KR101013454B1 - A method and an apparatus for forming via holes into a ceramic sheet - Google Patents
A method and an apparatus for forming via holes into a ceramic sheet Download PDFInfo
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- KR101013454B1 KR101013454B1 KR1020090041301A KR20090041301A KR101013454B1 KR 101013454 B1 KR101013454 B1 KR 101013454B1 KR 1020090041301 A KR1020090041301 A KR 1020090041301A KR 20090041301 A KR20090041301 A KR 20090041301A KR 101013454 B1 KR101013454 B1 KR 101013454B1
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Abstract
The method of forming a via hole in the ceramic sheet of the present invention comprises the steps of (a) preparing a ceramic slurry for casting the ceramic sheet, (b) a body in which the ceramic slurry is injected and accommodated, and a position corresponding to the position of the via hole. Providing a casting head including an extension extending upwardly with respect to the bottom surface of the main body, (c) supplying the ceramic slurry prepared in the step (a) to the casting head, and (d) Casting the ceramic sheet by drying the ceramic slurry to form a via hole at a position corresponding to the extension, and (e) floating the cast ceramic sheet from the casting head. According to the present invention, the punching process can be omitted, thereby preventing cracks, peeling, and poor contact in the post-process by laser punching in advance, and preventing damage to the ceramic sheet or burr caused by mechanical punching. It is possible to manufacture this excellent laminated chip component. In addition, the punching step can be omitted to shorten the manufacturing process, improve the work efficiency in forming the via holes, and improve the accuracy of the via hole forming position.
Ceramic Sheet, Via Hole, Punching, Ceramic Slurry, Casting Head, Turntable, Extensions, Drying, Rotary
Description
The present invention relates to a method and apparatus for forming a via hole in a ceramic sheet, and more particularly, due to the punching process for the ceramic sheet used in the manufacture of multilayer chip components, during lamination, pressing and firing of a plurality of ceramic sheets. A method and apparatus for forming a via hole in a ceramic sheet to minimize problems such as cracks, peeling and poor contact caused.
In particular, the present invention eliminates the laser punching process or the mechanical punching process after the casting of the ceramic sheet in the manufacture of laminated chip components, thereby preventing cracks, peeling and poor contact in the post process by laser punching in advance, and The present invention relates to a method and an apparatus for forming a via hole in a ceramic sheet which prevents damage to a ceramic sheet due to punching or burr generation, thereby enabling manufacture of a laminated chip component having excellent physical properties.
In addition, the present invention shortens the manufacturing process by eliminating the punching process, improves the work efficiency in the formation of the via holes, and improves the precision of the via hole forming position, thereby providing the ceramic sheet for post processing such as lamination, pressing and firing. A method and apparatus for forming a via hole in a ceramic sheet capable of improving physical properties and quality of a stacked chip component using the same.
Recently, as various electronic devices have become smaller and lighter, demands for miniaturization, light weight, and thinning of various electronic components are increasing.
In particular, miniaturization and lightening of related components are emerging as a very important technology element in accordance with the development of the mobile communication field and electronic devices. To this end, it is necessary to increase the wiring density of components and to reduce the weight and thickness of individual components. To meet these demands, new parts manufacturing techniques are being proposed.
For example, the technique of manufacturing the electronic component containing a chip inductor and a capacitor into a laminated chip component using a ceramic sheet | seat is mentioned. The multilayer chip component casts a ceramic sheet, punches the cast ceramic sheet, prints internal electrode patterns, and then stacks, presses, and calcinates a plurality of ceramic sheets so that the printed electrode patterns are electrically connected to each other. It is manufactured through a process.
In the manufacture of stacked chip components such as chip inductors and capacitors, a first process is to manufacture a ceramic sheet, which is a slurry formed by mixing powders, binders, solvents, and dispersants such as alumina or glass-ceramic composites. The slurry is passed through a tape caster or the like to form and dry into a sheet. This process is often referred to as the casting of ceramic sheets.
In addition, the ceramic sheet which removed the volatile solvent etc. other than a ceramic component through the drying process etc. is called green sheet.
