KR101049396B1 - Apparatus and method for simulating printing process - Google Patents

Abstract

PURPOSE: A printing process simulation apparatus and a method thereof are provided to seek an optimal process condition by examining process conditions like a contact pressure, a speed or a contact time at the printing. CONSTITUTION: A sample substrate(120) is provided within a chamber(100) and forms a groove on a surface. The first substrate stage(140) loads the sample substrate. A dispenser(160) provides a printing solution for the groove. A linear stage(141) transfers the first substrate stage. A doctor blade(135) doctors the sample substrate. A substrate transport part(150) transports the doctored sample substrate.

Description

Apparatus and Method for simulating printing process

The present invention relates to a printing process simulation apparatus and method, and more particularly to a printing process simulation apparatus and method for automatically investigating the influence of the adhesion characteristics between the material for the printing process and the process conditions thereto.

What is needed is a process of forming a pattern through contact between dissimilar materials in an imprint lithography process, a transfer process, and a printing process used to make micro / nanometer sized patterns and devices. In addition, a process of transferring a desired material (metal, polymer, ink, etc.) from one base material to another is absolutely necessary.

At this time, the process is successful only if the adhesion between the two materials in contact is properly controlled.

In particular, in order to manufacture high-performance flexible electronic devices and displays, a process of transferring a material and a device manufactured by a conventional semiconductor process into contact with a stamp, removing the substrate from the substrate, and then transferring the same to a flexible substrate is required. In addition, in the printing process of manufacturing an electronic circuit in a continuous production process, the stamp is contacted with a base material coated with a conductive ink to remove the ink from the base material, and then the process of transferring the ink to a desired substrate is repeatedly performed.

Adhesion between stamps, inks, substrates, and substrates is very important for successful printing, and process conditions such as contact pressure, speed, and contact time, as well as materials, have a significant effect on adhesion characteristics.

However, conventionally, in order to solve this problem, the optimum process conditions were found by varying materials and operating conditions by trial and error. Therefore, much effort, time, and cost were required.

Therefore, there is a need for a process simulation apparatus and method for finding the optimum process conditions efficiently by investigating the effects of adhesion between materials and process conditions thereon.

It is an object of the present invention to provide a process simulation apparatus and method for investigating adhesive properties between stamps, inks, substrates and substrates in order to solve the problems posed by the prior art.

Another object of the present invention is to provide a process simulation apparatus and method for efficiently finding an optimal process condition by examining process conditions such as contact pressure, speed, and contact time during printing.

The present invention provides a printing process simulation apparatus to solve the problems raised above. This printing process simulation apparatus includes the chamber chamber 100; A sample substrate 120 provided in the chamber chamber 100 and having at least one groove 1030 formed on a surface thereof; A first substrate stage 140 loading the sample substrate 120; A dispenser unit 160 supplying a printing solution to the at least one groove 1030; A linear stage 141 for transferring the first substrate stage 140; A doctor blade 135 for doctoring the sample substrate 120 as it is transferred; A substrate carrier (150) for carrying the doctored sample substrate (120); A second substrate stage (195b) on which the sample substrate (120) is loaded by the substrate carrier (150); A position adjusting unit 170 for moving the second substrate stage 195b in at least one of X, Y, and Z axis directions; And a contact lens 107 installed on one side of the chamber chamber 100 and contacting the sample substrate 120 as the second substrate stage 195b is raised.

In addition, the printing process simulation apparatus is provided between the position adjusting unit 170 and the second substrate stage 195b to sense a load acting on the sample substrate 120 to provide the at least one groove 1030. It further comprises a load sensor 190b for calculating the adhesive force between the printing solution and the sample substrate 120 supplied to the adhesive force, the adhesive force as the contact lens 107 is in contact with the sample substrate 120 The printing solution may be attached to the adhesive lens 107 and the sample substrate 120 at the same time for a certain period of time, and the tensile strength of the printing solution may be separated from the sample substrate 120.

In addition, the printing process simulation apparatus, the transparent plate 105 is coupled to the contact lens 107 and installed on the outer surface of the chamber chamber 100 and engraved alignment mark 600; A microscope 103 installed at a predetermined distance from the transparent plate 105; And a photographing unit 101 connected to the microscope 103 to photograph the contact surface according to the contact between the sample substrate 120 and the contact lens 107.

The printing process simulation apparatus further includes a target substrate for transferring the printing solution adsorbed from the second substrate stage 195a and the sample substrate 120 on which the cleaning pad 270 for cleaning the contact lens 107 is loaded. It further includes a second substrate stage 195c into which 290 is loaded.

