CN117279205A

CN117279205A - Circuit board with embedded part and manufacturing method thereof

Info

Publication number: CN117279205A
Application number: CN202210670019.1A
Authority: CN
Inventors: 林原宇
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2023-12-22

Abstract

The application provides a manufacturing method of a circuit board with an embedded part, which comprises the following steps: providing a circuit substrate, which comprises a substrate layer and a first circuit layer; forming an accommodating hole in the circuit substrate and forming an inner wall surrounding the accommodating hole; laminating a strippable glue on the surface of the substrate layer far away from the first circuit layer; placing the embedded part in the accommodating hole, and forming a gap between the embedded part and the inner wall; wherein the embedded part comprises an electrode; arranging an adhesive body in a part of the gap; arranging conductive paste on part of the first circuit layer and the embedded part to form first conductive paste, and filling part of the conductive paste into a gap of the other part to form second conductive paste; the first conductive paste is electrically connected with the electrode; and sequentially pressing a first insulating layer and a second circuit layer on the first circuit layer and the embedded part, and arranging a conducting body penetrating through the first insulating layer to electrically connect the first conductive paste and the second circuit layer to obtain the circuit board with the embedded part. The application also provides a circuit board with the embedded part.

Description

Circuit board with embedded part and manufacturing method thereof

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board with embedded parts and a manufacturing method thereof.

Background

In order to realize integration and thinning of the circuit board, it is generally necessary to embed electronic components in the circuit board. Conventional fabrication methods generally include: slotting on the circuit substrate, embedding parts, laminating, laser drilling conductive blind holes and electroplating filling holes to form a conducting body for electrically connecting the embedded electronic element and an external circuit. Because the electronic component paster precision is not enough, also can take place certain skew at the circuit board in-process that carries out follow-up pressfitting and increases the layer, and the electrode cross-sectional area on the current electronic component is different, consequently when carrying out laser drilling, appears laser alignment inaccurately and beat or the electronic component of misdamage easily, causes the functional influence, causes the yield of circuit board not high. In addition, the circuit board obtained by the manufacturing method has poor heat dissipation effect.

Disclosure of Invention

In view of the above, the present application provides a method for manufacturing a circuit board with an embedded component.

An embodiment of the present application provides a method for manufacturing a circuit board with an embedded part, including the following steps:

providing a circuit substrate, wherein the circuit substrate comprises a base material layer and a first circuit layer formed on one surface of the base material layer;

forming a containing hole in the circuit substrate, and forming an inner wall surrounding the containing hole on the circuit substrate;

laminating a strippable glue on the surface of the substrate layer far away from the first circuit layer;

placing an embedded part in the accommodating hole, wherein a gap is formed between the embedded part and the inner wall; wherein the embedded part comprises an electrode;

arranging an adhesive body in part of the gaps;

arranging conductive paste on part of the first circuit layer and the embedded part to form first conductive paste, and filling part of the conductive paste into the gap of the other part to form second conductive paste; the first conductive paste is electrically connected with the electrode;

sequentially laminating a first insulating layer and a second circuit layer on the first circuit layer and the embedded part, and arranging a conducting body penetrating through the first insulating layer so as to electrically connect the first conductive paste and the second circuit layer;

and removing the strippable glue to obtain the circuit board with the embedded part.

In some embodiments, the conductive paste is copper paste or copper alloy paste.

In some embodiments, the step of disposing a conductive paste on portions of the first wiring layer and the buried member to form a first conductive paste includes:

and setting conductive paste on part of the first circuit layer and the embedded part in a printing mode, filling part of the conductive paste into the gap of the other part, and then baking and curing the conductive paste to form the first conductive paste and the second conductive paste.

In some embodiments, the step of disposing a conductive paste on a portion of the first circuit layer and the embedded part to form a first conductive paste further includes:

the first conductive paste is fired by laser to form a first conductive pattern and a second conductive pattern, the first conductive pattern covers the electrode, the cross-sectional area of the first conductive pattern is larger than that of the electrode, and the second conductive pattern connects the electrode and the first circuit layer.

In some embodiments, the step of disposing an adhesive in a portion of the gap comprises:

and filling insulating glue in gaps at two opposite sides of the embedded part in a printing mode, and then baking and curing the insulating glue to form the adhesive body.

In some embodiments, the embedded part comprises a body, the electrode is connected with the body, the body is accommodated in the accommodating hole, the surface of the body away from the electrode is flush with the surface of the substrate layer adjacent to the first circuit layer, and the surface of the electrode away from the body and the surface of the substrate layer away from the first circuit layer are flush.

In some embodiments, the adhesive and the second conductive paste filled in the gap are flush with a surface of the substrate layer remote from the first wiring layer.

