KR101069878B1 - Lighting apparatu using light emitting diode - Google Patents

Abstract

A lighting apparatus using a light emitting diode is provided. A lighting apparatus using a light emitting diode may include a printed circuit board having a light emitting diode attached thereto, a first reflective sheet attached to a region other than a region having the light emitting diode attached on an upper surface of the printed circuit board, and coupled to the printed circuit board. A fixing member, a heat dissipation body coupled to the fixing member, and having a heat dissipation fin for heat dissipation, and a heat dissipation plate coupled to the heat dissipation body and transmitting light emitted from the light emitting diodes, wherein the fixing member and the heat dissipation body include: A heat dissipation coating for cooling the surface of the heat dissipation body is treated, and the heat dissipation coating is performed using a composite binder resin in which nano-sized inorganic thermal filler particles are highly dispersed in a thermally conductive functional resin. The composite binder resin has heat generated from the light emitting diode and the printed circuit board. Due to the thermal vibration between the inorganic filler particles and the thermal diffusion effect of the thermally conductive functional resin is to be emitted to the outside by radiation.

Description

Lighting device using light emitting diodes {LIGHTING APPARATU USING LIGHT EMITTING DIODE}

The present invention relates to a lighting device, and more particularly, to a lighting device using a light emitting diode (LED).

In addition to simply identifying objects, lighting is used to create an interior decoration or a cozy atmosphere, and incandescent or fluorescent lamps are generally used.

Incandescent lamps are simple to attach to lighting, and easy to combine with other lighting fixtures, despite the widespread use of fluorescent lamps, the demand is still high.

Fluorescent lamps are widely used with incandescent lamps because of their relatively high efficiency and long life compared to incandescent lamps that use filaments.

Recently, iodine bulbs, high-efficiency halide lamps, solar lamps, etc. using halogen cycles have been developed and put into practical use.

EL lamps, which are crystal light emitters, have been spotlighted as next-generation light sources as surface light sources, but have not yet reached the practical stage due to problems such as efficiency and light source devices.

In addition, a light emitting diode (hereinafter referred to as “LED”), an optoelectronic device, is used as a lamp.

This LED is applied to various places such as outdoor large billboards, traffic signals, automobile dashboards, medical equipment, warning lights, etc., and has low power consumption, semi-permanent life, and environment-friendly characteristics compared to incandescent and fluorescent lamps. I am in the limelight.

However, the LED has good straightness but not good diffusion, so it is not easy to use as a lighting for indoor lighting.

In addition, conventional lighting fixtures that implement indoor lighting using LEDs have a problem that installation is cumbersome and production costs are increased because a plurality of LEDs are arranged on a predetermined panel so as to exhibit illuminance similar to incandescent or fluorescent lamps. There was this.

In addition, in the case of arranging a plurality of LEDs, there is a problem such that the panel is broken or the life of the LED itself is reduced due to the high heat emitted from each LED, and there is a problem that a secondary mechanism for heat dissipation must be additionally provided. .

Korean Patent No. 10-992647 lighting device

In order to solve the above problems of the prior art, the present invention provides a device that can improve the illuminance of the light using a light emitting diode (hereinafter, referred to as "LED").

In addition, the present invention provides an apparatus capable of efficiently dissipating heat generated from an LED.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood from the following description.

In order to achieve the above object, a lighting apparatus using a light emitting diode according to an aspect of the present invention, a printed circuit board with a light emitting diode, a region other than the region with the light emitting diode attached on the upper surface of the printed circuit board A first reflective sheet to be attached, a fixing member coupled to the printed circuit board, a fixing member coupled to the fixing member, and a heat dissipating body having a heat dissipation fin for heat dissipation, and a heat dissipating body coupled to the heat dissipating body, and configured to transmit light emitted from the light emitting diode. Including a transmission plate, the fixing member and the heat dissipation body is a heat dissipation coating for cooling the surface of the heat dissipation body, the heat dissipation coating is a thermal conductive functional resin of nano-sized inorganic filler (organic thermal fillers) particles It is carried out using a highly dispersed composite binder resin, the composite binder resin is Diodes and so that the radiation emitted to the outside by the heat generated from the circuit board due to the thermal diffusion effect of the thermal vibration and the thermal conductivity between the functional resin, the inorganic filler particles.

In addition, in one aspect of the present invention, the heat dissipation body is attached to the second reflective sheet for reflecting light emitted from the light emitting diode and the light reflected through the first reflective sheet.

