KR101081490B1 - Manufacturing method of heat emmiting part for led lamp - Google Patents

Abstract

The present invention relates to an LED lamp having an improved heat dissipation function, and more particularly, an LED module having a plurality of LEDs disposed on a front surface of a PCB board, and plastic diffusion for changing an LED point light source of the LED module into a surface light source. A heat dissipation unit for dissipating heat generated by the LED module primarily, a heat dissipation unit for finally dissipating remaining heat after heat dissipation in the heat dissipation unit, and the heat dissipation unit and a heat dissipation unit to be protected. It is formed in a cylindrical shape, the outer heat dissipation unit accommodated therein and the exterior ventilation unit having a ventilation structure so that the outside air flows into the heat dissipation unit, and the AC power introduced through the socket unit grounded with the heat dissipation unit and the DC unit to drive the LED module The heat dissipation unit and the heat dissipation unit of the LED lamp composed of a power PCB for converting power into aluminum (Al) or in the injection-molded injection molding using a thermally conductive resin The present invention relates to an LED lamp which maximizes heat dissipation effect by directly inserting copper (Cu).

LED, heat conductive resin, aluminum, copper, injection molding, cylinder, heat dissipation

Description

Manufacturing method of heat radiating part for LED etc. {MANUFACTURING METHOD OF HEAT EMMITING PART FOR LED LAMP}

The present invention relates to a heat dissipation part manufacturing method for improving the heat dissipation function of the LED lamp so that the heat generated from the LED light source to effectively radiate heat to the outside, to extend the life of the LED product.

Generally, incandescent lamp is a light source that gets light by temperature radiation while filament wire is heated to high temperature when the filament wire is put in a glass of vacuum. Gas is added to suppress evaporation, prolonging life. Ordinary incandescent lamps, which emit light close to natural light, can reduce eye fatigue, and are easily detachable to sockets, which is one of the most widely used lamps for many years since fluorescent lamps were devised by Edison. It has the disadvantage of low thermal efficiency because it is emitted as heat and only part of it is used as light.

Light emitting diode (LED) is a light source using light emitting phenomenon generated when voltage is applied to a semiconductor. Its brightness has been improved enough to be used for lighting due to technological developments over the last few years, and it consumes less power than incandescent bulbs. Its long life span is bright, bright, and it is expected to be used for general light bulbs.

However, such an LED also has a problem caused by heat, and by dissolving the adhesive component of the ground portion of the component by the heat generated from the LED light source causes a problem of malfunction and shortened life.

In order to solve such a problem, a method of increasing the maximum heat dissipation efficiency is considered first, and for this purpose, it is necessary to have a technical configuration to dissipate heat generated from the LED light source to the outside as possible.

Conventionally, various heat sinks have been proposed to increase heat dissipation, and heat sinks may be made of copper, which has high thermal conductivity, but there are certain limitations in changing the heat sink. In order to use a high material, there was a problem that the industrial availability is lowered due to an increase in manufacturing cost.

Therefore, the LED product having high industrial conductivity should be presented by efficiently heat dissipating heat generated from the LED light source to the outside and lowering the manufacturing cost.

In order to solve the above problem, the present invention injection molding the heat dissipation unit using a thermally conductive resin having a high thermal conductivity, and the aluminum (Al) or copper (Cu) which is a metal with high thermal conductivity to the injection molded injection molding as described above. By inserting directly, the manufacturing cost is much lower and the thermal conductivity is higher than the case of manufacturing heat sink using copper etc., and the heat generated from the LED light source can be radiated to the outside efficiently, which can increase the life of LED products. It is an object of the present invention to provide a method for manufacturing a heat dissipation unit that can improve the heat dissipation function of the LED lamp.

