KR100994287B1 - Susceptor and atomic layer deposition apparatus having the susceptor - Google Patents

Abstract

Disclosed are a susceptor having an aligner for aligning a position of the susceptor and a drive shaft during assembly of the susceptor, and an atomic layer deposition apparatus having the same. A susceptor for an atomic layer deposition apparatus that facilitates assembly of a susceptor is provided with a base plate on which a plurality of wafers are seated, and a lift pin assembly supporting the wafer so as to be elevated to protrude upward from the base plate, and the base plate lower portion. Is coupled to the drive shaft for rotating and lifting the base plate and the shaft coupling groove formed in the recessed in the lower surface of the base plate and the outer peripheral portion of the shaft coupling groove is disposed to detect the alignment of the drive shaft and the base plate And an aligner including a plurality of alignment pins. Therefore, the susceptor, the drive shaft, and the lift pin can be assembled at the correct position, thereby preventing the lift pin from being broken during assembly or lifting of the lift pin. It also allows the wafer to be seated in the correct position.

Atomic layer deposition equipment, ALD, susceptors, lift pins, aligners

Description

Susceptor and atomic layer deposition apparatus having the same {SUSCEPTOR AND ATOMIC LAYER DEPOSITION APPARATUS HAVING THE SUSCEPTOR}

The present invention relates to an atomic layer deposition apparatus, and more particularly, to align the position of the susceptor and the drive shaft to prevent the lift pin from being damaged by misalignment of the susceptor and the drive shaft and to allow the wafer to be seated in place. It is to provide a susceptor and an atomic layer deposition apparatus having the same.

In general, in order to deposit a thin film having a predetermined thickness on a wafer such as a semiconductor wafer or glass, physical vapor deposition (PVD) using physical collision such as sputtering and chemical vapor deposition using chemical reaction ( thin film manufacturing method using chemical vapor deposition (CVD) or the like is used.

As the design rule of the semiconductor device is drastically fine, a thin film of a fine pattern is required, and the step of the region where the thin film is formed is also very large. Accordingly, the use of an atomic layer deposition (ALD) method, which is capable of forming a very fine pattern of atomic layer thickness very uniformly and has excellent step coverage, is increasing.

The atomic layer deposition (ALD) method is similar to the conventional chemical vapor deposition method in that it uses chemical reactions between gas molecules. However, unlike conventional chemical vapor deposition (CVD) methods injecting a plurality of gas molecules into the process chamber at the same time to deposit the reaction product generated above the wafer onto the wafer, the atomic layer deposition method processes one gaseous material. It is different in that it is injected into the chamber and then purged to leave only the physically adsorbed gas on top of the heated wafer, and then inject other gaseous materials to deposit chemical reaction products that occur only on the top of the wafer. The thin film implemented through such an atomic layer deposition method has a very good step coverage characteristics and has the advantage that it is possible to implement a pure thin film with a low impurity content, which is widely attracting attention.

Meanwhile, a semi-batch type atomic layer deposition apparatus capable of simultaneously depositing thin films on a plurality of wafers is disclosed. In the conventional semi-batch type atomic layer deposition apparatus, a plurality of wafers are disposed radially along the circumferential direction on the susceptor, and as the susceptor rotates, source gas is sequentially sprayed onto the wafer to perform the deposition process.

Here, the conventional atomic layer deposition apparatus is provided with a susceptor in which two wafers are loaded / unloaded at the same time in order to improve throughput. However, in order to load / unload two wafers, it is important that the susceptor is accurately aligned to the loading / unloading position of the wafer.

Aligning the susceptor to the loading / unloading position of the wafer is determined by the rotation of the drive shaft provided in the susceptor. However, when the susceptor and the drive shaft are assembled in a misaligned state when assembling the susceptor, a problem arises in that the susceptor is aligned at a position shifted from the loading / unloading position of the wafer.

In other words, if the susceptor is misaligned, the wafer may not be seated in place and may be separated from the lift pin or the position of the wafer may be misaligned. This may cause a poor deposition quality or a defect or breakage of the wafer. In particular, when two wafers are loaded at the same time, when the wafers are aligned at the right and left sides corresponding to one wafer, the lift pin corresponding to one sheet does not rise, and the wafer does not settle on the lift pin and the susceptor There is a problem going down. In addition, even when the wafer is unloaded, a problem may occur in that only one wafer is unloaded and a wafer subsequently loaded onto the remaining one wafer is loaded.

Therefore, an aligner is provided to align the position of the susceptor and the drive shaft so that the susceptor and the drive shaft are assembled at the correct position when the susceptor is assembled.

