KR101132733B1 - Multi-layer chip diplexer for uwb and conventional coax service band - Google Patents

Abstract

The present invention relates to a stacked-chip diplexer for separating an ultra-wide band (UWB) signal and a coaxial line signal, minimizing interference between the UWB signal and the coaxial line signal, and miniaturizing a device by transmitting the UWB signal for near field communication by using a stack-type diplexer connected to a coaxial line. To this end and for a device for transceiving a coaxial line signal and a UWB signal through a coaxial line, the stacked-chip diplexer for separating an ultra-wide band (UWB) signal and a coaxial line signal according to the present invention comprises: a stack-type substrate in which a plurality of dielectric substrates are layered, and on which a lowermost dielectric substrate, a grounding pad, a coaxial line signal receiving pad, a UWB signal transceiving pad, and a coaxial line signal transmitting pad are formed; a low pass filter for generating resonance by using a strip pattern on the plurality of dielectric substrates of the stack-type substrate and for passing the coaxial line signal; a high pass filter for generating resonance by using the strip pattern on the plurality of dielectric substrates of the stack-type substrate and for passing the UWB signal; a matching circuit which is constituted of a planar capacitor patterned on the dielectric substrate and which is electrically connected among the coaxial line signal receiving pad, the low pass filter, and the high pass filter; and a via hole for electrically connecting each strip pattern formed on each stack-type substrate.

Description

MULTI-LAYER CHIP DIPLEXER FOR UWB AND CONVENTIONAL COAX SERVICE BAND}

The present invention relates to an apparatus for transmitting a UWB signal using a coaxial line installed in a home. In particular, an ultra wideband signal (UWB) for short-range wireless communication is transmitted by using a stacked diplexer connected to a coaxial line. The present invention relates to a multilayer chip diplexer for separating the UWB signal and the coaxial line signal, which can minimize the interference between the UWB signals and miniaturize the device.

In general, in homes, broadcast signals distributed from the satellite antenna or cable operator to the home via coaxial lines are connected to the set-top box or TV, and recently, various technologies for providing wired / wireless home networking using the coaxial lines are provided. Is being proposed.

As a representative example, U.S. Patent Application Publication No. 2005-0034159 discloses a method for interfacing a wired network based on a coaxial line and an ultra wide band (UWB) wireless network for a home video network. It is starting.

In this case, a UWB signal is wirelessly transmitted to the antenna due to the simple operation of a switch by placing a switch between an access point, an antenna for wireless LAN, and a splitter of a coaxial line, in order to connect the UWB signal to a coaxial line in a home environment. The UWB signal is transmitted as it is on the coaxial line.

However, in the conventional technique of separating signals by using a splitter coupled to a coaxial line, there is less interference between signals when using the same band, but the frequency of the band much higher than the band that the UWB signal is conventionally used in the coaxial line. Since the transmission loss of the UWB signal increases, the possibility of interference between the coaxial line signal and the UWB signal is high.

Accordingly, in order to minimize interference and signal loss between the coaxial line signal and the UWB signal, a diplexer combining a low pass filter (LPF) through which a low frequency signal passes and a high pass filter (HPF) through a high frequency signal passes. ) Is required.

In general, a low pass filter (LPF) or a high pass filter (HPF) is composed of a concentrator composed of an inductor (L), a capacitor (C), and a resistor (R). Due to the changing nature, there is a difficulty in stable product composition.

In addition, when the diplexer is configured with a conventional planar structure, the structure for implementing the circuit can be configured only on the upper and lower surfaces, which makes it difficult to miniaturize.

SUMMARY OF THE INVENTION An object of the present invention for solving the disadvantages of the background technology is to form an inductor and a capacitor in a strip pattern on a dielectric substrate, and to laminate it to a plurality of dielectric substrates using a low-temperature plastic ceramic process to achieve miniaturization of the UWB signal. The present invention provides a multilayer chip diplexer for separating coaxial line signals.

