second non-heating unit 20, 30 may be provided in a 'b' shape on the side reference, forming the terminal portion (21, 31) at the end of the horizontal portion, the end of the vertical portion The taper 40 may be provided to be connected.

In addition, a portion to which the terminal portions 21 and 31 are connected may be formed to be inclined at 30 °, 45 °, or the like, without bending at 90 ° with respect to the vertical portion.

In FIGS. 1 to 3, the first and second non-heating units 20 and 30 are illustrated in a straight cylindrical shape, but the first and second non-heating units 20 and 30 are formed in a '-' shape and formed on the sidewall of the heat treatment chamber. It may be installed.

In this case, when the first and second non-heating units 20 and 30 are provided in a straight cylindrical shape, the first and second non-heating units 20 and 30 may be installed perpendicular to the ceiling of the heat treatment chamber, and the heating unit 10 and the coil unit ( When 12) is heated, the ductility of the coil-type heating element itself is increased, and deformation of the coil-type heating element due to its own weight may occur.

Therefore, the first and second non-heating units 20 and 30 are provided in a '-' shape so that the heat generating unit 10 and the coil unit 12 face the direction of gravity, thereby deforming the coil type heating element. Can be prevented.

On the other hand, the heating unit 10 may be formed of 1 to 10 of the coil unit 12.

Here, the coil unit 12 is a component for increasing the thermal radiation rate of the coil-type heating element, as shown in Figures 1 to 3, it may be formed by plastic working the heating unit 10 to a predetermined external force.

In addition, the coil unit 12 serves to increase the heat generation density of the heating element because heat generation occurs in the coil unit 12 compared to the conventional 'U' or 'W' type heating element.

Here, the number of turns of the coil unit 12 may be selectively employed according to the position to be installed in the heat treatment chamber, and as the number of turns increases, the heating density of the coil type heating element may increase.

In addition, the number of turns of the coil part 12 may be provided at least once to a maximum of 10 times. When the number of turns of the coil part 12 exceeds 10 times, the length and width of the heating part 10 may be In addition to the difficulty in manufacturing the heating element, there is a limitation in forming the same relative height of the terminal portion (21, 31).

On the other hand, the coil unit 12 may be formed in a vertical direction or a horizontal direction on a plane when wound in a plurality of circuits.

Here, the coil unit 12 may be formed at different heights (vertical direction) along the height of the heat generating unit 10, as shown in FIG. 2, as shown in FIG. It may be formed in the width direction (horizontal direction) of the (10).

In addition, when the coil part 12 is formed in plural, the pitch interval p of the coil part 12 may be provided in the range of 2 to 100 (mm).

Here, the pitch interval (p) of the coil portion 12 represents the interval between the coil portion 12 and the adjacent coil portion 12, as shown in Figures 2 to 3, to be provided with a spacing of less than 2mm In this case, a short may occur due to deformation due to thermal expansion and creep at high temperature, and thus it is difficult to form the coil part 12 in the heating element.

In addition, when the interval between the coil unit 12 exceeds 100mm, not only the heat density between the coil unit 12 decreases, but also the effect of lowering the amount of heat supplied, the physical of the heat generating unit 10 As the length becomes longer, there is a difficulty in manufacturing a heating element of an appropriate size.

Here, the diameter (D) of the coil unit 12 may be provided 5 to 15 times the diameter (d) of the heat generating unit (10).

This is a range of suitable curvature for forming the coil portion 12, and when the diameter (D) of the coil portion 12 is less than five times the diameter (d) of the heat generating portion 10, the external force When forming the coil part 12 by this, there exists a possibility that this coil part 12 may be broken.

In addition, when the diameter (D) of the coil portion 12 exceeds 15 times the diameter (d) of the heat generating portion 10, the length between the heat generating portion 10 connected to the taper 40 is Since it becomes wider, there is a limit in increasing the exothermic density of the heating element.

The coil-type heating element provided in the above-described configuration may increase the amount of heat generated by forming the coil part 12 on the lower side of the heating part 10 as compared with the conventional 'U' or 'W' type heating element.

In addition, the coil-type heating element by applying a predetermined external force (bending force) at a temperature of 1200 ~ 1700 (℃) to the heat generating portion 10 provided with MoSi2 (molybdenum disulfide) to form the coil portion 12 Can be prepared.

In addition, as described above, the radius of curvature (D / 2) of the coil portion 12 may be formed in the range of 2.5 to 7.5 times the diameter (d) of the heat generating portion 10.

Here, the coil-type heating element is preferably provided so that the Mo and Si components occupy 80% or more of the total weight ratio in order to implement the shape of the coil unit 12, the mole ratio (mole ratio) of Mo and Si at 0.35 It may be provided in the range of 0.75.