In addition, in one aspect of the present invention, the fixing member is attached with a second reflecting sheet for reflecting light emitted from the light emitting diode and the light reflected through the first reflecting sheet.

In addition, in one aspect of the invention, the lighting apparatus using the light emitting diode further includes a converter connected to the printed circuit board to supply power to the light emitting diode, the converter converts the input AC voltage into a DC voltage The voltage is supplied to the light emitting diode, and the voltage supplied to the light emitting diode is controlled by PWM (Pulse Width Modulation).

In order to achieve the above object, a plurality of printed circuit board with a light emitting diode attached, a reflective sheet, a multi-channel heat pipe attached to the remaining area other than the region with the light emitting diode attached on the upper surface of the printed circuit board, the printing A first heat dissipation body including one evaporation region coupled to a bottom surface of the circuit board and a plurality of condensation regions formed around the evaporation region, a second heat dissipation body having heat dissipation fins for heat dissipation, and the printed circuit board; And a converter connected to supply power to the light emitting diode, wherein the first heat dissipation body and the second heat dissipation body are integrally formed, and a heat dissipation coating for cooling each surface is processed, and the heat dissipation coating is nano. Composite Binders with High Dispersion of Inorganic Thermal Filler Particles in Thermally Conductive Functional Resin And the composite binder resin allows heat generated from the light emitting diode and the printed circuit board to be released to the outside by radiation due to thermal vibration between the inorganic filler particles and the thermal diffusion effect of the thermally conductive functional resin. ..

In another aspect of the present invention, the evaporation zone is combined with the lower surface of the printed circuit board to absorb heat, and the vapor evaporated by the heat absorbed in the evaporation zone condenses in the condensation zone to release the heat.

Further, in another aspect of the present invention, the evaporation region has a geometric shape and the printed circuit board is coupled to an upper surface of the condensation region.

In addition, the first heat dissipation body has a geometry, and the printed circuit board is coupled to at least one side of the geometry.

Further, in another aspect of the present invention, the second heat dissipation body includes a plurality of hollow areas capable of flowing air therein, and the cross-sectional area of the second heat dissipation body is larger than the cross-sectional area of the first heat dissipation body. .

Further, in another aspect of the present invention, the first heat dissipation body and the printed circuit board are directly or indirectly coupled, the indirect coupling is the printed circuit board is coupled with the fixing member, and the fixing member is the first member. Combined with the heat dissipation body.

In addition, in another aspect of the present invention, further comprising a fixing member coupled to a lower surface of the printed circuit board, and coupled to at least one of the first heat dissipation body and the second heat dissipation body, wherein the fixing member is the heat dissipation coating. A heat pipe is used that contains a working fluid to be processed or to reduce the thermal resistance generated on the printed circuit board.

In addition, in another aspect of the present invention, the lighting device using the light emitting diode is coupled to the second heat dissipation body and the base guard for fixing the converter and the outer periphery of the base guard is coupled to the external power system It further comprises a base connected with.

The converter converts an input AC voltage into a DC voltage and supplies it to the light emitting diode, and controls the voltage supplied to the light emitting diode by PWM (Pulse Width Modulation).

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

However, the present invention is not limited to the embodiments disclosed below, but may be configured in different forms, and the present embodiments are intended to complete the disclosure of the present invention and to provide general knowledge in the technical field to which the present invention belongs. It is provided to fully inform those who have the scope of the invention.

According to one of the problem solving means of the lighting apparatus using the light emitting diode (hereinafter referred to as "LED") of the present invention, it is possible to improve the illuminance of the light using the LED.

In addition, the heat generated from the LED can be efficiently released, and the heat generation performance can be improved to contribute to extending the life of the lighting device using the LED.

1A to 1C illustrate a lighting apparatus using a light emitting diode (LED) according to an embodiment of the present invention.
2A to 2D are views illustrating a lighting apparatus using LEDs according to an embodiment of the present invention.
3A to 3D are views illustrating a lighting device using LEDs according to another embodiment of the present invention.

The present invention may be variously modified and have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail with reference to the accompanying drawings.

However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

For reference, in the entire specification, when a part is said to "include" a certain component, it means that it can further include other components rather than exclude other components unless specifically stated otherwise.

Hereinafter, with reference to the accompanying drawings to describe the specific content for the practice of the present invention.