Here, the position adjusting unit 170, the Y-axis stage 200 for moving at least one of the second substrate stage (195a to 195c) in the Y-axis direction; X-axis stages 210a to 210c for moving at least one of the second substrate stages 195a to 195c in the X-axis direction; Z-axis stages 220a to 220c for moving at least one of the second substrate stages 195a to 195c in the Z-axis direction; And tilting stages 230a to 230c for adjusting the inclination of at least one of the second substrate stages 195a to 195c.

In addition, the printing process simulation apparatus further includes a load sensor 190c for calculating the adhesive force between the adsorbed printing solution and the target substrate 290.

The printing process simulation apparatus further includes a heater 193 for heating at least one of the second substrate stages 195a to 195c; And

In addition, the printing process simulation apparatus further includes an insulator 191 for blocking heat between the heater 193 and the load sensor 190.

In addition, the printing process simulation apparatus further includes a vibration damping table 179 for maintaining the chamber chamber 100 without vibration.

In addition, the printing process simulation apparatus, the load detection sensor 131 for detecting a load acting on the doctor blade 135; And a Z axis stage 130 for moving the doctor blade 135 in the Z axis direction.

In addition, the printing process simulation apparatus, the pressure and temperature and hygrometer 180 for adjusting the pressure, temperature and humidity in the chamber chamber 100; And intake and exhaust ports 181 and 182 for switching the air atmosphere in the chamber chamber 100.

At this time, the substrate carrier 150, the cylinder 152; A rod 155 inserted into the cylinder 152 to reciprocate; A rotating part 157 connected to the rod 155 to rotate; A linear guide 151 coupled to the rotating part 157 and horizontally moving; And a tong part 153 that grips the sample substrate 120.

In addition, the printing process simulation apparatus further includes a substrate providing unit 110 for loading the sample substrate 120 into the first substrate stage 140.

At this time, the substrate providing unit 110, the substrate holding unit 111 for holding the sample substrate 120 and loading on the first substrate stage 140; A guide 112 coupled to the substrate holding part 111 and moving; A rail 113 for moving the guide 112; And an elevating unit 115 for elevating the stacked sample substrates 120 one by one.

The printing process simulation apparatus further includes: substrate holding portions 290a and 290b for fixing at least one of the sample substrate 120, the cleaning pad 270, and the target substrate 290; A non-contact surface temperature sensor 270 for measuring the at least one surface temperature; And a non-contact displacement measuring sensor 270 for measuring the at least one displacement.

According to another embodiment of the present invention, a printing process simulation method includes: contacting a contact lens 107 with a sample substrate 120 or a target substrate 290 filled with a printing solution in a groove 1030; Finding a position of the alignment marker 600 on the sample substrate 120 or the target substrate 290; Finding a center point 800 of the contact area 810 in contact with the contact lens 107 on the sample substrate 120 or the target substrate 290 by applying an initial contact point; Checking whether a distance between the alignment marker 600 and the center point 800 is within an allowable error range; And separating the sample substrate 120 or the target substrate 290 from the contact lens 107 when the result is greater than or equal to the tolerance range.

Adjusting the tilting stage of the sample substrate 120 or the target substrate 290 by adjusting the tilting stages 230a to 230c; And

Contacting the sample substrate 120 or the target substrate 290 and the contact lens 107 again.

In addition, the printing process simulation method, comprising the steps of obtaining a contact pressure using the contact area and the load force sensed by the load sensor 190; When the sample substrate 120 or the target substrate 290 is in contact with the contact lens 107, obtaining a contact time using a time at which the Z-axis stages 220a to 220c are stopped; Obtaining a contact speed by using the time for which the Z-axis stages 220a to 220c rise; And obtaining a separation speed by using the time during which the Z-axis stages 220a to 220c fall.

In addition, in the printing process simulation method, when the sample substrate 120 or the target substrate 290 and the contact lens 107 is in contact, using the load sensing sensors 190a to 190c to calculate the adhesive force of the printing solution The adhesive force may further include the adhesive force as the contact lens 107 is in contact with the sample substrate 120, and the printing solution is simultaneously adhered to the adhesive lens 107 and the sample substrate 120 for a predetermined time to be stretched. It is characterized in that the maximum tensile force at the moment of separation from the substrate 120.

According to the present invention, it is possible to automatically calculate the adhesive properties between the stamp, the ink, the base material, and the substrate using a load sensor or the like.

In addition, another effect of the present invention is that the processing conditions such as contact pressure, speed, and contact time can be calculated during printing using a microscope, a photographing means, a raising / lowering means of a substrate, etc. Can be mentioned.

