CN206322670U - A kind of welding semiconductor devices mechanism - Google Patents
A kind of welding semiconductor devices mechanism Download PDFInfo
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- CN206322670U CN206322670U CN201621462589.8U CN201621462589U CN206322670U CN 206322670 U CN206322670 U CN 206322670U CN 201621462589 U CN201621462589 U CN 201621462589U CN 206322670 U CN206322670 U CN 206322670U
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Abstract
A kind of welding semiconductor devices mechanism, belongs to welding semiconductor devices apparatus field.It is characterized in that：Described frame（6）It is provided with heating arrangements（7）, described heating arrangements（7）It is laid side by side including multiple in frame（6）On heating plate, each heating plate top surface individually places semiconductor device（11）；Frame（6）On be additionally provided with lifting travel mechanism（3）, lift travel mechanism（3）By conductor device（11）Semiconductor devices is driven after being lifted from a heating plate simultaneously（11）It is moved horizontally to next heating plate.The utility model changes traditional mode of heating, using heating mode during contact, contact heating is directly realized by semiconductor contact with the heating surface of heating arrangements, the drawbacks of existing heating of traditional tunnel-kiln type heating is uneven is avoided, and heating arrangements are multiple heating plates being laid side by side in frame top.
Description
Technical field
A kind of welding semiconductor devices mechanism, belongs to welding semiconductor devices apparatus field.
Background technology
With the development of modern science and technology, semiconductor devices and component are in engineering, extensive use available commercially.It is in thunder
Reach, the extensive application of remote-control romote-sensing, Aero-Space etc. proposes higher and higher requirement to its reliability.And because of chip welding
（Paste）The bad failure caused also increasingly causes the attention of people, irreversible because this failure is often fatal
's.
When assembling semiconductor devices, the process that circuit portion is heated, fixed with peripheral housing using bonding agent, it
Afterwards, carry out by using soldering paste（Scolding tin）Welding be formed in connection in the portion of terminal of peripheral housing and the distribution of insulated substrate
Process.In the case of bonding circuit portion with peripheral housing, in circuit portion or peripheral housing adhesive-applying, and with appropriate pressure
Caking face in the state of the peripheral housing of power pressing, thus solidifies bonding agent, affixed circuit portion and peripheral housing.
At present, semiconductor devices is that multiple, marshalling semiconductor crystal block is welded on base plate to be made, existing
In technology, the welder of used semiconductor devices is electric heating plate；In use, the base plate for being placed with crystal block is placed on
On electric heating plate, crystal block is pressed using press tool with hand, makes crystal block together with base plate sweat soldering, reaches the mesh of welding
's；Such device has the shortcomings that labor strength is big, efficiency is low, precision is low, qualification rate is low, energy consumption is big.Heated
Heating-up temperature must be accurately controlled in journey, while ensureing heating effect again, welding effect is not influenceed.But it has been found that
Current welded plate is generally integral structure, and the side or top of welded plate are provided with heater strip or heating tube, and such a structure is formed
Heating surface it is not uniform enough, heating effect is simultaneously bad, have impact on the welding effect of semiconductor devices；Moreover, semiconductor devices exists
Conveying between each process is generally artificial or apparatus clamping, is easily destroyed semiconductor device surface, or cause one to human body
Setting loss does harm to.
The content of the invention
Technical problem to be solved in the utility model is：The deficiencies in the prior art are overcome to avoid device from damaging there is provided one kind
Hinder, be easy to convey, improve the welding semiconductor devices mechanism of welding effect.
The utility model solves the technical scheme that its technical problem used：The welding semiconductor devices mechanism, including
Frame, it is characterised in that：Described frame is provided with heating arrangements, and described heating arrangements include multiple be laid side by side in frame
On heating plate, each heating plate top surface individually places semiconductor device；Lifting travel mechanism is additionally provided with frame,
It is next that lifting travel mechanism drives semiconductor devices to be moved horizontally to simultaneously after conductor device is lifted from a heating plate
Heating plate.
Change traditional mode of heating, using heating mode during contact, directly pass through the heating of semiconductor and heating arrangements
Contact heating is realized in the contact in face, and heating arrangements are multiple heating plates being laid side by side in frame top, in frame also
The lifting travel mechanism for sending semiconductor devices horizontal direction to shift is set, the position of semiconductor is lifted by lifting travel mechanism,
The semiconductor devices delivery of previous process is just completed to next station, without mobile heating plate, moreover, semiconductor devices is direct
Mobile conveying, can avoid gripping mode from causing the problem of damage, and positioning of the fixture to station are forbidden to semiconductor device surface.
