KR101024602B1 - Method of adhering a chip on a fpcb and apparatus for adhering the chip on the same fpcb - Google Patents

Abstract

PURPOSE: A method for mounting a component on a FPCB(Flexible Printed Circuit Board) of a double sided exposure structure is provided to improve productivity by simultaneously mounting an electronic component on both sides of a FPCB. CONSTITUTION: A FPCB(400) is positioned at a receiving groove(650) and an insertion hole(640) of a reinforcement plate(600). The receiving groove is formed along the boarder of the folded FPCB to receive the folded FPCB. When the FPCB is received in the receiving groove, an insertion hole is formed at the position of a folding part to insert the folding part. The reinforcement plate has a fixing groove around the receiving groove to fix one side of the FPCB.

Description

A method of mounting a component on a double-sided exposed flexible printed circuit board and a reinforcing plate for mounting the component {Method of adhering a chip on a FPCB and apparatus for adhering the chip on the same FPCB}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board, and more particularly, when mounting a component on a flexible printed circuit board having a double-sided exposure structure, a flexible printed circuit having a double-sided exposure structure capable of simultaneously mounting a component on both sides in one process. A method for mounting a component on a substrate and a reinforcing plate for mounting the component.

A flexible printed circuit board (hereinafter, referred to as “FPCB”) refers to an original plate of a circuit board coated with a flexible copper foil (copper film). In general, a three-layer structure that bonds a copper foil and a polyimide (PI) film with an adhesive has been mainly used, but a layer 2 FCCL product that directly die-casts or bonds a PI film to a copper foil at high temperature has been released. Layer 2 FCCL is used for display products such as mobile phones, LCDs, and PDP modules because of its fine pattern formation and flexibility.

In general, with the development of electronic components and component embedding technology, multilayer printed circuit boards that overlap circuit conductors have been continuously developed. Recently, the degree of integration of semiconductor integrated circuits has been rapidly developed in the electronic industry, and surface mounting technology (hereinafter referred to as 'SMT') for directly mounting small chip components has been developed.

SMT technology is a method of attaching surface mounted components (SMC) to electronic circuits that can be directly mounted on the surface of a printed circuit board (PCB). Such electronic devices are referred to as surface mount devices (SMDs). In the electronics industry, surface-mount technology has replaced the through-hole technology attachment method, which uses components that insert device pins into holes in printed circuit boards. In general, surface mount components are smaller than the same through-hole components. This is because the pins on surface-mount components can be shorter or not at all. Surface-mount components have shorter pins, and there are different types of packages, such as planar contact, ball arrangement (BGA), and pins over the component's package.

As the SMT technology has been developed and the electronic equipment has been miniaturized, it has been required to be easily embedded in a more complicated and narrow space. In response to this demand, the FPCB has been developed.

In particular, in the case of flexible printed circuit boards having easy-to-laminate and high-use double-sided exposure structures, the demand is increasing due to the rapid increase in use due to the technological development of mobile phone batteries, printer heads, LCDs, and PDPs. It is true.

Hereinafter, an example in which an FPCB is applied to a general mobile terminal will be described with reference to FIGS. 1 to 3. 1 is a view showing a typical mobile phone (eg, a folder type terminal), Figure 2 is a view showing a state in which the FPCB is inserted into the mobile phone.

In general, the mobile phone 100 has a built-in antenna 120 is installed on one side of the upper case of the lower case 140, the keypad 230 is provided, as shown in the upper hinge portion of the lower case 140 The upper case 110 in which the speaker 210 is built-in and the liquid crystal panel 220 is installed is coupled to rotate upward by a predetermined angle through a hinge pin (not shown).

In addition, at the inner center of the upper case 110, as shown in Figure 2 to apply the power supplied from the battery 130 coupled to the lower case 140 to another PCB embedded in the upper case 110 The FPCB 200 is adhesively fixed on the bottom surface of the upper case 110 by an adhesive material, and the liquid crystal panel is interfaced with the keypad 230 on the upper case 110 by the FPCB 220. The 220 is coupled to the front part of the upper case 110.

That is, the driver of the keypad 230 positioned in the lower case 140 and the liquid crystal panel 220 positioned in the upper case 110 may be interfaced with each other by using the above-described FPCB 200. The reason for using the FPCB 200 is that a plurality of lines must be mounted in a flexible film form and interconnected using the same.