1 is a block diagram of a printing process simulation apparatus according to an embodiment of the present invention.
2A illustrates a concept of the position adjusting unit 170 of FIG. 1.
2B is a plan view of the position adjusting unit 170 and the substrate stage 195 of FIG. 1.
3 is a view illustrating a structure of the substrate carrier 150 of FIG. 1.
4 is a perspective view showing the doctor blade structure of FIG.
5A illustrates a dispensing process according to an embodiment of the present invention.
5B illustrates a doctoring process according to an embodiment of the present invention.
6 is a view showing a configuration for parallel alignment according to an embodiment of the present invention.
7 is a flowchart showing a parallel alignment process according to an embodiment of the present invention.
8A is a screen example showing an unaligned state according to an embodiment of the present invention.
8B is a screen example showing an alignment state according to an embodiment of the present invention.
9 is a screen example of an adhesive force graph and a captured image according to an embodiment of the present invention.
10A to 10D are views illustrating a printing process according to an embodiment of the present invention.

The terms or words used in this specification and claims are not to be construed as limiting in their usual or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiments of the present invention, and do not satisfy all of the technical idea of the present invention, and various equivalents may be substituted for them at the time of the present application. It should be understood that there may be water and variations.

Hereinafter, a printing process simulation apparatus and method according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram of a printing process simulation apparatus according to an embodiment of the present invention. Referring to FIG. 1, the printing process simulation apparatus includes a chamber chamber 100, a substrate providing unit 110 providing a sample substrate 120, and a sample substrate 120 provided from the substrate providing unit 110. The substrate stage 140, the dispenser unit 160 providing ink to the sample substrate 120, the linear stage 141 for transferring the substrate stage 140, and the doctor doctoring the sample substrate 120. A blade 135, a substrate carrier 150 for carrying the sample substrate 120, a substrate stage 195 for seating the transported sample substrate 120, and the substrate stage 195 in the X, Y and Z axes. The position adjusting unit 170 to be moved, the contact lens 107 contacted as the substrate stage 195 rises, the microscope 103 for inspecting the contact state between the contact lens 107 and the sample substrate 120, the microscope A photographing unit 101 or the like for photographing the contact state irradiated by 103 is configured.

Referring to FIG. 1, the chamber chamber 100 maintains a gas atmosphere therein. For example, the inside is kept in the atmospheric state, nitrogen (N ₂ ) state, vacuum state and the like. Therefore, a metal material such as iron or an aluminum alloy that can be sealed on the outside is used. To this end, the inlet and exhaust ports 181 and 182 are configured at the lower end of the chamber chamber 100 to exhaust the air atmosphere of the chamber chamber 100 or to inhale a specific gas for another air atmosphere.

In order to accurately calculate the adhesion property between materials in the chamber chamber 100, an external impact should not be applied to the chamber chamber 100, and thus, a vibration damping table 170 is provided at the lower end of the chamber chamber 100. That is, the vibration damping table 170 is a vibration removing pneumatic damping table so that the chamber chamber 100 is in a stable stop state.

In addition, one side of the chamber chamber 100 is provided with a pressure and thermo-hygrometer 180 to adjust the pressure, temperature and temperature humidity in the chamber chamber 100. The pressure and thermo-hygrometer 180 is provided with a pressure supply (not shown), a heater (not shown) and a humidifier (not shown), and is provided with a measuring device (not shown) for measuring the pressure and temperature and humidity. Of course, since the configuration of the pressure and hygrometer 180 is well known, further description will be omitted for a clear understanding of the present invention.

The substrate providing unit 110 loads the sample substrate 120 into the first substrate stage 140. Of course, for this purpose, the substrate providing unit 110 grips the sample substrate 120 and loads it on the first substrate stage 140, which is coupled to the substrate holding unit 111 to move. The guide 112, the rail 113 which moves this guide 112, the elevating part 115 which raises and lowers the laminated board | substrate one by one, the support stand 114a, 114b which supports this rail 113, etc. are provided.

Therefore, the substrate holding part 111 grips the sample substrate 120, and the guide 112 moves horizontally on the rail 113 to be loaded on the first substrate stage 140. Of course, the substrate providing unit 110 provides not only the sample substrate 120 but also the target substrate 290, the cleaning pad 270, and the like, which will be described later with reference to FIG. 2B. In this case, the dispensing step and the doctoring step of supplying ink are omitted.

The first substrate stage 140 is transferred from side to side on the linear stage 141. To this end, the first substrate stage 140 has a rail structure.

The dispenser unit 160 is installed at a predetermined distance from the first substrate stage 140, and the dispenser unit 160 supplies ink to the surface of the sample substrate 120 loaded on the first substrate stage 140. do.