In addition, an object of the present invention is to provide a stacked chip diplexer for separating the UWB signal and the coaxial line signal that can be disposed only on the dielectric substrate of the lowest layer to suppress parasitic capacitance generation.

The stacked chip diplexer for separating the UWB signal and the coaxial line signal of the present invention for solving the problem, in the device for transmitting and receiving the coaxial line signal and the UWB signal through the coaxial line, a plurality of dielectric substrate is laminated, the lowest Resonance is caused by a laminated substrate having a ground pad, the coaxial line signal receiving pad, a UWB signal transmitting pad, a coaxial line signal transmitting pad, and a strip pattern patterned on a plurality of dielectric substrates of the stacked substrate. Low pass filter for passing through; A high pass filter generating resonance by a strip pattern patterned on a plurality of dielectric substrates of a stacked substrate and passing the UWB signal; A matching circuit consisting of a flat plate capacitor patterned on the dielectric substrate and electrically connected between the coaxial line signal receiving pad, the low pass filter and the high pass filter; And a via hole electrically connecting each strip pattern formed on each stacked substrate, wherein the matching circuit is formed on the fourth layer dielectric substrate and electrically connected between the low pass filter and the high pass filter, And a first capacitor formed on the sixth layer dielectric substrate and having a first lower electrode electrically connected to the coaxial line signal receiving pad.

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The low pass filter may include a first strip pattern formed on the second layer dielectric substrate and a fourth strip pattern formed on the third layer dielectric substrate and having one end electrically connected to the other end of the first strip pattern through a via hole. A first inductor composed of a portion, a second strip pattern formed on the second layer dielectric substrate adjacent to the first strip pattern and the other end electrically connected to the coaxial signal transmission pad, and a second end pattern formed on the third layer dielectric substrate and the other end A second inductor composed of a portion of a fourth strip pattern connected to one end of the second strip pattern through a via hole, a fifth strip pattern formed on a fourth layer dielectric substrate, and connected through a via hole in the center of the fourth strip pattern And a third inductor connected in parallel to the first inductor and the second inductor so as to be connected to one end of the fourth strip pattern of the fourth layer dielectric substrate. The second is formed in the upper electrode, and the sixth layer dielectric substrate and a second capacitor comprised of the second lower electrode having one end connected to the ground pads through via hole portion.

In addition, the high pass filter is formed of a third strip pattern formed on the second layer dielectric substrate, and consists of a fourth inductor, a fifth inductor, and a sixth strip pattern formed on the fifth layer dielectric substrate connected in series with one end thereof via a via hole. A sixth inductor electrically connected to the fifth inductor and the other end electrically connected to the UWB transmit / receive pad; a third upper electrode formed on the fourth layer dielectric substrate and a sixth layer dielectric substrate; A third capacitor comprising a third lower electrode electrically connected to the seventh inductor and the seventh layer dielectric substrate, which is formed as part of a seventh strip pattern formed on the seventh layer dielectric substrate, and whose one end is electrically connected to the third capacitor through a via hole; The other end of the seventh strip pattern is formed, and the other end of the sixth inductor is And an eighth inductor electrically connected thereto.

According to the present invention, the diplexer can be miniaturized by stacking a plurality of dielectric substrates having a plurality of dielectric substrates having a plurality of inductors and capacitors.

In addition, the present invention can minimize the interference between the coaxial line signal and the UWB signal due to the parasitic capacitance and improve the reliability of the diplexer by disposing the ground plane only on the lowermost layer dielectric substrate.

1 is an equivalent circuit diagram of a multilayer chip diplexer for separation of a UWB signal and a coaxial line signal according to the present invention.
Figure 2 is a perspective view of a stacked chip diplexer for separation of UWB signal and coaxial line signal in accordance with the present invention.
3A to 3H are plan views illustrating patterns formed on dielectric substrates of stacked chip diplexers for separating UWB signals and coaxial line signals according to the present invention.
Figure 4 is a graph showing the frequency characteristics of the stacked chip diplexer for separation of UWB signal and coaxial line signal according to the present invention.