In order to achieve the above object, the present invention is a LED module having a plurality of LEDs disposed on the front surface of the PCB substrate, a plastic diffuser for changing the LED point light source of the LED module to a surface light source, and in the LED module It is formed in a cylindrical shape so as to receive and protect the heat dissipation unit for dissipating the heat generated primarily, a heat dissipation unit for finally dissipating the remaining heat after heat dissipation in the heat dissipation unit, and to receive and protect the heat dissipation unit and the heat dissipation unit. Exterior vents having a ventilation structure so that draft air flows into the heat dissipation unit and the heat dissipation unit, and a power PCB for converting AC power introduced through the socket unit grounded with the heat dissipation unit to DC power so that the LED module is driven. As about heat radiation part manufacturing to use for a configured LED lamp,

The heat dissipation part is an injection molded product in which a thermally conductive resin is integrally formed outside the aluminum (Al) or copper (Cu) cylindrical tube by injection molding the thermally conductive resin out of the aluminum (Al) or copper (Cu) cylindrical tube prepared in the injection mold. ,

The injection molding is a drying step of drying the thermally conductive resin at 145 ~ 150 ℃ for 4 to 6 hours,

After injecting the thermally conductive resin into the cylinder of the injection machine having a temperature of the rear end connected to the hopper is 270 ~ 300 ℃, the temperature of the stop 280 ~ 305 ℃, the front end of the nozzle attached is 295 ~ 315 ℃ An injection step of injecting into a mold mounted on an injection molding machine through a nozzle having a pressure of 6.2 to 13.8 MPa and a resin melting temperature of 305 to 330 ° C. at a rotation speed of 50 to 150 rpm at a screw rotation speed of 305 to 330 ° C .;

Pressure holding step to prevent deformation of the shape due to excessive shrinkage and rapid shrinkage of the injection molded product by applying a pressure of 2.1 ~ 6.9 MPa with the injection molded product,

A cooling step of cooling the molded article in the mold having undergone the holding step at 45 to 60 ° C. for 40 to 60 seconds,

The manufacturing method of the heat dissipation part used for the LED lamp which comprises the mold release step which removes the injection molded product which passed the said cooling process from a metal mold | die shall be a main technical structure.

As described above, the LED lamp having improved heat dissipation function according to the present invention reduces the manufacturing cost by injection molding a heat dissipation unit having a heat dissipation function using a thermally conductive resin, thereby increasing the industrial applicability and using the heat conductive resin. It is easy to manufacture by inserting aluminum (Al) or copper (Cu) with high thermal conductivity directly into the thermal conductive resin during the injection process, while maximizing thermal conductivity, so that the heat generated from the LED light source is effectively radiated to the outside. It can provide LED lamp with low failure rate and long life.

Hereinafter, a detailed description of the technical configuration will be described with reference to the accompanying drawings.

As shown in FIG. 1, the LED lamp 1 having improved heat dissipation function according to the present invention includes an LED module 10 having a plurality of LEDs disposed on a front surface of a PCB substrate, and the LED module 10. Plastic diffusion unit 20 for converting the LED point light source of the surface light source, and the heat dissipation unit 30 for dissipating heat generated by the LED module 10 primarily, and the heat dissipation unit 30 After the heat dissipation unit 40 for finally dissipating the remaining heat and the heat dissipation unit 30 and the heat dissipation unit 40 is formed in a cylindrical shape to be protected, and the heat dissipation unit 30 accommodated therein and The exterior vent part 50 having a ventilation structure to allow the draft air to flow into the heat dissipation part 40, and the AC power introduced through the socket part 61 to be grounded with the heat dissipation sinusoid part 30 so that the LED module is driven. It consists of a power PCB 60 which converts into electric power. In addition, the LED module 10 includes a half arc-shaped aluminum reflecting plate 21 having a plurality of LED reflecting grooves formed on the front surface thereof so as to be inserted into and coupled with the plurality of LEDs.

As described above, in the case of the LED light (1) is not able to effectively remove the heat generated from the light source, the defects of the product occurs while the deformation caused by the heat occurs in the coupling portion between the components constituting the LED light (1), This causes a problem of shortening the product life of the LED lamp.

Therefore, the technical configuration for effectively radiating heat generated from the light source should be included, and in the present invention, the heat dissipation shin unit 30 and the heat dissipation unit 40 have a heat dissipation function.

The heat dissipation new casting unit 30 and the heat dissipation unit 40 may be expected to have a high heat dissipation effect by using a product having high thermal conductivity such as copper, but in this case, the price of the product is increased due to an increase in the manufacturing cost. Since the availability of the phase is very low, the thermal conductivity should be increased and the industrial availability should be increased.