In the second process of manufacturing a multilayer chip component, an internal electrode pattern is printed on ceramic sheets, which are green sheets, followed by lamination, pressing, and firing, thereby completing a basic form of a blocked multilayer chip component. Often, during the firing process, when the ceramic material is fired at a temperature below 1000 ° C., it is called a low temperature fired ceramic substrate. When the ceramic material is fired at a temperature above 1000 ° C., it is called a high temperature fired ceramic substrate.
Subsequently, in the final process of manufacturing the multilayer chip component, processes such as polishing, dipping, electrode firing, and plating are performed to form an external electrode for electrical connection with an internal electrode pattern printed on the ceramic sheet.
However, in the first and second processes as described above, in order for the internal electrodes printed on the laminated ceramic sheets to be electrically connected between the ceramic sheets, a via hole is formed in the ceramic sheet and the via holes are filled with a conductive paste to form the ceramic sheet. Must be stacked. Thus, there is a need for a punching process for forming a via hole in a ceramic sheet between the first and second steps in the manufacture of stacked chip components.
In general, the punching process for forming the via holes in the ceramic sheet is performed using laser punching or mechanical punching.
When the via hole is formed in the ceramic sheet by laser punching, as shown in FIG. 2A, the shape of the drop hole is not uniform and the size of the via hole in the upper surface of the ceramic sheet (d1) and the size of the via hole in the lower surface of the ceramic sheet. Another phenomenon occurs at (d2). That is, when the laser is irradiated to the ceramic sheet to form the via hole, a problem of evaporation and crystallization of the material due to thermal deformation occurs, which causes the tapered via hole formation as shown in FIG. 2A. The taper phenomenon of the via holes causes a problem that the laminated cross section becomes uneven when the ceramic sheets are stacked, and causes cracks, peeling, and poor contact of the ceramic sheets during the firing process. It is a cause of failure in the manufacture of parts.
In addition, in the case of forming the via hole in the ceramic sheet by mechanical punching, as shown in FIG. 3, the via hole is formed through the film during mechanical processing using a drill or the like, which causes thermal deformation of the film to cause the ceramic sheet. Due to the over-adhesion of the film positioned under the ceramic sheet, the ceramic sheet may be damaged or broken when the ceramic sheet is peeled from the film. In addition, in the case of mechanical processing, a burr is generated in the ceramic sheet when the via hole is formed, and the burr is separated in a post process (printing process), thereby adversely affecting printing characteristics.
Therefore, crack, peeling, and poor contact caused by laser punching and mechanical sheet damage or burr caused by mechanical punching in the conventional via hole forming technology of the ceramic sheet related to the punching process of the ceramic sheet used to manufacture the multilayer chip component. Development of a new via hole forming method and apparatus for solving the burr generation problems is required in the technical field to which the present invention belongs.
The present invention provides a via hole in a ceramic sheet which minimizes problems such as cracking, peeling, and poor contact that occur during the lamination, pressing, and sintering of a plurality of ceramic sheets due to the punching process for the ceramic sheet used in the manufacture of multilayer chip components. Its purpose is to provide a method and apparatus for forming the same.
Specifically, the present invention in the manufacture of laminated chip components by eliminating the laser punching process or mechanical punching process after the casting of the ceramic sheet to prevent cracking, peeling and poor contact in the post-process by laser punching in advance, It is an object of the present invention to provide a method and an apparatus for forming a via hole in a ceramic sheet which prevents damage to a ceramic sheet or burr generation due to conventional punching, thereby enabling manufacture of a laminated chip component having excellent physical properties.
In addition, the present invention shortens the manufacturing process by eliminating the punching process, improves the work efficiency in the formation of the via holes, and improves the precision of the via hole forming position, thereby providing the ceramic sheet for post processing such as lamination, pressing and firing. It is an object of the present invention to provide a method and apparatus for forming a via hole in a ceramic sheet capable of improving physical properties and quality of a stacked chip component using the same.
