KR101042185B1

KR101042185B1 - laser welding apparatus and laser welding method

Info

Publication number: KR101042185B1
Application number: KR1020090027574A
Authority: KR
Inventors: 김성대
Original assignee: 주식회사 신호
Priority date: 2009-03-31
Filing date: 2009-03-31
Publication date: 2011-06-16
Also published as: KR20100109137A

Abstract

The present invention relates to a new laser welding device and a laser welding method using the same, which enables welding of leads provided in semiconductor devices such as LEDs and resistors to terminals.

According to the laser welding device and the laser welding method using the same according to the present invention, since the bending piece 2c is pressurized to surround the circumferential surface of the lead 5, the lead 5 is not only fixed so as not to move, The thermal conductivity between the terminal 2 and the peripheral surface of the lead 5 can be increased. Accordingly, the laser can be accurately irradiated to the contact surface between the lead 5 and the bent piece 2c, and the terminal 2 and the lead 5 are heated to the same temperature at the same time even if the laser is irradiated for only a short time. Not only increase the work time and reduce the working time, but also prevent the occurrence of welding defects, and minimize the heat applied to the lead (5) and the terminal (2) to prevent damage to the semiconductor device by heat There is this.

Lead, terminal, laser, welding, bend piece

Description

Laser welding apparatus and laser welding method using the same

In general, in the case of a switch installed in a vehicle instrument panel (commonly referred to as an IP switch), an LED and a resistor are provided, and the LED is on and off together with the switch on and off. And on-off status can be easily checked.

1 and 2 illustrate such an IP switch, and a terminal 2 which is a conductor is provided on one side of the switch body 1 made of a synthetic resin material, and the LED 2 and the resistor 4 are provided at the terminal 2. Lead 5 is welded so that the LED 3 is turned on by the electric power applied through the terminal 2.

The terminal 2 is installed to penetrate the upper and lower surfaces of the switch body 1, and one side is provided with a welding portion 2a to which the lead 5 is welded. The welded portion 2a is formed by bending an end portion of the terminal 2 downward, and a recessed portion 2b on which the lead 5 is placed is formed on an end surface thereof, and the lead portion is formed in the recessed portion a. 5) It can be soldered by welding. In this case, the lead 5 and the terminal 2 are made of copper or a copper alloy having a low electrical resistance 4.

Accordingly, the recess 2 is coupled to the switch body 1 and the upper and lower surfaces of the switch body 1 are turned upside down so that the welded portion 2a and the recessed portion 2b face upward. The lead 5 of the LED 3 or the resistor 4 is placed on the 2b, and as shown in Figs. 3A and 3B, the solder 6 is used for the LED 3 and the LED 5, respectively. By soldering the welding part 2a mutually, the lead 5 and the terminal 2 can be welded mutually.

However, according to this welding method, since the lead 5 is simply raised on the recess 2b of the welded portion 2a, the lead 5 and the welded portion 2a do not come into close contact with each other so that the lead 5 and the welded portion ( The thermal conductivity between 2a) drops. Therefore, when soldering in a state where the weld 2a and the lead 5 are not sufficiently heated, the solder 6 causes the solder 6 to be welded 2a and the lead 5 due to the temperature difference between the lead 5 and the weld 2a. There was a problem that can cause a welding defect that can not be fully fused. In addition, since the welding proceeds while the lead 5 is placed on the recess 2b of the welding part 2a, the position of the lead 5 is not fixed accurately, and accordingly, the switch body 1 is used for welding. ) Or when the lead 5 is moved during the welding operation, there is a problem that a position defect may occur in the welded resistor 4 or the LED 3.

On the contrary, in order to solve such a problem, when soldering the lead 5 and the weld 2a in this manner, the terminal 2 and the periphery of the lead 5 are sufficiently heated, and then the front and rear surfaces of the weld 2a and the lead 5 Since the soldering lead should be buried in the entire circumference of the), it takes a long time for welding. In particular, the copper or copper alloy forming the lead 5 and the terminal 2 has not only electrical conductivity but also high thermal conductivity, so that when the lead 5 or the welding portion 2a is excessively heated, the lead 5 Heat applied to the LED 3 or the resistor 4 can damage the LED 3 or the resistor 4, as well as to the entire thermal terminal 2 applied to the weld 2a to be heated. There was a problem that the switch body 1 of the synthetic resin material can be deformed by the terminal (2).