Looking at the manufacturing process of the FPCB, a photosensitive dry film is laminated on the surface of the copper foil of the rolled copper foil, which is a raw material, and the circuit pattern is continuously exposed using a conventional roll-to-roll exposure machine. Done. Thereafter, the exposed copper foil laminate is formed with a developing pattern with a developing solution and an etching process with an etching solution to form a circuit pattern.

In this conventional process, the FPCB is sheeted and hole punched by hand based on the mark engraved on the FPCB in the sheet state, or a sensor press (image processing or expensive laser metering equipment) is used to prepare the material. While supplying, punching is performed one by one, and then solder resist printing, reinforcing bar mounting, and press working for final FPCB outline processing are processed in the post-processing process to become the final product.

Meanwhile, the FPCB 200 used in a device such as a mobile phone described above may have two electronic component mounting surfaces 301 and 302 as shown in FIG. 3, and the component mounting surfaces 301 and 302 are mutually different. It can be formed on the opposite side. Therefore, in the electronic component mounting process, the electronic component 311 is first mounted on the first component mounting surface 301, and then the electronic component 312 is mounted on the second component mounting surface 302 which is the opposite surface. .

In this case, two reinforcement plates are required for mounting electronic components on the FPCB 200, and two times of work are required, which causes problems in manufacturing time and manufacturing cost. In addition, after mounting the component on the first component mounting surface 301 is completed, in order to mount the component on the second component mounting surface 302, there is a disadvantage that a subsequent work must be waited for. Accordingly, there has been a problem that the productivity is lowered and the machine utilization rate is lowered.

That is, in the process of mounting an electronic component, when the two mounting surfaces formed in the FPCB are formed in reverse, after attaching the FPCB to the reinforcing plate, the first step of mounting the electronic component on one mounting surface is performed. After finishing the process, a second reinforcement plate was required to enter the second electronic component mounting process, resulting in a lot of work time and cost. The reason why the two reinforcement plates should be provided in this way is that the reinforcement plate used in the primary component mounting process and the hole arrangement of the reinforcement plate for arranging the electronic components mounted in the primary process below the flat surface are different. .

As described above, the conventional FPCB fabrication method of the double-sided exposure structure has a separate reinforcement plate for each side and the manufacturing process has to be made twice. Therefore, there is an urgent need for a method for simultaneously mounting components on both sides of the FPCB in one process.

An object of the present invention is a flexible printed circuit of a double-sided exposed structure that can be mounted on both sides of the FPCB at the same time through a single work process using a single reinforcement plate in the process of mounting the electronic component on the FPCB of the double-sided exposed structure. A method for mounting a component on a substrate and a reinforcing plate for mounting the component are provided.

In addition, an object of the present invention is to fold the FPCB so that both sides of the electronic component mounting portion at the same time facing the front in the process of mounting the electronic component in the FPCB of the double-sided exposed structure, and performs the component mounting process by seating the folded part in the insertion hole of the reinforcement plate The present invention provides a method of mounting a component on a flexible printed circuit board having a double-sided exposure structure capable of simultaneously mounting electronic components on both sides of an FPCB through a single work process, and a reinforcing plate for mounting the component.

In addition, an object of the present invention is to fold the FPCB so that both sides of the electronic component mounting portion at the same time facing the front in the process of mounting the electronic component in the FPCB of the double-sided exposure structure, and fixed the one end of the FPCB to the fixing groove of the reinforcement plate to mount the component The present invention provides a method of mounting a component on a flexible printed circuit board having a double-sided exposure structure capable of simultaneously mounting electronic components on both sides of an FPCB through a single work process, and a reinforcing plate for mounting the component.

In order to achieve the above object, the method according to the present invention, the electronic component is mounted on a flexible printed circuit board of a double-sided exposed structure in which the electronic component is mounted on the first mounting surface and the second mounting surface which is the rear surface of the first mounting surface, respectively. A method of mounting a component, wherein the electronic component mounting portion of the first mounting surface and the electronic component mounting portion of the second mounting surface are folded and folded on a portion where the electronic component is not mounted on the flexible printed circuit board simultaneously. Forming a portion; The flexible printed circuit board is formed on a reinforcing plate in which a recess is formed along the edge of the folded flexible printed circuit board so that the folded flexible printed circuit board is seated, and an insertion hole is formed to insert the folded portion. Seating; Applying a lead at the same time after the metal mask is adhered to each mounting plate; Simultaneously mounting the electronic component to each of the electronic component mounting units; And curing the applied lead to complete the mounting.

The flexible printed circuit board is fixed by an adhesive tape installed in the mounting groove formed in the reinforcing plate.