In some embodiments, further comprising:

and sequentially laminating a third circuit layer, a second insulating layer and a fourth circuit layer on one surface of the substrate layer, which is far away from the first circuit layer.

The application also provides a circuit board with embedded part, including: the circuit board comprises a base material layer and a first circuit layer formed on one surface of the base material layer, wherein an accommodating hole is formed in the circuit board, and an inner wall surrounding the accommodating hole is formed on the circuit board;

the embedded part is arranged in the accommodating hole, and a gap is reserved between the embedded part and the inner wall; wherein the embedded part comprises an electrode; the adhesive body is arranged in the gaps at two opposite sides, and the second conductive paste is arranged in the gaps at two other opposite sides;

the first conductive pattern coats the electrode, and the cross-sectional area of the first conductive pattern is larger than that of the electrode;

the first insulating layer and the second circuit layer are sequentially stacked on the first circuit layer and the embedded part, and the conducting body penetrates through the first insulating layer to be electrically connected with the second circuit layer and the first conductive pattern.

In some embodiments, further comprising: a second conductive pattern connected to the buried member and the first circuit layer;

the second conductive paste, the first conductive pattern and the second conductive pattern are made of copper paste or copper alloy glue.

According to the manufacturing method of the circuit board with the embedded part, the adhesive body and the second conductive paste are arranged in sequence, so that the embedded part can be well fixed. By arranging the first conductive paste body to be electrically connected with the electrode, the connection cross-sectional area of the electrode can be enlarged, the alignment capability of the subsequent build-up laser to the embedded part is increased, the problem of insufficient patch precision of the embedded part is compensated, the embedded part is prevented from being damaged, and the yield is improved. And the first conductive paste and the second conductive paste can effectively improve the heat dissipation efficiency of the embedded part, so that the heat dissipation effect of the whole circuit board with the embedded part is improved.

In addition, the second conductive pattern is formed by firing the first conductive paste through laser, so that the second conductive pattern can be used as a connecting line between the embedded part and the first circuit layer, and subsequent layer adding is reduced.

Drawings

Fig. 1 is a cross-sectional view of a circuit substrate according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of the circuit board shown in fig. 1 after a receiving hole is formed therein.

Fig. 3 is a cross-sectional view of the circuit board shown in fig. 2 after the peelable adhesive is bonded thereto.

Fig. 4 is a cross-sectional view of the housing hole shown in fig. 3 after the embedded part is provided therein.

Fig. 5 is a cross-sectional view of the adhesive body disposed in the gap shown in fig. 4.

Fig. 6 is a cross-sectional view of the wiring substrate shown in fig. 5 after the first conductive paste and the second conductive paste are provided thereon.

Fig. 7 is a cross-sectional view of the first conductive paste shown in fig. 6 after laser firing to form a first conductive pattern and a second conductive pattern.

Fig. 8 is a top view of the first conductive paste shown in fig. 6 after laser firing to form a first conductive pattern and a second conductive pattern.

Fig. 9 is a cross-sectional view of a circuit board with embedded parts according to an embodiment of the present application.

Description of the main reference signs

Circuit board 100 with embedded parts

Circuit board 10

Substrate layer 11

First circuit layer 12

Third circuit layer 13

Receiving hole 20

Inner wall 21

Peelable glue 30

Built-in fitting 40

Body 401

Electrode 402

Gap 41

Adhesive body 50

First electrically conductive paste 60

Second conductive paste 61

First conductive pattern 62

Second conductive pattern 63

First insulating layer 70

Second insulating layer 72

Second circuit layer 80

Fourth line layer 82

Via body 90

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In order to further describe the technical means and effects adopted by the present application to achieve the predetermined purpose, the following detailed description is made in connection with the accompanying drawings and preferred embodiments.

An embodiment of the present invention provides a method for manufacturing a circuit board with an embedded part, and it should be noted that the present embodiment only uses four layers of circuit boards as an illustration and description, but the present invention is not limited to such a multi-layer circuit board structure, and those skilled in the art can understand that the present invention can also be applied to connection boards and other multi-layer circuit board structures or processes.

Referring to fig. 1 to 6, the method for manufacturing the circuit board with the embedded part includes the following steps:

in step S1, referring to fig. 1, a circuit substrate 10 is provided.

In this embodiment, the circuit substrate 10 includes a base material layer 11 and a first circuit layer 12 formed on one surface of the base material layer 11.

The material of the substrate layer 11 may be one selected from epoxy resin (epoxy resin), ABF resin, polypropylene (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate, PEN), and the like. In this embodiment, the material of the substrate layer 11 is ABF resin.