And, by welding with lead, there was a problem causing environmental problems.

This problem has arisen in common when welding not only the above-described LED 3 or resistor 4 but also all kinds of semiconductor elements having leads, such as diodes and transistors, to the terminal 2.

On the other hand, recently, a method of welding using a laser welding machine has been developed and widely used. This laser welding method has the advantage of being able to intensively apply heat to a very small area, while applying a minimum of heat to the member, and the welding time is fast.

By the way, using this laser welding method, in order to mutually weld the lead 5 and the terminal 2, it is necessary to accurately irradiate the laser to the contact portion of the lead 5 and the terminal 2, (5) and the terminal (2) has a problem that the position of the lead (5) is flexible, it is difficult to irradiate the laser accurately to the contact portion of the lead (5) and the terminal (2). In addition, according to the above-described problem, since the laser should be irradiated to the wide portions of the lead 5 and the terminal 2, the probability that excessive heat is applied to the lead 5 may damage the semiconductor element is very high. Therefore, this laser welding method is mainly used only for spot welding of a large area material without the problem of heat damage such as stainless steel sheet or steel sheet, and is not used for welding the lead 5 and the terminal 2. have.

The present invention is to solve the above problems, while reducing the welding time between the lead 5 and the terminal 2 provided in the semiconductor device such as the LED (3) or the resistor (4) is generated To provide a new laser welding device and a laser welding method using the same, which can prevent the semiconductor device from being damaged by heat by welding by applying only minimal heat to the lead 5 and the terminal 2. There is this.

According to the present invention, in the laser welding apparatus for welding the lead 5 provided in the semiconductor element such as the LED 3 and the resistor 4 to the welding portion 2a on one side of the terminal 2 made of a conductor material, A conveying apparatus 10 for conveying the terminal 2; A semiconductor element supply device which is provided at an intermediate portion of a transfer path of the transfer device 10 and supplies a semiconductor element so that the lead 5 is disposed between a pair of bent pieces 2c protruding from the welding portion 2a ( 20); A concave groove 31a for bending the bending piece 2c includes a core 31 formed at one side, and a driving device 32 for advancing and retreating the core 31. A bending device (30) positioned in the process to press and fold the core (31) back and forth so that the bending piece (2c) is brought into close contact with the circumferential surface of the lid (5); A laser welding machine (40) positioned in a post-process of the bending device (30) to irradiate and weld a laser to a bending piece (2c) or a lead (5) pressurized by the core (31); Provided is a laser welding device comprising a.

According to another feature of the invention, the bending piece (2c) is configured to be narrower toward the front end portion is pressurized to surround the circumferential surface of the lead 5 in the state in which the front end parts are separated from each other by the bending device 30 Provided is a laser welding device, which is bent.

According to another feature of the present invention, a black paint 7 is applied to the circumferential surface of the lid 5, and the semiconductor element supply device 20 has a portion where the black paint 7 is coated on the bent piece ( The reader 5 of the semiconductor element is disposed so as to be positioned between 2c, and the laser welder 40 is capable of irradiating a laser to a contact portion between the bent piece 2c and the lead 5. A laser welding device is provided.

According to another feature of the present invention, laser welding for welding the lead 5 provided in the semiconductor device such as the LED 3 and the resistor 4 to the welding portion 2a on one side of the terminal 2 made of a conductor material. A method, comprising: provisional step of arranging the lead (5) between a pair of bending pieces (2c) protruding from the welding portion (2a); A bending step of bending the bending piece 2c such that the bending piece 2c is brought into close contact with the circumferential surface of the lead 5 by using a press; A laser welding method is provided, including a welding step of irradiating a laser beam onto the bent piece 2c or the lead 5 so that the bent piece 2c and the lead 5 are mutually welded.

According to another feature of the invention, the bent piece (2c) is configured to be narrower toward the tip end portion is a laser, characterized in that the pressure bend to surround the circumferential surface of the lead 5 in the state that the tip parts are spaced from each other A welding method is provided.