1 is an equivalent circuit diagram of a multilayer chip diplexer for separating UWB signals and coaxial line signals according to the present invention, and uses a coaxial preference installed in a home to transmit and receive not only coaxial line signals but also UWB signals that are short-range wireless communication frequencies. Do it.

Referring to FIG. 1, the multilayer chip diplexer 10 for separating the UWB signal and the coaxial line signal according to the present invention may include a first terminal part 20, a second terminal part 30, and a third terminal part 40. Is connected between. Here, the first terminal unit 20 is connected to the coaxial line and receives a coaxial line signal, which is a service signal, or transmits and receives a UWB signal. The second terminal unit 30 transmits the coaxial line signal received through the first terminal unit 20, and the third terminal unit 40 transmits or approaches the UWB signal received through the first terminal unit 20. Receive the UWB signal.

The multilayer chip diplexer 10 for separating the UWB signal and the coaxial line signal of the present invention includes a matching circuit 11, a low pass filter 12, and a high pass filter 13. The laminated structure of the flexure 10 will be described with reference to FIGS. 2 and 3A to 3H described later.

On the other hand, the matching circuit 11 is composed of a first capacitor (C1) connected in parallel between the first terminal portion 20, the low pass filter 12 and the high pass filter 13, the frequency of different bands, that is, coaxial Ensure frequency matching is made between the line signal and the UWB signal.

The low pass filter 12 is connected between the matching circuit 11 and the second terminal portion 30 to pass a low frequency signal, that is, a coaxial line signal, received through the first terminal portion 20. Specifically, one end of the low pass filter 12 is connected to the connection point of the first terminal portion 20 and the first capacitor C1, and the other end thereof is the second terminal portion 30, and the first inductor L1 And a second inductor L2, a third inductor L3, and a second capacitor C2.

One end of the first inductor L1 is connected to a connection point of the first terminal portion 20 and the first capacitor C1, and the other end thereof is connected to one end of the second inductor L2. The other end of the second inductor L2 is connected to the second terminal unit 30. In addition, one end of the third inductor L3 is connected between the connection point of the first inductor L1 and the second inductor L2, and the other end thereof is connected to the ground terminal through the second capacitor C2.

According to such a configuration, the low pass filter 12 has a parallel resonator and a series resonator. That is, the first inductor L1 and the second inductor L2 connected to each other in series constitute a parallel resonator with the second capacitor C2, and the third inductor L3 forms a series resonator with the second capacitor C2. Done.

The high pass filter 13 is connected between the matching circuit 11 and the third terminal portion 40 to pass a high frequency signal, ie, a UWB signal, received through the first terminal portion 20 or to the third terminal portion 40. It passes through the high-frequency signal received through the UWB signal and serves to deliver to the matching unit (11). Here, the high pass filter 13 includes a third capacitor C3, a fourth inductor L4, a fifth inductor L5, a sixth inductor L6, a seventh inductor L7, and an eighth inductor L8. It consists of.

First, one end of the third capacitor C3 is connected to the first capacitor C1 and the other end is connected to the third terminal portion 40. One end of the fourth inductor L4 is connected to the connection point of the first capacitor C1 and the third capacitor C3, and the other end thereof is connected to one end of the fifth inductor L5. In addition, one end of the seventh inductor L7 is connected to the connection point of the third capacitor C3 and the third terminal portion 40, and the other end thereof is connected to the eighth inductor L8. In addition, the fifth inductor L5 and the eighth inductor L8 are connected to each other in series. One end of the sixth inductor L6 is connected to the connection point of the fifth inductor L5 and the eighth inductor L8, and the other end thereof is connected to the ground terminal.

According to the configuration, the high pass filter 12 includes a fourth resonator L4 and a fifth inductor L5 connected in series to each other, and a third resonator C3 and a parallel resonator, and the seventh inductor L7 connected in series to each other. ) And the eighth inductor L8 form a parallel resonator with the third capacitor C3.

