KR101038883B1

KR101038883B1 - Light emitting diode package and method of manufacturing the same

Info

Publication number: KR101038883B1
Application number: KR1020090012741A
Authority: KR
Inventors: 정일권
Original assignee: 삼성엘이디 주식회사
Priority date: 2009-02-17
Filing date: 2009-02-17
Publication date: 2011-06-02
Also published as: KR20100093691A

Abstract

The present invention relates to a light emitting diode package and a method for manufacturing the same, comprising: an LED chip mounted on a substrate; A phosphor formed along a surface of the LED chip; And a light-transmitting resin formed on the phosphor. The present invention also provides a method of manufacturing the light emitting diode package.

LED, water repellent coating, phosphor, volatile solvent

Description

Light emitting diode package and method of manufacturing the same

The present invention relates to a light emitting diode package and a method of manufacturing the same. More specifically, after forming a volatile solvent mixed with a phosphor on the LED chip, as the volatile solvent is evaporated, the phosphor is uniform thickness on the surface of the LED chip The present invention relates to a light emitting diode package and a method of manufacturing the same.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.

In recent years, thanks to the rapid development of semiconductor technology, LEDs have escaped from general-purpose products with low brightness, enabling production of high-brightness and high-quality products. In addition, as the implementation of high-performance blue and white LEDs becomes a reality, its application value is being extended to displays and next-generation lighting sources.

As the demand for high power and high brightness LEDs, such as white LEDs for lighting, increases, studies are being actively conducted to improve the performance and reliability of LED packages. In order to improve the performance of the LED products, together with the LED chip itself having excellent light efficiency, the LED package must be secured at the same time to extract the light effectively, excellent color purity and uniform characteristics between the products.

In the conventional LED package, a groove is formed in a base substrate and an LED chip is bonded inside the groove, and then a mixture of phosphor and silicone resin is coated on the LED chip.

However, the LED package according to the prior art should additionally form a groove larger than the LED chip for the application of the phosphor, and due to the viscosity of the silicone resin, the precipitation of the phosphor in the resin does not occur quickly, so There is a problem that it is quite difficult to control the spatial distribution of the phosphor.

Therefore, the present invention has been made to solve the above problems, an object of the present invention, after forming a water-repellent coating layer on the substrate of the remaining area except the area requiring the application of the phosphor, in the portion where the water-repellent coating layer is not formed The present invention provides a light emitting diode package and a method of manufacturing the same, by applying a volatile solvent mixed with phosphors, so that the phosphors are deposited to a uniform thickness on the surface of the LED chip as the volatile solvent is evaporated.

According to an embodiment of the present invention, a light emitting diode package includes: an LED chip mounted on a substrate; A phosphor formed along a surface of the LED chip; And a transparent resin formed on the phosphor.

Here, the transparent resin may be a silicone resin.

In addition, the transparent resin may be formed in a lens shape.

In addition, the method of manufacturing a light emitting diode package according to an embodiment of the present invention for achieving the above object comprises the steps of: forming a water-repellent coating layer exposing a portion of the substrate on a substrate; Mounting an LED chip on a substrate on which the water repellent coating layer is not formed; Applying a volatile solvent mixed with a phosphor to cover the LED chip on the substrate on which the water repellent coating layer is not formed; Evaporating the volatile solvent to precipitate the phosphor on the surface of the LED chip; And forming a transparent resin on the phosphor.

Here, the volatile solvent may be acetone.

In addition, the transparent resin may be a silicone resin.

In addition, after the step of forming a transparent resin on the surface of the phosphor, the step of removing the water repellent coating layer; may further comprise a.

As described above, according to the light emitting diode package and the method of manufacturing the same, the volatile solvent mixed with the phosphor is applied only to the portion where the water repellent coating layer is not formed, so that the volatile solvent does not evaporate over time. As the phosphor is mixed with the volatile solvent, the phosphor may adhere to the surface of the LED chip and be precipitated to a predetermined thickness.

Therefore, since the present invention can form a phosphor with a uniform thickness on the surface of the LED chip, there is an effect that the color uniformity of light emitted through the package can be uniformly solved by eliminating color unevenness according to the direction of light. .

In addition, the present invention by using the water-repellent coating layer, the volatile solvent mixed with the phosphor is applied only to the portion where the water-repellent coating layer is not formed, it is possible to allow the phosphor to be applied only to the desired region without a separate groove structure for the phosphor coating. There is an advantage.

Matters relating to the operational effects including the technical configuration of the light emitting diode package and the manufacturing method according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

Embodiment of Structure of Light Emitting Diode Package

A light emitting diode package according to an embodiment of the present invention will be described in detail with reference to FIG. 1.

1 is a cross-sectional view showing the structure of a light emitting diode package according to an embodiment of the present invention.

As shown in FIG. 1, a light emitting diode package according to an embodiment of the present invention includes a base substrate 100, an LED chip 120 mounted on the base substrate 100, and the LED chip 120. It includes a phosphor 130 formed along the surface of the transparent resin 150 formed on the phosphor 130 and.

The LED chip 120 may be connected to a wire (not shown) of the base substrate 100 by a wire (not shown). In addition, the LED chip 120 may be mounted in a flip chip bonding method instead of the bonding method using the wire.

As the LED chip 120 and the phosphor 130, for example, a blue LED chip and a yellow phosphor may be used to implement a white LED. In addition, a combination of a blue LED chip and a mixture of green and red phosphors, or a combination of an ultraviolet LED chip and a mixture of red, green and blue phosphors may be used.

