KR101121732B1 - Light emitting diode and method of manufacturing the same - Google Patents

Light emitting diode and method of manufacturing the same Download PDF

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Publication number
KR101121732B1
KR101121732B1 KR1020040110462A KR20040110462A KR101121732B1 KR 101121732 B1 KR101121732 B1 KR 101121732B1 KR 1020040110462 A KR1020040110462 A KR 1020040110462A KR 20040110462 A KR20040110462 A KR 20040110462A KR 101121732 B1 KR101121732 B1 KR 101121732B1
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KR
South Korea
Prior art keywords
light emitting
emitting chip
fluorescent material
phosphor
solvent
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Application number
KR1020040110462A
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Korean (ko)
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KR20060071958A (en
Inventor
이건영
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서울반도체 주식회사
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Priority to KR1020040110462A priority Critical patent/KR101121732B1/en
Publication of KR20060071958A publication Critical patent/KR20060071958A/en
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Publication of KR101121732B1 publication Critical patent/KR101121732B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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Abstract

The present invention relates to a light emitting diode and a method of manufacturing the same. A light emitting diode comprising: providing a light emitting diode, a substrate on which a light emitting chip is mounted, a fluorescent material mixed with a phosphor, a resin, and a solvent; and spraying the fluorescent material in the form of fine particles on the light emitting chip. It provides a method for producing.

Therefore, the fluorescent material mixed with the phosphor, the resin and the solvent is granulated through a predetermined sprayer and sprayed onto the light emitting chip, so that the phosphor can be uniformly applied around the light emitting chip, and the solvent of the sprayed particles can evaporate instantly. Therefore, the process of curing the fluorescent material can be shortened, and the amount of the fluorescent material can be reduced since it can be uniformly applied around the light emitting chip with only a small amount of phosphor.

Light Emitting Diode, Phosphor, Phosphor, Resin, Solvent, Spray, Sprayer

Description

Light emitting diode and method of manufacturing the same

1 and 2 are conceptual diagrams for explaining the conventional phosphor coating.

3 to 6 are conceptual diagrams for explaining the application of the phosphor according to the present invention.

7 and 8 are light emitting diodes according to the present invention.

9 is a flowchart illustrating a method of manufacturing a light emitting diode according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10, 110: substrate 20, 120: light emitting chip

30, 130: fluorescent material 112, 114, 122, 124: lead terminal

132: reflection cup 135: wire

140: molding part 200: sprayer

The present invention relates to a light emitting diode and a method of manufacturing the same, and more particularly to a method of applying a phosphor formed on the light emitting chip.

In general, a method of manufacturing a white light emitting diode uses a method of obtaining white light by mounting red, green, and blue light emitting chips, which are three primary colors of light, in one package and then emitting light at the same time. However, since the current voltage characteristics of the red, green, and blue light emitting diodes are different, separate control is required outside each light emitting diode in order to obtain uniform white.

In order to solve this problem, recently, InGaN and GaN-based light emitting chips are mounted on a substrate, and then, a phosphor that absorbs a part of the light output from the light emitting chip and outputs a wavelength different from the wavelength of the light is formed on the light emitting chip. The method of obtaining white light by mixing light is used.

1 and 2 are conceptual diagrams for explaining a conventional phosphor coating.

1 and 2, a substrate 10 having a light emitting chip 20 mounted thereon is provided, and a phosphor and an epoxy mixed with phosphor by using a predetermined potting device. ) Is potted on the light emitting chip 20 and then cured for a predetermined time.

Since the potted phosphor 30 is in a liquid state, the potted phosphor 30 on the light emitting chip 20 flows down and is not uniformly applied. In particular, as in the region A of FIG. 2, phosphors are not applied to the sidewall region of the light emitting chip 20, or are applied very thinly compared to other regions, so that staining occurs in white light and the visibility is also reduced.

Therefore, in order to solve the above problems, the present invention provides a light emitting diode capable of uniformly applying a fluorescent material around the light emitting chip by spraying a fluorescent material into particles and spraying the light emitting chip, and also reducing the amount of phosphor applied. Its purpose is to provide a method.

According to an embodiment of the present invention; A light emitting chip mounted on the substrate; And a fluorescent material uniformly formed throughout the light emitting chip.
The substrate is preferably made of a material having excellent thermal or electrical conductivity.