The method for forming the via hole in the ceramic sheet of the present invention,
(a) preparing a ceramic slurry for casting the ceramic sheet,
(b) providing a casting head including a main body into which the ceramic slurry is injected and received, and an extension part extending upwardly with respect to the bottom surface of the main body at a position corresponding to the position of the via hole;
(c) supplying the ceramic slurry prepared in step (a) to the casting head,
(d) drying the ceramic slurry to cast a ceramic sheet while forming a via hole at a position corresponding to the extension portion;
(e) removing the cast-finished ceramic sheet from the casting head.
The method of forming the via hole in the ceramic sheet of the embodiment of the present invention further includes the step of rotating the casting head in a constant direction and speed after the step (c).
In the method of forming the via hole in the ceramic sheet of the embodiment of the present invention, the step of rotating the casting head in a constant direction and speed is located on a turntable that the casting head rotates in a constant direction and speed, the rotation of the turntable According to the casting head may be performed by rotating. On the other hand, the turntable is connected to a rotating motor for providing rotational power is preferably connected to a rotating shaft that rotates in a predetermined direction and speed is rotated in accordance with the rotation of the rotating shaft.
Meanwhile, when the ceramic slurry is dried while rotating the casting head supplied with the ceramic slurry according to an embodiment of the present invention, the ceramic slurry is uniformly dispersed in the casting head so that the thickness of the cast ceramic sheet may be constant, and the via hole formed at the same time. There is an advantage that can be made constant in size.
In a method of forming a via hole in a ceramic sheet of a preferred embodiment of the present invention, the casting head includes a plurality of extensions, and in step (d), forming a plurality of via holes corresponding to each of the plurality of extensions. The ceramic sheet can be cast. In this case, the patterns of the plurality of extension portions and the patterns of the plurality of via holes coincide with each other.
In addition, in the method of forming the via hole in the ceramic sheet of the embodiment of the present invention, the casting head and the turntable may be detachably coupled to each other. For example, a plurality of extensions are fixed to an upper surface of the turntable, a plurality of holes corresponding to the plurality of extensions are formed on a bottom surface of the casting head, and fixed to an upper surface of the turntable. The casting head may be detachably coupled to the turntable in such a manner that a plurality of extensions pass through the plurality of holes formed in the bottom surface of the casting head and protrude over the bottom surface.
An apparatus for forming a via hole in the ceramic sheet of the present invention,
A casting head including a main body into which the ceramic slurry is injected and accommodated, an extension part extending upwardly with respect to the bottom surface of the main body at a position corresponding to the position of the via hole;
And a turntable for rotating the casting head in a constant direction and speed.
Preferably, the casting head has a short cylindrical shape with an open top, and a bottom surface of the main body has a thin disk shape.
In the apparatus for forming a via hole in the ceramic sheet of the embodiment of the present invention, the casting head is located on the turntable, the turntable is connected to a rotating motor that provides a rotational power to the rotating shaft to rotate in a constant direction and speed Can be connected.
In the apparatus for forming the via hole in the ceramic sheet of the preferred embodiment of the present invention, the casting head may include a plurality of extensions.
Further, in the apparatus for forming a via hole in the ceramic sheet of the embodiment of the present invention, the casting head and the turntable may be detachably coupled to each other. For example, a plurality of extensions are fixed to an upper surface of the turntable, a plurality of holes corresponding to the plurality of extensions are formed on a bottom surface of the casting head, and fixed to an upper surface of the turntable. The casting head may be detachably coupled to the turntable in such a manner that a plurality of extensions pass through the plurality of holes formed in the bottom surface of the casting head and protrude over the bottom surface.
At this time, the shape of the turntable is preferably in the form of a plate-shaped disk corresponding to the shape of a short cylindrical cylinder head with an open top, and the extension portions protrude upward from the plate-shaped disk. .
When the method and apparatus for forming a via hole in the ceramic sheet of the present invention are utilized in manufacturing a stacked chip component, problems such as cracking, peeling, and poor contact occurring during lamination, pressing, and sintering of a plurality of ceramic sheets may be minimized.
That is, according to the method and apparatus for forming a via hole in the ceramic sheet of the present invention, the laser punching process or the mechanical punching process may be omitted after the casting of the ceramic sheet, thereby cracking, peeling and It is possible to manufacture a laminated chip component having excellent physical properties by preventing contact failure in advance and preventing ceramic sheet damage or burr generation due to mechanical punching.