In step S2, referring to fig. 2, a receiving hole 20 is formed in the circuit substrate 10.

The receiving hole 20 penetrates the circuit board 10, and an inner wall 21 surrounding the receiving hole 20 is formed on the circuit board 10.

In step S3, referring to fig. 3, a peelable adhesive 30 is attached to a surface of the substrate layer 11 away from the first circuit layer 12.

Wherein, the peelable glue 30 seals one end of the accommodating hole 20.

In step S4, referring to fig. 4, the embedded part 40 is placed in the accommodating hole 20, and a gap 41 is formed between the embedded part 40 and the inner wall 21.

Wherein, the inner diameter of the receiving hole 20 is larger than the outer diameter of the embedded part 40, so that the gap 41 is formed between the embedded part 40 and the inner wall 21. Wherein the embedded part 40 is further located on the peelable glue 30.

In this embodiment, the cross-sectional shape of the receiving hole 20 is substantially rectangular, and the number of the corresponding gaps 41 is four. The embedded part 40 includes a body 401 and two electrodes 402 electrically connected to the body 401. In this embodiment, both electrodes 402 are located on a side of the body 401 remote from the peelable glue 30.

It will be appreciated that in other embodiments, the cross-section of the receiving cavity 20 may be other shapes, such as circular.

Wherein a surface of the body 401 remote from the electrode 402 is substantially flush with a surface of the substrate layer 11 adjacent to the first wiring layer 12, and a surface of the electrode 402 remote from the body 401 and a surface of the substrate layer 11 remote from the first wiring layer 12 are substantially flush.

In step S5, referring to fig. 5, insulating glue is filled in the gaps 41 at two opposite sides of the embedded part 40 to form the bonding body 50.

Specifically, the gaps 41 on the two opposite sides of the embedded part 40 are filled with insulating glue by printing, and then baked to cure the insulating glue to form the adhesive body 50, so as to fix the embedded part 40 in the accommodating hole 20.

The material of the adhesive body 50 may be one selected from epoxy resin (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN).

In step S6, referring to fig. 6, a first conductive paste 60 is formed by disposing a conductive paste on a portion of the first circuit layer 12 and the embedded part 40, and a second conductive paste 61 is formed by filling a portion of the conductive paste into the gaps 41 on the other opposite sides.

Specifically, a conductive paste is disposed on a portion of the first circuit layer 12 and the embedded part 40 by printing, and then the conductive paste is baked and cured to form the first conductive paste 60 and the second conductive paste 61.

In this embodiment, the conductive paste is made of copper paste or copper alloy paste. The adhesive body 50 and the second conductive paste 61 filled in the gap 41 are flush with a surface of the first wiring layer 12 away from the substrate layer 11 and a surface of the first wiring layer 12 away from the substrate layer.

In step S7, referring to fig. 7 and 8, the first conductive paste 60 is laser fired to form a first conductive pattern 62 and a second conductive pattern 63.

The number of the first conductive patterns 62 is two, and the first conductive patterns 62 respectively cover the electrode 402, and the cross-sectional area of the first conductive patterns 62 is larger than the cross-sectional area of the electrode 402. The second conductive pattern 63 connects the embedded part 40 and the first circuit layer 12.

In step S8, referring to fig. 9, a first insulating layer 70 and a second insulating layer 80 are sequentially laminated on the first circuit layer 12 and the embedded part 40, and a conductive body 90 is disposed through the first insulating layer 70 to electrically connect the second circuit layer 80 and the first conductive pattern 62.

In this embodiment, the via 90 may be formed by electroplating copper after laser drilling.

Wherein, step S8 further comprises: and removing the peelable glue 30, and sequentially laminating a third circuit layer 13, a second insulating layer 72 and a fourth circuit layer 82 on a surface of the substrate layer 11, which is far away from the first circuit layer 12, to obtain the circuit board 100 with the embedded part.

In this embodiment, the material of the first insulating layer 70 and the second insulating layer 72 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate, PEN), and the like.

Those skilled in the art can know that the method for manufacturing the circuit board with the embedded part further comprises the steps of pressing, welding prevention, surface treatment, finished product testing and the like, so as to finish the manufacturing of the whole multi-layer circuit board.

The manufacturing method of the circuit board with embedded parts provided by the application can well fix the embedded parts 40 by arranging the bonding body 50 and the second conductive paste 61 in sequence. The first conductive paste 60 is fired by laser to form a first conductive pattern 62 and a second conductive pattern 63, the first conductive pattern 62 coats the two electrodes 402, so that the connection cross-sectional area of the two electrodes 402 can be enlarged, the alignment capability of the subsequent build-up laser to the embedded part 40 is increased, the problem of insufficient patch precision of the embedded part 40 is compensated, the embedded part 40 is prevented from being damaged, and the yield is improved. In addition, the first conductive paste 60 and the second conductive paste 61 can effectively improve the heat dissipation efficiency of the embedded part 40, thereby improving the heat dissipation effect of the whole circuit board 100 with embedded parts.