FIG. 10A is a diagram for easily understanding a process of supplying ink to the surface of the sample substrate 120. 10A illustrates a dispensing process, in which ink is supplied from the dispenser unit 160 onto the sample substrate 120. Of course, one embodiment of the present invention shows gravure offset printing, but is not limited thereto, and is also applicable to screen printing, flexo printing, ink-jet printing, pad printing, and the like. In addition to the ink, a material for a printing process such as polymer, graphene, metal, Teflon, and silicon may be used.

Referring to FIG. 1 again, a doctor blade 135 for a doctoring process is provided on the ceiling side of the chamber chamber 100 at a predetermined distance from the first substrate stage 140. Of course, the Z-axis stage 130 is configured to operate the doctor blade 135 up and down, the Z-axis stage 130 is provided with a load sensor 131.

Z-axis stage 130 is implemented by a cylinder, ball / lead screw, and the like. The load sensor 131 is usually a load cell (loadcell) is used, there is a magnetic, full capacitance, strain gauge method. Therefore, the load sensor 131 measures the force that the doctor blade presses on the sample substrate during the doctoring process, and adjusts the force by adjusting the displacement of the Z-axis stage 130 up and down.

The doctor blade 135 is coupled to the fixing member 133 and the blade 137 is configured at the bottom. A diagram showing this is shown in FIG. 4. This will be described later.

Referring to FIG. 1, by the doctor blade 135, the ink 161 on the sample substrate 120 is doctored as the sample substrate 120 is transferred to the left direction, thereby providing a groove (on the sample substrate 120). (Not shown) to make the ink uniformly filled.

When the doctoring process is completed, the sample substrate 120 is transferred to the left end of the linear stage 141, in which case the substrate carrier 150 transfers the sample substrate 120 to the second substrate stage 195. . Of course, the heater 193, the insulating unit 191, the load sensor 190, the position adjusting unit 170, and the like are sequentially formed at the lower end of the second substrate stage 195. 3 is a view illustrating the structure of the substrate carrier 150. This will be described later.

The heater 193 controls the temperature of the ink filled in the sample substrate 120 by adjusting the temperature of the second substrate stage 195 by applying heat to the second substrate stage 195.

The insulator 191 prevents the heat of the heater 193 from being transferred to the load sensor 190 at the bottom thereof. Therefore, inorganic systems, magnetic machines, glass systems, fibrous systems, resins, rubber systems, varnishes, etc., which do not transfer heat, are used.

The load sensor 190 is the same as the load sensor 131 described above. Of course, the load sensor 190 serves to measure the contact load and adhesive force when the ink of the sample substrate 120 is in contact with and separated from the contact lens 107.

The position controller 170 moves the second substrate stage 195 along the X, Y, and Z axes. Therefore, the sample substrate 120 is raised to be in contact with or separated from the contact lens 107, and the contact and separation can be repeated several times to test the adhesion of the ink. A diagram showing this contact and separation process sequentially is shown in FIGS. 10A-10D. This will be described later.

In addition, a view showing the structure of the position adjusting unit 170 is shown in Figure 2a. This will be described later.

The contact lens 107 is installed inside the chamber chamber 100 in a line with the second substrate stage 195. The contact lens 107 is made of a semi-sphere, usually made of transparent PDMS (PolyDimethylSioxane) material, fused silica, transparent glass, or the like. The dual PDMS material can stably adhere to a relatively large area of the substrate. In addition, the free energy is low, homogeneous, isotropic and optically transparent up to a thickness of 300nm. It is also a durable elastomer. Finally, the surface properties of PDMS can be easily modified by the control of plasma generated by the formation of self-assembly monolayers (SAMs).

The contact lens 107 is assembled and fastened with the transparent plate 105, and the transparent plate 105 is installed outside the chamber chamber 100.

When the sample substrate 120 on the second substrate stage 195 and the contact lens 107 are in contact with the outside of the chamber chamber 100, the circular shape of the contact lens 107 is irradiated onto the sample substrate 120. The microscope 103 and the imaging | photography part 101 which image | photographs an image through this microscope 103 are comprised. A diagram showing the captured image is shown in FIG. 9. This will be described later.

The microscope 103 may be an electron microscope, an optical microscope, or the like, and the imaging unit 101 may be a charge-coupled device (CCD) camera, but the present invention is not limited thereto, and a complementary metal oxide semiconductor (CMOS) camera may also be used. Can be used.

2A illustrates a concept of the position adjusting unit 170 of FIG. 1. Referring to FIG. 2A, the position adjusting unit 170 includes a Y axis stage 200 for moving the second substrate stage 195 of FIG. 1 in the Y axis direction, and three X axes on the Y axis stage 200. The stages 210a to 210c are configured at regular intervals.