However, the conventional aligner has a problem that it is not easy to determine whether the susceptor and the drive shaft are aligned in the correct position. As a result, the susceptor and the drive shaft may be assembled in a misaligned state, thereby causing problems due to misalignment of the susceptor. In addition, when the susceptor and the drive shaft are assembled misaligned, the lift pin may be deformed or broken when the lift pin assembly is assembled to the susceptor.

In addition, in the assembling process of the susceptor, the operator needs to know whether the susceptor is aligned with the drive shaft, which increases effort and time, and when the susceptor is misaligned after assembly, the susceptor is disassembled and rearranged. Since there is a need to reassemble, there is a problem that the assembly time increases and productivity is lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and to provide a susceptor capable of easily aligning a position of a susceptor and a drive shaft, and an atomic layer deposition apparatus having the same.

In addition, the present invention is to provide a susceptor and an atomic layer deposition apparatus having the same to simplify the susceptor assembly process and to save time, effort, and cost.

According to embodiments of the present invention for achieving the above object of the present invention, a susceptor for an atomic layer deposition apparatus that facilitates the assembly of the susceptor is a base plate on which a plurality of wafers are seated, protrudes above the base plate A lift pin assembly configured to be liftable to support the wafer, a drive shaft coupled to a lower portion of the base plate to rotate and lift the base plate, and a shaft coupling groove formed in the bottom surface of the base plate and the shaft coupling groove; It is disposed along the outer periphery and includes an aligner including a plurality of alignment pins for detecting whether the drive shaft and the base plate is aligned.

In an embodiment, the lift pin assembly includes a lift pin provided through the base plate and arranged in a triangular shape to support the wafer at three points, and a lift portion provided below the base plate to lift the lift pin. The lift pins and the lift units are connected to lift and lift six lift pins on which two neighboring wafers are seated at the same time. In addition, the bottom side of the two triangles formed by the six lift pins that are lifted at the same time is disposed so as to be located on the reference line.

In an embodiment, the base plate has a disk shape, the plurality of wafers are disposed radially along the circumferential direction of the base plate, and the reference line is a straight line perpendicular to the radial direction of the base plate. The shaft coupling groove has a polygonal shape whose edge is formed parallel to the reference line. For example, the shaft coupling groove has a triangular shape, the alignment pin is provided in the central portion of each corner of the shaft coupling groove. In addition, the end of the drive shaft is provided with a coupling flange having a shape corresponding to the shaft coupling groove and inserted into the shaft coupling groove. For example, the shaft coupling groove may have an equilateral triangle shape in which the center and the center of gravity of the base plate coincide with each other.

On the other hand, according to another embodiment of the present invention for achieving the above object of the present invention, the atomic layer deposition apparatus that facilitates the assembly of the susceptor is a process chamber in which a plurality of wafers are accommodated, the deposition process is performed, the A transfer chamber provided adjacent to the process chamber and entering and exiting the wafer into the process chamber, a susceptor provided in the process chamber to seat a plurality of wafers, and loaded in the transfer chamber to simultaneously load two wafers into the susceptor / And an aligner provided at a lower portion of the transfer unit for unloading and the susceptor, the aligner including a plurality of align pins for detecting whether the position of the susceptor is aligned with the loading / unloading position of the wafer. You include a shaft coupling groove for coupling the susceptor and the drive shaft, A alignment pin is provided around the shaft coupling groove to detect whether the susceptor and the driving shaft are aligned.

In an embodiment, the susceptor includes a base plate on which the plurality of wafers are seated, the shaft coupling groove is formed in the bottom surface of the base plate, and the alignment pin is coupled to the shaft inside the shaft coupling groove. It may be provided along the outer periphery of the groove. For example, the susceptor has three regular pins arranged in an equilateral triangle so that the susceptor is aligned with the loading / unloading position of the wafer as six wafers are seated and the drive shaft rotates at 120 ° intervals. Can be arranged. The shaft coupling groove may have a triangular shape, and the alignment pin may be provided at a central portion of each corner of the shaft coupling groove.

In an embodiment, the transfer part comprises two handling arms to simultaneously grip and transfer two wafers, wherein the shaft engaging groove has an edge of the shaft engaging groove when aligned with the loading / unloading position of the wafer. It is formed to be perpendicular to the direction of movement of the handling arm.

In an embodiment, an end portion of the driving shaft may have a shape corresponding to the shaft coupling groove, and a coupling flange inserted into the shaft coupling groove may be provided.

