KR101054980B1 - Light emitting device and manufacturing method - Google Patents

Light emitting device and manufacturing method Download PDF

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Publication number
KR101054980B1
KR101054980B1 KR1020090041690A KR20090041690A KR101054980B1 KR 101054980 B1 KR101054980 B1 KR 101054980B1 KR 1020090041690 A KR1020090041690 A KR 1020090041690A KR 20090041690 A KR20090041690 A KR 20090041690A KR 101054980 B1 KR101054980 B1 KR 101054980B1
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KR
South Korea
Prior art keywords
light emitting
reflector
emitting device
cavity
resin material
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Application number
KR1020090041690A
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Korean (ko)
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KR20100122677A (en
Inventor
장지원
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020090041690A priority Critical patent/KR101054980B1/en
Publication of KR20100122677A publication Critical patent/KR20100122677A/en
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Publication of KR101054980B1 publication Critical patent/KR101054980B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

A light emitting device according to an embodiment of the present invention includes a package body including a cavity; A plurality of electrodes having one end disposed in the cavity; A light emitting diode mounted in the cavity and electrically connected to the plurality of electrodes; Resin formed in the cavity; And a reflector formed to cover a portion of the upper surface of the resinous material along the circumference of the upper surface of the resinous material.

Light emitting element

Description

Light emitting device and manufacturing method thereof

The present invention relates to a light emitting device and a method of manufacturing the same.

Light emitting diodes are used as light sources in various fields.

Among these, a backlight unit (BLU) using a light emitting diode provides light by installing the light emitting diode at the rear or side of the LCD panel, which is becoming increasingly slim and large. In addition, in view of cost reduction, a method of reducing the number of light emitting diodes used in the backlight unit has been studied.

According to this trend, in order to secure uniform brightness in a slim and large backlight unit using a small number of light emitting diodes, it is important to adjust the distribution of light distribution of the light emitted from the light emitting diodes to be wide and even.

The embodiment provides a light emitting device having a wide and uniform light distribution.

The embodiment provides a light emitting device that can be applied to a backlight unit that ensures uniform luminance while using a small number of light sources.

The light emitting device according to the embodiment includes a package body including a cavity; A plurality of electrodes having one end disposed in the cavity; A light emitting diode mounted in the cavity and electrically connected to the plurality of electrodes; Resin formed in the cavity; And a reflector formed to cover a portion of the upper surface of the resinous material along the circumference of the upper surface of the resinous material.

The light emitting device manufacturing method according to the embodiment may include forming a package body by disposing one end of the plurality of electrodes in a cavity; Mounting a light emitting diode to the plurality of electrodes in the cavity; Forming a resin in the cavity; And forming a reflector to cover a portion of the upper surface of the resinous material along the circumference of the upper surface of the resinous material.

The embodiment can provide a light emitting device having a wide and uniform light distribution by forming a reflector on the emission surface.

The embodiment can provide a light emitting device having a wide and uniform light distribution while minimizing the loss of light.

The embodiment can provide a light emitting device having a wide and uniform light distribution by forming a reflector by a simple method.

The embodiment can provide a light emitting device that can be applied to a backlight unit that ensures uniform luminance while using a small number of light sources.

Hereinafter, with reference to the drawings, it presents a specific embodiment of the present invention.

However, the spirit of the present invention is not limited to the following embodiments, and those skilled in the art who understand the spirit of the present invention can easily add, change, delete, and add various elements included in the scope of the same idea. It may be proposed, but this is also included in the spirit of the present invention.

1 is a cross-sectional view of a light emitting device according to an embodiment. 2 is a plan view from above of a light emitting device according to an embodiment;

1 and 2, the light emitting device 100 includes a package body 110, a light emitting diode 120, a plurality of electrodes 135 and 136, and a reflector 150.

The package body 110 is selectively made using a metal core PCB (MCPCB), a silicon material, a silicon-based wafer level package (WLP), silicon carbide (SiC), FR-4, polyphthalamide (PPA), or the like. It may be formed, but not limited thereto.

The package body 110 is illustrated as having a circular shape, but is not limited thereto. For example, the package body 110 may have an oval shape, a square shape, a polygon shape, and the like.

The package body 110 is formed with a cavity 113 with an open top. The cavity 113 may be formed during injection molding of the package body 110. In addition, a surface of the cavity 113 may be formed of a material having a high reflection effect, for example, a metal material such as silver (Ag) by coating or the like.