The reinforcement plate may further include a fixing groove around the seating groove of the reinforcement plate so that one end of the flexible printed circuit board may be fixed to the reinforcement plate.

The reinforcement plate may include mounting grooves repeatedly formed to allow a plurality of flexible printed circuit boards to be seated, thereby simultaneously mounting electronic components on the plurality of flexible printed circuit boards.

In order to achieve the above object, in the reinforcement plate for component mounting of a double-sided exposed structure flexible printed circuit board according to the present invention, an electronic component is mounted on a first mounting surface and a second mounting surface which is a rear surface of the first mounting surface, respectively. A reinforcing plate for mounting parts of a double-sided exposed structure flexible printed circuit board for mounting the electronic component on a double-sided exposed structure flexible printed circuit board, wherein the electronic component mounting portion of the first mounting surface and the second mounting surface are formed. Flexible printing in the folded state so that the flexible printed circuit board can be seated in the folded state when the folded portion is formed by folding a portion in which the electronic component is not mounted on the flexible printed circuit board so that the electronic component mounting portion faces the front simultaneously. A seating groove formed along an edge of the circuit board; And an insertion hole formed at a position where the folded portion is seated so that the folded portion is inserted when the flexible printed circuit board is seated in the seating groove.

According to the present invention, when mounting an electronic component on the FPCB having a double-sided exposure structure, the production process is shortened by simultaneously mounting the electronic components on both sides of the FPCB through one work process using one reinforcement plate to maximize productivity. It has the advantage of being able to.

In addition, conventionally provided with a separate reinforcement plate for each side in order to mount the electronic component on the FPCB and the manufacturing process also has to be made twice, there was a problem that the work time and cost loss increases, but according to the present invention one reinforcement The ability to mount electronic components on both sides simultaneously with the plate has the advantage of not only reducing the reinforcement plate manufacturing cost but also reducing the work time.

1 is a view showing a typical mobile phone.
2 is a view showing a state where a flexible printed circuit board is inserted into a typical mobile phone.
3 is a diagram illustrating a flexible printed circuit board applied to a general mobile phone.
4 is a view showing a flexible printed circuit board applied to the present invention.
5 illustrates a fold of a flexible printed circuit board in accordance with an embodiment of the present invention.
6 illustrates a reinforcement plate to which a flexible printed circuit board is fixed according to an embodiment of the present invention.
7 is a view illustrating a concept of fixing a flexible printed circuit board to a reinforcing plate according to an embodiment of the present invention.
8 is a flowchart illustrating a procedure for mounting a component on a flexible printed circuit board having a double-sided exposure structure according to an embodiment of the present invention.

The present invention relates to a flexible printed circuit board having a double-sided exposed structure that can be mounted on both sides of the FPCB simultaneously through a single work process in the process of mounting the electronic component on the FPCB of a double-sided exposed structure. We propose a method of mounting parts.

To this end, the electronic component mounting portion of the first mounting surface and the electronic component mounting portion of the second mounting surface, which is the rear surface of the first mounting surface, are folded at the same time so that the electronic component mounting portion is not mounted on the FPCB to form a folded portion. Then, the electronic parts are mounted using the reinforcement plate.

Therefore, the reinforcing plate is formed to form a mounting groove along the rim shape of the FPCB in the folded state so that the FPCB in the folded state, the insertion hole is further formed so that the folded portion is inserted.

The reinforcing plate thus formed is seated by a predetermined bonding means or fixing means as it is in the folded state of the FPCB. In this case, an adhesive tape may be installed along the seating groove, and the FPCB may be fixed to the reinforcement plate by the adhesive tape, and one end of the FPCB may be fixed to the reinforcement plate. The fixing groove may be further provided on the fixing groove.

Hereinafter, a detailed description of a preferred embodiment of the present invention will be described with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

4 is a view showing an FPCB applied to the present invention, Figure 5 is a view showing a folded portion is formed when the FPCB is folded in accordance with an embodiment of the present invention.

Referring to FIG. 4, the first mounting surface of the FPCB 400 is shown in front. 410 is a component mounting part where the component is actually mounted, and 420 and 430 are the other side of the component mounting surface on which the component is mounted on the rear surface of the first mounting surface (ie, the second mounting surface).

Therefore, conventionally, the FPCB is fixed to the reinforcement plate so that the first mounting surface is visible on the front surface, and the electronic component is completed on the component mounting surface of No. 410. Then, the FPCB is turned upside down to fix the FPCB to the reinforcement plate so that the second mounting surface is visible on the front surface, and the electronic components are mounted on the back surfaces of Nos. 420 and 430.

