KR101044270B1 - The manufacturing method of conductive gasket - Google Patents

Abstract

The present invention relates to a method for producing a conductive gasket.

The present invention provides a method of manufacturing a conductive gasket having a shielding function, the plating step of plating a conductive material on the surface of the workpiece to be supplied; And an elastic means processing step of coating and drying the elastic means on the plated object.

The present invention is easy to secondary processing in a variety of shapes and sizes, regardless of the size and shape of the product.

Description

Manufacturing Method of Conductive Gasket {THE MANUFACTURING METHOD OF CONDUCTIVE GASKET}

The present invention relates to a method for manufacturing a conductive gasket, and more particularly, to a method for manufacturing a conductive gasket that performs a function of blocking electromagnetic waves generated from various electric and electronic products and electrically conducting (grounding).

In general, the conductive gasket is a shielding means for blocking the electromagnetic waves generated from various electrical and electronic products, and performs a function of electrically conducting (grounding).

The conductive gasket was manufactured by wrapping electroconductive copper (Cu) on conductive fabric (fabric; fabric, fabric) and Mash (mesh; mesh) fabric in a rectangular sponge (sponge).

Such a conventional conductive gasket is a copper material (Cu) is a conductive material is wrapped in FABRIC fabric and Mash fabric in a sponge, there is a problem that the work associated with the adhesion is cumbersome.

In particular, since the FABRIC fabric and the mesh fabric are wrapped around the outside of the sponge having a certain size and shape, there is a problem in that the size, in particular, the shape is restricted (monomorphic).

The present invention provides a method of manufacturing a conductive gasket having a shielding function, the plating step of plating a conductive material on the surface of the workpiece to be supplied; And an elastic means processing step of coating and drying the elastic means on the plated object.

The present invention is easy to secondary processing in a variety of shapes and sizes, regardless of the size and shape of the product.

BRIEF DESCRIPTION OF THE DRAWINGS Prior to explaining the present invention, the accompanying drawings presenting to assist in understanding the technology. FIG. 1 is a block diagram briefly illustrating a process step according to an embodiment of the present invention, and FIG. 3 is a block diagram illustrating the steps in more detail, and FIG. 3 is a block diagram showing the steps in detail according to another embodiment of the present invention, and FIG. 4 is a comprehensive diagram of combining another embodiment with one embodiment of the present invention. It is a simplified device diagram showing the progression step, Figure 5 shows a schematic diagram showing a partially enlarged view of the conductive gasket itself produced by the present invention.

The present invention will be described below with reference to the accompanying drawings presented as above.

1 and 2, the present invention provides a method for manufacturing a conductive gasket having a shielding function, the plating step (S10) for plating a conductive material on the surface of the object (S) to be supplied; It may be proceeded to include; elastic means processing step (S20) for applying the elastic means to the plated object (S) to be plated and dried.

Herein, the object S to be supplied in the present invention may be a PE fabric or a sponge that forms the basis of the conductive gasket. In this case, the sponge may be a sponge for a gasket. In addition, the processing object (S) may be processed step by step in the process of being transferred to the opposite side while being uncoiled in the rolled up.

On the other hand, the plating step (S10) of the present invention is to precipitate the object (S) in the nickel plating bath nickel plating, washed with water, and then the first plating step (S11) to dry; After washing the first plated object (S) with water, it is precipitated in a copper sulfate plating bath to adsorb copper to the surface of the object (S) through electrolysis, followed by repeated washing with water in water. The secondary plating step (S12); may proceed to.

At this time, the nickel plating in the primary plating step (S11) may be electroless plating, and the copper ions are adsorbed in the next step of the copper plating process, the copper plating in the secondary plating step (S12) is processed ( S) is a process of making it conductive.

On the other hand, the elastic means processing step (S20) of the present invention is the elastic means injection step (S21) for injecting or depositing silicon to the secondary-plated object (S); A crimping step (S22) of compressing the processing object S into which the elastic means is injected so that only a predetermined amount of the elastic means remains in the processing object S; And a curing step (S23) of drying the processing object (S) in which the injected state of the elastic means is controlled.

In this case, the elastic means injection step (S21) may be made in the injection device for injecting the liquid silicon raw material or in the reservoir in which the liquid silicon is stored.

In addition, the pressing step (S22) is rotated by the motor, it may be made by a pair of pressing rollers different in the pressing height for the processing object (S). At this time, the pair of pressing rollers are higher in the pressing height of the pressing roller in the direction in which the processing object (S) is input, that is, the pressing force may be different from each other. In this case, as the processing object S progresses, the pressing force is sequentially increased to smoothly induce the progress, and it is possible to prevent the silicon injected into the processing object S from flowing out rapidly.

