KR101084532B1 - Led chip of testing apparatus - Google Patents

Led chip of testing apparatus Download PDF

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Publication number
KR101084532B1
KR101084532B1 KR1020110025428A KR20110025428A KR101084532B1 KR 101084532 B1 KR101084532 B1 KR 101084532B1 KR 1020110025428 A KR1020110025428 A KR 1020110025428A KR 20110025428 A KR20110025428 A KR 20110025428A KR 101084532 B1 KR101084532 B1 KR 101084532B1
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South Korea
Prior art keywords
led chip
block
blade
gold
connection terminal
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KR1020110025428A
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Korean (ko)
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이기현
심규열
홍성민
방지원
임정호
송준성
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강우테크 주식회사
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Led Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: A test apparatus of an LED chip is provided to determine defects such as a leakage current in the LED chip separated from a wafer manufactured in a manufacturing process with a different current supply method. CONSTITUTION: A plurality of blocks(12) is comprised of ceramics and fixed in a turn table(11) with a predetermined angle. A gold block(14) is placed in the upper surface of the block and loads an LED chip(13) to be tested. A vacuum hole(15) is arranged in the block and gold block with penetration and supplies vacuum pressure. A probe card(16) is installed in the upper surface of the turn table. One blade(17a) is connected to a contact terminal arranged in the upper surface of the LED chip. The other blade(17b) is connected to the upper surface of the gold block in which the LED chip is loaded.

Description

엘이디 칩의 테스트장치 {LED CHIP OF TESTING APPARATUS}LED Chip Tester {LED CHIP OF TESTING APPARATUS}

본 발명은 엘이디 칩(LED Chip)의 테스트장치에 관한 것으로써, 좀더 구체적으로는 생산 공정에서 생산된 웨이퍼로부터 분리된 엘이디 칩을 프로버를 이용하여 전기적인 테스트하는 과정에서 전류 인가방식을 달리하여 누설전류 유무 등과 같은 불량여부를 판단할 수 있도록 하는 엘이디 칩(LED Chip)의 테스트장치에 관한 것이다.
The present invention relates to a test apparatus for an LED chip, and more specifically, in a process of electrically testing an LED chip separated from a wafer produced in a production process using a prober, The present invention relates to a test apparatus for an LED chip to determine whether there is a defect such as the presence of leakage current.

일반적으로, 발광소자인 엘이디〔이하 "LED"(Light Emitting Diode)라 함〕는 최근 발광 효율의 향상으로 그 응용범위가 초기의 신호 표시용에서 휴대폰용 백라이트 유닛(Back Light Unit : BLU) 또는 액정표시장치(Liquid Crystal Display : LCD)와 같은 대형 표시장치의 광원 및 조명용으로 더욱 넓어지고 있다. In general, LEDs (hereinafter referred to as "LEDs" (Light Emitting Diodes)), which are light emitting devices, have recently been improved in light emitting efficiency, and their application ranges are that of a backlight unit (BLU) or liquid crystal for a mobile phone in the early signal display. It is becoming wider for light sources and lighting of large display devices such as liquid crystal displays (LCDs).

그 이유는 LED가 종래의 조명인 전구나 형광등에 비해 소모전력이 적고 수명이 길기 때문이다.The reason for this is that the LED consumes less power and has a longer life than the conventional light bulb or fluorescent lamp.

이러한 발광소자인 LED는 통상, 기판 상에 서로 다른 도전형의 반도체층과 그 사이에 발광을 활성화하는 활성층을 성장시킨 후 각 반도체층에 전극을 형성하여 제조한다. LEDs, which are such light emitting devices, are generally manufactured by growing different conductive semiconductor layers on a substrate and an active layer activating light emission therebetween, and then forming electrodes on each semiconductor layer.