The cavity 113 may be formed in a cup shape, a concave container shape, or the like, and a circumferential surface thereof may be a vertical side surface or an inclined side surface. Also, referring to FIG. 2, the surface shape of the cavity 113 is illustrated as a circle having a radius b, but is not limited thereto. For example, the cavity 113 may have a polygonal shape, an elliptical shape, or the like.

One end of the plurality of electrodes 135 and 136 is inserted into the package body 110. That is, one end of the plurality of electrodes 135 and 136 may be disposed in the cavity 113, and the other end thereof may be exposed to the outside of the package body 110.

The plurality of electrodes 135 and 136 may be selectively formed using a PCB type, a lead frame type, a plating method, and the like, but is not limited thereto.

For example, in FIG. 1, the plurality of electrodes 135 and 136 are formed inside the package body 110 in a lead frame type, but as shown in FIG. 3, the plurality of electrodes 135 and 136 are plated. It may be formed on the cavity 113 and the package body 110 by using.

The light emitting diode 120 is mounted in the cavity 113 of the package body 110. The light emitting diode 120 is electrically connected to the plurality of electrodes 135 and 136. The light emitting diode 120 may be connected to the plurality of electrodes 135 and 136 by a wire method, a flip chip method, a die bonding method, and the like, but is not limited thereto.

The light emitting diode 120 includes an LED chip, and the LED chip may be implemented as colored LED chips such as red LED chips, blue LED chips, and green LED chips, or may be implemented as UV LED chips. There is no limitation on the type and number of mounting.

In addition, the package body 110 may be equipped with a protection device (eg, zener diode, varistor) for protecting the LED chip, but is not limited thereto.

The resin material 130 is formed in the cavity 113 of the package body 110. The resin material 130 is made of a transparent material such as silicon or epoxy, and seals the light emitting diode 120. At least one kind of phosphor may be added to the resin material 130, but is not limited thereto. The component and the component ratio of the phosphor may be adjusted so that the light emitting device 100 may optimize and emit desired light.

The upper surface 131 of the resin material 130 is an emission surface for emitting the light generated by the light emitting diode 120 to the outside. The shape of the upper surface 131 of the resin material 130 corresponds to the surface shape of the cavity 113, and may be any one of a circle, an ellipse, or a polygonal shape.

For example, referring to FIG. 2, the shape of the upper surface 131 of the resin material 130 is formed in the shape of a circle having a radius b. On the other hand, referring to Figure 4, the shape of the upper surface 131 of the resin material 130 was formed in the shape of a rectangle. That is, the shape of the upper surface 131 of the resin material 130 is not limited.

The reflector 150 is formed to cover a portion of the upper surface 131 of the resin material 130 along the circumference of the upper surface 131 of the resin material 130. The reflector 150 may be formed only on the top surface 131 of the resin material 130, or may be formed on the top surface 131 and the package body 110 of the resin material 130.

The reflector 150 may have a frame shape having an opening smaller than the upper surface 131 of the resin material 130. The shape of the opening of the reflector 150 may be any one of a circle, an ellipse or a polygon. The frame shape also refers to a frame (frame) of circular, oval or polygonal having a width and the opening.

For example, referring to FIG. 2, the reflector 150 may be in the form of a circular frame having an opening having a radius a and having a width d.

In this case, since a part of the upper surface 131 of the resin material 130, which is the emission surface of the light emitted from the light emitting diode 120, is blocked by the reflector 150, the emission surface has a radius b. The face is reduced to a circular face with radius a.

For example, referring to FIG. 4, the reflector 150 may have a rectangular opening and may have a rectangular frame having a predetermined width. In this case, a part of the upper surface 131 of the resin material 130 is covered by the reflector 150, so that the emission surface is reduced.

That is, the shape of the reflector 150 is freely along the circumference of the upper surface 131 of the resin material 130 so as to appropriately cover a part of the upper surface 131 of the resin material 130 so that the emission surface is reduced. It may be formed, but not limited thereto.

However, the shape of the opening of the reflector 150 and the resin material 130 may effectively cover the upper surface 131 of the resin material 130 along the circumference of the upper surface 131 of the resin material 130. Shapes of the upper surface 131 may be formed to correspond to each other.

In addition, in order to improve extraction efficiency of light emitted from the light emitting diodes 120, the center of the upper surface 131 of the resin material 130 may be formed to coincide with the center of the opening of the reflector 150.

The reflector 150 may be formed of a resin material, a silicon material, or a metal material which is easily molded such as UV resin or epoxy. In addition, a material having a high reflection effect may be formed on the surface of the reflector 150 by coating or plating.