However, in the present invention, the FPCB is folded and processed as shown in FIG. 2 to process the two mounting processes at once. That is, as shown in FIG. 2, the component mounting part 410 for mounting the electronic component on the first mounting surface and the component mounting parts 500 and 510 for mounting the electronic component on the second mounting surface face simultaneously at the same time. The FPCB is folded to form the folded portion 520.

In this way, the electronic component can be mounted simultaneously on the component mounting portion 410 of the first mounting surface and the component mounting portions 500 and 510 of the second mounting surface.

6 illustrates a reinforcement plate to which a flexible printed circuit board is fixed according to an exemplary embodiment of the present invention. The FPCB folded as shown in FIG. 5 is fixed to the reinforcement plate as shown in FIG. 6, and then the component mounting process is performed at the same time.

Accordingly, the reinforcing plate 600 according to the embodiment of the present invention forms a seating groove 650 intaglio along the rim of the FPCB 400 is folded as shown in Figure 5, the FPCB 400 is folded It is seated in the reinforcement plate 600 along the seating groove 650 as it is.

At this time, the reinforcing plate 600 is formed in the insertion hole 640 to insert the folded portion 520 in order to prevent the folded portion 520 of the FPCB 400 is deformed in a subsequent process, such as pressing. Done. By doing so, the FPCB 400 in the folded state as shown in FIG. 5 can be positioned in the seating groove 650 and the insertion hole 640 of the reinforcing plate 600.

Meanwhile, in order to fix the FPCB 400 to the reinforcement plate 600 so that the FPCB 400 does not flow when the electronic component is mounted, an adhesive tape may be installed on a part of the seating groove 650. The FPCB 400 is fixed to the reinforcing plate 600 by the adhesive tape. In addition, as shown in FIG. 7, a fixing groove 700 is further around the mounting groove 650 of the reinforcing plate 600 so that one end of the FPCB 400 may be fixed to the reinforcing plate 600. It may be provided.

In addition, as shown in FIG. 6, a plurality of FPCBs 400 are seated so that the seating grooves 650 may be repeatedly formed in the reinforcement plate 600 so that electronic components may be simultaneously mounted on the plurality of FPCBs 400. It may be. In this way, a large number of FPCBs 400 can be mounted on both sides of the component at the same time, so that the process can be made faster and higher in productivity.

In addition, since the FPCB 400 is folded and processed as in the present invention, the size of the reinforcement plate 600 is reduced. Therefore, a larger number of FPCBs 400 can be seated on the reinforcement plate 600 of the same size.

On the other hand, if the insertion hole 640 is not formed in the reinforcing plate 600 as described above, the FPCB 400 overlaps in a subsequent process such as pressing, which causes deformation of the FPCB 400 itself, which makes it difficult to install in an actual mobile phone. A problem arises, and thus, the FPCB 400, which becomes obsolete, needs to be disposed of.

Therefore, in the present invention, the insertion hole 640 is formed in the reinforcing plate 600 to prevent such defects, so that the folded portion 520 of the FPCB 400 is inserted. In addition, since the FPCB 400 used in the present invention has sufficient flexibility, after the process of mounting the electronic component is completed, the folded portion 520 immediately returns to its original position and thus does not affect the installation at all in the necessary equipment. . Meanwhile, in FIG. 6, the foldable part 520 is inserted into the insertion hole 640. However, the foldable part 520 may be sufficiently seated by forming a deep groove without drilling a hole.

As such, after fixing the FPCB 400 to the reinforcing plate 600, the lead is applied (printing), the parts are mounted, and then the lead is cured by passing through REFLOW to complete the entire process. Therefore, it is possible to complete the double-sided component mounting operation of the FPCB 400 in one step.

That is, in the related art, a process for mounting a component on one surface of the FPCB 400 is performed, followed by a separate process for mounting a component on the other surface (back), thereby complicating the process and causing a cost increase. As described above, according to the present invention, the component mounting process of the FPCB 400 is finished in one operation, thereby simplifying the process and reducing the cost.

Hereinafter, with reference to Figure 8, the procedure for mounting the component in the FPCB according to an embodiment of the present invention.

The folding part is formed by folding a portion where the FPCB electronic component is not mounted so that the electronic component mounting portion of the first mounting surface of the FPCB and the electronic component mounting portion of the second mounting surface, which is the rear surface of the first mounting surface, face the front side simultaneously ( S801).