상기한 바와 같이 제조 공정을 거쳐 제조된 LED 칩(발광소자)은 전기적 특성 및 발광효율과 같은 성능을 검사하게 되는데, 성능 검사 중 특히 내부에서 발생하는 누설 전류는 소자의 안정성, 수명, 열화 등과 밀접한 연관이 있기 때문에 발광소자 제품의 신뢰성에 커다란 영향을 미치는 요인으로 평가된다.As described above, the LED chip (light emitting device) manufactured through the manufacturing process is inspected for performance such as electrical characteristics and luminous efficiency.In particular, the leakage current generated inside during the performance test is closely related to the stability, lifespan, and deterioration of the device. Because of the association, it is evaluated as a factor that greatly affects the reliability of light emitting device products.

따라서 LED의 제조 공정 자체에 칩 상태인 LED의 성능을 검사하기 위한 공정이 삽입되는데 이 과정을 통하여 누설 전류의 유무를 판단할 수 있게 된다.Therefore, a process for checking the performance of the LED in the chip state is inserted into the LED manufacturing process itself. Through this process, it is possible to determine the presence of leakage current.

이 때, 사용되는 장비는 프로버(prober)인데, 상기 프로버는 LED 칩에 투명전극과 본딩패드와 같은 전기적인 접촉이 형성된 상태에서 전압을 인가한 후 나타나는 전기적인 특성 및 광 특성을 측정할 수 있는 장비이다. At this time, the equipment used is a prober (prober), the prober can measure the electrical and optical characteristics that appear after applying a voltage in the electrical contact such as a transparent electrode and bonding pads formed on the LED chip. Equipment.

즉, 프로버를 사용하여 전압이 인가된 LED 칩의 전류 및 전압을 측정하여 LED 칩의 전기적 특성 및 광 밝기를 검사하게 된다.That is, the electrical characteristics and the light brightness of the LED chip are examined by measuring the current and voltage of the LED chip to which voltage is applied using a prober.

도 1은 종래의 장치를 나타낸 종단면도로써, 상기 프로버에서, 측정될 LED 칩은 턴테이블(1)에 소정의 각도로 설치된 초경블럭(2)의 상면에 로딩(loading)되는데, 상기 초경블럭(2)의 내부에는 LED 칩(3)을 진공압력에 의해 고정시키기 위한 진공 홀(4)이 형성되어 있다.1 is a longitudinal cross-sectional view of a conventional device, in which the LED chip to be measured is loaded on the upper surface of the cemented carbide block 2 installed at a predetermined angle on the turntable 1. In the inside of 2), the vacuum hole 4 for fixing the LED chip 3 by the vacuum pressure is formed.

그리고 상기 초경블럭(2)의 상부에는 다수 개의 블레이드(6)를 갖는 프로브 카드(probe card)(5)가 위치하는데, 상기 프로브는 LED 칩(3)에 전류/전압을 인가하는 전극으로써 기능을 하며, LED 칩(3)의 상면에는 도 2에 나타낸 바와 같이 블레이드(6)가 전기적으로 접촉하는 접속단자(7)가 2군데 형성되어 있다. In addition, a probe card 5 having a plurality of blades 6 is positioned on the cemented carbide block 2, and the probe functions as an electrode for applying current / voltage to the LED chip 3. On the upper surface of the LED chip 3, as shown in Fig. 2, two connection terminals 7 are formed in which the blades 6 are in electrical contact with each other.

상기 LED 칩(3)은 인가전압이 증가하면 동작전류도 증가하는데, LED 칩(3)이 불량품인 경우 누설전류로 인하여 동작전류 값이 소정 값을 초과하게 되므로 기준이 되는 LED 칩(3)의 전압/전류곡선을 참조하여 불량품인 발광소자를 확인할 수 있게 된다.When the applied voltage increases, the LED chip 3 also increases the operating current. When the LED chip 3 is defective, the operating current value of the LED chip 3 exceeds a predetermined value due to leakage current. The defective light emitting device can be identified by referring to the voltage / current curve.