In addition, according to the method and apparatus for forming a via hole in the ceramic sheet of the present invention, the punching step is omitted, thereby shortening the manufacturing process, improving the work efficiency in forming the via hole, and improving the accuracy of the via hole forming position. And it is possible to improve the physical properties of the ceramic sheet provided in the post-process, such as firing and the quality of the stacked chip component using the same.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings without limiting the present invention by way of example only.
The following examples of the present invention are not intended to limit or limit the scope of the present invention only to embody the present invention. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. References cited in the present invention are incorporated herein by reference.
1 is a flow chart of a manufacturing process for manufacturing a chip inductor, which is an example of a stacked chip component, according to a prior art, and a flowchart of a manufacturing process for manufacturing using a method and apparatus for forming a via hole in a ceramic sheet of the present invention. have. In one embodiment of the present invention, as shown in Figure 1 using a known manufacturing process of the prior art to manufacture a chip ductor, the punching process (S104) in the prior art is omitted and the "via hole in the ceramic sheet of the present invention Method and apparatus for forming a chip inductor into the casting process step of the ceramic sheet (step S103 of FIG. 1) during the manufacturing process of the chip inductor, cracks, peeling and poor contact by the conventional punching process in forming the via hole of the ceramic sheet And to solve the problem of sheet damage or burr (burr) generation.
Referring to Figure 1 describes the overall manufacturing process of the chip inductor as follows.
First, the powder manufacturing process (S101) is a process of manufacturing a ceramic powder having a uniform composition and dispersion state through a physicochemical process. In the manufacture of the chip inductor, magnetic powder or nonmagnetic powder may be used as the ceramic powder, and the type thereof is selected in consideration of the physical properties of the chip inductor. It is possible to use powders commonly used in chip inductors. For example, ferrite powder and zinc (ZnO) powder can be used.
Next, in the slurry manufacturing process (S102), the ceramic powder prepared in the powder manufacturing process (S101) and a material such as a polymer binder, a dispersant, and a solvent, such as an organic solvent, are mixed evenly, and the slurry is evenly dispersed to secure moldability. ) Is a process for manufacturing.
The slurry produced in the slurry production process (S102) is cast into a ceramic sheet in the casting process (S103), the slurry produced in the slurry production process (S102) is produced in a sheet form by a tape casting method or other casting method do. Usually, the slurry is applied on a support such as a PET film, and the ceramic sheet is manufactured by passing the film and the applied slurry through a doctor blade by a roller. Method and apparatus for forming via-holes are used to perform the casting process of the ceramic sheet. A detailed description thereof will be given later.
The prior art requires a punching process (S104) for forming a via hole by punching the ceramic sheet cast through the casting process (S103) by laser punching or mechanical punching. Normally, in the manufacture of stacked chip components such as chip inductors, via holes connecting the positioning holes and electrode patterns are processed in the ceramic sheet manufactured in the casting step S103, and the printing step S105. The internal electrode is printed using a paste for printing on the ceramic sheet on which the via hole is formed.
However, in the present invention, as described above, by performing the casting process (step S103 of FIG. 1) of the ceramic sheet using the "method and apparatus for forming a via hole in the ceramic sheet" of the embodiment of the present invention, the via hole is previously formed in the casting process. By forming, punching process (S104) can be skipped. Therefore, the chip inductor manufacturing method according to the present invention is distinguished from the chip inductor manufacturing method of the prior art in that the punching process (S104) is omitted.
On the other hand, Ag (silver) paste is generally used as the metal paste used in the printing process (S105), in addition to Pd (palladium), Ag / Pd (silver + palladium), Cu (copper), Au (gold), Metal pastes such as W (tungsten), glass pastes, and pastes for printing various electronic components such as epoxy may be used.
Then, in the stacking process (S106), the ceramic sheets printed through the printing process (S105) are laminated in accordance with the product characteristics, manufactured in the form of a bar, and laminated in the pressing / cutting process (S107). The pressure is applied to the bar to compress the multilayer ceramic sheets into a single layer, and then the compressed bar is cut into chips to fit the size.