1A to 1C illustrate a lighting apparatus using a light emitting diode (LED) according to an embodiment of the present invention.

Lighting device 100 using a light emitting diode (LED) according to an embodiment of the present invention is a printed circuit board 110, the first reflective sheet 120, the heat dissipation body 130 ), A second reflective sheet 140, a fixing member 150, a transmission plate 160, and a converter 170.

Referring to each component, the printed circuit board 110 is attached to at least one LED, the upper surface of the printed circuit board 110, as shown in FIG. The first reflective sheet 120 is attached to reflect light emitted from around the LED, particularly behind the LED, thereby improving light efficiency and light brightness.

On the other hand, the heat dissipation body 130 is coupled to the printed circuit board 110, for this purpose, as shown in Figure 1b, a groove 131 that can be coupled with the printed circuit board 110 is formed, the printed circuit board 110 may be inserted into the groove 131.

In addition, the fixing member 150 may be coupled to the heat dissipation body 130 where it is coupled with the printed circuit board 110.

That is, the fixing member 130 is coupled to the heat dissipation body 130, and the bottom surface of the printed circuit board 110 is coupled to the fixing member 150, thereby fixing heat generated from the printed circuit board 110. Release through the member.

For reference, the fixing member 150 may use a heat pipe including a working fluid for reducing the thermal resistance generated on the printed circuit board, thereby dissipating heat more effectively.

In addition, the heat dissipation body 130 may be a heat dissipation fin 132 for the heat dissipation may be formed on the heat dissipation body 130, the heat generated from the printed circuit board 110 can be quickly discharged to the outside through the heat dissipation fin 131. Make sure

In addition, the heat dissipation body 130 may be a heat dissipation coating for cooling the surface of the heat dissipation body.

The heat dissipation coating may be performed using a composite binder resin in which nano-sized inorganic thermal fillers particles are highly dispersed in a thermally conductive functional resin, and the composite binder resin coated on the heat dissipation body 130 is an LED. And heat generated from the printed circuit board 110 may be released to the outside by radiation due to thermal vibration between the inorganic filler particles and the thermal diffusion effect of the thermally conductive functional resin.

Therefore, the heat dissipation body 130 may maximize the release of heat generated from the LED and the printed circuit board 110 through the heat dissipation fin 132 and the heat dissipation coating.

For reference, the above-described heat dissipation coating may also be processed to the fixing member 150.

In addition, the heat dissipation body 130 is attached to the second reflecting sheet 140 reflecting the light emitted from the LED and the light reflected through the first reflecting sheet 120 as shown in Figure 1b to improve the illuminance. Can be.

2A to 2D are views illustrating a lighting device 100 ′ using LEDs according to another embodiment of the present invention.

In FIG. 1A, the heat dissipation body 130 has a long rod shape, while the heat dissipation body 130 illustrated in FIGS. 2A and 2B has a rectangular frame shape.

As shown in FIGS. 2A and 2B, the heat dissipation body 130 and the printed circuit board 110 may be indirectly coupled due to the fixing member 150.

That is, as shown in FIG. 2A, the printed circuit board 110 is coupled to the fixing member 150, and the fixing member 150 is coupled to the heat dissipation body 130, thereby generating the printed circuit board 110. Heat may be conducted to the heat dissipation body 130 through the fixing member 150 to be released.

For reference, as illustrated in FIG. 2C, the printed circuit board 110 may have at least one LED attached thereto, and the first reflective sheet may be formed on the upper surface of the printed circuit board 110 except for the region where the LED is attached. 120 may be attached to reflect light emitted from around the LED, particularly behind the LED, thereby improving light efficiency and light brightness.

In addition, the second reflective sheet 140 may be attached to the inside of the fixing member 150 illustrated in FIG. 2A to reflect light reflected through the first reflective sheet 120 emitted from the LED, thereby improving illuminance. have.

In addition, as shown in FIG. 2B, the fixing member 150 may also include a coupling component for coupling the lighting device 100 ′ using the LED.

Of course, the above-described heat dissipation coating may also be processed to the fixing member 150 shown in FIG. 2B to release heat.

On the other hand, the transmission plate 160 is coupled to the heat dissipation body 130, and includes light emitted from the LED (more specifically, the light reflected through the first reflective sheet 120 and the second reflective sheet 140). ), And the diffusion of light through the transmission plate 160 may be increased.