따라서 턴테이블(1)에 설치된 각 초경블럭(2)의 상면에 픽커(pick)(도시는 생략함)를 이용하여 테스트할 LED 칩(3)을 로딩(loading)한 다음 진공 홀(4)을 통해 진공압을 걸면 LED 칩(3)이 초경블럭(2)의 상면에 흡착 고정된다.Therefore, the LED chip 3 to be tested is loaded on the upper surface of each cemented carbide block 2 installed in the turntable 1 by using a picker (not shown), and then, through the vacuum hole 4. When the vacuum is applied, the LED chip 3 is fixed to the upper surface of the cemented carbide block 2 by suction.

이러한 상태에서 프로브 카드(5)가 하강하여 블레이드(6)가 LED 칩(3)의 각 접속단자(7)에 접속된 다음 전압을 인가하면 LED 칩(3)이 발광하게 되므로 테스터(도시는 생략함)에서 LED 칩(3)의 전기적인 특성 및 광 특성을 테스트하여 양품인지 불량품인지를 설정된 시간동안 테스트를 실시하게 된다.
In this state, when the probe card 5 descends and the blade 6 is connected to each connection terminal 7 of the LED chip 3 and then applies a voltage, the LED chip 3 emits light, so that the tester (not shown) The electrical and optical characteristics of the LED chip 3 is tested to test whether the product is good or defective for a set time.

그러나 이러한 종래의 장치는 테스트할 LED 칩을 초경블럭의 상면에 로딩한 상태에서 프로브 카드의 블레이드를 LED 칩의 형성된 각 접속단자에 접속하여 전기적인 특성 및 광 특성을 테스트하는 과정에서 초경블럭의 전기저항 때문에 LED 칩의 전기적인 특성이 저하됨은 물론이고 광의 밝기가 저하되어 테스트 품질이 떨어지는 치명적인 결함이 있었다.However, such a conventional device is connected to the blade of the probe card to each of the formed connection terminal of the LED chip in the state of loading the LED chip to be tested on the upper surface of the cemented block to test the electrical and optical characteristics of the cemented block The resistance not only degraded the electrical characteristics of the LED chip, but also resulted in a fatal defect that reduced the brightness of the light and degraded the test quality.

본 발명은 이와 같은 종래의 문제점을 해결하기 위해 안출한 것으로써, LED 칩을 테스트하는 장치의 구조를 획기적으로 개선하여 LED 칩의 테스트 품질을 향상시킬 수 있도록 하는데 그 목적이 있다.
The present invention has been made to solve such a conventional problem, the object of the present invention is to significantly improve the structure of the device for testing the LED chip to improve the test quality of the LED chip.

상기 목적을 달성하기 위한 본 발명의 형태에 따르면, 세라믹재질로 이루어지고 턴테이블에 일정 각도 유지되게 고정되는 복수 개의 블록과, 상기 블록의 상면에 위치되어 테스트할 LED 칩이 로딩되는 골드블록과, 상기 블록 및 골드블록에 관통되게 형성되어 진공압이 걸리는 진공 홀과, 상기 턴테이블의 상면에 설치되어 1개의 블레이드는 LED 칩의 상면에 형성된 접속단자에 접속되고, 다른 1개의 블레이드는 LED 칩이 로딩된 골드블록의 상면에 접속되는 프로브 카드로 구성된 것을 특징으로 하는 엘이디 칩의 테스트장치가 제공된다.
According to an aspect of the present invention for achieving the above object, a plurality of blocks made of a ceramic material and fixed to be maintained at an angle to the turntable, a gold block placed on the upper surface of the block and the LED chip to be tested, and A vacuum hole is formed to penetrate the block and the gold block to apply vacuum pressure, and one blade is connected to a connection terminal formed on an upper surface of the LED chip, and one blade is connected to a connection terminal formed on the upper surface of the LED chip. Provided is a test device for an LED chip comprising a probe card connected to an upper surface of a gold block.