Of course, these three X-axis stages 210a to 210c move the second substrate stages 195a to 195c on the X-axis, respectively. The X-axis stages 210a to 210c and the Y-axis stage 200 use linear guides.

Ball / lead screws are used for the Z-axis stages 220a to 220c and serve to raise or lower the second substrate stages 195a to 195c in the Z-axis direction, respectively.

Tilting stages 230a to 230c are configured on the upper ends of the Z-axis stages 220a to 220c to adjust the inclination of the second substrate stages 195a to 195c, respectively.

Load sensing sensors 190a to 190c are provided at the upper ends of the tilting stages 230a to 230c, respectively. As the load sensors 190a to 190c, a load cell or the like is used.

2A, substrate fixing portions 290a and 290b for fixing the cleaning pad 270, the sample substrate 120, and the target substrate 290, which will be described later with reference to FIG. 2B, the fixed cleaning pad 270, and the sample substrate ( 120 and a non-contact displacement measuring sensor 280 for measuring the displacement of the target substrate 290, a non-contact surface temperature measuring sensor 270 for measuring the surface temperature is provided. Of course, in Fig. 2b is shown simply for ease of understanding, and the support 271 for supporting these sensors (270, 280) is further configured.

2B is a plan view of the position adjusting unit 170 and the substrate stage 195 of FIG. 1. Referring to FIG. 2B, the position adjusting unit 170 includes a cleaning pad 270, a sample substrate 120, and a target substrate 290, respectively. Of course, these cleaning pads 270, the sample substrate 120, and the target substrate 290 are loaded into the second substrate stages 195a-195c shown in FIG. 2A, respectively. Therefore, the cleaning pad 270 cleans ink or dust deposited on the contact lens 107 shown in FIG. 1.

That is, when the cleaning pad 270 is loaded on the second substrate stage 195a shown in FIG. 2A, the Z-axis stage 220a is operated to contact the second substrate stage 195a similarly to the adhesion experiment. After contacting, detaching, or contacting the lens (107 of FIG. 1), the X-axis stage 220a and / or Y-axis stage 200 is operated to rub the cleaning pad and the contact lens so that the cleaning pad 270 contacts. The lens 107 is wiped off.

In a similar manner, it is possible to transfer ink from the sample substrate 120 to the target substrate 270. 10A to 10D show a series of such processes. This will be described later.

3 is a view illustrating a structure of the substrate carrier 150 of FIG. 1. Referring to FIG. 3, the substrate transporter 150 includes a cylinder 152, a linear guide 151, a forceps 153, and the like. Tongs 153 are coupled to the left side of the linear guide 151, the lower end is a rotating portion 157 for rotation.

This rotating part 157 is connected with the rod 155 of the cylinder 152. Therefore, after holding the substrate 120 loaded on the first substrate stage 140 on the linear stage 141 shown in FIG. It rotates 180 degrees by 157.

Thereafter, the cylinder 152 is upwardly raised to a height in the second substrate stage (195 of FIG. 1), the tongs 153 are horizontally moved to the left, and the sample substrate 120 is removed by opening the tongs. The two substrate stages 195 (exactly 195b of FIG. 2A) are loaded.

4 is a perspective view showing the doctor blade structure of FIG. Referring to FIG. 4, the doctor blade structure requires the blade 137 to be uniformly placed on the plane of the sample substrate (120 of FIG. 1) during the doctoring process, and one side may float. Therefore, the recess 400 is formed at the center of the doctor blade 135 so as to adjust the left and right to correct such an error. In addition, the protrusion 410 is formed at the center of the fixing member 133 to match the groove 400. Of course, the teeth 411 are formed in the protrusion 410 so that the angle is constantly changed, and teeth (not shown) intersecting with the teeth 411 are also formed inside the recess 400.

5A illustrates a dispensing process according to an embodiment of the present invention. That is, when the moving unit 142 moves along the linear stage 141 having the rail, the doctoring process is performed. Figure 10a is a diagram showing this for ease of understanding. 10A illustrates a dispensing process of supplying ink 161 to the surface of the sample substrate 120. In addition, as shown in FIG. 5A, a reverse hat drain container 511 is formed at the right end of the first substrate stage 140, and a wedge-shaped blade cleaning tip is disposed at the upper right of the drain container 511. 510 is configured.

5B illustrates a doctoring process according to an embodiment of the present invention. That is, when the moving part 142 passes the blade 137 while moving along the linear stage 141 configured with the rail, the convex ink on the sample substrate 120 is uniform by the blade 137. This is called a doctoring process. Figure 10b is a diagram illustrating this easily. That is, the ink is uniformly filled in the groove 1030 of the sample substrate 120 by the blade 137 attached to the lower end of the doctor blade 135 while the sample substrate 120 moves in the direction of the arrow 900.