In addition, the curing step (S23) may be a heating device for curing by applying heat to the processing object (S) is injected silicon. In this case, the heating device may be a hot air providing device for injecting hot heat to the processing object (S) to proceed in the transfer roller, may be a light providing device for irradiating light (for example ultraviolet rays), chamber It may be.

In this case, silicon or PE, which is an elastic means, to the object S cured in the plating step 10 may provide an elastic force to perform a function of a gasket.

In the present invention, the process is performed by a device (coiling device; a roller group that provides a winding roller rotating by a motor and a feeding path) for uncoiling the wound object S to be recovered via the processing devices. .

Hereinafter, the step-by-step description of the present invention will be described in detail.

First, the first plating step (S11) of the plating step (S10) is nickel plating by inducing the precipitate (S) by the nickel plating bath to precipitate, the chemical reduction on the surface of the workpiece (S), which is a non-conductive material As a process of depositing a metal by surface reaction and surface-treating, a reducing agent is selected as a phosphate ion or hydrazine.

The nickel is highly adaptable to the hypochlorite ion reduction system to cause a chain reaction of precipitation as a self-catalyst, and nickel is plated on the object S by a chemical reduction reaction. Subsequently, the primary object to be processed (S) plated with the stored water is washed with water.

On the other hand, the secondary plating step (S12) is guided to the copper-plated sulfuric acid solution plating bath to precipitate the primary plated processing object (S) is copper plating.

In detail, the current is supplied to the copper plating solution in which the copper (S) is induced and precipitated. At this time, the supplied current is controlled by the regulating resistor. When the power is turned on, the nickel plating layer on the surface of the object S has a negative charge, and electrons emitted from the nickel plating layer are transferred to copper ions (Cu ++) to precipitate copper metal.

The deposited copper atoms are adsorbed and plated on the surface of the nickel plated layer, where the same number of sulfate ions (SO-) are collected into the copper metal as the anode, and this process produces new copper sulfate in the solution. This process is common in the electroplating process.

That is, the solution is kept constant because the amount of copper metal precipitated at the cathode is equal when the current flows.

In this way, when the plating layer is formed on the surface of the workpiece S and dried, the workpiece S is in a hard state.

In the elastic means processing step (S20), the elastic means injection step (S21) is applied to the elastic means spraying device or the elastic means water storage tank to guide the processing object (S), which is in a hard state after the plating process to apply or precipitate the silicon The elastic means is injected into the object S.

Then, the pressing step (S22) by pressing the processing object (S) guided in the state in which the elastic means is injected through a compactor so that only a predetermined amount of elastic means remain in the processing object (S). In this way, the amount of elastic means injected into the object S can be adjusted, so that the elastic force and thickness of the conductive gasket can be adjusted.

Finally, the curing step (S23) is artificially hardened by the elastic means is guided to the processing object (S) in which the injection state is controlled to a drying path, or dry-hardened at room temperature.

In addition, the present invention may further include a pre-treatment step for processing preparation before the plating step (S10), as shown in FIG.

As the pretreatment step, as shown, an oxidation step (S1) for oxidizing the surface of the object (S) to be supplied; The neutralization step (S2) for neutralizing the processing object (S) whose surface is oxidized in the oxidation step; may be further included.

Here, in the present invention, the oxidation step (S1) uncoils the wound object (S) while uncoiled and precipitated by caustic soda (NaOH, sodium hydroxide) solution reservoir to oxidize the surface of the object (S), It can also proceed to the step of washing in the stored water.

At this time, the temperature of the caustic soda solution (10 ~ 30%) may be 40 ~ 45 degrees Celsius. The caustic soda has a hydroxyl group (-oh) attached to sodium (na), which combines oxygen (O) and hydrogen (h) to form water (h-oh, h2o).

On the other hand, the neutralization step (S2) is neutralized by precipitating the oxidized object (S) in the neutralization tank 1 in which the mixed solution of palladium chloride and tin chloride is stored and then washed with water. Step S2-1; After the first neutralization, the sulfuric acid (10 ~ 35%) is neutralized by precipitation in the water storage neutralization tank 2, and the second neutralization step of washing with water still water (S2-2); After the second neutralization, and neutralized by re-precipitating the sulfuric acid is stored in the neutralization tank 3, the third neutralization step (S2-3) also washed with the stored water; it may proceed.

In the present invention as described above, in the oxidation step (S1), when the PE material or sponge, which is the object S, is supplied and precipitated in the stored caustic soda solution, the surface of the object S is oxidized (corroded) and plating is performed. It is deformed in an easy state.