Then, in the baking out / Firing process (S108), first, before firing, the organic material such as the binder included in the chip is removed using an electric furnace, and then the chip from which the organic material is removed is fired using the electric furnace. Then, a round edge is formed at the fired edge to prevent chipping and a bonding step S109 is performed to improve the bonding between the inner electrode and the outer electrode, and then termination dipping. In the termination dipping step S110, an external electrode is formed on the side including both ends or both ends of the chip fired, and in the electrode firing step S111, the external electrode is coated and formed. The external electrode is fired using an electric furnace. After the firing of the external electrode is completed, Ni (nickel) and Sn (tin) are plated on the external electrode (S112), and a sorting / inspection process is performed to select defective products by inspecting the electrical characteristics of the plated chip. After (S113) the packaging of the good product of the sorting is completed.
Hereinafter, using the "method and apparatus for forming a via hole in a ceramic sheet" of the embodiment of the present invention to perform the casting process (S103) of the ceramic sheet as described above, and at the same time in the process of forming the via hole in the casting process Explain.
First, a description will be given of an apparatus for forming a via hole in a ceramic sheet of an embodiment of the present invention.
As shown in Figure 4a, 4b and 5, the apparatus for forming the via hole in the ceramic sheet of the embodiment of the present invention is the position of the
4A and 4B, the casting
In addition, as shown in Figures 4a and 4b, it can be seen that in the apparatus for forming a via hole in the ceramic sheet of the embodiment of the present invention, the casting
First, FIG. 4A shows a state in which the casting
The casting
In addition, the shape of the
Next, FIG. 4B shows a state in which the casting
On the other hand, the
However, the materials and / or sizes of the casting heads, extensions, and turntables as described above may vary in consideration of the casting conditions of the ceramic sheet used in the manufacture of the multilayer chip component, the size and thickness of the ceramic sheet, and the size of the via hole. It will be readily understood by one skilled in the art that adjustments are possible. In addition, in the present embodiment, the case where the number of holes of the extension and the casting head is 16 has been described as an example. However, the present invention is not limited thereto, and the number of holes of the extension and the casting head is not limited to the purpose of using the ceramic sheet. Those skilled in the art will readily understand that appropriate selections can be made.
Meanwhile, in the present embodiment, the
In addition, as shown in Figure 4a and 4b, the
A process of casting the ceramic sheet by using the apparatus for forming the via hole in the ceramic sheet according to the embodiment of the present invention as described above, and simultaneously forming the via hole in the casting process will be described as follows.
When the casting
Referring to FIG. 4B, the ceramic slurry S supplied to the
Then, the ceramic slurry S is dried while rotating the casting
When the ceramic slurry S supplied in the casting
In addition, a
Lastly, as shown in FIG. 5, when the dried and completed casting ceramic sheet CS is removed from the casting
Casting a ceramic sheet (CS) according to the method of forming a via hole in an embodiment of the present invention can omit the laser punching process or the mechanical punching process, thereby cracking, peeling and poor contact in the post-process by laser punching To prevent the ceramic sheet from being damaged or burr caused by mechanical punching in advance, it is possible to manufacture a laminated chip component having excellent physical properties. Further, according to the present invention, the punching step can be omitted to shorten the manufacturing process, improve the work efficiency in forming the via holes, and improve the accuracy of the via hole forming position.
On the other hand, the ceramic sheet (CS) cast in accordance with the method of the present invention is used in the manufacture of a variety of stacked chip components, for example, MLCC, in addition to the chip inductor, the ceramic slurry (S) used in the casting of the ceramic sheet is manufactured It may be configured by mixing a ceramic powder component and an organic solvent which can be variously selected according to the type of stacked chip component. For example, the ceramic slurry S may be prepared by mixing powders such as ferrite powder, zinc (ZnO) powder, alumina powder, or glass-ceramic composites with a binder, a solvent, a dispersant, and the like.