At this time, when the folded portion is formed in the FPCB as described above, the mounting groove is formed in the reinforcement plate along the rim of the flexible printed circuit board of the folded state so that the flexible printed circuit board can be seated in the folded state, The adhesive tape is installed in the seating groove (S802).

Then, the FPCB is fixed to the seating of the reinforcement plate as it is folded (S803). As such, when the FPCB is seated in the seating groove, the folded portion is inserted into the insertion hole of the reinforcing plate.

Next, after the metal mask is in close contact with each of the first mounting surface and the second mounting surface, lead is simultaneously applied (S804). Thereafter, the electronic components are simultaneously mounted on the first mounting surface and the second mounting surface (S805), and the lead is hardened in the curing furnace to complete soldering of the electronic components on the first mounting surface and the second mounting surface (S806).

In this way, electronic components can be mounted on both sides of the FPCB simultaneously.

On the other hand, in the embodiment of the present invention has been described with respect to specific embodiments, of course, various modifications are possible without departing from the scope of the invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the appended claims, but also by the equivalents of the claims.

100: mobile phone 110: upper case
120: antenna 130: battery
140: lower case 200, 400: FPCB
210: speaker 220: liquid crystal panel
230: keypad 301, 302, 410, 500, 510: component mounting surface
311, 312, 610, 620, 630: electronic components
420, 430: rear part mounting 520: folded part
600: reinforcement plate 640: insertion hole
650: mounting groove 660: adhesive tape
700: fixed groove

Claims (8)

In the method of mounting the electronic component on a flexible printed circuit board of a double-sided exposed structure in which the electronic component is mounted on the first mounting surface and the second mounting surface which is the rear surface of the first mounting surface, respectively,
Forming a fold by folding a portion of the flexible printed circuit board on which the electronic component is not mounted so that the electronic component mounting portion of the first mounting surface and the electronic component mounting portion of the second mounting surface face the entire surface at the same time;
The flexible printed circuit board is formed on a reinforcing plate in which a recess is formed along the edge of the folded flexible printed circuit board so that the folded flexible printed circuit board is seated, and an insertion hole is formed to insert the folded portion. Seating;
Applying a lead at the same time after the metal mask is adhered to each mounting plate;
Simultaneously mounting the electronic component to each of the electronic component mounting units; And
And curing the applied lead to complete the mounting.
The reinforcement plate,
The electronic component is mounted on a flexible printed circuit board having a double-sided exposed structure, further comprising a fixing groove around the seating groove of the reinforcing plate so that one end of the flexible printed circuit board is fixed to the reinforcing plate. How to.
The flexible printed circuit board of claim 1,
And mounting the electronic component on a flexible printed circuit board having a double-sided exposed structure, the adhesive tape being fixed to a mounting groove formed in the reinforcing plate.
delete The method of claim 1, wherein the reinforcement plate,
In the flexible printed circuit board having a double-sided exposed structure characterized in that the mounting groove is formed repeatedly so that the flexible printed circuit board can be mounted in a plurality, it is possible to perform electronic component mounting on the plurality of flexible printed circuit boards at the same time. The method of mounting the electronic component.
Component mounting of a double-sided exposed structure flexible printed circuit board for mounting the electronic component on a flexible printed circuit board of a double-sided exposure structure in which electronic components are mounted on a first mounting surface and a second mounting surface, which is a rear surface of the first mounting surface, respectively. In the reinforcement plate for
When the folded portion is formed by folding a portion in which the electronic component is not mounted on the flexible printed circuit board such that the electronic component mounting portion of the first mounting surface and the electronic component mounting portion of the second mounting surface face the front side simultaneously. A seating groove formed along an edge of the flexible printed circuit board in the folded state so that the circuit board may be seated in the folded state; And
And an insertion hole formed at a position where the folded portion is seated so that the folded portion is inserted when the flexible printed circuit board is seated in the seating groove.
The reinforcement plate,
And a fixing groove around the seating groove of the reinforcement plate so that one end of the flexible printed circuit board is fixed to the reinforcement plate.
The flexible printed circuit board of claim 5,
Reinforcement plate for component mounting of a double-sided exposed structure flexible printed circuit board, characterized in that fixed by an adhesive tape installed in the seating groove formed in the reinforcement plate.
delete The method of claim 5, wherein the reinforcement plate,
Mounting grooves are repeatedly formed to allow the flexible printed circuit board to be seated in plural, so that the mounting of the electronic component on the plurality of flexible printed circuit boards can be simultaneously performed. Reinforcement plate for mounting.

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