The fluorescent material preferably includes a phosphor and a resin.
The fluorescent substance including the phosphor and the resin is preferably a substance remaining after evaporation of the solvent among the substances including the phosphor, the resin, and the solvent.
The solvent is preferably at least one selected from the group consisting of petroleum light oil, alcohol, toluene, ether, acetone and halogenated hydrocarbons.
In addition, the light emitting diode according to an embodiment of the present invention preferably further includes a molding part encapsulating a light emitting chip in which the fluorescent material is uniformly formed.

On the other hand, according to another embodiment of the present invention comprising the steps of preparing a substrate on which the light emitting chip is mounted, and a fluorescent material mixed with a phosphor, a resin and a solvent; And spraying the fluorescent material in the form of particles on the light emitting chip as a whole.

Providing a substrate on which the light emitting chip is mounted, and a phosphor mixed with a phosphor, a resin, and a solvent may include preparing the substrate on which a lead terminal is formed; Mounting the light emitting chip on the substrate; And it is preferable to include a step of preparing a fluorescent material by mixing the phosphor, a resin and a solvent.
Spraying the fluorescent material in the form of particles throughout the light emitting chip, the step of injecting the fluorescent material into the spray; Granulating a fluorescent substance through the nebulizer; And spraying the granulated fluorescent material on the light emitting chip.
In addition, the light emitting diode manufacturing method according to another embodiment of the present invention preferably further comprises the step of evaporating the fluorescent material in the form of particles throughout the light emitting chip, the solvent contained in the fluorescent material is further evaporated. Do.
In addition, the light emitting diode manufacturing method according to another embodiment of the present invention preferably further comprises the step of forming a molding unit for encapsulating the light emitting chip after the step of evaporating the solvent contained in the fluorescent material.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

As the fluorescent substance in the present embodiment, a substance in which a predetermined solvent is mixed with a mixture of a phosphor and a predetermined resin is used.

As the phosphor, a phosphor capable of converting the wavelength of light emitted by the light emitting chip is used. In the present embodiment, a phosphor capable of converting the wavelength of light emitted by the light emitting chip into white is used. As the resin, when the phosphor is applied to the lower light emitting chip region, a material capable of bonding between the phosphor and the light emitting chip is used. In this embodiment, an epoxy resin or a silicone resin is used. As a solvent, a substance for liquefying a phosphor and a resin to be easily sprayed through a sprayer is used, but in this embodiment, a material having high solubility, high selectivity, and excellent recoverability, petroleum light oil, alcohol, Toluene, ether, acetone, halogenated hydrocarbons and the like. As described above, the present invention mixes a predetermined solvent in the mixture of the phosphor and the resin, and first adjusts the viscosity of the phosphor to facilitate the granulation of the phosphor through a subsequent sprayer, and then, after potting the conventional phosphor The curing process is omitted. This is due to the nature of the material is sprayed with the fluorescent material particles are sprayed around the light emitting chip is the instant evaporation of the instant it is possible to instant curing. In addition, the solvent is mixed to increase the mixing ratio of the phosphor.

3 to 6 are conceptual diagrams for explaining the application of the phosphor according to the present invention.

As shown in FIG. 3, the phosphor 130 mixed with the phosphor, the resin, and the solvent are granulated through the sprayer 200 and sprayed around the light emitting chip 120 mounted on the substrate 110. Here, the sprayer 200 refers to a device for spraying the liquid fluorescent material 130 having a predetermined viscosity by pressing the nozzle to make a mist shape with a nozzle. Such sprayers use consistent sprayers, lever sprayers, knapsack power sprayers, portable power sprayers, stationary power sprayers, wheeled power sprayers and traveling power sprayers.

As described above, when the liquid phase having a predetermined viscosity is sprayed around the light emitting chip 120 by using the sprayer 200, the liquid crystal having a predetermined viscosity is injected into the light emitting chip 120 as shown in FIG. 4. ) It is very evenly distributed around it. That is, since the fluorescent material 130 of the present embodiment has a predetermined viscosity and is granulated, the fluorescent material 130 is uniformly distributed in a predetermined area without a phenomenon such as a conventional flow down.

This is because the phosphor material ported on the conventional light emitting chip (see '20' of FIG. 2) is a liquid mass, but the phosphor material sprayed on the light emitting chip 120 of the present embodiment is fine particles such as fog. . This results in better step coverage of the finer particles than the liquid mass, and is thus uniformly applied to the upper and lower regions of the light emitting chip 120 as well as to the side regions thereof.

In order to further improve the effect of such spraying, as shown in FIG. 5, the fluorescent material 130 is sprayed using a plurality of nozzles of the sprayer 200, or sprayed in the side region of the light emitting chip 120 as shown in FIG. 6. .