Referring to FIG. 5B, the remaining ink 530 filled in the sample substrate 120 is pushed by the blade 137 and dropped to the drain 511 by the blade cleaning tip 137. Through this process, the blade 137 is cleaned.

6 is a view showing a configuration for parallel alignment according to an embodiment of the present invention. FIG. 6 shows the photographing unit 101, the microscope 103, the contact lens 107, the sample substrate 120 and the position adjusting unit 170 for adjusting the position of the sample substrate 120 shown in FIG. It is a figure which shows easily etc. to understand. Referring to FIG. 6, an alignment mark 600 is displayed at the bottom center of the transparent plate 105. Therefore, using this alignment mark 600, a parallel alignment process at the time of contact by the sample substrate 120 and the contact lens 107 is possible. This parallel alignment process is shown in FIG. 7 will be described later.

In addition, using the configuration shown in FIG. 6, it becomes possible to calculate information such as contact pressure, contact time, contact speed, separation speed and the like.

I) Contact pressure: When the sample substrate 120 comes into contact with the contact lens 107 by the position adjusting unit 170, the contact area of the contact lens 107 on the sample substrate 120 is captured by the microscope 103. do. In addition, the force (F) generated when the lift by the load sensor 190 can be seen. Therefore, when the force F is divided by the contact area A, the contact pressure is obtained.

Ii) Contact time: It is calculated | required by the time which the sample board | substrate 120 and the contact lens 107 contact and stop. That is, the contact time is calculated | required using the time which Z-axis stage (220b of FIG. 2A) stops after raising.

Iii) Contact speed: It is calculated | required using the speed which a sample board | substrate 120 raises by a Z-axis stage (220b of FIG. 2A).

I) Separation speed: It is calculated | required using the speed | rate which Z-axis stage (220b of FIG. 2A) raises and falls after a fixed time.

7 is a flowchart showing a parallel alignment process according to an embodiment of the present invention. Referring to FIG. 7, the position of the alignment marker 600 is found (step S700). The alignment marker 600 is displayed at the bottom center of the transparent plate 600 as shown in FIG. 6, and a "+" shape is usually used. That is, this "+" shape is projected onto the sample substrate 120 when the sample substrate 120 is in contact with the contact lens 107. Unlike this, FIG. 8B is a screen example showing an alignment state according to an embodiment of the present invention, and is an example of the screen in the alignment state.

With continued reference to FIG. 7, the initial contact point is used as it is, and the center point of the contact area contacted at this contact point is found (step S710). That is, the center point of the contact area is found by using the microscope 103 and the imaging unit 101 shown in FIG. 6.

If the center point is found, the distance between the center point of the contacted area and the alignment marker 600 is measured to check whether the value is within an error (step S730). FIG. 8A is a diagram illustrating this easily. 8A illustrates an example of a screen in an unaligned state according to an embodiment of the present invention. Referring to FIG. 8A, the alignment marker 600 is away from the center point 800 of the contact area 810 on the sample substrate 120.

In this case, the contact lens (107 in FIG. 6) and the sample substrate (120 in FIG. 6) are separated, and the tilt of the second substrate stage 195b is adjusted using the lens tilting stage (230b in FIG. 2A) (step S735 and step S740). After the adjustment, the Z-axis stage (220b in FIG. 2A) is raised again to contact the contact lens and the sample substrate (step S760). Afterwards, steps S720 and S730 are repeated.

This parallelism alignment was performed on the sample substrate (120 in FIG. 2B) and the target substrate (290 in FIG. 2B) and the cleaning pad (270 in FIG. 2B) without ink before performing the adhesion experiment, Correct the tilt of the stage on which the cleaning pad is placed.

9 is a screen example of an adhesive force graph and a captured image according to an embodiment of the present invention. Referring to FIG. 9, an adhesive force graph 900 is illustrated, in which the contact lens 107 of FIG. 6 and the sample substrate 120 of FIG. 6 are in contact with each other and the contact lens ( 107 is depicted with the sample substrate 120 separated 910.

The photographed contact screen example 921 and the separated screen example 912 are shown. That is, the contact screen example 921 shows the state at the initial contact time. After the elapse of a certain time, a separate screen example 912 is taken. In this separation screen example 912, the contact area 810 and the alignment marker 600 are shown on the separation screen example 912 while the contact lens 107 and the sample substrate 120 are separated. Of course, the alignment marker 600 is shown for understanding and is located on the transparent plate 105 as shown in FIG. The alignment marker 600 allows the contact lens 107 to confirm that the contact on the sample substrate 120 is in a normal state.