The molar ratio of Mo and Si is preferably between 0.35 and 0.75 because plasticity can be imparted in processing the coil to the heat generating portion 10 in post processing.

4 is a perspective view schematically showing a semiconductor heat treatment chamber including a coil-type heating element according to the present invention.

Referring to FIG. 4, the semiconductor heat treatment chamber (c) including the coil heating element according to the present invention is a semiconductor heat treatment chamber (c) in which a plurality of heating elements are installed, and at least one of the heating elements may be a coil heating element. Can be prepared.

Here, the coil-type heating element, the heating portion 10 is provided in a curved shape so that both ends are directed in the same direction; And first and second non-heating parts 20 and 30 extending from both ends of the heat generating part 10, respectively, and end portions of the first and second non-heating parts 20 and 30 are aluminum coated terminal parts 21, 31 is configured, and the heat generating portion 10 includes a coil portion 12 having a diameter D in plan view.

Here, in the semiconductor heat treatment chamber (c) including the coil-type heating element, a coil-type heating element having a larger number of windings of the coil part 12 may be installed toward the door direction of the chamber (c).

This is because when the door of the chamber (c) does not maintain a fully sealed state and the outside air is introduced, a temperature gradient between the door side and the inside of the chamber (c) occurs, such a chamber (c) This is to reduce the internal temperature gradient.

In addition, in the semiconductor heat treatment chamber (c) including the coil-type heating element, a coil-type heating element having a larger number of windings of the coil part 12 may be installed toward the lower direction of the chamber (c).

This is to reduce the temperature difference of the upper and lower sides caused by the convection phenomenon first rises in the temperature of the high space and later rises in the temperature of the low space.

In addition, the outside air introduced from the door (door) is also introduced into the lower portion of the door and discharged to the upper, so as to reduce the temperature deviation of the upper, lower generated accordingly.

4 is divided into three layers of the heating element installation space installed inside the heat treatment chamber (c), and the coil-type heating element having a larger number of windings of the coil portion 12 as it faces toward the door and is installed in the lower layer. Was installed.

However, the coil-type heating element installed in the heat treatment chamber (c) shown in FIG. 4 is only an embodiment of the present invention, and the coil part 12 of the coil-type heating element is dependent on the sealing degree of the door, the volume ratio of the chamber c, and the like. ) The number of turns and the installation range may vary.

Table 1 below, after installing the conventional U-type heating element and the coil-type heating element according to the present invention in the same two heat treatment chamber (c), respectively, the chamber (c) in which the heating element is heated at a constant voltage for a predetermined time This is the result of measuring the temperature distribution by location.

location  U type heating element Coiled heating element 11 (top) 1377 ℃ 1395 ℃ 10 1396 ℃ 1399 ℃ 9 1403 ℃ 1403 ℃ 8 1405 ℃ 1404 ℃ 7 1405 ℃ 1405 ℃ 6 1401 ℃ 1403 ℃ 5 1394 ℃ 1400 ℃ 4 1388 ℃ 1398 ℃ 3 1379 ℃ 1399 ℃ 2 1368 ℃ 1395 ℃ 1 (bottom) 1349 ℃ 1390 ℃

(Effective temperature range that product firing is possible: from 1394 degrees Celsius-1405 degrees Celsius)

As can be seen from the measurement results, when the coil-type heating element according to the present invention is mounted, the effective area that can be fired is from 2 to 11 layers, which shows a high effective area, and when the existing U-type heating element is mounted The effective area which can be fired showed a low effective area from 5 to 10 layers.

In particular, in the case of the lower end of the chamber (c), it can be seen that the temperature gradient inside the chamber (c) is significantly reduced in that the coil-type heating element according to the present invention is mounted as compared with the conventional U-type heating element.

As described above, the coil-type heating element according to the present invention, by forming a coil portion in the heating element mounted in the heat treatment chamber can maintain a uniform temperature distribution in the heat treatment chamber, and also compared to the conventional 'W' heating element A simple structure can provide a coil-type heating element that is easy to manufacture.

In addition, it can be applied to any existing electric chamber without changing the structure, and can selectively provide the required amount of heat according to the number of coils wound, it is possible to overcome the temperature gradient of the lower end of the electric chamber.

In addition, the semiconductor heat treatment chamber including the coil-type heating element according to the present invention, by selectively installing the coil-type heating element having the number of windings of the different coil portion according to the installation position, the amount of heat discharged through the door and the amount of heat required at the lower end portion By replenishing, the temperature gradient inside the chamber can be reduced.

As mentioned above, although the present invention has been described by way of limited embodiments and drawings, the technical idea of the present invention is not limited thereto, and it should be understood by those skilled in the art to which the present invention pertains. Various modifications and variations may be made without departing from the scope of the appended claims.