Described heating plate includes the upper plate body and lower body of spelling group up and down, is provided with and adds between upper plate body and lower body
Thermal and thermometric thermal resistance.
The plate body of traditional integral type is changed to the assembled structure of two-piece unit formula, then installs and adds between plate body up and down
Thermal, and equipped thermometric thermal resistance, ensure that the overall heating effect of plate body, thoroughly prevent plate body to semiconductor devices
The uneven phenomenon of heating surface, while real time temperature measurement is carried out using thermal resistance, so that the heating-up temperature of flexible modulation heater,
Further ensure plate body heating uniformity and heating-up temperature it is constant.Furthermore, plate body be divided into above and below two parts, be more convenient for peace
Assembly and disassembly, are easy to the later stage to the maintenance of heater and thermal resistance, change, Embedded inner mounting structure, it is ensured that plus
The flatness of hot plate top surface, is further ensured that welding effect.
Described upper plate body top surface lifts the power output of travel mechanism provided with a plurality of longitudinally disposed station movement slot
End is set in described station movement slot, and can be lifted and movable in station movement slot.It is preferred that, station movement
The setting direction of slot is consistent with the width of upper plate body, when needing transfer semiconductor devices, can be moved and inserted by station
Semiconductor devices is lifted shift from below by groove, convenient and swift, avoids causing semiconductor device surface damage again.
The bottom of described upper plate body and the top of lower body correspond to the electrical heating peace for offering and matching along its length
Tankage, two groups of electrical heating mounting grooves dock the installation through-hole to be formed and place heater.By inside upper plate body and lower body
Electrical heating mounting groove is set, the passage of a plurality of installation heater, the passage and plate body are formed between upper plate body and lower body
Length match, fully ensured that the overall heating of upper plate body, it is ensured that overall temperature rise it is uniform.Simultaneously, moreover it is possible to ensure heating
Smooth, the placement compression of device.
The bottom surface of described upper plate body is correspondingly provided with installation provided with the fixing hole for installing Thermistor Temperature Measurement end, lower body top surface
The thermal resistance mounting groove of thermal resistance body and circuit.Thermal resistance is also hidden in by upper plate body and lower body by thermal resistance mounting groove
Inside, saves overall structure space, more compact structure.
Heating plate base is provided with below described lower body, lower body bottom surrounding passes through latch grafting heating plate base top
The grafting endoporus in face, and cover sleeved on latch.By setting heating plate base, the height of heating plate is slightly lifted,
Certain space formed below of lower body, when the space is used to weld, the circulation of anti-oxidation atmosphere, it is ensured that welding effect.
Described lifting travel mechanism include end plate, lifting movable plate and lifting assembly and translation component, lifting assembly and
The top of translation component connects described lifting movable plate respectively.
Described lifting assembly includes lift arm and lifter slide, and lift arm includes telescopic cylinder and the cylinder bottom on top
What movable end was connected walks wheel, walks slipping and is arranged on the lifter slide of domatic setting；Translating component includes translation motor, translation
Arm and leading screw, translation motor output end connection leading screw, and pass through the bottom of threads of lead screw connection translation arms.
The bottom of described heating arrangements is provided with atmosphere conveying mechanism, and atmosphere conveying mechanism includes downward projection of arc gas
Atmosphere baffle plate and the nitrogen delivery pipe through atmosphere baffle plate setting below heating plate.By setting atmosphere conveying mechanism, in heating
The lower section of plate and surrounding form oxidation resistant atmosphere, prevent that semiconductor devices surface metal is aoxidized after welding, and then influence
Its performance.
Described loading machine hand includes two clamping plates be arrangeding in parallel, above and below the lower inside of the clamping plate of both sides is provided with
The lifting boss and correction boss be arrangeding in parallel.By the setting for lifting boss and correction boss so that the clamping plate of manipulator
When gripping layers of chips, without realizing positioning, you can complete the calibration actions of layers of chips, when saving processing step and work
Between, it is further ensured that welding effect.