Accordingly, the light incident on the bottom surface of the reflector 150 is reflected and incident on the cavity 113 of the package body 110, and the light is formed on the surface of the cavity 113 with a high reflection effect. The light may be reflected again to be incident to the emission surface. As such, light incident on the reflector 150 may be incident on the emission surface through reflection, thereby minimizing the loss of light due to the formation of the reflector 150.

As described above, since a part of the upper surface 131 of the resin material 130 that is the emission surface is covered by the reflector 150, the emission surface from which light is substantially emitted is reduced. As such, as the emission surface is reduced, it is possible to easily adjust the distribution of light. That is, the emission surface is reduced, and the emission surface is closer to the point light source than the surface light source, so that it is easy to adjust the light distribution of the light by a lens or the like, thereby manufacturing a light emitting device having a wide and uniform luminance.

However, the smaller the emission surface of the light emitting device 100 is, the easier it is to control the distribution of light. However, when the upper surface 131 of the resin material 130 is overly covered by the reflector 150, a considerable amount of light Since it may not be emitted by the emission surface and may be repeatedly lost in the resin material 130, the shape or area of the reflector 150 may be appropriately adjusted as necessary.

After the reflector 150 is manufactured separately, the reflector 150 may be attached to the top surface of the resin material 130 and the package body 110.

Alternatively, the reflector 150 is injection molded into the package body 110, and then forms the light emitting diode 120 and the resin material 130 on the cavity 113 of the package body 110, and then again. It can be formed by performing injection molding.

Alternatively, the reflector 150 forms a photoresist (not shown) on the upper surface of the resin material 130 and the package body 110 to correspond to the shape of the reflector 150, and the photoresist (not shown). It can form by vapor-deposition, plating, etc. as a mask.

In addition, when the reflector 150 is manufactured separately and then attached, the reflector 150 may be easily and accurately attached to the upper surface of the resin material 130 and the package body 110. The width can be varied from (d) to (e). Thus, the reflector 150 may be accurately attached to the inner wall of the package body 110.

The lens 160 may be formed on the package body 110. The lens 160 adjusts a light distribution of light emitted from the emission surface. As described above, in the embodiment, since the emission surface is reduced by the reflector 150, the emission surface is closer to the point light source, so that the lens 160 can easily adjust the light distribution of the light as necessary. .

At least one kind of phosphor may be added to the lens 160. In addition, the shape of the lens 160 is not limited to the illustrated, and may be formed in various forms as necessary.

The light emitting device 100 is an example for packaging the light emitting diodes 120. For example, referring to FIG. 3, the first and second electrodes 135 and 136 of the light emitting device 100 are the package body. It may be formed in a structure formed on the 110, such a package structure may be variously changed within the technical scope of the embodiment.

In addition, the light emitting device 100 according to the embodiment may be formed so that a plurality are arranged in an array form.

Hereinafter, a light distribution of light emitted from the light emitting device 100 in which the reflector 150 is formed will be described in detail with reference to FIGS. 5 and 6.

5 is a diagram illustrating light distribution of a light emitting device in which the reflector 150 is not formed, and FIG. 6 is a diagram illustrating light distribution of the light emitting device 100 in which the reflector 150 is formed according to an exemplary embodiment. Except for the presence or absence of the reflector 150, all the conditions, such as the type of the light emitting diode 120, the type of the lens 160 is the same.

Referring to FIG. 5, in the case of the light emitting device in which the reflector 150 is not formed, the light distribution is uneven and the luminance of the center portion is high. That is, it is seen that the luminance is high around 90 °, and that the distribution of light distribution is severe. The reason for this characteristic is that when the reflector 150 is not formed, since the emission surface of the light emitting device is wide and close to the surface light source, since the amount of light emitted from the central portion of the emission surface is large, these light distribution distributions This is because it is difficult to control.

1 and 6, when the reflector 150 is formed according to the embodiment, it can be seen that the light distribution of the light emitting device 100 is widely and evenly formed. That is, it can be seen that the luminance is not high near 90 °, and the light distribution is evenly distributed while the distribution of light distribution is smoothly changed. The reason for this characteristic is that the reflector 150 reduces the emission surface of the light emitting device 100, and the emission surface is closer to the point light source than the surface light source, so that the distribution of light distribution is controlled by the lens 160 or the like. This is because it can be easily adjusted so that the directivity of the light distribution is wide and the luminance is uniform.