In addition, by forming the second conductive pattern 63, a connection line between the embedded part 40 and the first circuit layer 12 is formed, so that the subsequent build-up can be reduced.

Referring to fig. 8 and 9, an embodiment of the present application further provides a circuit board 100 with embedded parts manufactured by the above manufacturing method.

The circuit board 100 with embedded parts includes a circuit substrate 10, an embedded part 40, an adhesive body 50, a second conductive paste 61, a first conductive pattern 62, a second conductive pattern 63, a first insulating layer 70, a second insulating layer 72, a second circuit layer 80, a third circuit layer 13, a fourth circuit layer 82, and a conductive body 90.

The circuit substrate 10 includes a base material layer 11 and a first circuit layer 12 disposed on one surface of the base material layer 11. A receiving hole 20 is formed in the circuit substrate 10 in a penetrating manner, and the receiving hole 20 includes a plurality of inner walls 21. The embedded part 40 is disposed in the receiving hole 20, a plurality of gaps 41 are provided between the embedded part 40 and the inner wall 21, the adhesive body 50 is disposed in the gaps 41 on opposite sides, and the second conductive paste 61 is disposed in the gaps 41 on the other two sides.

The embedded part 40 includes a body 401 and an electrode 402 electrically connected to the body 401. The first conductive pattern 62 wraps the electrode 402, and the second conductive pattern 63 connects the embedded part 40 and the first circuit layer 12.

Wherein a surface of the body 401 remote from the electrode 402 is substantially flush with a surface of the substrate layer 11 adjacent to the first wiring layer 12, and a surface of the electrode 402 remote from the body 401 and a surface of the substrate layer 11 remote from the first wiring layer 12 are substantially flush. Two of the electrodes 402 are located on the same side of the body 401.

In this embodiment, the materials of the second conductive paste 61, the first conductive pattern 62 and the second conductive pattern 63 are copper paste or copper alloy paste.

The first insulating layer 70 and the second circuit layer 80 are sequentially stacked on the first circuit layer 12 and the embedded part 40, and the conductive body 90 is disposed through the first insulating layer 70 to electrically connect the second circuit layer 80 and the first conductive pattern 62. The third circuit layer 13, the second insulating layer 72 and the fourth circuit layer 82 are sequentially stacked on a surface of the base material layer 11 away from the first circuit layer 12.

The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application.

Claims

1. The manufacturing method of the circuit board with the embedded part is characterized by comprising the following steps of:

forming a containing hole in the circuit substrate, wherein an inner wall surrounding the containing hole is formed on the circuit substrate;

arranging an adhesive body in part of the gaps;

2. The method of claim 1, wherein the conductive paste is copper paste or copper alloy paste.

3. The method of manufacturing a circuit board with embedded parts according to claim 1, wherein the step of disposing conductive paste on portions of the first circuit layer and the embedded parts to form a first conductive paste comprises:

4. The method of manufacturing a circuit board with embedded parts according to claim 1, wherein the step of forming a first conductive paste by disposing a conductive paste on a part of the first circuit layer and the embedded parts further comprises:

5. The method of manufacturing a circuit board with embedded parts according to claim 1, wherein the step of disposing an adhesive body in a part of the gaps comprises:

6. The method of claim 1, wherein the embedded component comprises a body, the electrode is connected to the body, the body is accommodated in the accommodating hole, a surface of the body away from the electrode is flush with a surface of the substrate layer adjacent to the first circuit layer, and a surface of the electrode away from the body and a surface of the substrate layer away from the first circuit layer are flush.

7. The method of manufacturing a circuit board with embedded parts according to claim 1, wherein the adhesive body and the second conductive paste filled in the gap are flush with a surface of the substrate layer away from the first circuit layer.

8. The method for manufacturing a circuit board with embedded parts according to claim 1, further comprising:

9. A circuit board with embedded parts, comprising: the circuit board comprises a base material layer and a first circuit layer formed on one surface of the base material layer, wherein an accommodating hole is formed in the circuit board, and an inner wall surrounding the accommodating hole is formed on the circuit board;

10. The circuit board with embedded part according to claim 9, further comprising: a second conductive pattern connected to the buried member and the first circuit layer;

wherein the second conductive paste, the first conductive pattern and the second conductive pattern are all made of copper paste or copper alloy glue.