Since the accompanying drawings are for understanding the technical idea of the present invention together with the specific contents for the above-described embodiment, the present invention should not be limited to the matters shown in the following drawings.

1 is a plan view of a coil-type heating element according to the present invention,

2 is a plan view of a coil-type heating element according to another embodiment of the present invention,

3 is a plan view of a coil-type heating element according to another embodiment of the present invention,

4 is a perspective view schematically showing a semiconductor heat treatment chamber including a coil-type heating element according to the present invention.

* Description of the symbols for the main parts of the drawings *

10: heat generating portion 12: coil portion

20, 30: 1st, 2nd non-heat generating part 21, 31: terminal part

40: taper D: diameter of coil

d: diameter of the heat generating portion d ': diameter of the first and second non-heating portions

Claims (17)

A heating element comprising a MoSi 2 (molybdenum disulfide) component, A heating unit provided in a curved shape so that both ends face the same direction; And first and second non-heating units extending from both ends of the heating unit, respectively. End portions of the first and second non-heat generating portions are configured with an aluminum coated terminal portion, The heating element is a coil-like heating element, characterized in that it comprises a coil portion of planar diameter D. The method of claim 1, Coil-type heating element, characterized in that the terminal portion of the first, second non-heating portion is formed in the same height in cross section on the frontal basis. The method of claim 1, The heating element and the first, second non-heating unit is provided in a circular cross section, the diameter of the heat generating unit is a coil-type heating element, characterized in that provided in 0.4 to 0.6 times the diameter of the first, second non-heating unit. The method of claim 3, wherein The heat generating unit and the first, second non-heating unit is connected as a taper (taper), the taper has a constant inclination, the coil-type heating element, characterized in that the diameter is reduced toward the heat generating unit. The method of claim 4, wherein The first and second non-heating units are provided in a '-' shape on a lateral basis, and form the terminal portion at the end of the horizontal portion, the coil-type heating element characterized in that the taper is connected to the end of the vertical portion. The method of claim 1, Coil-type heating element, characterized in that the coil winding number of the coil portion is formed of 2 to 10. The method of claim 6, The coil unit is formed at different heights on the basis of the front, or the coil-type heating element, characterized in that formed along the width direction of the heating portion on the basis of the plane. The method of claim 6, Coil-type heating element, characterized in that the coil pitch interval is provided in the range of 2 ~ 100 (mm). The method of claim 6, Coil-type heating element, characterized in that the diameter of the coil portion is provided 5 to 15 times the diameter of the heating portion. A semiconductor heat treatment chamber in which a plurality of heating elements are installed therein, At least one of the heating elements is provided with a coil type heating element, The coil-type heating element includes a heating part provided in a curved shape so that both ends face the same direction, and first and second non-heating parts respectively extending from both ends of the heating part, and at the ends of the first and second non-heating parts. An aluminum-coated terminal portion is formed, wherein the heat generating portion comprises a coil-shaped heating element, characterized in that it comprises a coil portion of diameter D on the plane. 11. The method of claim 10, A terminal heat treatment chamber including a coil-type heating element, wherein the terminal portions of the first and second non-heat generating portions have the same height in cross section on a frontal basis. 11. The method of claim 10, The semiconductor heat treatment chamber including the coil heating element, The semiconductor heat treatment chamber including the coil-type heating element, characterized in that the coil-type heating element is increased in the winding direction toward the door of the chamber is installed. 11. The method of claim 10, The semiconductor heat treatment chamber including the coil heating element, The semiconductor heat treatment chamber including the coil-type heating element, characterized in that the coil-type heating element, the winding number of the coil portion is increased is installed toward the lower direction of the chamber. In the method of manufacturing a coil-type heating element, The heat generating part including MoSi 2 (molybdenum disulfide) component is plastically processed at a temperature of 1200 to 1700 (° C.) to form a coil part, and the radius of curvature of the coil part is 2.5 to 7.5 times the diameter of the heating part having a circular cross section. Method for producing a coil-type heating element, characterized in that formed in the range of. The method of claim 14, The coil type heating element, A heating unit provided in a curved shape so that both ends face the same direction; Coils, each of which extends from both ends of the heat generating unit and is provided with first and second non-heating units including an aluminum coated terminal portion at an end thereof, and is manufactured by bonding the heat generating unit and the first and second non-heating units. Method of manufacturing a type heating element. The method of claim 15, The heat generating unit and the first and second non-heating unit are joined by a taper (taper), the taper is a method of manufacturing a coil-type heating element, characterized in that the taper has a constant inclination is made to decrease in diameter toward the heat generating unit. The method of claim 16, The coil-type heating element is a coil-type heating element, characterized in that the Mo and Si components occupy 80% or more of the total weight ratio, and the mole ratio of Mo and Si is between 0.35 and 0.75 in order to realize the shape of the coil unit. Manufacturing method.

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