KR101138620B1 - Vision apparatus for aligning and method for setting the same - Google Patents

Abstract

The alignment vision device includes a main body, a first vision mechanism, and a second vision mechanism. The body moves between the wafer and the template facing each other. The first vision apparatus is installed at a portion facing the template of the main body, and detects the first alignment mark of the template. The second vision mechanism is installed at a portion facing the wafer of the main body, and detects the second alignment mark of the wafer to align the template and the wafer like the first vision mechanism.

Description

Vision device for alignment and how to set it {VISION APPARATUS FOR ALIGNING AND METHOD FOR SETTING THE SAME}

The present invention relates to a vision device for alignment and a method for setting the same, and more particularly, a vision device for aligning the template with the wafer such that solders injected into the cavities of the template are correctly attached to the bump pad of the wafer. And a method of setting the same.

Recently, the microelectronic packaging technology has changed from a wire bonding method to a solder bump method. Here, various techniques are known for using the solder bumps. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.

In particular, C4NP (controlled collapse chip connection new process) technology has attracted much attention due to the advantages that can realize a fine pitch at a low cost and improve the reliability of semiconductor devices manufactured from wafers. Examples of the C4NP technology are disclosed in US Pat. Nos. 5,607,099, 5,775,569, 6,025,258, and the like.

Thus, referring briefly to the C4NP technology, solder is injected into each of the plurality of cavities of the template chucked to the template chuck, and the wafer is placed on the wafer chuck so that the bump pad of the wafer faces the solders. After chucking, the solders are thermocompression-bonded to the bump pad while narrowing the gap between the template chuck and the wafer chuck.

In this case, the C4NP technology is most important to attach the solders to the correct position of the bump pad in order to ensure that the electrical function of the semiconductor device manufactured from the wafer is correctly performed. Therefore, before attaching the solders to the bump pad, The process of aligning the template and the wafer with each other is performed.

However, the conventional process of aligning the template with the wafer detects and aligns the first align mark of the template and the second align mark of the wafer through an inversion or elevating operation of only one vision mechanism. As such, not only the process efficiency is lowered, but also serious errors may occur in the alignment due to the operation of the vision apparatus.

It is an object of the present invention to provide an alignment vision device capable of efficiently aligning a template and a wafer while reducing an error range.

Another object of the present invention is to provide a method for setting the above-described alignment device.

The alignment vision apparatus according to an aspect of the present invention described above includes a main body, a first vision mechanism, and a second vision mechanism.

The body moves between the wafer and the template facing each other. The first vision apparatus is installed at a portion of the main body facing the template, and detects the first alignment mark of the template. The second vision mechanism is installed at a portion of the main body facing the wafer, and detects a second alignment mark of the wafer to align the template with the wafer like the first vision mechanism.

Accordingly, each of the first and second vision apparatuses may include the low magnification lens and the image obtained from the low magnification lens to obtain an image of a region where the first align mark or the second align mark is formed. The lens may further include a high magnification lens for secondaryly acquiring an image of a narrower area than the low magnification lens so as to accurately detect the first alignment mark or the second alignment mark.

In this case, each of the first and second vision apparatuses may be connected to a focus unit that adjusts the high magnification lens to focus the image of the narrow region, and through a position of the high magnification lens focused by the focus unit. The apparatus may further include a distance calculator configured to calculate a distance between the main body and the template or the wafer.

On the other hand, the vision device may further include a heat insulation mechanism or a cooling mechanism installed on the main body to protect the first and second vision mechanisms from heat.

In order to achieve the above object of the present invention, the setting method of the alignment vision device according to an aspect of the present invention comprises setting the first and second setting plates having first and second setting marks, respectively, to the first and second setting marks. Stacking them so that they overlap each other, raising the second setting plate in a vertical direction, a main body, a first vision mechanism installed below the main body, and a second vision mechanism installed above the main body. Moving the device between the first and second setting plates, and each of the first and second vision instruments is steered to sense each of the first and second setting marks to control the first and second vision. Setting the instruments.

In this case, the setting of the first vision device and the second vision device may include setting the first vision device by controlling the first vision device to detect the first setting mark and setting the first vision device. And setting the second vision mechanism by adjusting the second vision mechanism to sense the second setting mark.

In addition, each of the first and second vision apparatuses may sense each of the first and second setting marks while focusing.