In addition, the ceramic slurry (S) for the ceramic sheet (CS) to be cast according to the method of the present invention can be combined with a variety of components according to the type, physical properties or performance of the desired laminated chip component, the component ratio is also suitable for use and design It will be readily understood by one skilled in the art that the present invention may be appropriately adjusted.
On the other hand, the
As mentioned above, although this invention was demonstrated to the said Example, this invention is not limited to this. It will be understood by those skilled in the art that modifications and variations may be made without departing from the spirit and scope of the invention, and that such modifications and variations are also contemplated by the present invention.
1 is a flow chart of a manufacturing process for manufacturing a chip inductor, which is an example of a stacked chip component, according to a prior art, and a flowchart of a manufacturing process for manufacturing the method using a method and apparatus for forming a via hole in a ceramic sheet of the present invention. Drawing.
2A is a cross-sectional view of the ceramic sheet in cross section showing the shape of the via hole formed in the ceramic sheet by laser punching.
FIG. 2B is a cross-sectional view of the stacked ceramic sheets illustrating a state in which the ceramic sheets of FIG. 2A are stacked.
3 is a cross-sectional view of the ceramic sheet in cross section showing the shape of the via hole formed in the ceramic sheet by mechanical punching.
4A is a view showing an apparatus for forming a via hole in a ceramic sheet according to an embodiment of the present invention, in which the casting
4B is a view showing a device for forming a via hole in a ceramic sheet according to an embodiment of the present invention, in which the casting
FIG. 5 is a diagram illustrating a ceramic sheet CS having a via hole VH formed after the dried ceramic sheet CS is cast out of the casting
<Description of the symbols for the main parts of the drawings>
10: slurry discharge device 12: discharge tube
14: discharge port
20: casting head 22: main body
24: bottom surface 26: extension part
28: turntable
30: rotating shaft 40: rotating motor
50: laser thickness meter
S: ceramic slurry CS: ceramic sheet
F: Film VH: Via Hole
H: Hole C: Case
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090041301A KR101013454B1 (en) | 2009-05-12 | 2009-05-12 | A method and an apparatus for forming via holes into a ceramic sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090041301A KR101013454B1 (en) | 2009-05-12 | 2009-05-12 | A method and an apparatus for forming via holes into a ceramic sheet |
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| Publication Number | Publication Date |
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| KR20100122320A KR20100122320A (en) | 2010-11-22 |
| KR101013454B1 true KR101013454B1 (en) | 2011-02-14 |
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| KR1020090041301A KR101013454B1 (en) | 2009-05-12 | 2009-05-12 | A method and an apparatus for forming via holes into a ceramic sheet |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040224125A1 (en) * | 2003-05-08 | 2004-11-11 | Ngk Insulators, Ltd. | Ceramic members, a method of producing the same and corrosion resistant members |
| JP2005022162A (en) * | 2003-06-30 | 2005-01-27 | Kikusui Chemical Industries Co Ltd | Hole forming member of ceramic baked body and manufacturing method for ceramic baked body having holes |
| KR20060109807A (en) * | 2005-04-18 | 2006-10-23 | 가부시키가이샤 무라타 세이사쿠쇼 | Method for producing ceramic green compact and apparatus for producing the same |
| KR20100013115A (en) * | 2008-07-30 | 2010-02-09 | 한국표준과학연구원 | Apparatus and method using centrifugal molding |
-
2009
- 2009-05-12 KR KR1020090041301A patent/KR101013454B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040224125A1 (en) * | 2003-05-08 | 2004-11-11 | Ngk Insulators, Ltd. | Ceramic members, a method of producing the same and corrosion resistant members |
| JP2005022162A (en) * | 2003-06-30 | 2005-01-27 | Kikusui Chemical Industries Co Ltd | Hole forming member of ceramic baked body and manufacturing method for ceramic baked body having holes |
| KR20060109807A (en) * | 2005-04-18 | 2006-10-23 | 가부시키가이샤 무라타 세이사쿠쇼 | Method for producing ceramic green compact and apparatus for producing the same |
| KR20100013115A (en) * | 2008-07-30 | 2010-02-09 | 한국표준과학연구원 | Apparatus and method using centrifugal molding |
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| KR20100122320A (en) | 2010-11-22 |
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