Compared with prior art, the utility model is had an advantageous effect in that：The utility model changes traditional heating
Mode, using heating mode during contact, directly realizes contact heating by semiconductor contact with the heating surface of heating arrangements,
The drawbacks of existing heating of traditional tunnel-kiln type heating is uneven is avoided, and heating arrangements are laid side by side in machine to be multiple
Heating plate on frame, also sets up the lifting travel mechanism for sending semiconductor devices horizontal direction to shift in frame, is moved by being lifted
The position of dynamic mechanism lifts semiconductor, just completes the semiconductor devices delivery of previous process to next station, adds without mobile
Hot plate, moreover, the directly mobile conveying of semiconductor devices, can avoid gripping mode from causing damage, and folder to semiconductor device surface
Have the problem of positioning to station is forbidden.
Brief description of the drawings
Fig. 1 is welding semiconductor devices mechanism axonometric drawing schematic diagram.
Fig. 2 is welding semiconductor devices mechanism side view schematic diagram.
Fig. 3 is heating arrangements explosive view schematic diagram.
Fig. 4 is Fig. 3 front view schematic diagram.
Fig. 5 is Fig. 1 part A close-up schematic view.
Wherein, 1, switch board 2, portal frame 3, lifting travel mechanism 301, end plate 302, lifting movable plate 303, carry
Rise arm 304, lifter slide 305, translation motor 306, translation arms 307, leading screw 4, loading machine hand 401, lifting boss
402nd, correction boss 403, clamping plate 5, welding gland 6, frame 601, longitudinal baffle 602, horizontal baffle 7, heater
Structure 701, lower body 7011, latch 7012, mounting groove 7013, thermal resistance mounting groove 702, heating muff on heating wire
7021st, mounting groove 7032 under heating wire 703, upper plate body 7031, heating wire, station movement slot 7033, fixing hole 704,
Mounting hole 8, cooling body 9, unloading manipulator 10, connection pivoted arm 11, semiconductor devices 12, atmosphere baffle plate 13, nitrogen
Delivery pipe 14, heating plate base 1401, grafting endoporus 15, sleeve 16, thermal resistance.
Embodiment
Fig. 1 ~ 5 are most preferred embodiments of the present utility model, and 1 ~ 5 pair of the utility model is done furtherly below in conjunction with the accompanying drawings
It is bright.
Referring to the drawings 1 ~ 5：A kind of welding semiconductor devices mechanism, including frame 6, frame 6 are provided with heating arrangements 7, plus
Heat engine structure 7 includes multiple heating plates being laid side by side in frame 6；Conveying semiconductor devices level side is additionally provided with frame 6
To the lifting travel mechanism 3 of displacement, lifting travel mechanism 3 drives simultaneously after conductor device 11 is lifted from a heating plate
Semiconductor devices 11 is moved horizontally to next heating plate.
Each heating plate top surface individually places semiconductor device 11, it is preferred that lifting travel mechanism 3, which is arranged on, to be added
The bottom surface of semiconductor devices 11 is lifted in the lower section of heat engine structure 7, the mobile terminal of lifting travel mechanism 3, and the bottom of heating arrangements 7 is provided with gas
Atmosphere conveying mechanism.Such as realized using cylinder or oil cylinder, the lifting of semiconductor devices 11 is realized using lifting cylinder, by translating gas
Cylinder realizes the translation of semiconductor devices 11.
Lifting travel mechanism 3 can be also arranged on to the side of heating arrangements 7, can be real by lifting cylinder or expansion link etc.
The mechanism of existing oscilaltion realizes the lifting to semiconductor devices 11, and half is realized by the mechanism of the achievable translation such as line slideway
The translation of conductor device 11.Can be realizing semiconductor by way of being lifted to the lifting of the top of semiconductor devices 11 or lower section
The lifting of device 11, then the displacement for coordinating translation mechanism to realize semiconductor devices 11.In the present embodiment, emphasis narration is using under
The mode that side is lifted realizes the operation principle of the lifting of semiconductor devices 11.
In addition, the top of frame 6 be provided with by connect in the welding gland 5 that pivoted arm 10 is connected, frame 6 according to process according to
Secondary to be provided with heating arrangements 7 and cooling body 8, the feed end of heating arrangements 7 is provided with loading machine hand 4, the discharge end of cooling body 8
Provided with unloading manipulator 9；The lower section of heating arrangements 7 and cooling body 8 is carried provided with the horizontal direction displacement of conveying semiconductor devices
Travel mechanism 3 is risen, the bottom of heating arrangements 7 is provided with atmosphere conveying mechanism.