According to another feature of the invention, the black paint 7 is applied to the circumferential surface of the lid 5, so that the portion to which the black paint 7 is applied is disposed between the bent pieces 2c. The laser welding method is characterized in that the laser is irradiated to the contact portion between the bent piece (2c) and the lead (5).

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the laser welding device according to the present invention, the lead 5 provided in the semiconductor element such as the LED 3 and the resistor 4 is welded to the welding portion 2a on one side of the terminal 2 made of a conductor material. 4 to 9 illustrate a laser welding device for welding the lead 5 of the resistor 4 to the welding portion 2a of the terminal 2 coupled to the switch body 1 of the IP switch.

In this case, the terminal 2 and the lead 5 are made of copper or a copper alloy, and a black paint 7 is applied to a predetermined region of the peripheral surface of the lead 5 of the resistor 4. In addition, as shown in FIG. 4, the welded portion 2a of the terminal 2 is formed by bending one end of the terminal 2 downward, and the welded portion 2a is configured to have a narrower width toward the tip portion. The bent pieces 2c are protruded downwards to be spaced apart from each other. In addition, the terminal 2 configured as described above is welded to the lead of the resistor 4 in a state in which the welding part 2a is coupled so as to penetrate from the upper surface to the lower surface of the switch body 1 of the IP switch made of synthetic resin. .

In addition, according to the present invention, the laser welding device includes a transfer device (10) for transferring the terminal (2) together with the switch body (1); The semiconductor device supply device 20 is provided in the middle of the transfer path of the transfer device 10 and supplies a resistor 4 so that the lead 5 is disposed between the bent pieces 2c protruding from the welded portion 2a. )Wow; A bending device (30) positioned at a post-process of the transfer device (10) to press bending the bending piece (2c) to be in close contact with the circumferential surface of the lid (5); It is located in the post-process of the bending device 30 and consists of a laser welding machine 40 for welding the bending piece (2c) and the lead (5).

The transfer device 10 is a conveyor device provided with a plurality of support blocks 11 on which the switch body 1 is mounted at regular intervals. After the terminal 2 is coupled to the switch body 1 in a previous process, When the switch body 1 is placed upside down on the support block 11, the terminal 2 is moved along the path of the transfer device 10 together with the switch body 1 to supply the semiconductor device. 20 and the lower portion of the bending device 30 and the laser welder 40 are sequentially passed. At this time, the terminal (2) is coupled so that the end penetrates the switch body (1) from the upper surface in the lower direction, so that the welding portion (2a) and the bending piece (2c) is disposed to face downward, the switch body (1) When turned over to the support block 11, the welded portion (2a) and the bent piece (2c) is directed upward.

As shown in FIGS. 5 and 6, the semiconductor device supply device 20 includes a feeder 21 for aligning and sequentially supplying the resistor 4, and a resistor 4 supplied by the feeder 21. The picker is composed of a picker 22 that picks up and puts it on the switch body 1. When the switch body 1 is transported to the lower side of the picker 22 by the transfer device 10, the picker 22 resists. (4) is picked up and moved so that the lead 5 of the resistor 4 may be located between the bent pieces 2c. In this case, as shown in FIG. 9B, the semiconductor element supply device 20 has a black paint 7 coated on the leader 5 of the resistor 4. Position it so that it is located between.

As shown in FIGS. 7 and 8, the bending device 30 lifts up and down the core 31 and the core 31 having a concave groove 31a for bending the bending piece 2c on its lower surface. Made of a driving device (32). The drive device 32 is configured by using an air cylinder or a hydraulic cylinder, and by raising and lowering the core 31, the concave groove 31a of the core 31 presses the bending piece 2c downward, The bent piece 2c is bent so as to surround the circumferential surface of the lid 5. At this time, the length of the bent piece (2c) and the shape of the concave groove (31a), the front end of the bent piece (2c) bent by the core 31 is adjusted to be spaced apart from each other by a predetermined interval (L). .

As shown in FIG. 9, the laser welder 40 is positioned above the transfer device 10 and disposed to irradiate a laser to a contact portion between the bent piece 2c and the lead 5, thereby bending the laser welder 40. It is comprised so that heat may be simultaneously applied to the piece 2c and the lid 5.