According to this configuration, the coaxial line signal and the UWB signal received by the first terminal portion 20 are branched and branched into the low pass filter 12 and the high pass filter 13. Then, the low pass filter 12 is a low frequency band signal, that is, a coaxial line signal in a signal applied according to a resonance phenomenon generated by the first inductor L1 through the third inductor L3 and the second capacitor C2. It passes through the bay and transmits to the terminal connected thereto via the second terminal portion 30.

In addition, the high pass filter 13 has a high frequency band in a signal applied through the matching circuit 11 according to a resonance phenomenon generated by the fourth inductor L4 through the eighth inductor L8 and the third capacitor C3. In other words, only the UWB signal is transmitted through the third terminal unit 40 and transmitted to the adjacent wireless terminal.

In addition, when the UWB signal is received from the wireless terminal in proximity through the third terminal unit 40, the high pass filter 13 transmits the applied UWB signal to the matching circuit 11, where frequency matching is performed in the matching circuit 11. The high frequency signal may be transmitted to another space through the first terminal unit 20.

2 is a perspective view of a stacked chip diplexer for separating a UWB signal and a coaxial line signal according to the present invention. The stacked chip diplexer 10 has a structure in which first to eighth dielectric layers are stacked. Has

Here, each dielectric substrate is laminated by Low Temperature Co-fired Ceramics using a ceramic material having a dielectric constant of 40k or more. On both sides of the stacked chip diplexer 10, a ground pad G, a coaxial line signal receiving pad P1, and a UWB signal transmitting / receiving pad P3 are formed on the eighth layer dielectric substrate 180 of the third h, which will be described later. And a plurality of side terminals 100 electrically connected to the coaxial line signal transmission pad P2.

3A to 3H are plan views illustrating patterns formed on the dielectric substrates of the stacked chip diplexers for separating the UWB signal and the coaxial line signal according to the present invention, and FIGS. 3A to 3H are circuit diagrams of FIG. This will be described with reference to.

First, referring to FIG. 3A, a marking M for component mounting is formed on the first layer dielectric substrate 110.

Referring to FIG. 3B, a first strip pattern S1 and a second strip pattern S2 adjacent to each other are formed on the second layer dielectric substrate 120, and the first strip pattern S1 and the second strip pattern are formed. A third strip pattern S3 is formed under the SS2.

Referring to FIG. 3C, a fourth strip pattern S4 is formed on the third layer dielectric substrate 130 at positions corresponding to the first strip pattern S1 and the second strip pattern S2.

Here, the first strip pattern S1 is electrically connected to the coaxial line signal receiving pad P1 formed at one end of the eighth layer dielectric substrate 180 of the third h through the side terminal 100 of FIG. 2. The other end is electrically connected to one end of the fourth strip pattern S4 through a via hole penetrating the bottom thereof. The second strip pattern S2 is electrically connected to the other end of the fourth strip pattern S4 through a via hole penetrating the bottom of one end thereof, and the other end thereof will be described later through the side terminal 100 of FIG. 2. Is electrically connected to the coaxial line signal transmission pad P2 formed on the eighth layer dielectric substrate 180 of FIG. Accordingly, a portion of the first strip pattern S1 and the fourth strip pattern S4 forms the first inductor L1, and a portion of the second strip pattern S2 and the fourth strip pattern S4 is formed of the first inductor L1. 2 form an inductor (L2). The first inductor L1 and the second inductor L2 are connected to each other in series by the fourth strip pattern S4. In this case, the first inductor L1 and the second inductor L2 have a structure stacked on the second layer dielectric substrate 120 and the third layer dielectric substrate 130 to obtain an effect of lengthening the inductor. .

In addition, the third strip pattern S3 illustrated in FIG. 3B forms a fourth inductor L4 and a fifth inductor L5 electrically connected to each other.