As described above, the light emitting device 100 according to the embodiment may adjust the light distribution widely and evenly. For example, when the light emitting device 100 is applied to the backlight unit BLU, a uniform brightness may be achieved while using a small number of light sources. The branch can implement an image. In addition, the light emitting device 100 according to the embodiment may have a wide distribution of light, and thus may form a slim thickness of the backlight unit.

Although the above has been described with reference to preferred embodiments thereof, these are merely examples and are not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component shown in detail in the embodiment of the present invention may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 to 6 are diagrams illustrating a light emitting device according to an embodiment.

Claims (19)

A package body including a cavity; A plurality of electrodes having one end disposed in the cavity; A light emitting diode mounted in the cavity and electrically connected to the plurality of electrodes; Resin formed in the cavity; And A light emitting element comprising a reflector in which a portion of an upper surface of the resinous material overlaps a circumference of the upper surface of the resinous material, and an opening having a smaller opening than the upper surface of the resinous material is formed. The method of claim 1, The upper surface of the resin is any one of a circle, ellipse or polygonal shape. The method of claim 1, The opening is any one of a circle, ellipse or polygonal shape. The method of claim 3, The shape of the opening of the reflector corresponds to the shape of the upper surface of the resin material. The method of claim 3, A light emitting element in which the center of the upper surface of the resin material and the center of the opening of the reflector coincide. The method of claim 1, The reflector is a light emitting device formed of any one of a resin material, a silicon material or a metal material. The method according to claim 1 or 6, The light emitting device is formed with a material having a high reflection effect on the surface of the reflector. The method of claim 1, The light emitting device further comprises a lens on the package body. Disposing one end of the plurality of electrodes in the cavity to form a package body; Mounting a light emitting diode to the plurality of electrodes in the cavity; Forming a resin in the cavity; And And forming a reflector including a portion of the upper surface of the resin material overlapping the upper surface of the resin material, the reflector having an opening smaller than the upper surface of the resin material. The method of claim 9, The upper surface of the resin is any one of a circle, ellipse or polygonal shape. The method of claim 9, The opening is a light emitting device manufacturing method of any one of the shape of a circle, ellipse or polygon. The method of claim 11, The shape of the opening of the reflector corresponds to the shape of the upper surface of the resin material. The method of claim 11, The center of the upper surface of the said resin material and the center of the opening part of the said reflector are a manufacturing method of the light emitting element. The method of claim 9, The reflector is a light emitting device manufacturing method formed of any one of a resin material, a silicon material or a metal material. The method according to claim 9 or 14, A method of manufacturing a light emitting device in which a material having high reflection effect is formed on a surface of the reflector. The method of claim 9, Forming a lens on the package body further comprising a light emitting device manufacturing method. The method of claim 9, The reflector is a light emitting device manufacturing method attached to the resin and the package body. The method of claim 9, The reflector is a light emitting device manufacturing method formed by injection molding. The method of claim 9, The reflector is formed by forming a photoresist on the resin material and the upper surface of the package body to correspond to the shape of the reflector, and by depositing or plating using the photoresist as a mask.
KR1020090041690A 2009-05-13 2009-05-13 Light emitting device and manufacturing method KR101054980B1 (en)

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KR1020090041690A KR101054980B1 (en) 2009-05-13 2009-05-13 Light emitting device and manufacturing method

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Application Number Priority Date Filing Date Title
KR1020090041690A KR101054980B1 (en) 2009-05-13 2009-05-13 Light emitting device and manufacturing method

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KR20100122677A KR20100122677A (en) 2010-11-23
KR101054980B1 true KR101054980B1 (en) 2011-08-05

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368283A (en) * 2001-06-07 2002-12-20 Seiwa Electric Mfg Co Ltd Led lamp
JP2004228143A (en) 2003-01-20 2004-08-12 Seiko Epson Corp Solid-state light source lighting device, projector, and optical apparatus
KR100900286B1 (en) 2006-12-11 2009-05-29 엘지전자 주식회사 light emitting device package and method for manufacturing it

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368283A (en) * 2001-06-07 2002-12-20 Seiwa Electric Mfg Co Ltd Led lamp
JP2004228143A (en) 2003-01-20 2004-08-12 Seiko Epson Corp Solid-state light source lighting device, projector, and optical apparatus
KR100900286B1 (en) 2006-12-11 2009-05-29 엘지전자 주식회사 light emitting device package and method for manufacturing it

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Publication number Publication date
KR20100122677A (en) 2010-11-23

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