FIG. 10C is a diagram for easily understanding the contact and disconnection states. Referring to FIG. 10C, the contact lens 107 is completely in contact with the sample substrate 120, and corresponds to the 'Dwell time in off process' of FIG. 9. When a predetermined time elapses in this state, ink is adsorbed onto the surface of the contact lens 107 and adheres.

Therefore, when the load sensor 190 is used, the adhesive force between the ink (161 of FIG. 1) and the sample substrate 120 as the printing solution is measured. That is, as shown in FIG. 10C, when the adhesive lens 107 is separated from the sample substrate 120, the ink 161 is adhered to the sample substrate 120, so that the ink 161 is attached to the adhesive lens 107. It is possible to calculate the cohesion by measuring the force when adsorbed by). A cohesion graph 911 is shown to illustrate this.
In the graph 911 of FIG. 9, the peak value indicated as 'Adhesion force between ink and mother substrate' is the ink 161 that is attached to the adhesive lens 107 and the sample substrate 120 at the same time for a predetermined time and is stretched. The maximum tensile force at the moment of separation from 120), which is the adhesive force.
This adhesive force is a heterogeneous adhesive force as an adhesion force. At this time, the self weight of the ink 161, which is the printing solution, is relatively very small so that it can be neglected compared to the adhesive force load.

Similarly, as shown in FIG. 10D, when the adhesive lens 107 is contacted with the target substrate 290 and separated after a certain time, the adhesive force between the adhesive lens 107 and the ink is obtained.

FIG. 10D is a view illustrating a state in which the ink adsorbed on the adhesive lens 107 is transferred to the target substrate 290 by FIG. 10C.

100: chamber chamber 101: the imaging unit
103: microscope 105: transparent plate
107: contact lens 110: substrate providing unit
120: sample substrate 270: cleaning pad
290: target substrate
130: Z axis stage
131: load sensing sensor 133: fixed member
135: doctor blade 137: blade
140: first substrate stage 141: linear stage
150: substrate carrier 160: dispenser
170: position adjusting unit 179: vibration damping table
180: pressure and temperature hygrometer
181, 182: intake and exhaust ports 190, 190a to 190c: load sensing sensor
191: insulation 193: heater
195: second substrate stage 200: Y-axis stage
210a to 210c: X-axis stage
220a to 220c: Z axis stage
230a to 230c: tilting stage
270: non-contact displacement measurement sensor
280: non-contact surface temperature sensor
290a and 290b: substrate holding part
400: groove 410: protrusion
411 tooth
510: blade cleaning tip 511: drain
600: alignment marker 800: center point
810: contact area

Claims (17)