Referring to FIG. 3D, the fourth layer dielectric substrate 140 includes a fifth strip pattern S5, a second upper electrode C21 connected in series with the fifth strip pattern S5, and a fifth strip pattern S5. The first upper electrode C11 and the third upper electrode C31 which are disposed below and are connected to each other in series are formed. In this case, the third upper electrode C31 is electrically connected to one end of the third strip line S3 through a via hole penetrating through the third dielectric substrate 130 and the second dielectric substrate 120.

In addition, the fifth strip pattern S5 is electrically connected through a via hole penetrating a lower portion of the center of the fourth strip pattern S4 formed on the third layer dielectric substrate 130, so that the first inductor L1 and the second inductor L1 and the second strip pattern S5 are electrically connected. A third inductor L3 is formed to be connected in parallel between the inductors L2.

Referring to FIG. 3E, a sixth strip pattern S6 is formed on the fifth layer dielectric substrate 150, and one end of the sixth strip pattern S6 is the fourth layer dielectric substrate 140 and the third layer dielectric substrate. Electrically connected to the other end of the third strip pattern S3 through a via hole penetrating through the 130 and the second layer dielectric substrate 120, the other end of which is described later through the side terminal 100 of FIG. 2. The sixth inductor L6 is connected to the fifth inductor L5 in parallel by being electrically connected to the ground pad G formed on the eighth layer dielectric substrate 180 of 3h.

Referring to FIG. 3F, a first lower electrode C12, a second lower electrode C22, and a third lower electrode C32 are formed on the sixth layer dielectric substrate 160. Here, the first lower electrode C12 is disposed to correspond to the first upper electrode C11 with the fifth dielectric substrate 150 interposed therebetween to form the first capacitor C1 together with the first upper electrode C11. do. The second lower electrode C22 is disposed to correspond to the second upper electrode C21 with the fifth dielectric substrate 150 interposed therebetween to form the second capacitor C2. In addition, the third lower electrode C32 is disposed to correspond to the third upper electrode C31 with the fifth dielectric substrate 150 interposed therebetween to form the third capacitor C3.

Here, the first upper electrode C11 and the third upper electrode C31 are electrically connected, and the third upper electrode C31 penetrates through the third layer dielectric substrate 130 and the second layer dielectric substrate 120. The fourth inductor L4 is connected in parallel between the first capacitor C1 and the third capacitor C3 as the first strip C1 is electrically connected to one end of the third strip pattern S1 through the via hole.

In addition, the first lower electrode C12 is connected to the coaxial line receiving pad P1 formed on the eighth layer dielectric substrate 180 of FIG. 3h through the side terminal 100 of FIG. 2 and the second lower electrode. C22 is electrically connected to the ground pad G formed on the eighth layer dielectric substrate 180 of 3h described later through the side terminal 100 of FIG. 2, and the third lower electrode C32 is illustrated in FIG. 2. It is electrically connected to the UWB transmit / receive pad P3 formed on the eighth layer dielectric substrate 180 of 3h to be described later through the side terminal 100 of FIG.

Referring to FIG. 3G, a seventh strip pattern S7 constituting the seventh inductor L7 and the eighth inductor L8 is formed on the seventh layer dielectric substrate 170. Here, one end of the seventh strip pattern S7 is electrically connected to the third lower electrode C32 through a via hole penetrating through the sixth layer dielectric substrate 160, so that the seventh inductor L7 and the third capacitor ( C3) is connected in parallel.

The other end of the seventh strip pattern S7 is electrically connected to one end of the sixth strip pattern S6 through a via hole penetrating through the sixth layer dielectric substrate 160 and the fifth layer dielectric substrate 150. Accordingly, the sixth inductor L6 and the eighth inductor L8 are connected in parallel.

Referring to FIG. 3H, a plurality of ground pads G3, coaxial line signal receiving pads P1, coaxial line signal transmitting pads P2, and UWB signal transmitting / receiving pads P3 may be provided on the eighth layer dielectric substrate 180. Is formed.