본 발명은 전기저항이 '제로(0)'인 세라믹 블록의 상면에 전기전도도가 가장 높은 금속인 골드블록을 위치함과 동시에 LED 칩의 상, 하부에 접속단자를 형성하여 1개의 블레이드는 상면에 형성된 접속단자와 접속되도록 하고, 나머지 1개의 블레이드는 LED 칩의 하부에 형성된 접속단자와 밀착된 골드블록에 접속되도록 한 상태에서 LED 칩의 전기적인 특성 및 광 특성을 테스트하므로 전기적인 특성 및 광의 밝기를 높여 테스트에 따른 LED 칩의 불량률을 최소화할 수 있는 효과를 얻게 된다.The present invention places a gold block, which is the metal with the highest electrical conductivity, on the top surface of a ceramic block having zero electrical resistance and at the same time forms a connection terminal on the top and bottom of the LED chip so that one blade is placed on the top surface. It is connected to the formed connection terminal, and the other one blade is connected to the gold block in close contact with the connection terminal formed on the bottom of the LED chip in the test the electrical characteristics and optical characteristics of the LED chip, so the electrical characteristics and brightness of the light By increasing, the effect of minimizing the defective rate of the LED chip according to the test is obtained.

도 1은 종래의 장치를 나타낸 종단면도
도 2는 종래의 LCD 칩을 나타낸 평면도
도 3은 본 발명의 장치를 나타낸 종단면도
도 4는 본 발명에 적용되는 LED 칩을 나타낸 평면도Figure 1 is a longitudinal cross-sectional view showing a conventional device
2 is a plan view showing a conventional LCD chip
3 is a longitudinal sectional view showing the device of the present invention;
Figure 4 is a plan view showing an LED chip applied to the present invention

이하, 본 발명을 일 실시예로 도시한 도 3 및 도 4를 참고하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 3 and 4 as an embodiment.

도 3은 본 발명의 장치를 나타낸 종단면도이고 도 4는 본 발명에 적용되는 LED 칩을 나타낸 평면도로써, 본 발명은 턴테이블(11)에 일정 각도 유지되게 고정되는 복수 개의 블록(12)이 절연체인 세라믹재질로 이루어져 있어 LED 칩(13)에 전원을 인가하여 테스트하는 동안 전기저항이 커지는 현상을 근본적으로 차단하도록 되어 있고 상기 블록(12)의 상면에는 테스트할 LED 칩(13)이 로딩되는 골드블록(14)이 위치되어 있다.Figure 3 is a longitudinal sectional view showing the device of the present invention and Figure 4 is a plan view showing an LED chip applied to the present invention, the present invention is a plurality of blocks 12 are fixed to the turntable 11 is maintained at an angle is an insulator It is made of a ceramic material to apply a power to the LED chip 13 to block the phenomenon that the electrical resistance increases during the test and the gold block on which the LED chip 13 to be tested is loaded on the upper surface of the block 12 (14) is located.

이 때, 상기 골드블록(14)의 상면은 연마 처리되어 있는데, 이는 반복 사용으로 골드블록(14)의 상면에 스크래치 등이 발생하여 저항 값이 커질 때 이를 연마하여 재 사용할 수 있도록 하기 위한 것이다.At this time, the upper surface of the gold block 14 is polished, which is intended to be reused by polishing and scratching the upper surface of the gold block 14 by repeated use when the resistance value increases.

본 발명의 블록(12) 및 골드블록(14)에는 종래와 마찬가지로 진공압이 걸려 LED 칩(13)을 테스트하는 동안 LED 칩이 유동되지 않도록 하는 진공 홀(15)이 관통되게 형성되어 있다.In the block 12 and the gold block 14 of the present invention, a vacuum hole 15 is formed through the vacuum hole 15 to prevent the LED chip from flowing during the test of the LED chip 13 as in the prior art.