Therefore, in the present invention, in the production of the heat dissipation stretching unit 30 and the heat dissipation unit 40 using a thermally conductive polymer, injection molding by inserting an aluminum (Al) or copper (Cu) cylindrical tube into the thermally conductive polymer. The cylindrical tube and the thermally conductive polymer are integrated to provide a heat dissipation stretch unit 30 and a heat dissipation unit 40 that are easy to manufacture and have high thermal conductivity. 30) and a low failure rate of the product according to the increase in the heat radiation effect of the heat dissipation unit 40 to provide a long life LED lamp.

Injection molding of the heat dissipation shin unit 30 and the heat dissipation unit 40 is made through the following process.

First, the injection molding uses a general injection machine comprising a screw mounted inside the cylinder, a hopper for injecting the injection material into the cylinder, and a nozzle for injecting the injection material changed into a liquid into the mold into the mold. do.

The injection molding is composed of a drying step, an injection step, a packing step, a cooling step, and a release step.

Drying stage

Drying the thermally conductive resin used in the injection molding before injection molding, it is made for 4 to 6 hours at 145 ~ 150 ℃. If the thermally conductive resin in the drying step is not dried for 4 to 6 hours at 145 ~ 150 ℃, a problem occurs that bubbles are generated on the surface of the injection molded article using the resin, the drying temperature in the drying step And the time is preferably maintained for 4 to 6 hours at 145 ~ 150 ℃.

Injection stage

The injection step is a process of injecting a thermally conductive resin supplied through a hopper into a liquid phase through melting in a cylinder, and then injecting it into a mold mounted on an injection machine. have.

This is because defects and properties of the molded article may vary according to such conditions, and the mold temperature also greatly affects the molded article because the mold temperature determines the flow of the resin in the mold.

Specifically, as the temperature gradient in the cylinder of the injection machine, the rear end 270 ~ 300 ℃, the stop 280 ~ 305 ℃ connected to the hopper for supplying the thermal conductive resin, the front end portion 295 ~ 315 ℃ with a nozzle, the temperature of the nozzle The thermally conductive resin is injected into a cylinder having a temperature of 305 to 330 ° C., and the mold is mounted to the injection molding machine with the thermally conductive resin at a screw rotation speed of 50 to 150 rpm at a pressure of 6.2 to 13.8 MPa and a melt temperature of 305 to 330 ° C. Inject in.

If the temperature of the cylinder is maintained at a temperature lower than the temperature specified at the rear end 270 ~ 300 ℃, the stop 280 ~ 305 ℃, the front end of the nozzle attached 295 ~ 315 ℃, which is the temperature of the cylinder, The problem may occur, such as a screw breakage, and when the temperature is higher than the designated temperature, the strength of the injection molded product is lowered and discoloration occurs. Therefore, the cylinder temperature is preferably maintained within the above range.

More specifically, the internal temperature of the cylinder at the point where the thermally conductive resin is supplied through the hopper is 280 ° C, the temperature of the front end portion adjacent to the nozzle is 300 ° C, and the temperature in the remaining cylinder is maintained at 290 ° C. . And the temperature of the nozzle for injecting liquid thermally conductive resin into a metal mold | die is 310 degreeC.

In addition, when the injection pressure is less than 6.2MPa, the molding is not performed well, and the molding surface of the injection molded product is formed irregularly, and when the injection pressure exceeds 13.8 MPa, a change in the size of the injection molded product occurs. Since the production of the product is not made according to the standard, the injection pressure is preferably maintained in the range of 6.2 ~ 13.8 MPa.

The resin used in the injection molding is a thermal conductive resin, specifically, thermal conductivity (Termal Conductivity) 6 W / mK, Thermal Diffusivity 0.0322 ㎠ / sec, Specific Heat 0.963 J / g ℃, Tensile Modulus 17,500 MPa, Tensile Strength 70 Mpa, Flexural Modulus 17,500 Mpa, Flexural Strength 129 MPa, Density 1.71 g / cc Polyphenylene Sulfide is used.

In the mold, an aluminum (Al) or copper (Cu) cylindrical tube is prepared in advance, and molten thermally conductive polymer is injected into the aluminum (Al) or copper (Cu) cylindrical tube to inject the aluminum (Al). Alternatively, the thermally conductive polymer is integrally formed outside the copper (Cu) cylindrical tube.

The aluminum (Al) or copper (Cu) cylindrical tube is a hollow tube in which one side is sealed.

