KR100997800B1 - Manufacturing method of printed circuit board - Google Patents

Abstract

Disclosed is a method of manufacturing a printed circuit board. Providing a first circuit board on which the first via land is formed and a second circuit board on which the second via land is formed, disposing a first via post in the first via land, and the second via land is connected to the first via post. A printed circuit board manufacturing method comprising the step of aligning a second circuit board so as to face each other, and injecting a liquid insulating material between the first circuit board and the second circuit board, simultaneously providing via posts for connection between layers. It is possible to arrange and to shorten the manufacturing process by injecting and forming the insulating layer at the same time without lamination.

Via Land, Via Post, Insulation Material, Arc Welding

Description

Manufacturing method of printed circuit board

The present invention relates to a printed circuit board manufacturing method.

With the development of the electronics industry, as miniaturization and high functionality of electronic components have increased, the demand for miniaturization, thinning, and high density of printed circuit boards is steadily increasing. As described above, in order to meet the demand for higher density, thinner thickness, and the like of printed circuit boards, a high density connection between layers of a multilayer printed circuit board is required.

For the electrical connection between layers of a multi-layer circuit pattern substrate, a technology of plating, printing a metal paste to fill a via hole with a conductor, and a so-called 'Buried bump interconnection technology (B2it)' to make an interlayer connection by forming a triangular cone paste Technology and the like are used.

Plating technology is to process via holes such as plated through hole (PTH) and blind via hole (BVH) through a circuit layer of a multilayer circuit pattern board, and then copper plating the inner circumferential surface of the via hole or filling a copper plating layer in the via hole. This is how the interlayer connection is implemented.

In the technique of filling a metal paste, a via hole is processed using a laser, and then a copper (Cu) paste or the like is filled in the via hole to implement interlayer connection. This technique allows the interlayer electrical signals to be connected by arranging, heating, and pressing several core layers implementing interlayer connection to bond core layers collectively.

The 'B2it' technology is a method of forming a paste stud by printing and curing a special conductive paste on a copper foil in a triangular pyramid shape, and then penetrating an insulating layer and thermocompression bonding thereon to implement interlayer connection.

However, the above-described prior arts have limitations in the high density connection between layers, and there is a problem in that the manufacturing process of the multilayer printed circuit board is increased.

The present invention provides a printed circuit board manufacturing method which can increase the degree of freedom of circuit design and shorten the manufacturing process by densifying the connection between circuit pattern layers in a multilayer printed circuit board.

According to one aspect of the invention, providing a first circuit board having a first via land and a second circuit board formed with a second via land, disposing a first via post in the first via land, second A method of manufacturing a printed circuit board is provided, comprising: arranging a second circuit board so that the via lands face the first via post, and injecting a liquid insulating material between the first circuit board and the second circuit board. .

After aligning the second circuit board, the method may further include bonding the first via land and the second via land to the first via post.

The joining step may be performed by arc welding.

The first via post may be made of magnetic material.

In addition, according to another aspect of the invention, the first circuit board is formed with the first via land, the second circuit board is formed with the second via land and the third via land on both sides and the third circuit board formed with the fourth via land, respectively Providing a, arranging a first via post in the first via land, aligning the second circuit board so that the second via land faces the first via post, and a second via in the third via land. Arranging the post, aligning the third circuit board such that the fourth via land faces the second via post, and injecting a liquid insulating material between the first circuit board, the second circuit board, and the third circuit board. Provided is a printed circuit board manufacturing method comprising the steps of:

After aligning the second circuit board, the method may further include bonding the first via land and the second via land to the first via post, and after the aligning the third circuit board, the second via The method may further include bonding the third vialand and the fourth vialand to the post.

The joining step may be performed by arc welding.

The via posts for the connection between the layers can be arranged at the same time, and the manufacturing process can be shortened by injecting and forming the insulating layers without laminating them at the same time.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, an embodiment of a method of manufacturing a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and Duplicate explanations will be omitted.

1 is a flowchart illustrating a method for manufacturing a printed circuit board according to an embodiment of the present invention, and FIGS. 2 to 6 are flowcharts illustrating a method for manufacturing a printed circuit board according to an embodiment of the present invention. 2 to 6, the first circuit board 12, the circuit patterns 14 and 20, the first via land 16, the second circuit board 18, the second via land 22 and the first circuit board 12 are formed. One via post 24, welder 26, injector 27, and insulating material 28 are shown.

According to the present embodiment, a method of manufacturing a printed circuit board may include providing a first circuit board 12 having a first via land 16 and a second circuit board 18 having a second via land 22 formed thereon, Disposing the first via post 24 in the first via land 16, aligning the second circuit board 18 such that the second via land 22 is disposed corresponding to the first via post 24. Injecting a liquid insulating material 28 between the step and the circuit board.