Heating arrangements 7 include multiple heating plates being laid side by side at the top of frame 6, and each heating plate top surface is individually put
Semiconductor device 11 is put, heating plate includes the upper plate body 703 and lower body 701 of spelling group up and down, upper plate body 703 and lower plate
Heater and thermometric thermal resistance 16 are provided between body 701.The top surface of upper plate body 703 is inserted provided with a plurality of longitudinally disposed station movement
Groove 7032, the clutch end of lifting travel mechanism 3 is set in station movement slot 7032, and can move slot in station
7032 are lifted and movable, i.e., a plurality of lifting movable plate 302 is set in station movement slot 7032, and lifting movable plate
302 longitudinal lengths are less than the depth that station moves slot 7032.The bottom of upper plate body 703 and the top of lower body 701 are along length
Direction correspondence offers the electrical heating mounting groove matched, and two groups of electrical heating mounting grooves dock the installation to be formed and place heater
Through hole.The bottom surface of upper plate body 703 is correspondingly provided with provided with the fixing hole 7033 for installing the thermometric end of thermal resistance 16, the top surface of lower body 701
The thermal resistance mounting groove 7013 of the body of thermal resistance 16 and circuit is installed.The lower section of lower body 701 is provided with heating plate base 14, lower body
701 bottom surroundings are set with by the grafting endoporus 1401 of the top surface of 7011 grafting heating plate base of latch 14, and on latch 7011
Sleeve.
Lifted travel mechanism 3 include end plate 301, lifting movable plate 302 and lifting assembly and translation component, lifting assembly and
The top of translation component connects lifting movable plate 302 respectively, and lifting movable plate 302 is a plurality of provided with horizontal parallel setting, a plurality of
Lift the two ends of movable plate 302 and fixation is encapsulated by end plate 301 respectively.Lifting assembly includes lift arm 303 and lifter slide 304,
What the telescopic cylinder and cylinder lower removable telescopic end that lift arm 303 includes top were connected walks wheel, walks slipping and is arranged on domatic
On the lifter slide 304 of setting；Translating component includes translation motor 305, translation arms 306 and leading screw 307, and translation motor 305 is defeated
Go out end connection leading screw 307, and pass through the bottom of the threaded connection translation arms 306 of leading screw 307.
Operationally, after semiconductor devices 11 completes the operational sequence at heating plate, start translation motor 305, put down
Moving motor 305 drives leading screw 307 to rotate, and drives translation arms 306 to realize by leading screw 307 and translates, translation arms 306 drive multiple supports
Lift the one or more stations of the synchronizing moving of semiconductor devices 11 on lifting movable plate 302, during movement, lift arm
303 follow the lifting synchronizing moving of movable plate 302, and the telescopic cylinder telescopic end being equally connected with lifting movable plate 302 stretches out, and leads to
Cross away wheel gradually to glide along lifter slide 304, after the completion of station, lifting movable plate 302 declines one under the drive of telescopic cylinder
Fixed position, departs from the contact with semiconductor devices 11, then, translation motor 305 is overturn, and translation arms 306 reversely translate back original
Position, similarly, telescopic cylinder telescopic end are gradually retracted original position, and are slided by walking wheel along lifter slide 304 is gradually upper, heating arrangements 7
Bottom be provided with atmosphere conveying mechanism, atmosphere conveying mechanism includes downward projection of arc atmosphere baffle plate 12 and through atmosphere baffle plate
12 are arranged on the nitrogen delivery pipe 13 below heating plate.Loading machine hand 4 includes two clamping plates 403 be arrangeding in parallel, both sides
The lower inside of clamping plate 403 is provided with the lifting boss 401 be arrangeding in parallel up and down and correction boss 402.By lifting boss 401
With the setting of correction boss 402 so that the clamping plate 403 of manipulator is when gripping layers of chips, without realizing positioning, you can complete
Into the calibration actions of layers of chips, processing step and working time are saved, welding effect is further ensured that.
The above, is only preferred embodiment of the present utility model, is not to make other forms to the utility model
Limitation, any those skilled in the art are changed or are modified as possibly also with the technology contents of the disclosure above equivalent
The Equivalent embodiments of change.But it is every without departing from technical solutions of the utility model content, it is real according to technology of the present utility model
Any simple modification, equivalent variations and remodeling that confrontation above example is made, still fall within the guarantor of technical solutions of the utility model
Protect scope.