On the other hand, the converter 170 is connected to the printed circuit board 110 to supply power to the LED.

The converter 170 converts an input AC voltage into a DC voltage and supplies the same to the LED, and controls the voltage supplied to the LED to control pulse width modulation (PWM).

3A to 3D are views illustrating a lighting device using LEDs according to another embodiment of the present invention.

Lighting device 200 using an LED according to another embodiment of the present invention is a plurality of printed circuit board 210, a reflective sheet 220, a first heat dissipation body 231, a second heat dissipation body 232, a converter 240, a base guard 250, a base 260, a reflector 270, a reflector holder 280, and a fixing member 290.

Referring to each component, a plurality of printed circuit board 210 may be present as shown in Figure 3a and 3b, a plurality of LED is attached to the upper surface of each printed circuit board 210.

In addition, on the upper surface of the printed circuit board 210, the reflective sheet 220 is attached to the remaining areas other than the area to which the LED is attached, thereby reflecting light emitted around the LED, particularly behind the LED, thereby improving light efficiency and light. Can improve the brightness.

Meanwhile, the first heat dissipation body 231 is coupled to the printed circuit board 210.

The first heat dissipation body 231 may have a geometric shape, and may include a plurality of hollow regions therein to increase efficiency of heat dissipation.

The printed circuit board 210 may be coupled to at least one surface of the first heat dissipation body 231 having a geometrical shape, as shown in FIGS. 3A and 3C.

In this case, the first heat dissipation body 231 and the printed circuit board 210 may be directly or indirectly combined.

In this case, the direct coupling may be directly coupled to the printed circuit board 210 with the first heat dissipation body 231, and the indirect coupling may be such that the printed circuit board 210 is coupled with the fixing member 290 and the fixing member 290. ) May be combined with the first heat dissipation body 231.

For reference, the fixing member 290 may be subjected to the above-described heat dissipation coating, it is also possible to use a heat pipe containing a working fluid for reducing the heat resistance generated on the printed circuit board 210, the heat dissipation coating May be processed.

On the other hand, as shown in Figure 3c, the upper surface of the first heat dissipation body 231 may be blocked, in this case, the printed circuit board 210 directly on the upper surface without using the fixing member 290 separately Can be combined.

If the hollow region is formed on the top surface of the first heat dissipation body 231 like the second heat dissipation body 232, the fixing member 290 is coupled to the top surface of the first heat dissipation body 231, and the fixing member ( The lower surface of the 290 and the printed circuit board 210 may be combined.

In addition, the first heat dissipation body 231 includes an evaporation region 231a coupled to the bottom surface of the printed circuit board 210 and a plurality of condensation regions 231b formed around the evaporation region, as shown in FIG. 3D. can do.

Here, the evaporation region 231a is combined with the lower surface of the printed circuit board 210 to absorb heat, and the vapor evaporated by the heat absorbed in the evaporation region may condense in the condensation region 231b to release heat.

Meanwhile, the second heat dissipation body 232 may include a plurality of heat dissipation fins 232a for heat dissipation around the outer circumference of the second heat dissipation body 232, and a plurality of hollow areas in which air may flow. (232b) can increase the efficiency of heat dissipation.

The first heat dissipation body 231 and the second heat dissipation body 232 may be integrally formed as shown in FIG. 3C, and each surface of the first heat dissipation body 231 and the second heat dissipation body 232 is cooled. A heat dissipation coating for the purpose can be treated.

The heat dissipation coating is the same as the contents of the heat dissipation body 130 described with reference to FIGS. 1A to 1C and thus will be omitted.

For reference, as shown in FIG. 3C, the cross-sectional area of the second heat dissipation body (the cross-sectional area including the length of the heat dissipation fin 232a) may be larger than that of the first heat dissipation body.

Meanwhile, the converter 240 is connected to each of the plurality of printed circuit boards 210 to supply power to the LEDs.

The converter 170 converts an input AC voltage into a DC voltage and supplies the same to the LED, and controls the voltage supplied to the LED to control pulse width modulation (PWM).

On the other hand, the base guard 250 is coupled to the second heat dissipation body 232 and serves to receive and secure the converter 170.

Meanwhile, the base 260 may be coupled to the outer circumference of the base guard 250 and connected to an external power system.