Looking at the method of manufacturing a printed circuit board according to the present embodiment in detail, first, as shown in FIG. 2, the first circuit board 12 and the second via land 16 is formed as shown in FIG. In operation S100, a second circuit board 18 on which a via land 22 is formed is provided. The via land may be formed on the first circuit board 12 and the second circuit board 18 as part of the circuit patterns 14 and 20 where via posts for connection between layers are connected.

The circuit board may be manufactured by forming a via hole in a copper-clad laminate and plating the plated layer on an inner wall of the via hole, and then forming a circuit pattern including a via land on both sides of the circuit board.

Next, as shown in FIG. 3, the first via post 24 is disposed in the first via land 16 (S200). The first via post 24 is disposed on the first via land 16 of the first circuit board 12 for electrical connection between the first circuit board 12 and the second circuit board 18.

The length of the via posts can be changed in consideration of the thickness between the layers. Viaposts can be made using electrically conductive materials. In this embodiment, for precise placement of the via posts, a case in which the via posts are made of a magnetic material that can be electrically energized and can be attached by a magnet is presented. A magnetic body is a substance that is magnetized in a magnetic field and has a property of sticking to a magnet.

When the via post is made of a magnetic material, the via post may be disposed on the via land by the magnetic position controller. That is, the magnetic field is applied to the electromagnet coupled to the magnetic position controller to lift the via post made of magnetic material, the via post is disposed on the via land, and the magnetic field is removed from the electromagnet to place the via post in the via land.

In addition, when a plurality of via posts are disposed on a plurality of via lands, the plurality of via posts may be simultaneously lifted by the electromagnet corresponding to the formation positions of the plurality of via lands, and then simultaneously placed on the via lands to reduce manufacturing time. Can be.

Next, as shown in FIG. 4, the second circuit board 18 is aligned such that the second via land 22 is in contact with the first via post 24 (S300). The first via post 24 is for electrical connection between the first via land 16 of the first circuit board 12 and the second via land 22 of the second circuit board 18. One end of 24 is disposed to contact the first via land 16, and the second circuit board 18 is aligned such that the other end of the first via post 24 and the second via land 22 face each other. .

Next, as shown in FIG. 4, the first via land 16 and the second via land 22 are bonded to the first via post 24 (S400). It is also possible to inject the liquid insulating material 28 without passing through this step, but one end of the first via post 24 and the other end of the first via land 16 and the first via post 24 and the second via land. A method of joining the first via land 16 and the second via land 22 to the first via post 24 in order to secure the reliability of the bonding with (22).

As shown in FIG. 4, when the second via land 22 and the first via post 24 come into contact with each other while the second circuit board 18 is aligned using the arc welder 26. The arc welding method can be used by applying a voltage to melt and weld to a high temperature generated by the arc discharge. By using such arc welding, a plurality of via posts and via lands can be joined at the same time. In addition, it is also possible to contact both ends of the first via post 24 and the first via land 16 and the second via land 22 via a conductive adhesive.

 Next, as shown in FIG. 5, a liquid insulating material 28 is injected between the first circuit board 12 and the second circuit board 18. Liquid insulating material using an injector 27 between the first circuit board 12 and the second circuit board 18 to form an insulating layer between the first circuit board 12 and the second circuit board 18. Inject (28) to fill. When the filling of the liquid insulating material 28 is completed, as shown in FIG. 6, the liquid insulating material 28 is cured to form an insulating layer. By this step, the process of laminating a conventional insulating layer can be omitted, and the manufacturing process can be shortened.

Although the present embodiment has described a manufacturing process of a printed circuit board having a total of four layers, the above-described process may be repeated to manufacture four or more printed circuit boards.

7 to 10 are flowcharts illustrating a part of a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention. 7 to 10, the first circuit board 12, the circuit patterns 14, 20, and 36, the first via land 16, the second circuit board 18, and the circuit patterns 14, 20, 36, the second via land 22, the first via post 24, the insulating material 28, the third via land 30, the second via post 32, the third circuit board 34, the fourth Vialand 38 is shown.

It is also possible to manufacture the printed circuit board by repeating the process of the above-described embodiment in order to manufacture four or more layers of the printed circuit board, but before the step of injecting the liquid insulating material 28 in the above-described process in advance as in the present embodiment It is also possible to manufacture four or more printed circuit boards by aligning two or more circuit boards and then injecting a liquid insulating material 28 at the same time.