Chamber chamber 100;
A sample substrate 120 provided in the chamber chamber 100 and having at least one groove 1030 formed on a surface thereof;
A first substrate stage 140 loading the sample substrate 120;
A dispenser unit 160 supplying a printing solution to the at least one groove 1030;
A linear stage 141 for transferring the first substrate stage 140;
A doctor blade 135 for doctoring the sample substrate 120 as it is transferred;
A substrate carrier (150) for carrying the doctored sample substrate (120);
A second substrate stage (195b) on which the sample substrate (120) is loaded by the substrate carrier (150);
A position adjusting unit 170 for moving the second substrate stage 195b in at least one of X, Y, and Z axis directions; And
A contact lens 107 installed on one side of the chamber chamber 100 and contacting the sample substrate 120 as the second substrate stage 195b is raised;
Printing process simulation apparatus comprising a. The method of claim 1,
The printing solution and the sample provided between the position adjusting unit 170 and the second substrate stage 195b and supplied to the at least one groove 1030 by sensing a load acting on the sample substrate 120. Further comprising a load sensor 190b for calculating the adhesive force between the substrate 120, the adhesive force is the printing solution is the adhesive lens 107 as the contact lens 107 is in contact with the sample substrate 120 Printing process simulation apparatus, characterized in that the maximum tensile force at the time of being attached to the sample substrate 120 at the same time, the tensile force is separated from the sample substrate (120). The method according to claim 1 or 2,
A transparent plate 105 coupled to the contact lens 107 and installed on an outer surface of the chamber chamber 100 and having an alignment mark 600 engraved therein;
A microscope 103 installed at a predetermined distance from the transparent plate 105; And
And a photographing unit (101) connected to the microscope (103) to photograph the contact surface according to the contact between the sample substrate (120) and the contact lens (107). The method of claim 2,
The second substrate stage 195a loaded with the cleaning pad 270 for cleaning the contact lens 107 and the second substrate loaded with the target substrate 290 transferring the printing solution adsorbed from the sample substrate 120. Printing process simulation apparatus further comprising a stage (195c). The method of claim 4, wherein
The position adjusting unit 170,
A Y-axis stage 200 for moving at least one of the second substrate stages 195a to 195c in the Y-axis direction;
X-axis stages 210a to 210c for moving at least one of the second substrate stages 195a to 195c in the X-axis direction;
Z-axis stages 220a to 220c for moving at least one of the second substrate stages 195a to 195c in the Z-axis direction; And
Printing process simulation apparatus comprising a tilting stage (230a to 230c) for adjusting the inclination of at least one of the second substrate stage (195a to 195c). The method of claim 5, wherein
Printing process simulation apparatus further comprising a load sensor (190c) for calculating the adhesive force between the adsorbed printing solution and the target substrate (290). The method of claim 4, wherein
A heater 193 for heating at least one of the second substrate stages 195a to 195c; And
Printing process simulation apparatus further comprises an insulating portion (191) for blocking heat between the heater (193) and the load sensor (190). The method according to claim 1 or 2,
Printing process simulation apparatus further comprises a vibration damping table (179) for maintaining the chamber chamber 100 in a vibration-free state. The method according to claim 1 or 2,
A load sensor 131 for sensing a load acting on the doctor blade 135; And
Printing process simulation apparatus further comprises a Z-axis stage (130) for moving the doctor blade in the Z-axis direction. The method according to claim 1 or 2,
A pressure and temperature hygrometer (180) for controlling pressure, temperature and humidity in the chamber chamber (100); And
Printing process simulation apparatus further comprises an intake and exhaust port (181, 182) for switching the air atmosphere in the chamber chamber (100). The method according to claim 1 or 2,
The substrate carrier 150,
Cylinder 152;
A rod 155 inserted into the cylinder 152 to reciprocate;
A rotating part 157 connected to the rod 155 to rotate;
A linear guide 151 coupled to the rotating part 157 and horizontally moving; And
Printing process simulation apparatus including a forceps (153) for holding the sample substrate (120). The method according to claim 1 or 2,
And a substrate providing unit (110) for loading the sample substrate (120) onto the first substrate stage (140). The method of claim 12,
The substrate providing unit 110,
A substrate holding part 111 holding the sample substrate 120 and loading it on the first substrate stage 140;
A guide 112 coupled to the substrate holding part 111 and moving;
A rail 113 for moving the guide 112; And
Printing process simulation apparatus including a lifting unit 115 for lifting the laminated sample substrate 120 one by one. The method of claim 4, wherein
Substrate fixing parts 290a and 290b for fixing at least one of the sample substrate 120, the cleaning pad 270, and the target substrate 290;
A non-contact surface temperature sensor 270 for measuring the at least one surface temperature; And
Non-contact displacement measuring sensor 270 for measuring the at least one displacement
Printing process simulation apparatus further comprising. Contacting the contact lens 107 with the sample substrate 120 or the target substrate 290 filled with the printing solution in the groove 1030;
Finding a position of the alignment marker 600 on the sample substrate 120 or the target substrate 290;
Finding a center point 800 of the contact area 810 in contact with the contact lens 107 on the sample substrate 120 or the target substrate 290 by applying an initial contact point;
Checking whether a distance between the alignment marker 600 and the center point 800 is within an allowable error range; And
Checking the sample substrate 120 or the target substrate 290 and the contact lens 107 when the result is greater than or equal to the tolerance range;
Adjusting the tilting stage of the sample substrate 120 or the target substrate 290 by adjusting the tilting stages 230a to 230c; And
Contacting the sample substrate 120 or the target substrate 290 with the contact lens 107 again.
Printing process simulation method comprising a. The method of claim 15,
Obtaining a contact pressure using the contact area and the load force sensed by the load sensor 190;
When the sample substrate 120 or the target substrate 290 is in contact with the contact lens 107, obtaining a contact time using a time at which the Z-axis stages 220a to 220c are stopped;
Obtaining a contact speed by using the time for which the Z-axis stages 220a to 220c rise; And
Printing process simulation method further comprising the step of obtaining the separation rate by using the time the Z-axis stage (220a to 220c) is falling. The method according to claim 15 or 16,
When the sample substrate 120 or the target substrate 290 and the contact lens 107 is in contact, further comprising the step of calculating the adhesive force of the printing solution using the load sensors 190a to 190c, the adhesive force Is the maximum tensile force at the moment when the printing solution is adhered to the adhesive lens 107 and the sample substrate 120 or the target substrate 290 at the same time for a certain time and separated from the sample substrate 120 or the target substrate 290. Characterized in the printing process simulation method.

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