In addition, the LED chip 120 and the phosphor 130 used in the present invention is not particularly limited since the present invention can be applied to the LED package for obtaining light of other colors in addition to the white LED.

Silicone resin or the like may be used as the transparent resin 150 formed on the phosphor 130.

The transparent resin 150 may be formed in a lens shape or the like.

In the LED package according to the exemplary embodiment of the present invention, the phosphor 130 is formed to have a uniform thickness only in a desired region without a separate groove structure for applying the phosphor 130, and thus the color according to the phosphor 130 distribution. The nonuniformity of can be eliminated.

Embodiment of a manufacturing method of a light emitting diode package

Hereinafter, a method of manufacturing a light emitting diode package according to an embodiment of the present invention will be described in detail with reference to FIGS. 2A to 2F.

2A through 2F are cross-sectional views sequentially illustrating a method of manufacturing a light emitting diode package according to an exemplary embodiment of the present invention.

First, as shown in FIG. 2A, after the water repellent coating layer 110 is formed on the base substrate 100, a portion of the water repellent coating layer 110 is removed by using a laser light or the like to form the base substrate 100. To expose a portion of the. Here, the portion of the substrate 100 exposed by removing the water repellent coating layer 110 is a portion where the mounting of the LED chip 120 and the coating of the phosphor 130 are to be performed.

The water repellent coating layer 110 may be formed by applying or spraying a water repellent paint having no affinity with water.

Next, as shown in FIG. 2B, the LED chip 120 is mounted on the base substrate 100 on which the water repellent coating layer 110 is not formed.

Next, as shown in FIG. 2C, the volatile solvent 140 mixed with the phosphor 130 is coated on the base substrate 100 on which the water repellent coating layer 110 is not formed to cover the LED chip 120. do.

At this time, in the embodiment of the present invention, the volatile solvent 140 mixed with the phosphor 130 does not rise on the water repellent coating layer 110, but is applied only to a region where the water repellent coating layer 110 is not formed.

That is, according to the method of manufacturing a light emitting diode package according to an embodiment of the present invention, the phosphor is coated by using the water repellent coating layer 110, thereby applying the phosphor using a conventional groove structure or the like. Compared to the case, there is an advantage that the size of the region to which the phosphor 130 is applied can be minimized.

Here, as the LED chip 120 and the phosphor 130, a blue LED chip and a yellow phosphor is used to implement a white LED as described above, or a combination of a blue LED chip and a mixture of green and red phosphors, or ultraviolet rays. Combinations of LED chips and mixtures of red, green and blue phosphors can be used. In addition, the LED chip 120 and the phosphor 130 used in the present invention is not particularly limited since the present invention can be applied to the LED package for obtaining light of other colors in addition to the white LED.

In addition, the volatile solvent 140 may be a volatile organic material, such as acetone, which is easily evaporated at room temperature.

The volatile solvent 140 has a much lower viscosity than the silicone resin that was used in combination with a conventional phosphor. Therefore, the phosphor 130 mixed in the volatile solvent 140 may be precipitated faster than the phosphor mixed in the conventional silicone resin.

As described above, after the application of the volatile solvent 140 mixed with the phosphor 130 on the LED chip 120 is completed, as shown in FIG. 2D, the volatile solvent 140 evaporates. As it disappears, the precipitation of the phosphor 130 occurs quickly.

Accordingly, the phosphor 130 is in close contact with the surface, that is, the upper surface and the side surface of the LED chip 120 is distributed in a constant thickness. Therefore, according to the exemplary embodiment of the present invention, the light generated from the LED chip 120 is converted into a color to be realized through the phosphor 130 formed to have a predetermined thickness along the surface of the LED chip 120, and comes out through the package. The color may appear uniform throughout.

Thereafter, as illustrated in FIG. 2E, a transparent resin 150 covering the phosphor 130 is formed. Silicone resin or the like may be used as the transparent resin 150, and may be formed in a lens shape as illustrated in the drawing as needed.

Then, as shown in Figure 2f, the water-repellent coating layer 110 is removed. In this case, the removal of the water repellent coating layer 110 may be omitted.

According to the manufacturing method of the LED package according to the embodiment of the present invention as described above, by using the water-repellent coating layer 110, the phosphor 130 is only in a desired region without a separate groove structure for coating the phosphor 130 Can be applied.

In addition, by applying the volatile solvent 140 mixed with the phosphor 130 only in the portion where the water repellent coating layer 110 is not formed, as the volatile solvent 140 is evaporated, the phosphor 130 on the surface of the LED chip 120 May be precipitated to a uniform thickness. Therefore, the present invention can solve the non-uniformity of the color according to the phosphor 130 distribution.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

100: substrate 110: water repellent coating layer

120: LED chip 130: phosphor

140: volatile solvent 150: transparent resin

Claims

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Forming a water repellent coating layer exposing a portion of the substrate on the substrate;

Mounting an LED chip on a substrate on which the water repellent coating layer is not formed;

Applying a volatile solvent in which phosphors are mixed to cover the LED chip on the substrate on which the water repellent coating layer is not formed;

Evaporating the volatile solvent to precipitate the phosphor on the surface of the LED chip; And

Forming a transparent resin on the phosphor;

Method of manufacturing a light emitting diode package comprising a.

The method of claim 4, wherein

The volatile solvent is acetone manufacturing method of a light emitting diode package.

The method of claim 4, wherein

The transparent resin is a silicone resin manufacturing method of a light emitting diode package.

The method of claim 4, wherein

After the step of forming a transparent resin on the surface of the phosphor,

Removing the water-repellent coating layer; Method of manufacturing a light emitting diode package further comprising.