On the other hand, the transmissive body 270 is coupled to the transmissive holder 280, the light emitted from the LED (more specifically, the degree of light reflected through the reflective sheet 220 attached to the upper surface of each printed circuit board 210) It includes), in this case, the diffusing property of the light through the transmission body 270 can be increased.

Meanwhile, the transmission holder 280 may be coupled between the first heat dissipation body 231 and the second heat dissipation body 232 to fix the transmission body.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments.

The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

100: lighting device using LED according to an embodiment of the present invention
110: printed circuit board
120: first reflective sheet
130: the heat dissipation body, 131: the groove to which the printed circuit board is bonded, 132: heat dissipation fin
140: second reflective sheet
150: fixed member
160: transmission plate
170: converter
200: lighting device using LED according to another embodiment of the present invention
210: printed circuit board
220: reflective sheet
231: first heat dissipation body, 231a: evaporation zone, 231b: condensation zone
232: second heat dissipation body, 232a: heat dissipation fin
240: converter
250: Base Guard
260: Base
270 reflector
280: Reflector Holder
290: fixed member

Claims (13)

In a lighting device using a light emitting diode,
Printed circuit board with light emitting diode attached,
A first reflective sheet attached to a region other than the region to which the light emitting diode is attached on an upper surface of the printed circuit board,
A fixing member coupled to the printed circuit board and attached with a second reflective sheet for reflecting light emitted from the light emitting diode and light reflected through the first reflective sheet;
A heat dissipation body coupled with the fixing member and having a heat dissipation fin formed on the outside for dissipation;
A transmission plate coupled to the heat dissipation body and transmitting light emitted from the light emitting diode;
A converter connected to the printed circuit board to convert an input AC voltage into a DC voltage to supply the light emitting diode, and to control the voltage supplied to the light emitting diode to PWM (Pulse Width Modulation)
It includes, but the fixing member and the heat dissipation body is a heat dissipation coating is treated to cool the surface, the heat dissipation coating is a composite binder in which the nano-sized inorganic thermal fillers (inorganic thermal fillers) particles highly dispersed in the thermally conductive functional resin It is carried out using a resin, wherein the composite binder resin is such that the heat generated from the light emitting diode and the printed circuit board is released to the outside by radiation due to thermal vibration between the inorganic filler particles and the thermal diffusion effect of the thermally conductive functional resin. , Lighting device.
delete delete delete In a lighting device using a light emitting diode,
A plurality of printed circuit boards with light emitting diodes attached,
A reflective sheet attached to a region other than the region to which the light emitting diode is attached on an upper surface of the printed circuit board,
A multi-channel heat pipe, comprising: a first heat dissipation body having a geometric shape and including one evaporation region coupled to a bottom surface of the printed circuit board, and a plurality of condensation regions formed around the evaporation region,
A second heat dissipation body including a plurality of hollow regions capable of flowing air therein and having heat dissipation fins formed around the outer periphery of the heat dissipation;
A converter connected to the printed circuit board and converting an input AC voltage into a DC voltage to supply the LED to the light emitting diode, and controlling a voltage supplied to the light emitting diode to control a pulse width modulation (PWM);
A base guard coupled to the second heat dissipation body to secure the converter,
A base coupled to an outer circumference of the base guard and connected to an external power system;
Transmitter holder coupled between the first heat dissipation body and the second heat dissipation body,
A transmissive member coupled to the transmissive holder and transmitting light emitted from the light emitting diode;
A heat pipe coupled to a bottom surface of the printed circuit board and coupled to at least one of the first heat dissipation body and the second heat dissipation body, the heat pipe including a working fluid for reducing thermal resistance occurring on the printed circuit board. Fixing member
Including,
The evaporation region is combined with the lower surface of the printed circuit board to absorb heat, the vapor evaporated by the heat absorbed in the evaporation region condenses in the condensation region to release the heat,
Each of the first heat dissipation body and the second heat dissipation body has a geometric shape and is integrally formed, and the first heat dissipation body, the second heat dissipation body, and the fixing member are treated with a heat dissipation coating for cooling each surface. It is carried out using a composite binder resin in which silver nano-sized inorganic thermal fillers particles are highly dispersed in a thermally conductive functional resin, wherein the composite binder resin is formed by heat generated from the light emitting diode and the printed circuit board. And to be emitted to the outside by radiation due to thermal vibration between the inorganic filler particles and the thermal diffusion effect of the thermally conductive functional resin. delete delete delete delete delete delete delete delete

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