Packing step

The pressure holding step is a process of applying a predetermined pressure to a molded article that has already been injected for a predetermined time from the end of the injection process to prevent deformation of the shape due to excessive shrinkage and rapid shrinkage of the injection molded product. 2.1 to 6.9 MPa, more specifically 5.2 MPa pressure.

Cooling stage

The cooling step is to cool the molten resin at high heat after the thermal conductive resin is completely filled in the space inside the mold through the holding step. In this case, rapid cooling causes excessive shrinkage, and the quality of the molded product can be guaranteed through proper cooling temperature and cooling time. The cooling temperature and the cooling time is for 40 seconds to 60 seconds at 45 ~ 60 ℃, more specifically the cooling temperature of 50 ℃ for 40 seconds.

Release step

The release step is a step of removing the injection molding cooled and filled in the mold space from the mold, the release can be released using an eject pin, using compressed air or through an eject plate.

The precautions in this release step is that if the injection molded product does not undergo a sufficient cooling process, marks on the surface of the injection molded product may lead to product defects during release, so it is desirable to proceed after sufficient cooling during release. Do.

In this way, injection molding is performed using a thermally conductive polymer, followed by a drying step, an injection step, a packing step, a cooling step, and a release step. The 1cycle time of the remaining steps except for the drying step is performed within 1 minute 30 seconds to 2 minutes. .

1 is an exploded perspective view showing an LED lamp with improved heat dissipation function according to the present invention.

2 is a flow chart showing an injection process according to the present invention.

Description of the Related Art [0002]

10: LED module

20: plastic diffusion

30: heat dissipation

40: heat dissipation unit

50: appearance vent

60: power PCB

Claims (2)

A LED module 10 having a plurality of LEDs disposed on the front surface of the PCB board, a plastic diffuser 20 for converting the LED point light source of the LED module 10 into a surface light source, and the LED module 10 Heat dissipation stretch unit 30 for dissipating heat generated by the primary heat radiation, the heat dissipation unit (30) and the heat dissipation unit (30) and finally dissipate the remaining heat after heat dissipation in the heat dissipation unit (30); It is formed in a cylindrical shape to receive and protect the heat dissipation unit 40, and the exterior ventilation unit 50 having a ventilation structure so that the draft air flows into the heat dissipation shin unit 30 and the heat dissipation unit 40 accommodated therein, and Manufacturing the heat dissipation unit 40 to be used in the LED lamp consisting of a power PCB (60) for converting the AC power introduced through the socket portion 61 and the DC power so as to be grounded with the heat dissipation Shinjube (30). In that, An injection molded product in which a thermally conductive resin is integrally formed outside an aluminum (Al) or copper (Cu) cylindrical tube by injection molding the thermally conductive resin out of an aluminum (Al) or copper (Cu) cylindrical tube prepared in an injection mold. The injection molding is a drying step of drying the thermally conductive resin at 145 ~ 150 ℃ for 4 to 6 hours, After injecting the thermally conductive resin into the cylinder of the injection machine having a temperature of the rear end connected to the hopper is 270 ~ 300 ℃, the temperature of the stop 280 ~ 305 ℃, the front end of the nozzle attached is 295 ~ 315 ℃ An injection step of injecting into a mold mounted on an injection molding machine through a nozzle having a pressure of 6.2 to 13.8 MPa and a resin melting temperature of 305 to 330 ° C. at a rotation speed of 50 to 150 rpm at a screw rotation speed of 305 to 330 ° C .; Pressure holding step to prevent deformation of the shape due to excessive shrinkage and rapid shrinkage of the injection molded product by applying a pressure of 2.1 ~ 6.9 MPa with the injection molded product, A cooling step of cooling the molded article in the mold having undergone the holding step at 45 to 60 ° C. for 40 to 60 seconds, Method for manufacturing a heat dissipation unit for LED lamps, characterized in that it comprises a release step of removing the injection molded product from the cooling step from the mold. The method according to claim 1, The thermal conductive resin has a thermal conductivity of 6 W / mK, a thermal diffusivity of 0.0322 ㎠ / sec, a specific heat of 0.963 J / g ° C, a tensile modulus of 17,500 MPa, and a tensile strength of tensile. Heat dissipation part for LED lamp which is characterized by 70 Mpa, Flexural Modulus 17,500 Mpa, Flexural Strength 129 MPa, Density 1.71 g / cc Polyphenylene Sulfide Manufacturing method.

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