The welding method using the laser welding device configured as described above is as follows.

First, using a transfer robot (not shown), if the switch body 1 coupled to the terminal 2 in the previous step is placed on the support block 11 of the transfer apparatus 10 in an upside down state, the terminal (2) is sequentially transferred along the transfer path of the transfer device 10 together with the switch body 1 in a state that the welding portion (2a) and the bent piece (2c) is upward.

When the switch body 1 is transported below the picker 22 of the semiconductor device supply device 20, as shown in FIG. 6, the picker 22 is supplied by the feeder 21. (4) is picked up and arranged so that the lead 5 of the resistor 4 is positioned between the bent pieces 2c of the terminal 2. At this time, the lead 5 of the resistor 4 is disposed so that the portion coated with the black paint 7 is positioned between the bent pieces 2c by the semiconductor element supply device 20.

When the switch body 1 having the resistor 4 disposed thereon is transferred to the lower side of the bending device 30, as shown in FIG. 8, the core 31 is lowered to the driving device 32 while the core is lowered. A concave groove 31a of 31 presses the bending piece 2c, and accordingly, the leading piece of the bending piece 2c is bent in an adjacent direction, so that the bending piece 2c is a circumferential surface of the lid 5. Close to At this time, the bent piece (2c) is bent so that the tip portion is spaced apart from each other by a predetermined interval (L). In addition, since the lead 5 is disposed so that the portion where the black paint 7 is applied is located between the bent pieces 2c, the bent piece 2c is a portion where the black paint 7 is applied. It is bent to wrap.

Then, when the switch body 1 is transferred to the lower side of the laser welder 40, as shown in (a) and (b) of FIG. 9, the laser welder 40 and the bending piece (2c) By irradiating the laser to the contact portion of the lead 5, as shown in Fig. 10 (a) or (b), the bent piece 2c and the lead 5 heated by the laser can be melted and fused together. Make sure

According to the laser welding apparatus and the laser welding method configured as described above, the bending piece 2c is pressurized and bent to surround the circumferential surface of the lid 5, so that the lid 5 is not fixed to move and the terminal 2 is not fixed. And the thermal conductivity between the peripheral surface of the lid 5 can be increased. Therefore, it is not only possible to prevent the positional defect of the welded resistance 4 from being generated, but also to irradiate the laser to the contact portion of the lead 5 and the bent piece 2c accurately, even if the laser is irradiated for only a short time. Since the terminal 2 and the lead 5 are heated to the same temperature at the same time, not only can the welding efficiency be increased and the working time can be reduced, but also the occurrence of welding failure can be prevented, and the lead 5 and the terminal 2 can be By minimizing the heat applied, the resistance 4 and the switch body 1 of the synthetic resin are prevented from being damaged by the heat.

In addition, since the bending pieces 2c and the leads 5 of the terminal 2 are welded to each other without using lead, environmental pollution due to lead is not generated, and the burnout of the leads 5 can be minimized. There is an advantage.

In addition, since the bent piece (2c) is configured to be narrower toward the tip portion and the width is bent so as to be spaced apart from each other, the bent piece (2c) can be easily bent to surround the circumferential surface of the lead (5), the lead (5) ), There is an advantage that the bent piece (2c) melted exposed to the circumference can be quickly fused to the surface of the lead (5).

In addition, the lid 5 is disposed such that the black paint 7 is applied so that the position where the black paint 7 is applied is located between the bent pieces 2c, and the laser welder 40 is the lead ( 5) Since the laser is irradiated to the contact portion of the bent piece (2c), by increasing the absorption rate of the laser, there is an advantage that can reduce the welding work time, and improve the efficiency.