In order to achieve the above object of the present invention, a method of setting an alignment vision apparatus according to another aspect includes preparing a setting plate having a setting mark, a main body, a first vision mechanism installed below the main body, and the main body. Moving the alignment vision device including a second vision device installed at an upper portion of the setting plate so that the first vision device detects the setting mark at an upper portion of the setting plate, and setting the first vision device detecting the setting mark. Moving the vision device setting the first vision device from the setting plate to the outside; raising the setting plate while moving the vision device to the outside; At the bottom of the plate, the first vision mechanism moves to the position where the setting mark was detected. , And a step of setting the second vision mechanism to adjust the second vision mechanism of the mobile device to detect a non-setting of the mark, up setting plate.

In this case, each of the first and second vision apparatuses may detect the focusing setting mark.

According to the method of setting the alignment vision device, a first vision mechanism for detecting a first alignment mark of the template and a second alignment of the wafer at each of the portions facing the template of the main body and the portions facing the wafer. A second vision mechanism for detecting a mark is installed in a precisely set state in advance so that the first and second alignment marks are sensed at once without separate operation, thereby efficiently freezing the template and the wafer while reducing an error range. Phosphorus process can be performed.

1 is a view schematically showing an alignment vision device according to an embodiment of the present invention.
FIG. 2 is a view of an upper portion of the vision device illustrated in FIG. 1 in a state in which a second insulating plate is removed.
3 is a view illustrating in detail the low magnification lens and the high magnification lens of the second vision apparatus in the vision apparatus shown in FIG. 2.
4A to 4C are diagrams illustrating a process of setting the alignment vision device shown in FIG. 1 according to an embodiment.
5A to 5D are diagrams illustrating a process of setting the alignment vision device shown in FIG. 1 according to another embodiment.

Hereinafter, an alignment vision device and a method of setting the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

FIG. 1 is a view schematically showing an alignment vision device according to an embodiment of the present invention, and FIG. 2 is a view of the upper portion of the vision device illustrated in FIG. 1 with the second insulation plate removed.

1 and 2, the alignment vision apparatus 100 according to an embodiment of the present invention includes a main body 20, a first vision mechanism 30, and a second vision mechanism 40.

The main body 20 moves between the template 1 having the first alignment mark 2 and the wafer 5 having the second alignment mark 6. Here, the template 1 has a predetermined pattern on the upper surface of the template chuck 300 disposed in the lower portion of the vacuum chamber 200 with a cavity (not shown) formed with a plurality of solders (not shown), respectively. ) And the wafer 5 is chucked to a wafer chuck 400 disposed above in the vacuum chamber 200 so as to face the top surface of the template 1.

Accordingly, the wafer chuck 400 is lowered along the z-axis through the lifting mechanism 500 to be injected into the cavities of the template 1 in a bump pad (not shown) formed on the lower surface of the wafer 5. Solders may be heat bonded. In this case, the solders are portions electrically connected to an external electronic device in each of the semiconductor devices manufactured from the wafer 5, and thus, the solders may have a fine pitch.

With respect to the above configuration, the main body 20 is specifically, the template chuck 300 and the wafer chuck 400 through the opening 212 formed in the side wall 210 of the vacuum chamber 200 from the outside. You can move between.

On the other hand, the template chuck 300 and the wafer chuck 400 each of the first and second alignment mechanisms 600 and 700 for moving in the plane direction defined by the x-axis and y-axis for alignment with each other Each of these may be connected. In this case, the first alignment mechanism 600 may be configured to adjust the distortion of the template chuck 300.

In addition, the template chuck 300 may include a heater 310 for heating the template 1 such that solders injected into the cavities of the template 1 are thermally attached to the bump pad of the wafer 5. Can be. Here, the heater 310 may heat the template 1 to about 100 to 200 ℃.

The first vision mechanism 30 is installed at a portion facing the template 1 of the main body 20, that is, under the main body 20. The first vision device 30 detects the first alignment mark 2 of the template 1.

The second vision mechanism 40 is provided at a portion facing the wafer 5 of the main body 20, that is, at an upper portion of the main body 20 that faces the first vision mechanism 30. The second vision mechanism 40 detects the second alignment mark 6 of the wafer 5.

In this case, when the first and second vision mechanisms 30 and 40 detect the first and second alignment marks 2 and 6 simultaneously, the template 1 and the wafer 5 are accurately It is preset in order to be aligned, which will be described in detail with reference to FIGS. 4A to 4C and 5A to 5D.