That is, in the oxidation step S1, a myriad of holes are formed on the surface of the object S, and the elastic means is covered on the entire surface of the object S including the hole. In this way, the formation of the plating layer on the surface of the object S can be facilitated.

Thereafter, the processing object S, which is also moved to the stored water, is washed and moved to the next step of neutralization step S2.

In the neutralization step S2, the oxidized object S is precipitated in the mixed solution of the stored palladium chloride and tin chloride to be neutralized. In this case, the neutralization is because the palladium chloride and tin chloride neutralizing the acidified workpiece (S) is neutralized. The basic property is a basic property through which a base passes, and it has a property of neutralizing the action of acid and producing only salt and water by working with acid.

As described above, the neutralization step S2 proceeds to the first neutralization step S2-1, the second neutralization step S2-2, and the third neutralization step S2-3. Since the same principle as described above, more detailed description will be omitted.

In summary, as shown in FIG. 4, the above-described steps are sequentially performed. Of course, at this time, the induction of the processing object (S) to the processing position through the uncoil may be made continuously, as shown, the processing process in consideration of the ease of storage of the processing object (S) and the length of the process progress path It may be uncoiled after rewinding the object S, which was guided to the machining position while being uncoiled in the middle.

The conductive gasket G manufactured as described above is shown in FIG. 5 (in FIG. 5, an embodiment of the object S is applied as a sponge), and includes a hole formed in the object S. FIG. A copper plating layer on the surface and an elastic means layer are integrally laminated thereon.

Therefore, the present invention facilitates secondary processing of the object S to a desired size and shape.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Rather, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.

Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

1 is a block diagram schematically showing a progression step according to an embodiment of the present invention.

Figure 2 is a block diagram showing in more detail the progress step according to an embodiment of the present invention.

Figure 3 is a block diagram showing in detail the progress step according to another embodiment of the present invention.

Figure 4 is a simplified device diagram showing a comprehensive progression step combining another embodiment to one embodiment of the present invention.

Figure 5 is a partially enlarged view of the conductive gasket itself produced by the present invention.

<Description of the symbols for the main parts of the drawings>

S10: plating step S11: first plating step

S12: secondary plating step S20: elastic means processing step

S21: elastic means injection step S22: compression step

S23 curing step S1 oxidation step

S2: neutralization stage S: object to be processed

G: Gasket

Claims (14)

A method of manufacturing a conductive gasket having a shielding function, the method comprising: a plating step (S10) of plating a conductive material on a surface of a workpiece (S) to be supplied; In the process, including, the elastic means processing step (S20) to apply the silicon to the plated processing object (S) to dry; An elastic means injection step (S21) of injecting or depositing silicon to inject elastic means; A crimping step (S22) of compressing the processing object S into which the elastic means is injected so that only a predetermined amount of the elastic means remains in the processing object S; And a curing step (S23) of drying the processed object (S) in which the injected state of the elastic means is controlled. delete delete delete delete delete delete delete The method of manufacturing a conductive gasket according to claim 1, wherein the pressing step (S22) of the elastic means processing step (S20) sequentially increases the pressing force on the processing target (S). The method of claim 1, further comprising an oxidation step (S1) of oxidizing the surface of the object S to be supplied as a pretreatment step of the plating step (S10). . The method according to claim 10, further comprising a neutralizing step (S2) of neutralizing the workpiece (S) whose surface is oxidized as a next step of the oxidation step (S1). The method of claim 1, wherein as a pre-treatment step of the plating step (S10), the oxidation step (S1) for oxidizing the surface of the workpiece (S) to be supplied; The neutralizing step (S2) for neutralizing the workpiece (S) surface is oxidized in the oxidation step (S1); The manufacturing method of the conductive gasket characterized in that it further comprises. The method of manufacturing a conductive gasket according to claim 10 or 12, wherein the oxide material in the oxidation step (S1) is a caustic soda solution. The method according to claim 11 or 12, wherein the neutralizing step (S2) is neutralized by precipitating the oxidized object (S) in the neutralization tank 1 in which the mixed solution of palladium chloride and tin chloride is stored and then neutralized. A first neutralization step of washing with water (S2-1); After the first neutralization, the sulfuric acid is precipitated in the neutralization tank 2, and then neutralized, the secondary neutralization step of washing with water also stored (S2-2); After the secondary neutralization, the sulfuric acid is precipitated again in the neutralization tank 3, and then neutralized, and then the third neutralization step (S2-3) to wash with water also stored; the conductive gasket characterized in that the progress Manufacturing method.

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