As shown in FIG. 5, the fluorescent substance 130 granulated using the sprayer 200 having a plurality of spray nozzles arranged horizontally with the substrate 110 on the light emitting chip 120 is perpendicular to the substrate 110. Spray. In addition, as shown in FIG. 6, the fluorescent substance 130 granulated using the sprayer 200 having the spray nozzles arranged at a predetermined angle with the substrate 110 on the light emitting chip 120 is disposed on the substrate 110. Spray at an angle against As a result, no gap is generated in the area around the light emitting chip 120. This spraying can reduce the amount of expensive phosphor used.

The present invention is not limited to the above embodiment, and when the fluorescent material 130 is sprayed, a cover (not shown) having a predetermined through hole is used for controlling the spraying area of the fluorescent material 130. In addition, the distance between the spray nozzle of the sprayer 200 and the substrate 110, the spraying speed, and the amount of the fluorescent substance 130 sprayed are controlled to prevent the fluorescent substance 130 from being diffused to an area where it is not necessary.

Hereinafter, a light emitting diode according to the above-described fluorescent substance and its spraying method and a method of manufacturing the same will be described.

7 and 8 are light emitting diodes according to the present invention.

Referring to FIG. 7, the light emitting diode includes a first lead terminal 112 having a light reflecting cup 132 formed at a tip thereof, a second lead terminal 114 spaced a predetermined distance from the first lead terminal 112, and The light emitting chip 120 mounted inside the reflective cup 132, the fluorescent material 130 sprayed in the form of particles on the light emitting chip 120, and the front end portions of the first and second lead terminals 112 and 114. It includes a molding unit 140 for sealing.

To this end, the blue light emitting chip 120 is potted using a paste in the reflection cup 132, and the light emitting chip 120 and the second lead terminal 114 are electrically connected through a wiring process. Next, the fluorescent material 130 in the form of particles having a predetermined viscosity is sprayed into the reflection cup 132 on which the light emitting chip 120 is mounted. The molding part 140 is manufactured by using a molding die at the front ends of the first and second lead terminals 112 and 114.

Referring to FIG. 8, the light emitting diode is sprayed in the form of particles around the substrate 110 having the lead terminals 122 and 124 formed thereon, the light emitting chip 120 mounted on the substrate 110, and the light emitting chip 120. And a molding part 20 for encapsulating the fluorescent material 130 and the light emitting chip 120.

At this time, the light emitting chip 120 and the lead terminal 122 or 124 are electrically connected through a predetermined wire 135. In addition, a light emitting chip 120 having a light emission wavelength of 410 to 530 nm is used. In addition, a material having excellent thermal conductivity and / or electrical conductivity is used as the substrate 110.

9 is a flowchart illustrating a method of manufacturing a light emitting diode according to the present invention.

Referring to FIG. 9, a light emitting chip is mounted on a substrate on which a lead terminal is formed (S10). After applying a predetermined paste on the substrate, the light emitting chip is mounted. At this time, the light emitting chip is mounted on the substrate, or mounted on one side lead terminal formed on the substrate. Thereafter, the light emitting chip and the lead terminal are electrically connected through a predetermined wiring process. On the other hand, the fluorescent material is generated by mixing the phosphor, resin and solvent in a predetermined container (S20). During the mixing of the phosphor and the resin, a solvent is added to adjust the viscosity of the mixture. That is, for example, yttrium, aluminum, and garnet-based phosphors (YAG phosphors) are mixed with a transparent epoxy resin at a fixed ratio, and a solvent is added thereto.

Thereafter, the fluorescent material is sprayed onto the light emitting chip in the form of particles (S30). The phosphor mixed with the phosphor, the resin, and the solvent is injected into the sprayer, and then the phosphor is granulated (fog) and sprayed around the light emitting chip through the sprayer. Since the granulated fluorescent material has a predetermined viscosity, phosphors can be uniformly distributed around the light emitting chip, and the curing material is instantaneously cured or the curing process time is shortened because the fluorescent material is sprayed on the light emitting chip and the solvent evaporates. do.

A molding part for encapsulating the light emitting chip is formed (S40). The molding part uses a transparent epoxy resin to cover the light emitting chip and a predetermined terminal electrode connected to the substrate so as to be blocked from the outside. Thereafter, a predetermined curing process is performed for 30 minutes to 2 hours (S50).

This forms a light emitting diode in which a predetermined fluorescent substance is uniformly coated on the light emitting chip.

As described above, the present invention can adjust the viscosity of the fluorescent material by mixing a predetermined solvent in the mixture of the phosphor and the resin.

