KR101068505B1 - Apparatus for forming the lead wires - Google Patents

Abstract

Disclosed is a lead wire forming apparatus capable of obtaining a high quality lead wire by installing a cooling device so that the wire can be cooled by water cooling in the middle of vertical movement of the plating bath. The lead wire forming apparatus according to the present invention includes a bobbin in which a wire to be plated is wound and supplied, a softening furnace and a cooling water tank for softening the wire supplied from the bobbin, a flux tank for applying a plus to the softened wire, and a flux coated wire. A plating bath for plating the plate, a cooling device for cooling the plated wire, and a winding unit for winding and completing the completed wire. The cooling device is mounted on the upper surface of the inner cylinder or the outer cylinder and the outer pipe and inner cylinder coupled so that the bottom surface is spaced apart from each other, the through pipe through which the plated wire is further protruded upward from the bottom surface of the inner cylinder and passed from the lower side to the upper side. A guide roll for guiding the coil to the winding portion, a spray nozzle for ejecting coolant to the wire passing through the inner cylinder, a supply pipe supplied from the coolant tank to the spray nozzle, and a coolant used on the bottom surface of the inner cylinder. And a drainage pipe for discharging oil into the cooling water tank and the cooling water drained to the outer cylinder to the cooling water tank.

Description

Lead wire forming device {Apparatus for forming the lead wires}

The present invention relates to a lead wire forming apparatus, and more particularly, to a molding apparatus capable of producing high quality lead wires by cooling the lead wires passed through the stone road without touching them with other objects without shaking.

In general, a lead wire used to manufacture a diode or a resistor is used by plating a melt containing tin as a main component on a copper core wire (wire) to a predetermined thickness.

1 is a schematic process diagram showing a lead wire manufacturing method according to the prior art, as shown in FIG. 1, several strands of wires are simultaneously supplied from the bobbin 110 and heat-treated (annealed) while passing through the softening furnace 120. Each heat-treated wire is water cooled while passing through the cooling water tank 121. The wires of the several strands heat-treated in this way are pickled and washed to remove foreign matters that have accumulated on the outer circumferential surface of the wire, and then the flux is applied to form a uniform coating on the outer circumferential surface of the wire in the liquid flux tank 130.

After that, as the wire moves through the inside of the plating bath 140 containing the melt, a film having a thickness of about 3 to 4 μm is formed, and the wire passing through the plating bath 140 is cooled in the cooling unit 150. Next, by winding up in the winding unit 160, the film forming work is completed.

However, the conventional cooling unit 150 is subjected to the primary cooling by the strong wind of the fan 151 to the wire vertically moved to the upper side of the plating tank 140, the wire is shaken in this process is uneven plating layer (eccentricity) It was done.

In addition, since the distance between the plating tank 140 and the roller 152 is 3m or more, there is also a problem that takes up a lot of space.

In addition, since the primary cooling is air-cooled, there is also a problem that the less-finished film is peeled off while contacting the roller 152.

In addition, the cooling tank 153 for the secondary cooling is positioned in the middle of the roller 152 and the roller 154 so that the plating discoloration and corrosion occurs in a state where the wire with the cooling water is not completely dried.

The present invention has been made to solve the above problems, and provides a lead wire forming apparatus that can obtain a high-quality lead wire by installing a cooling device to be cooled by water-cooled during the vertical movement of the wire directly above the plating bath. It is.

The present invention to solve the above problems,

Bobbins on which the wire to be plated is wound and supplied, softening furnaces and cooling water tanks for softening the wires supplied from the bobbins, flux tanks for applying plus to the softened wires, plating baths for plating the flux-coated wires, and plated wires In the lead wire forming apparatus comprising a cooling device for cooling the wire and a winding portion for winding the completed wire is completed,

The cooling device is mounted on the upper surface of the inner cylinder or the outer cylinder and the outer pipe and inner cylinder coupled so that the bottom surface is spaced apart from each other, the through pipe through which the plated wire is further protruded upward from the bottom surface of the inner cylinder and passed from the lower side to the upper side. A guide roll for guiding the coil to the winding portion, a spray nozzle for ejecting coolant to the wire passing through the inner cylinder, a supply pipe supplied from the coolant tank to the spray nozzle, and a coolant used on the bottom surface of the inner cylinder. It provides a lead wire forming apparatus, characterized in that consisting of a drain port for discharging to the discharge pipe, and a recovery pipe for sending the cooling water drained to the outer cylinder back to the cooling water tank.