그리고 상기 턴테이블(11)의 상면에 설치되는 프로브 카드(16)에서 1개의 블레이드(17a)는 종래와 마찬가지로 LED 칩(13)의 상면에 형성된 접속단자(18a)에 접속되도록 되어 있고, 다른 1개의 블레이드(17b)는 종래와는 달리 LED 칩(13)이 로딩된 골드블록(14)의 상면에 접속되어 LED 칩(13)의 저면에 형성되어 골드블록(14)에 접속되는 접속단자(18b)와 전기적으로 통하여지도록 구성되어 있다.In the probe card 16 installed on the upper surface of the turntable 11, one blade 17a is connected to the connection terminal 18a formed on the upper surface of the LED chip 13 as in the prior art, and the other one Unlike the related art, the blade 17b is connected to the upper surface of the gold block 14 loaded with the LED chip 13 unlike the related art, and is formed on the bottom surface of the LED chip 13 to be connected to the gold block 14. And electrically through.

본 발명에 적용되는 LED 칩(13)은 상부에 2개소의 접속단자가 형성된 종래와는 달리 도 4에 나타낸 바와 같이 블레이드(17a)가 직접 접속되는 접속단자(18a)가 상면에 1개소, 그리고 골드블록(14)과 접속되는 1개소의 접속단자(18b)가 LED 칩(13)의 저면에 형성되어 있다.Unlike the conventional LED chip 13 having two connection terminals formed thereon, the connection terminal 18a to which the blade 17a is directly connected as shown in FIG. One connection terminal 18b connected to the gold block 14 is formed on the bottom surface of the LED chip 13.

이와 같이 구성된 본 발명의 장치를 이용하여 LED 칩을 테스트하는 과정에 대하여 설명하면 다음과 같다.Referring to the process of testing the LED chip using the device of the present invention configured as described above are as follows.

먼저, 턴테이블(11)의 회전으로 LED 칩(13)의 로딩 포지션(도시는 생략함)으로 골드블록(14)이 고정된 블록(12)이 위치하면 픽커(도시는 생략함)가 흡착된 테스트할 LED 칩(13)을 골드블록(14)의 상면에 로딩한 다음 진공압을 해제하게 되므로 LED 칩(13)의 로딩(loading)이 완료된다.First, when the block 12 in which the gold block 14 is fixed to the loading position (not shown) of the LED chip 13 by the rotation of the turntable 11 is positioned, a test in which a picker (not shown) is adsorbed. Since the LED chip 13 is loaded on the upper surface of the gold block 14 and the vacuum pressure is released, the loading of the LED chip 13 is completed.

상기 LED 칩(13)의 로딩이 완료되고 나면 진공 홀(15)을 통해 진공압을 걸어 골드블록(14)의 상면에 LED 칩(13)이 흡착되도록 함으로써, LED 칩(13)의 이동간에 골드블록(14)에서 LED 칩(13)이 이탈되지 않는다.After the loading of the LED chip 13 is completed, the vacuum pressure is applied through the vacuum hole 15 to allow the LED chip 13 to be adsorbed on the upper surface of the gold block 14, thereby allowing the gold to move between the LED chips 13. In block 14 the LED chip 13 is not separated.

이러한 LED 칩(13)의 로딩과정은 종래의 테스트 방법과 동일하게 이루어진다.The loading process of the LED chip 13 is performed in the same manner as the conventional test method.

이와 같이 LED 칩(13)의 로딩 포지션에서 각 골드블록(14)의 상면에 로딩한 상태에서 턴테이블(11)이 소정의 각도만큼 회전을 하여 테스트 포지션으로 도달하면 프로브 카드(16)가 하강하여 1개의 블레이드(17a)는 LED 칩(13)의 상면에 형성된 접속단자(18a)에 접속됨과 동시에 다른 1개의 블레이드(17b)는 골드블록(14)에 접속되지만, LED 칩(13)의 저면에 형성된 접속단자(17b)는 전기저항이 가장 낮은 금속인 골드블록(14)에 접속되어 있어 LED 칩(13)에 전원이 인가된다.As described above, when the turntable 11 rotates by a predetermined angle and reaches the test position in the state where the LED chip 13 is loaded on the upper surface of each gold block 14, the probe card 16 is lowered. Two blades 17a are connected to the connection terminal 18a formed on the upper surface of the LED chip 13 and the other blade 17b is connected to the gold block 14, but is formed on the bottom surface of the LED chip 13 The connection terminal 17b is connected to the gold block 14, which is the metal having the lowest electrical resistance, so that power is applied to the LED chip 13.