In addition, the first and second vision mechanisms 30 and 40 align the template 1 and the wafer 5 according to a result of detecting the first and second alignment marks 2 and 6. The first and second alignment mechanisms 600 and 700 may be electrically connected to each other so that the operation may be performed.

As such, a first vision for detecting the first alignment mark 2 of the template 1 on each of the lower part facing the template 1 and the upper part facing the wafer 5 of the main body 20. The first and second alignment marks 2 are installed by installing the second vision mechanism 40 that detects the mechanism 30 and the second alignment mark 6 of the wafer 5 in a precisely preset state. , 6) at a time without a separate operation, it is possible to efficiently align the template 1 and the wafer 5 while reducing the error range.

On the other hand, the vision device 100 is a heat insulating mechanism 50 and a cooling mechanism 60 to prevent the first and second vision mechanisms 30 and 40 from being damaged by heat generated from the heater 310. It may further include.

The heat insulation mechanism 50 may include first and second heat insulation plates 52 and 54 attached to upper and lower surfaces of the body 20, respectively. The first and second insulation plates 52 and 54 are made of a metal material having excellent thermal conductivity. As a result, the first and second heat insulating plates 52 and 54 are easily generated from the heater 310 and heat transferred to the main body 20 in which the first and second vision mechanisms 30 and 40 are installed. Can be released to protect the first and second vision devices 30 and 40 that are susceptible to heat.

The cooling mechanism 60 may be configured in the form of a tube extending from the inside of the main body 20 to the outside. The cooling mechanism 60 receives the cooling gas CG from the outside and directly supplies the cooling gas CG to the first and second vision mechanisms 30 and 40, thereby providing heat and weakness to the first and second vision mechanisms 30 and 40. Can be protected from the heat of the heater 310. Here, the cooling gas (CG) may be a gas cooled lower than room temperature through a separate cooling device from the outside as the name, or may simply be air at room temperature.

In the present exemplary embodiment, the vision device 100 may protect the first and second vision devices 30 and 40 from the heat of the heater 310. Although described to include all, since the heat from the heater 310 is not so high as about 100 to 200 ℃, even if any one of these can be expected the above effects.

In addition, the vision apparatus 100 may further include a cover member 70 mounted on the side of the main body 20 to protect the first and second vision mechanisms 30 and 40 from external impact. . Here, the cover member 70 may be mounted only on the front portion of the side portion of the main body 20 having a high possibility of external impact.

3 is a view illustrating in detail the low magnification lens and the high magnification lens of the second vision apparatus in the vision apparatus shown in FIG. 2.

In the following description with reference to FIG. 3, since the first and second vision mechanisms 30 and 40 have the same configuration except that the first and second vision mechanisms 30 and 40 are installed at positions opposite to each other, the second The representative of the vision apparatus 40 will be described.

3, the second vision apparatus 40 may include a low magnification lens 42 and a high magnification lens.

The low magnification lens 42 acquires an image of a relatively wide first area A1, and conversely, the high magnification lens 44 captures an image of a second area A2 that is relatively narrower than the first area A1. Acquire.

The low magnification lens 42 acquires an image of the wide first area A1 of the wafer 5 to quickly search the second alignment mark 6, and the high magnification lens 44 performs the The low magnification lens 42 acquires an image of the narrow second area A2 with respect to the first area A1 searched by including the second align mark 6 and the second align mark 6. ) Is detected correctly.

Accordingly, the second vision mechanism 40 quickly searches for the vicinity of the second alignment mark 6 formed through the low magnification lens 42, and then the second eye through the high magnification lens 44. By precisely detecting the in mark 6, the time for the second vision mechanism 40 to detect the second alignment mark 6 can be shortened. In addition, the first vision mechanism 30 also has the same configuration as the low magnification lens 42 and the high magnification lens 44 of the second vision mechanism 40, thereby detecting the first alignment mark 2. It can save time.

On the other hand, the low magnification lens 42 is installed at the tip position along the direction in which the main body 20 moves between the template 1 and the wafer 5 and the high magnification lens 44 is installed at the rear end position. The second vision mechanism 40 may allow the second alignment mark 6 to be detected immediately while the main body 20 moves.

Therefore, the vision apparatus 100 detects at least two of the first and second alignment marks 2 and 6 through the first and second vision apparatuses 30 and 40 to detect the template 1. The template 1 by recognizing the degree of warp in the plane direction defined by the x-axis and the y-axis and transferring the result to the first and second alignment mechanisms 600, 700. ) And the wafer 5 may be aligned along the plane direction through the first and second alignment mechanisms 600 and 700.