At this time, the plating bath is provided with a guide for guiding the wire into the plating bath again toward the cooling device, the guide is hinged to be pivotable on the upper surface of the plating bath while having a deflection shape, the one end of the direction of the wire It is preferable that the first guide hole, the second guide hole, and the third guide hole are divided into three parts to change the shape, and a fourth guide hole for guiding the plated wire to rise vertically is formed at the rear of the hinge.

And it is connected between the injection nozzle and the supply pipe by a branch pipe, the branch pipe may be equipped with a valve.

As described above, in the lead wire forming apparatus according to the present invention, by installing a cooling device that cools the wire before the wire comes into contact with another object, the plating layer of the lead wire stably forms a film, and has a small space. And it is possible to produce in the area, to solve the plating thickness defects, it is possible to prevent the appearance defects exposed to the outside in advance.

1 is a schematic process chart showing a method of forming a lead wire according to the prior art,
2 is a schematic process chart showing a method of forming a lead wire according to the present invention;
3 is a view showing the cooling device of FIG.
4 is a view showing a guide installed in the plating bath.

Hereinafter, a lead wire forming apparatus according to a preferred embodiment of the present invention with reference to the accompanying drawings.

Referring to FIG. 2, the lead wire forming apparatus 100 according to the present invention includes a bobbin 110 to which wires are wound and supplied, a softening furnace 120 and a cooling water tank 121 to heat-treat the wires supplied from the bobbin 110. ), A flux tank 130 for chemically treating the heat-treated wire to coat the film well, a plating bath 140 for coating the chemically treated wire with tin, and a wire plated in the plating bath 140. It comprises a cooling device 200 for cooling and a winding unit 160 for winding the cooled lead wire.

Lead wire forming apparatus 100 according to the present invention is characterized in that the guide 300 and the cooling device 200 of the plating bath 140, the remaining portion is the same as the prior art guide 300 and the cooling device 200 Only to be described in detail, detailed description of the rest will be omitted.

The plating tank 140 is formed with a guide 300 for receiving the flux coated wire from the flux tank 130 to guide the plated wire back to the vertical rise. The guide 300 has a refractive form, and is rotatably coupled to the upper surface of the plating bath 140.

Referring to FIG. 4, the guide 300 has a middle portion coupled to the upper surface of the plating tank 140 and a hinge 301, and at one end thereof, a first guide hole 310 and a second guide through which a wire to be plated passes. The ball 320 and the third guide hole 330 are integrally formed. The first guide hole 310 and the second guide hole 320 are formed to be spaced apart in the form of three branches of about 45 ° to change the direction of movement of the wire. That is, the first front guide hole 310 is the first place to receive the wire, the second guide hole 320 in the center to bend the wire, the third guide hole 330 at the rear is the wire It will be bent upward. And the other side of the guide 300, the handle 350 for rotating the guide 300 is integrally formed. Meanwhile, a fourth guide hole 340 is formed at the rear of the hinge 301 to guide the plated wire to vertically rise.

Referring to FIG. 3, the cooling device 200 is a device for cooling the coating layer while the wire passing through the fourth guide hole 340 rises vertically. The cooling device 200 includes an outer cylinder 210 and an inner cylinder 220. The injection nozzle 230 for supplying the cooling water into the inside of the 220 is provided.

