KR101093126B1 - 인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법과 이를 위한 기록매체 - Google Patents
인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법과 이를 위한 기록매체 Download PDFInfo
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- KR101093126B1 KR101093126B1 KR1020080095753A KR20080095753A KR101093126B1 KR 101093126 B1 KR101093126 B1 KR 101093126B1 KR 1020080095753 A KR1020080095753 A KR 1020080095753A KR 20080095753 A KR20080095753 A KR 20080095753A KR 101093126 B1 KR101093126 B1 KR 101093126B1
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
Description
Claims (4)
- 정보제공 서버가 인터넷뱅킹 서비스를 이용하여 고객에게 종합자산 정보를 제공하는 방법에 있어서,사용자 단말로부터 부동산 정보, 금융자산 정보, 부채 정보, 주식 정보 및 펀드 정보를 포함하는 종합자산 정보를 수신하는 단계;등기소 서버, 부동산 정보 제공 서버, 금융 서버 및 증권사 서버를 포함하는 유효성 확인 서버를 통해 상기 수신된 종합자산 정보의 유효성을 확인하는 단계;상기 부동산 정보, 상기 금융자산 정보, 상기 부채 정보, 상기 주식 정보 및 상기 펀드 정보를 연계 처리하여 저장매체에 저장하는 단계;상기 종합자산 정보의 변동 여부를 실시간(또는 주기적)으로 확인하는 단계;상기 종합자산 정보의 변동 여부가 확인되면, 상기 종합자산 정보의 증감현황 정보를 산출하고, 상기 증감현황 정보를 상기 종합자산 정보와 연결하여 상기 저장매체에 저장하는 단계;상기 사용자 단말로부터 상기 종합자산 정보의 조회 요청을 수신하면, 상기 등기소 서버, 상기 부동산 정보 제공 서버, 상기 금융 서버 및 상기 증권사 서버를 포함하는 상기 유효성 확인 서버를 통해 상기 저장매체에 저장된 종합자산 정보의 유효성을 확인하는 단계;상기 종합자산 정보에 포함된 자산 중에서 유효성이 인증되지 않는 자산을 제외한 종합자산의 규모에 따른 대출가능 금액을 산출하는 단계; 및상기 종합자산 정보, 상기 종합자산의 증감현황 정보 및 상기 대출 가능 금액을 상기 사용자 단말에 전송하는 단계;를 포함하여 이루어지는 것을 특징으로 하는 인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법.
- 삭제
- 제1항에 있어서,상기 사용자 단말에게 제공된 대출가능 금액의 일부(또는 전액)에 대한 대출을 요청하는 대출요청 정보를 수신하는 단계; 및상기 수신된 대출요청 정보에 대응하여 상기 사용자 단말의 고객에게 대출 처리하는 단계;를 더 포함하여 이루어지는 것을 특징으로 하는 인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법.
- 제1항 또는 제3항의 방법을 실행하는 프로그램을 기록한 것을 특징으로 하는 컴퓨터로 판독 가능한 기록매체.
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KR1020080095753A KR101093126B1 (ko) | 2008-09-30 | 2008-09-30 | 인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법과 이를 위한 기록매체 |
US12/564,073 US20100079966A1 (en) | 2008-09-30 | 2009-09-22 | Memory module |
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KR1020080095753A KR101093126B1 (ko) | 2008-09-30 | 2008-09-30 | 인터넷뱅킹 서비스를 이용한 종합자산 정보 제공 방법과 이를 위한 기록매체 |
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KR101093126B1 true KR101093126B1 (ko) | 2011-12-13 |
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US9530716B2 (en) * | 2012-04-20 | 2016-12-27 | Sandisk Technologies Inc. | Apparatus, system, and method for transferring heat from memory components |
US9603252B1 (en) * | 2013-11-12 | 2017-03-21 | Smart Modular Technologies, Inc. | Integrated circuit device system with elevated configuration and method of manufacture thereof |
US9648754B1 (en) | 2013-11-12 | 2017-05-09 | Smart Modular Technologies, Inc. | Integrated circuit device system with elevated stacked configuration and method of manufacture thereof |
JP2020030978A (ja) * | 2018-08-23 | 2020-02-27 | 株式会社デンソー | 基板モジュール |
CN109168259B (zh) * | 2018-09-25 | 2021-04-06 | 西安金百泽电路科技有限公司 | 成品小pcs板返工方法 |
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US5502333A (en) * | 1994-03-30 | 1996-03-26 | International Business Machines Corporation | Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit |
JP4419049B2 (ja) * | 2003-04-21 | 2010-02-24 | エルピーダメモリ株式会社 | メモリモジュール及びメモリシステム |
US7760513B2 (en) * | 2004-09-03 | 2010-07-20 | Entorian Technologies Lp | Modified core for circuit module system and method |
DE102006050882A1 (de) * | 2006-10-27 | 2008-05-08 | Qimonda Ag | Platine, insbesondere für ein Speichermodul, Speichermodul, Speichermodul-System, und Verfahren zur Herstellung einer Platine, insbesondere für ein Speichermodul |
KR100871381B1 (ko) * | 2007-06-20 | 2008-12-02 | 주식회사 하이닉스반도체 | 관통 실리콘 비아 칩 스택 패키지 |
JP2010021306A (ja) * | 2008-07-10 | 2010-01-28 | Hitachi Ltd | 半導体装置 |
JP5331427B2 (ja) * | 2008-09-29 | 2013-10-30 | 株式会社日立製作所 | 半導体装置 |
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2008
- 2008-09-30 KR KR1020080095753A patent/KR101093126B1/ko active IP Right Grant
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US20100079966A1 (en) | 2010-04-01 |
KR20100036498A (ko) | 2010-04-08 |
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