Meanwhile, the second vision mechanism 40 may further include a focus unit 46 and a distance calculator 48. The focus unit 46 adjusts the high magnification lens 44 to focus an image of the second area A2 obtained by the high magnification lens 44.

The distance calculator 48 measures the distance between the main body 20 and the wafer 5 through the position of the high magnification lens 44 in which the second area A2 is focused by the focus unit 46. d1) can be calculated. In addition, the first vision mechanism 30 also has the same configuration as the focus portion 46 and the distance calculator 48 of the second vision mechanism 40, whereby the main body 20 and the template 1 are provided. The distance (d2, not shown) between the two can also be calculated.

Accordingly, the vision apparatus 100 may transmit the at least three first and second alignment marks 2 and 6 to the main body 20 and the template through the first and second vision mechanisms 30 and 40. By calculating the distance (d1, d2) between the (1) and the wafer (5) to recognize the degree of warpage of the template (1) and the wafer (5) to transfer to the first alignment mechanism 600, The template 1 may be aligned by being parallel to the wafer 5 through the first alignment mechanism 600.

Hereinafter, a method of setting the vision apparatus 100 will be described in detail with reference to FIGS. 4A to 4C and FIGS. 5A to 5D.

4A to 4C are diagrams illustrating a process of setting the alignment vision device shown in FIG. 1 according to an embodiment.

1 and 4A, first and second setting marks are respectively set in order to set the alignment vision device 100 for aligning the template 1 and the wafer 5 according to an embodiment. The first and second setting plates 3, 7 having (4, 8) are stacked so that the first and second setting marks 4, 8 are superimposed on one another.

At this time, the first setting plate 3 on which the second setting plate 7 is stacked is chucked to the lower chuck 350 disposed below the setting chamber 250. In addition, the first and second setting plates 3 and 7 are made of a transparent material such that the first and second setting marks 4 and 8 are visible at any position up and down.

Referring to FIG. 4B, the first and second setting plates 3 and 7 are spaced apart from each other by accurately raising the second setting plate 7 in the vertical direction.

In this case, the second setting plate 7 is chucked to the upper chuck 450 disposed above the inside of the setting chamber 250. The first and second setting marks 4, 8 are then located on the same straight line in the vertical direction.

Referring to FIG. 4C, the vision device 100 is then moved between the first and second setting plates 3 and 7. At this time, the first and second vision mechanisms 30 and 40 of the vision device 100 may be installed at the tip position of the main body 20 so as to first enter between the first and second setting plates 3 and 7. Can be.

Subsequently, the first vision mechanism 30 is adjusted to detect the first setting mark 4 to fix and set the first vision mechanism 30 through a fixing means such as a set bolt. In this case, the first vision mechanism 30 accurately detects the first setting mark 4 while focusing.

Subsequently, the second vision mechanism 40 is adjusted to sense the second setting mark 8 while the first vision mechanism 30 is set, thereby adjusting the second vision mechanism 40 to the first vision. It is set in the same manner as the instrument 30. In this case, the second vision mechanism 40, like the first vision mechanism 30, accurately detects the second setting mark 8 while focusing.

Therefore, the position of the first and second vision mechanisms 30 and 40 can be accurately set by detecting the first and second setting marks 4 and 8 located on the same straight line in the vertical direction.

In the present embodiment, each of the setting chamber 250, the lower chuck 350 and the upper chuck 450 is the vacuum chamber 200, the template chuck 300 and the wafer chuck (shown in FIG. 1). 400 and the first and second setting plates 3 and 7 may also be the template 1 and the wafer 5 itself.

5A to 5D are diagrams illustrating a process of setting the alignment vision device shown in FIG. 1 according to another embodiment.

1 and 5A, a setting having a setting mark 10 in order to set the alignment vision device 100 for aligning the template 1 and the wafer 5 according to another embodiment. Prepare the plate (9).

In this case, the setting plate 10 is chucked to the lower chuck 360 disposed below the setting chamber 260. In addition, the setting plate 9 is made of a transparent material so that the setting mark 10 is visible at any position up and down.

Referring to FIG. 5B, the vision device 100 is then moved to the upper portion of the setting plate 9. At this time, the vision device 100 adjusts the position where the first vision mechanism 30 moves to sense the setting mark 10, thereby moving the first vision mechanism 30 through a fixing means such as a set bolt. Fix it and set it. In this case, the first vision apparatus 30 accurately detects the focusing setting mark 10.