4 is a graph showing the frequency characteristics of the multilayer chip diplexer for separating the UWB signal and the coaxial line signal according to the present invention, (a) shows the characteristics of the low pass filter, (b) shows the characteristics of the high pass filter. (C) shows the reflection coefficient characteristics. Despite the miniaturization of the device by forming a diplexer in a stacked structure, the low-pass characteristics and high-pass characteristics are excellent, and the reflection coefficient is "0". Apparently, the performance of the diplexer is excellent.

10: stacked chip diplexer 11 matching circuit
12: low pass filter 13: high pass filter
20: first terminal portion 30: second terminal portion
40: third terminal portion

Claims (4)

In the device for transmitting and receiving coaxial line signal and UWB signal through the coaxial line,
A plurality of dielectric substrates stacked on each other, wherein a stacked substrate including a ground pad, the coaxial line signal receiving pad, a UWB signal transmitting and receiving pad, and a coaxial line signal transmitting pad formed on a lowermost dielectric substrate;
A low pass filter generating resonance by a strip pattern patterned on a plurality of dielectric substrates of the stacked substrate and passing the coaxial line signal;
A high pass filter generating resonance by a strip pattern patterned on a plurality of dielectric substrates of the stacked substrate and passing the UWB signal;
A matching circuit formed of a plate type capacitor patterned on the dielectric substrate and electrically connected between the coaxial line signal receiving pad, the low pass filter and the high pass filter; And
It includes via holes for electrically connecting each strip pattern formed on each of the stacked substrate,
The matching circuit,
A first upper electrode formed on a fourth layer dielectric substrate and electrically connected between the low pass filter and the high pass filter, a first lower part formed on a sixth layer dielectric substrate and electrically connected to the coaxial line signal receiving pad Multilayer chip diplexer for separation of UWB signal and coaxial line signal, characterized in that the first capacitor consisting of an electrode.
delete The method of claim 1,
The low pass filter,
A first inductor formed of a first strip pattern formed on the second layer dielectric substrate and a portion of the fourth strip pattern formed on the third layer dielectric substrate and having one end electrically connected to the other end of the first strip pattern through a via hole; ,
A second strip pattern formed on the second layer dielectric substrate adjacent to the first strip pattern and having the other end electrically connected to the coaxial signal transmission pad, and a second strip pattern formed on the third layer dielectric substrate and the other end of the second strip pattern A second inductor configured as part of a fourth strip pattern connected at one end through a via hole,
A third inductor having a fifth strip pattern formed on the fourth layer dielectric substrate and connected to a center of the fourth strip pattern through a via hole and connected in parallel with the first inductor and the second inductor;
A second upper electrode formed to be connected to one end of the fourth strip pattern of the fourth layer dielectric substrate, and a second lower electrode formed on the sixth layer dielectric substrate and having one end connected to the ground pad through a via hole; Multilayer chip diplexer for separation of UWB and coaxial line signals, characterized by including two capacitors. The method of claim 1,
The high pass filter,
A fourth inductor and a fifth inductor formed of a third strip pattern formed on the second layer dielectric substrate and connected in series with each other;
A sixth inductor having a sixth strip pattern formed on the fifth layer dielectric substrate, one end of which is electrically connected to the fifth inductor through a via hole, and the other end of which is electrically connected to the UWB transmission / reception pad;
A third capacitor formed on the third upper electrode formed on the fourth layer dielectric substrate and the third lower electrode formed on the sixth layer dielectric substrate and the other end electrically connected to the UWB transmission / reception pad,
A seventh inductor made of a part of the seventh strip pattern formed on the seventh layer dielectric substrate, and one end of which is electrically connected to the third capacitor through the via hole;
The eighth inductor is formed of a part of the seventh strip pattern formed on the seventh layer dielectric substrate, and the other end includes an eighth inductor electrically connected to one end of the sixth inductor through a via hole. Stacked Chip Diplexer for Separation.

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