According to the present invention, first, it is easy to detect the position of the alignment pin, even if the alignment process of the susceptor and the drive shaft is not performed separately, the aligner has a shape such that the susceptor and the drive shaft is aligned in an aligned state, the susceptor This can prevent the wafer loading / unloading problem and defects caused by misalignment.

It is also possible to prevent the lift pin from being deformed or broken when assembling the lift pin assembly to the susceptor.

Second, since the aligner has a shape that is sufficiently discernible to the naked eye, not only the alignment of the susceptor and the driving shaft is easy, but also the operator can shorten the time and effort for assembling the susceptor and improve productivity.

In addition, by aligning the susceptor and the drive shaft in the correct position, it is possible to lower the failure rate of the susceptor assembly process and prevent the occurrence of failure due to misaligned susceptor.

Third, since the structure of the aligner can be improved without changing the structure of the susceptor, the efficiency and productivity of the susceptor assembly process can be improved without increasing production costs or changing the process.

Although the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, the present invention is not limited or restricted by the embodiments.

Hereinafter, an atomic layer deposition apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3. For reference, FIG. 1 is a longitudinal cross-sectional view of an atomic layer deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a bottom surface of the susceptor for explaining the arrangement of the aligner and the wafer in the atomic layer deposition apparatus of FIG. 1. 3 is a plan view illustrating the susceptor and the drive shaft in FIG. 2.

Referring to FIG. 1, the atomic layer deposition apparatus 100 includes a process chamber 101 in which a deposition process is performed and a transfer chamber 105 provided adjacent to the process chamber 101 to enter and exit a wafer W. Referring to FIG. It is configured by.

The wafer W may be a silicon wafer. However, the object of the present invention is not limited to a silicon wafer, and the wafer W may be a transparent substrate including glass used for a flat panel display device such as a liquid crystal display (LCD) and a plasma display panel (PDP). have. In addition, the wafer W is not limited in shape and size by drawings, and may have substantially various shapes and sizes, such as circular and rectangular base plates.

The process chamber 101 accommodates the wafer W to provide a space in which the deposition process is performed, and the susceptor 102 and the wafer (W) on which the wafer W is seated in the process chamber 101 are provided. A shower head 103 is provided for providing a deposition gas to W).

The susceptor 102 is provided in the process chamber 101 and the plurality of wafers W are seated. Here, the susceptor 102 is a semi-batch type with excellent throughput. One surface of the wafer W may accommodate a plurality of wafers W at the same time so that a deposition process may be performed. The susceptor 102 is seated on an upper surface of the susceptor 102 and disposed radially along the circumferential direction. For example, the susceptor 102 is seated with six wafers W spaced apart from each other by a predetermined interval.

A drive shaft 125 for rotating the susceptor 102 is provided below the susceptor 102 to rotate the susceptor 102 so that the wafer (see FIG. W) goes idle. In addition, the drive shaft 125 moves the susceptor 102 up and down a predetermined distance in the process chamber 101.

The shower head 103 is provided above the process chamber 101 to provide deposition gas to the surface of the wafer W supported by the susceptor 102.

The deposition gas includes a source gas containing a material constituting a thin film to be formed on the surface of the wafer (W) and a purge gas for purging the source gas. In addition, according to the present embodiment, different kinds of gases that react with each other on the surface of the wafer W to form a thin film material are used as source gas, and as the purge gas, the source gas, the wafer W, and the wafer W are used. A stable gas is used that does not chemically react with the thin film formed on the layer.

One side of the shower head 103 is connected to the deposition gas supply unit 130 for supplying the deposition gas to the shower head 103.

The transfer chamber 105 communicates with the process chamber 101 to allow the wafer W to enter and exit the process chamber 101. Here, the entrance and exit opening which allows the entrance and exit of the wafer (W) to communicate with the transfer chamber 105 and the process chamber 101 on a wall adjacent to the process chamber 101 and the transfer chamber 105. 111 is formed, the doorway 111 is provided with a door 112 for opening and closing the doorway (111). That is, the door 112 opens the doorway 111 to allow the wafer W to enter and exit when the wafer W is loaded / unloaded, and the door 112 while the deposition process is performed. Closes the exit 111 to seal the process chamber 101.

The transfer chamber 105 is provided with a transfer unit 106 for transferring the wafer W, and a buffer unit 151 for storing the wafer W is provided. For example, the buffer unit 151 may be provided with two or more buffer units 151 to separately accommodate the wafer W before the deposition process is performed and the wafer W where the deposition process is completed. . The buffer unit 151 may be a cassette or a front opening unified pod (FOUP) in which a plurality of wafers W are simultaneously accommodated.