In the method of manufacturing a printed circuit board according to the present embodiment, a first circuit board 12 having a first via land 16 formed therein, a second via land 22 and a third via land 30 formed on both surfaces thereof, respectively; Providing a third circuit board 34 having a second circuit board 18 and a fourth via land 38 formed thereon, disposing a first via post 24 in the first via land 16, and a second Aligning the second circuit board 18 so that the via land 22 faces the first via post 24, arranging the second via post 32 in the third via land 30; Aligning the third circuit board 34 such that the fourth via land 38 is in contact with the second via post 32 and the first circuit board 12, the second circuit board 18, and the third. Injecting a liquid insulating material 28 between the circuit board 34.

This embodiment provides a method of manufacturing a total of six printed circuit boards by aligning three circuit boards and injecting a liquid insulating material 28.

The first circuit board 12 having the first via land 16 formed thereon, the second circuit board 18 and the fourth via land having the second via land 22 and the third via land 30 formed on both surfaces thereof. Providing a third circuit board 34 having a 38 formed therein, disposing a first via post 24 in the first via land 16 and a second via land 22 in the first via post 24. Arranging the second circuit board 18 so as to face each other) is the same as the above-described embodiment except for providing the third circuit board 34, so the description thereof will be omitted and the above-described embodiment will be omitted. Only examples and other components will be described.

As shown in FIG. 7, the first via land 16 of the first circuit board 12 and the second via land 22 of the second circuit board 18 are disposed at both ends of the first via post 24. The second circuit board 18 is aligned so as to be in contact with each other. In this case, as described above, the first via post 24, the first via land 16, and the second via land 22 may be joined by the arc welding method.

Next, as shown in FIG. 8, the second via post 32 is disposed in the third via land 30 of the second circuit board 18. Next, as shown in FIG. 9, the third circuit board 34 is aligned such that the fourth via land 38 abuts against the second via post 32. In this case, the second circuit board 18 may be aligned, and the via post and the via land may be joined by arc welding, and the third circuit board 34 may be aligned and arc welded to bond the via post and the via land at once. It is possible. The fourth via land 38 may be formed on the third circuit board 34 as part of the circuit pattern 36. Next, when the second circuit board 18 and the third circuit board 34 are aligned, as shown in FIG. 10, the first circuit board 12, the second circuit board 18, and the third circuit board are shown. A liquid insulating material 28 is injected and filled between the 34. The liquid insulating material 28 is injected and then cured to form an insulating layer between the circuit boards.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

2 to 6 are flowcharts illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

7 to 10 are flowcharts illustrating a part of a method of manufacturing a printed circuit board according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

12, 18, 34: circuit board

14, 20, 36: circuit pattern

16, 22, 30, 38: Via Land

24, 32: Via Post

Claims (7)

Providing a first circuit board on which a plurality of first via lands are formed and a second circuit board on which a plurality of second via lands are formed; Placing a first via post in the first via land; At this time, the first via post is made of a magnetic material, by applying a magnetic field to the electromagnet coupled to the magnetic position controller to lift the first via post and place the first via post on the first via land and Removing the magnetic field from the electromagnet and placing the first via post in the first via land- Aligning the second circuit board such that the second via land contacts the first via post; And A method of manufacturing a printed circuit board comprising injecting a liquid insulating material between the first circuit board and the second circuit board. The method of claim 1, After aligning the second circuit board, And bonding the first via land and the second via land to the first via post. The method of claim 2, The joining step is a method of manufacturing a printed circuit board, characterized in that performed by arc (Arc) welding. delete Providing a first circuit board having a first via land, a second circuit board having a second via land and a third via land formed on both surfaces thereof, and a third circuit board having a fourth via land formed thereon; Placing a first via post in the first via land; At this time, the first via post is made of a magnetic material, by applying a magnetic field to the electromagnet coupled to the magnetic position controller to lift the first via post and place the first via post on the first via land and Removing the magnetic field from the electromagnet and placing the first via post in the first via land- Aligning the second circuit board such that the second via land contacts the first via post; Disposing a second via post in the third via land; At this time, the second via post is made of a magnetic material, by applying a magnetic field to the electromagnet coupled to the magnetic position controller to lift the second via post and place the second via post on the third via land and Removing the magnetic field from the electromagnet and placing the second via post in the third via land- Aligning the third circuit board such that the fourth via land faces the second via post; And injecting a liquid insulating material between the first circuit board, the second circuit board, and the third circuit board. The method of claim 5, After aligning the second circuit board, Bonding the first via land and the second via land to the first via post; After aligning the third circuit board, And bonding the third via land and the fourth via land to the second via post. The method of claim 6, The joining step is a printed circuit board manufacturing method, characterized in that performed by arc (Arc) welding.

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