Referring to FIG. 5C, the vision device 100 is moved outward from the setting plate 9 in a state where the first vision mechanism 30 has sensed the position of the setting mark 10.

Subsequently, the setting plate 9 is correctly raised in the vertical direction so that the setting plate 9 is positioned above the position memorized in the above. In this case, the setting plate 9 is chucked to the upper chuck 460 disposed above the setting chamber 260.

Referring to FIG. 5D, the vision apparatus 100 is then moved to the position memorized as described above so that the second vision mechanism 40 of the vision apparatus 100 is positioned below the setting plate 9.

Subsequently, the second vision mechanism 40 is adjusted to sense the setting mark 10 to set the second vision mechanism 40 in the same manner as the first vision mechanism 30. In this case, like the first vision mechanism 30, the second vision mechanism 40 detects the setting mark 10 while focusing accurately.

Accordingly, the position of the first and second vision apparatuses 30 and 40 may be accurately set by detecting the setting mark 10 rising in the vertical direction.

4A to 4C, the setting chamber 260, the lower chuck 360, and the upper chuck 460 may each have the vacuum chamber illustrated in FIG. 1. 200, the template chuck 300 and the wafer chuck 400 may have the same configuration, and the setting plate 9 may also be the template 1 or the wafer 5 itself.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1: Template 2: 1st alignment mark
5: wafer 6: second alignment mark
20: main body 30: first vision mechanism
40: second vision mechanism 42: low magnification lens
44: high magnification lens 46: focus portion
48: distance calculation unit 50: heat insulation mechanism
60: cooling mechanism 100: vision device
200: vacuum chamber 300: template chuck
310: heater 400: wafer chuck
500: lifting mechanism 600: first alignment mechanism
700: second alignment mechanism

Claims (9)

A main body moving between the wafer and the template facing each other;
A first vision mechanism installed at a portion of the template facing the template, the first vision mechanism detecting a first alignment mark of the template; And
Installed on a portion of the body facing the wafer, the alignment unit including a second vision mechanism for sensing the second alignment mark of the wafer and aligning the template with the wafer like the first vision mechanism Vision device. The apparatus of claim 1, wherein each of the first and second vision instruments is
A low magnification lens for firstly acquiring an image of a region in which the first alignment mark or the second alignment mark is formed; And
And a high magnification lens for secondarily acquiring an image of a narrower area than the low magnification lens so as to accurately detect the first alignment mark or the second alignment mark from the image obtained by the low magnification lens. Quotation vision device. 3. The apparatus of claim 2, wherein each of the first and second vision instruments is
A focus unit for adjusting the high magnification lens to focus the image of the narrow area; And
And a distance calculator connected to the focus unit and calculating a distance between the main body and the template or the wafer through the position of the high magnification lens focused by the focus unit. The alignment vision device of claim 1, further comprising: an insulation device or a cooling device installed in the main body to protect the first and second vision devices from heat. Stacking first and second setting plates having first and second setting marks respectively such that the first and second setting marks overlap each other;
Raising the second setting plate in a vertical direction;
Moving the alignment vision device between the first and second setting plates, the alignment device including a main body, a first vision mechanism provided below the main body, and a second vision mechanism installed above the main body; And
And setting the first and second vision instruments by adjusting the first and second vision instruments to sense each of the first and second setting marks, respectively. 6. The method of claim 5, wherein setting the first and second vision instruments is
Setting the first vision device by adjusting the first vision device to sense the first setting mark; And
And setting the second vision device by adjusting the second vision device to detect the second setting mark while the first vision device is set. 6. The method of claim 5, wherein each of the first and second vision mechanisms senses each of the first and second setting marks while focusing. Preparing a setting plate having a setting mark;
An alignment vision device including a main body, a first vision mechanism provided below the main body, and a second vision mechanism installed above the main body such that the first vision mechanism detects the setting mark at the upper portion of the setting plate. The step;
Setting a first vision device that senses the setting mark;
Moving the vision device setting the first vision device from the setting plate to the outside;
Raising the setting plate while moving the vision device to the outside;
Moving the vision device to a position at which the first vision mechanism sensed the setting mark below the raised setting plate; And
And setting the second vision device by adjusting the second vision device of the moved vision device to sense the setting mark of the raised setting plate. The method of claim 8, wherein each of the first and second vision apparatuses senses the setting mark while focusing.

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