Claims (9)
1. a kind of welding semiconductor devices mechanism, including frame（6）, it is characterised in that：Described frame（6）It is provided with heater
Structure（7）, described heating arrangements（7）It is laid side by side including multiple in frame（6）On heating plate, each heating plate top surface difference
Individually placed semiconductor device（11）；Frame（6）On be additionally provided with lifting travel mechanism（3）, lift travel mechanism（3）It will lead
Body device（11）Semiconductor devices is driven after being lifted from a heating plate simultaneously（11）It is moved horizontally to next heating plate.
2. a kind of welding semiconductor devices mechanism according to claim 1, it is characterised in that：Described heating plate includes upper
The upper plate body of lower spelling group（703）And lower body（701）, upper plate body（703）And lower body（701）Between be provided with heater
And thermometric thermal resistance（16）.
3. a kind of welding semiconductor devices mechanism according to claim 2, it is characterised in that：Described upper plate body（703）
Top surface is provided with a plurality of longitudinally disposed station movement slot（7032）, lift travel mechanism（3）Clutch end be set on institute
The station movement slot stated（7032）It is interior, and slot can be moved in station（7032）Lift and movable.
4. a kind of welding semiconductor devices mechanism according to claim 2, it is characterised in that：Described upper plate body（703）
Bottom and lower body（701）Top correspond to offer the electrical heating mounting groove that matches along its length, two groups of electrical heating
Mounting groove docks the installation through-hole to be formed and place heater.
5. a kind of welding semiconductor devices mechanism according to claim 2, it is characterised in that：Described upper plate body（703）
Bottom surface provided with install thermal resistance（16）The fixing hole of thermometric end（7033）, lower body（701）Top surface is correspondingly provided with installation thermoelectricity
Resistance（16）The thermal resistance mounting groove of body and circuit（7013）.
6. a kind of welding semiconductor devices mechanism according to claim 2, it is characterised in that：Described lower body（701）
Lower section is provided with heating plate base（14）, lower body（701）Bottom surrounding passes through latch（7011）Grafting heating plate base（14）Top
The grafting endoporus in face（1401）, and in latch（7011）Upper set is sleeved.
7. a kind of welding semiconductor devices mechanism according to claim 1, it is characterised in that：Described lifting travel mechanism
（3）Including end plate（301）, lifting movable plate（302）With lifting assembly and translation component, the top of lifting assembly and translation component
Described lifting movable plate is connected respectively（302）.
8. a kind of welding semiconductor devices mechanism according to claim 7, it is characterised in that：Described lifting assembly includes
Lift arm（303）And lifter slide（304）, lift arm（303）Telescopic cylinder and the connection of cylinder lower removable end including top
Walk wheel, walk slipping be arranged on domatic setting lifter slide（304）On；Translating component includes translation motor（305）, translation
Arm（306）And leading screw（307）, translation motor（305）Output end connects leading screw（307）, and pass through leading screw（307）Threaded connection is flat
Displacement arm（306）Bottom.
9. a kind of welding semiconductor devices mechanism according to claim 1, it is characterised in that：Described heating arrangements（7）
Bottom be provided with atmosphere conveying mechanism, atmosphere conveying mechanism include downward projection of arc atmosphere baffle plate（12）Kept off with through atmosphere
Plate（12）It is arranged on the nitrogen delivery pipe below heating plate（13）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621462589.8U CN206322670U (en) | 2016-12-29 | 2016-12-29 | A kind of welding semiconductor devices mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621462589.8U CN206322670U (en) | 2016-12-29 | 2016-12-29 | A kind of welding semiconductor devices mechanism |
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| Publication Number | Publication Date |
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| CN206322670U true CN206322670U (en) | 2017-07-11 |
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| CN201621462589.8U Active CN206322670U (en) | 2016-12-29 | 2016-12-29 | A kind of welding semiconductor devices mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653632A (en) * | 2016-12-29 | 2017-05-10 | 淄博才聚电子科技有限公司 | Semiconductor device welding mechanism |
-
2016
- 2016-12-29 CN CN201621462589.8U patent/CN206322670U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653632A (en) * | 2016-12-29 | 2017-05-10 | 淄博才聚电子科技有限公司 | Semiconductor device welding mechanism |
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 29-3, Shandong high tech Zone, min Tai Road, Zibo, Shandong Patentee after: Shandong Cai Electronic Technology Co., Ltd. Address before: 255086 Shandong Zibo high tech Zone North Xin Xi Road, Gan Jia Industrial Park Patentee before: ZIBO CAIJU ELECTRONIC TECHNOLOGY CO., LTD. |
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| CP03 | Change of name, title or address |