In addition, by spraying a fluorescent material mixed with a phosphor, a resin and a solvent into a small particle through a predetermined sprayer and spraying the light emitting chip, the phosphor can be uniformly applied around the light emitting chip, and the solvent of the sprayed particles is evaporated instantly. Therefore, the process of curing the fluorescent substance can be shortened.

In addition, since only a small amount of phosphor can be uniformly applied around the light emitting chip, the amount of phosphor used can be reduced.

Claims (11)

A substrate on which lead terminals are formed; A light emitting chip mounted on the substrate; And It is formed uniformly throughout the light emitting chip, and includes a fluorescent material including a phosphor and a resin; The fluorescent material is a light emitting diode which is a material remaining after evaporation of a solvent including a resin and a solvent. The method of claim 1, The substrate is a light emitting diode made of a material having excellent thermal or electrical conductivity. delete delete The method of claim 1, The solvent is at least one light emitting diode selected from the group consisting of petroleum light oil, alcohol, toluene, ether, acetone and halogenated hydrocarbons. The method of claim 1, And a molding unit encapsulating the light emitting chip in which the fluorescent material is uniformly formed. Providing a substrate on which a light emitting chip is mounted, and a fluorescent material in which a phosphor, a resin, and a solvent are mixed; And And spraying the fluorescent material in the form of particles on the entire light emitting chip. The method of claim 7, wherein Providing a substrate on which the light emitting chip is mounted, and a fluorescent material in which phosphor, resin, and solvent are mixed, Providing the substrate having a lead terminal formed thereon; Mounting the light emitting chip on the substrate; And A method of manufacturing a light emitting diode, comprising the steps of preparing a fluorescent material by mixing the phosphor, a resin, and a solvent. The method of claim 7, wherein Spraying the fluorescent material in the form of particles throughout the light emitting chip, Injecting the fluorescent material into a nebulizer; Granulating a fluorescent substance through the nebulizer; And And spraying the granulated fluorescent material on the light emitting chip. The method of claim 7, wherein After spraying the fluorescent material in the form of particles over the entire light emitting chip, The method of manufacturing a light emitting diode further comprising the step of evaporating the solvent contained in the fluorescent material. 11. The method of claim 10, After the step of evaporating the solvent contained in the fluorescent material, And forming a molding part for encapsulating the light emitting chip.
KR1020040110462A 2004-12-22 2004-12-22 Light emitting diode and method of manufacturing the same KR101121732B1 (en)

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KR101121732B1 true KR101121732B1 (en) 2012-03-23

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900291B1 (en) * 2007-01-19 2009-05-29 엘지전자 주식회사 LED package and method for manufacturing the same
KR100849782B1 (en) * 2007-02-12 2008-07-31 삼성전기주식회사 Method for manufacturing led package
KR101365624B1 (en) * 2007-06-20 2014-02-21 서울반도체 주식회사 Light emitting diode having phosphor thin film and method for manufacturing the same
KR100927272B1 (en) * 2008-10-23 2009-11-18 창원대학교 산학협력단 A led package and a manufacturing method
CN102097425A (en) 2009-12-09 2011-06-15 三星Led株式会社 Light emitting diode, method for fabricating phosphor layer, and lighting apparatus
KR101253586B1 (en) 2010-08-25 2013-04-11 삼성전자주식회사 Phosphor film, method of manufacturing the same, method of coating phosphor layer on an LED chip, method of manufacturing LED package and LED package manufactured thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203989A (en) 2000-12-21 2002-07-19 Lumileds Lighting Us Llc Light emitting device and its manufacturing method
JP2003115614A (en) * 2001-10-03 2003-04-18 Nichia Chem Ind Ltd Method of fabricating light emitting device
JP2003298116A (en) 2002-03-29 2003-10-17 Stanley Electric Co Ltd White light emitting diode and method of manufacturing the same
KR200362813Y1 (en) 2004-06-22 2004-09-23 쉰-룽 리우 Improved structure of light-emitting diode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203989A (en) 2000-12-21 2002-07-19 Lumileds Lighting Us Llc Light emitting device and its manufacturing method
JP2003115614A (en) * 2001-10-03 2003-04-18 Nichia Chem Ind Ltd Method of fabricating light emitting device
JP2003298116A (en) 2002-03-29 2003-10-17 Stanley Electric Co Ltd White light emitting diode and method of manufacturing the same
KR200362813Y1 (en) 2004-06-22 2004-09-23 쉰-룽 리우 Improved structure of light-emitting diode

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