In this embodiment, the welding of the lead 5 of the resistor 4 to the weld 2a of the terminal 2 is illustrated, but the lead 5 of the LED 3 is welded to the terminal 2. In the case of a laser welding device for welding to (2a), the lid 5 of the LED 3 is coupled so as to penetrate downward from the upper surface of the switch body 1, so that the upper surface of the switch body 1 is upward. The LED 3 is coupled to the switch body 1 using the semiconductor device supply device 20 in a state in which it is disposed on the support block 11 of the transfer apparatus 10 so as to face the same, and using a separate robot arm. After the switch body 1 is turned upside down, the welding part 2a, the bending piece 2c, and the dire 5 are disposed upward, and then the bending step and the welding step are preferably performed. In addition, the laser welding apparatus and the laser welding method are not limited to the above-described IP switch, but the LED 3 and the resistor 4 and the lead 4 of the semiconductor element including the diode or the transistor are welded to the terminal 2. You can use it wherever you are.

In addition, although the welding part 2a illustrates bending of one end of the terminal 2, the shape of the welding part 2a may be freely changed, and if necessary, one side of the terminal 2 may be welded 2a. It is also possible to set).

As such, the laser welding apparatus and the laser welding method according to the present invention can be variously modified depending on the needs of the operator or the characteristics of the work, without departing from the spirit of the present invention.

1 is an exploded perspective view illustrating a conventional IP switch;

Figure 2 is a side cross-sectional view illustrating a conventional IP switch,

3 is a reference diagram showing a conventional method for welding a lead and a terminal,

4 is an exploded perspective view illustrating an IP switch to which a laser welding method according to the present invention is applied;

5 is a schematic view showing a laser welding device according to the present invention;

6 is a reference diagram showing a transfer device of a laser welding device according to the present invention;

7 and 8 is a reference view showing a bending device of the laser welding apparatus according to the present invention,

9 is a reference diagram showing a laser welder of the laser welding device according to the present invention;

10 is a reference diagram showing a laser welding method according to the present invention.

Claims

In the laser welding apparatus for welding the lead 5 provided in the semiconductor element such as the LED 3 and the resistor 4 to the welding portion 2a on one side of the terminal 2 made of a conductor material,

A conveying apparatus 10 for conveying the terminal 2;

A semiconductor element supply device which is provided at an intermediate portion of a transfer path of the transfer device 10 and supplies a semiconductor element so that the lead 5 is disposed between a pair of bent pieces 2c protruding from the welding portion 2a ( 20);

A concave groove 31a for bending the bending piece 2c includes a core 31 formed at one side, and a driving device 32 for advancing and retreating the core 31. A bending device (30) positioned in the process to press and fold the core (31) back and forth so that the bending piece (2c) is brought into close contact with the circumferential surface of the lid (5);

A laser welding machine (40) positioned in a post-process of the bending device (30) to irradiate and weld a laser to a bending piece (2c) or a lead (5) pressurized by the core (31);

Laser welding device comprising a.

According to claim 1, The bending piece (2c) is configured to be narrower toward the front end portion is bent to be wrapped so as to surround the circumferential surface of the lead 5 in the state in which the front end portions are separated from each other by the bending device (30) Laser welding apparatus, characterized in that.

The black paint 7 is coated on the circumferential surface of the lead 5, and the semiconductor element supply device 20 has a black paint 7 coated on a portion of the bent piece 2c. The reader 5 of the semiconductor element is disposed so as to be interposed therebetween, and the laser welding machine 40 is capable of irradiating a laser to a contact portion between the bent piece 2c and the lead 5. Device.

In the laser welding method of welding the lead 5 provided in the semiconductor element such as the LED 3 and the resistor 4 to the welding portion 2a on one side of the terminal 2 made of a conductor material, the welding portion 2a A provisional installation step of arranging the lead 5 between the pair of bending pieces 2c protruding from each other; A bending step of bending the bending piece 2c such that the bending piece 2c is brought into close contact with the circumferential surface of the lead 5 by using a press; And a welding step of irradiating the bent piece (2c) or the lead (5) with a laser to weld the bent piece (2c) and the lead (5) to each other.

The laser welding method according to claim 4, wherein the bent piece (2c) is narrower in width toward the tip portion, and is bent to wrap around the circumferential surface of the lead (5) in a state where the tip portions are spaced apart from each other. .

The black paint 7 is applied to the circumferential surface of the lid 5, so that a portion to which the black paint 7 is applied is disposed between the bent pieces 2c, and the laser Is irradiated to the contact portion of the bent piece (2c) and the lead (5).