The outer cylinder 210 and the inner cylinder 220 are disposed so that their bottom surfaces are spaced apart from each other, and on the bottom surface of the inner cylinder 220 is formed a drain 221 for discharging down the cooling water introduced into the inner cylinder 220, the outer cylinder On the bottom surface of 210, a recovery pipe 280 for recovering the coolant introduced through the drain 221 to the original coolant tank 260 is connected. And the side of the inner cylinder 220 is formed with a supply pipe 270 connected to the injection nozzle 230 to eject the cooling water supplied from the cooling water tank 260 into the inner cylinder 220, the supply pipe 270 is a coolant One extending in the tank 260, the branch pipe 290 is connected to the injection nozzle 230 by extending to a plurality of branch pipes (290) in the vicinity of the outer cylinder (210). In addition, the branch pipe 290 is formed with a valve 291 for regulating or opening and closing the water pressure.

On the bottom surface of the outer cylinder 210 and the bottom surface of the inner cylinder 220, a through pipe 250 through which a wire passes from the lower side is formed. The upper portion of the through pipe 250 protrudes higher from the bottom surface of the inner cylinder 220 to prevent the coolant from flowing into the through pipe 250. At this time, the position of the through pipe 250 and the injection nozzle 230 is disposed so that the cooling water sprayed from the injection nozzle 230 can reach the wire passing through the through pipe 250.

And on the upper surface of the inner cylinder 220 or the outer cylinder 210, the guide roll 240 is mounted so that the lead wire cooled by the coolant changes direction from the vertical direction to the horizontal direction, and the guide roll 240 passes the lead. The wire is wound by the winding unit 160 and completed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined by the appended claims. .

100: lead wire forming apparatus
110: bobbin 120: softening furnace
121: cooling water tank 130: flux tank
140: plating bath 150: cooling part
151: fan 152, 154: roller
153: cooling tank 160: winding
200: cooling device 210: outer cylinder
220: inner cylinder 221: drain
230: injection nozzle 240: guide roll
250: through pipe 260: cooling water tank
270: supply pipe 280: recovery pipe
290: branch pipe 291: valve
300: guide 301: hinge
310: first guide ball 320: second guide ball
330: third guide ball 340: fourth guide ball
350: handle

Claims (3)

The bobbin 110 is wound around the wire to be plated, the softening furnace 120 and the cooling water tank 121 for softening the wire supplied from the bobbin 110, and the flux tank 130 for applying a plus to the softened wire. ), A lead wire including a plating bath 140 for plating the flux-coated wire, a cooling device 200 for cooling the plated wire, and a winding unit 160 for winding the wire after cooling is completed. In the molding apparatus,
The cooling device 200 is the outer cylinder 210 and the inner cylinder 220 coupled to the bottom surface is spaced apart from each other, and further protrudes upward from the bottom surface of the inner cylinder 220 plated wire is passed from the bottom to the top A through-pipe 250, a guide roll 240 mounted on an upper surface of the inner cylinder 220 or an outer cylinder 210 to guide a wire to the winding portion 160, and formed on a side surface of the inner cylinder 220; The injection nozzle 230 for ejecting the coolant to the wire passing through the wire, the supply pipe 270 is supplied from the cooling water tank 260 connected to the injection nozzle 230 and used on the bottom surface of the inner cylinder 220 Lead wire forming apparatus, characterized in that consisting of a drain port 221 for discharging the cooling water to the outer cylinder 210, and a recovery pipe 280 for sending the cooling water drained to the outer cylinder 210 back to the cooling water tank (260). According to claim 1, The plating tank 140 is provided with a guide 300 for guiding the wire into the plating tank again toward the cooling device 200, the guide 300 has a refractive form while the plating The hinge 301 is coupled to be pivotable on the upper surface of the jaw 140, and at one end thereof, the first guide hole 310, the second guide hole 320, and the third branch are divided into three to change the direction of movement of the wire. Lead wire forming apparatus, characterized in that the three guide hole (330) is formed, the fourth guide hole (340) for guiding the plated wire to rise vertically in the rear of the hinge (301). The lead wire forming apparatus according to claim 1, wherein a branch pipe 290 is connected between the injection nozzle 230 and the supply pipe 270, and a valve 291 is mounted on the branch pipe 290. .

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