이에 따라, LED 칩(13)이 최대한의 성능을 발휘하면서 발광하게 되므로 테스터(도시는 생략함)에서 LED 칩(13)의 전기적인 특성 및 광 특성을 테스트하여 양품인지 불량품인지를 설정된 시간동안 테스트를 실시하게 되는 것이다.Accordingly, since the LED chip 13 emits light while exhibiting maximum performance, the tester (not shown) tests the electrical and optical characteristics of the LED chip 13 to test whether the product is defective or defective for a set time. Will be performed.

본 발명의 기술사상은 상기한 바람직한 실시예에 따라 구체적으로 기술되었으나, 전술한 실시예들은 그 설명을 위한 것이며, 그 제한을 위한 것이 아님을 주의하여야 한다.Although the technical spirit of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiments are for the purpose of description and not of limitation.

또한, 본 발명의 기술분야에서 통상의 전문가라면 본 발명의 기술사상의 범위 내에서 다양하게 변화하여 실시할 수 있음은 이해 가능한 것이다.In addition, it will be understood by those skilled in the art that various changes can be made within the scope of the technical idea of the present invention.

11 : 턴테이블 12 : 블록
13 : LED 칩 14 : 골드블록
15 : 진공 홀 16 : 프로브 카드
17a, 17b : 블레이드 18a, 18b : 접속단자11: turntable 12: block
13: LED chip 14: Gold Block
15: vacuum hole 16: probe card
17a, 17b: blade 18a, 18b: connection terminal

Claims (2)

턴테이블(11)의 상면에 프로브 카드(16)를 설치하여 1개의 블레이드(17a)는 LED 칩(13)의 상면에 형성된 접속단자(18a)에 접속하고, 다른 1개의 블레이드(17b)는 LED 칩(13)이 로딩된 블록의 상면에 접속되도록 하여 LED 칩의 특성을 테스트하는 엘이디 칩의 테스트장치에 있어서, 턴테이블(11)에 세라믹재질로 이루어진 복수 개의 블록(12)을 일정 각도 유지되게 고정하고 상기 블록의 상면에는 테스트할 LED 칩(13)이 로딩됨과 동시에 상면을 연마하여 재사용하는 골드블록(14)을 고정하며 상기 블록(12) 및 공드블록(14)에는 진공압이 걸리는 진공 홀(15)을 관통되게 형성하여서 된 것을 특징으로 하는 엘이디 칩 테스트장치.The probe card 16 is provided on the upper surface of the turntable 11 so that one blade 17a is connected to the connection terminal 18a formed on the upper surface of the LED chip 13, and the other blade 17b is the LED chip. In the LED chip test apparatus for testing the characteristics of the LED chip so that the (13) is connected to the upper surface of the loaded block, the plurality of blocks (12) made of ceramic material are fixed to the turntable 11 to be maintained at an angle At the same time, the LED chip 13 to be tested is loaded on the upper surface of the block, and the gold block 14 for polishing and reusing the upper surface is fixed, and the vacuum hole 15 is applied to the block 12 and the cold block 14. LED chip test apparatus, characterized in that formed through). 삭제delete
KR1020110025428A 2011-03-22 2011-03-22 Led chip of testing apparatus KR101084532B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506752A (en) 1996-12-12 2001-05-22 ジージービー インダストリーズ，インコーポレーテッド Probe card for high-speed test
KR100969975B1 (en) * 2010-04-05 2010-07-15 (주)큐엠씨 Led chip sorting apparatus and calibration unit therein

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001506752A (en) 1996-12-12 2001-05-22 ジージービー インダストリーズ，インコーポレーテッド Probe card for high-speed test
KR100969975B1 (en) * 2010-04-05 2010-07-15 (주)큐엠씨 Led chip sorting apparatus and calibration unit therein

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