The transfer unit 106 grips and moves the wafer W and loads and unloads the wafer W on the susceptor 102. The transfer unit 106 includes a handling arm 162 on which the wafer W is held, a transfer robot 161, and a driving unit 165. Here, the transfer part 106 may be provided with two handling arms 162 to simultaneously load / unload two wafers W.

A lift pin assembly 104 for elevating the wafer W from the surface of the base plate 121 at the loading / unloading of the wafer 10 at a position where the wafer 10 is seated in the susceptor 102. Is provided. The lift pin assembly 104 is provided under the base plate 121 and a plurality of lift pins 141 which are lifted so that the wafer W is seated and protrudes above a predetermined height from the surface of the base plate 121. It includes a pin lifting unit 145 for elevating the lift pin 141.

For example, the lift pins 141 are arranged in a triangular shape so that each of the lift pins 141 may be supported by three points to support the lower portion of the wafer 10 at three points.

The lift pin 141 penetrates through the base plate 121 and is connected to the pin elevating unit 145. The lift pin 141 ascends above a predetermined height from the surface of the base plate 121 and is inward from the surface of the base plate 121. It is provided to descend a predetermined depth. For reference, the base plate 121 is formed with a plurality of pin guide holes 124 penetrating the base plate 121 to accommodate the lift pin 141.

Here, the lift pin assembly 104 serves to transfer the wafer W between the handling arm 162 and the susceptor 102 when loading / unloading the wafer W. That is, when the wafer W is loaded, the lift pin 141 protrudes upward from a surface of the base plate 121 by a predetermined height and the wafer W is seated at an end of the lift pin 141. As the lift pin 141 moves downward from the surface of the base plate 121 for the deposition process, the wafer W is seated on the surface of the base plate 121. During the unloading of the wafer W, as the lift pin 141 is raised, the wafer W is raised from the surface of the base plate 121 by the lift pin 141 to a predetermined height. The handling arm 162 grips the wafer W supported by the lift pin 141 to unload the outside of the process chamber 101.

The susceptor 102 is loaded and unloaded two by one, and the lift pins 141 are lifted and lifted at the same time by the lift pins 141 at positions where two adjacent wafers W are to be seated. For example, six lift pins 141 disposed in areas adjacent to each other among the lift pins 141 may be connected to one pin lifter 145. In addition, the lift pins 141 are preferably arranged such that the two handling arms 162 are movable without collision between the lift pins 141.

Here, the imaginary straight line connecting the bases of the two triangles formed by the six lift pins 141, which are simultaneously elevated, is referred to as a reference line L. Since six wafers W are seated, the susceptor 102 Three reference lines L are formed. In addition, the handling arm 162 moves in the radial direction of the susceptor 102 to load / unload the wafer W, and the reference line L is perpendicular to the moving direction of the handling arm 162. Direction, that is, parallel to the tangent of the susceptor 102.

In order for two wafers W to be loaded / unloaded into the susceptor 102 at the same time, the susceptor 102 must be accurately stopped at the loading / unloading position of the predetermined wafer W. In the present embodiment, the loading / unloading position of the wafer W is disposed at a position where the one reference line L corresponds to the doorway 111 and is perpendicular to the moving direction of the handling arm 162. The susceptor 102 is located at the position where it is arranged.

The susceptor 102 is provided with a plurality of alignment pins 235 for detecting whether the susceptor 102 is aligned with the loading / unloading position of the wafer W.

In addition, the position of the susceptor 102 is determined by the rotation of the drive shaft 125, the base plate in order to accurately align the susceptor 102 with the loading / unloading position of the wafer (W) An aligner 123 specifying a coupling position of the 121 and the driving shaft 125 is provided.

Hereinafter, the alignment pin 235 and the aligner 123 will be described in detail with reference to FIG. 3.

The aligner 123 is provided below the base plate 121 and specifies a coupling position between the shaft coupling groove 231 and the driving shaft 125 into which the driving shaft 125 is inserted and coupled to the susceptor 102. It is configured to include the alignment pin 235 for aligning the position of.

For example, since the reference line L is aligned with the loading / unloading position of the wafer W as the driving shaft 125 rotates 120 °, three alignment pins 235 are provided on the susceptor 102. ) Is provided. In addition, as shown in FIG. 2, the alignment pin 235 may be disposed in a direction perpendicular to the reference line L at an approximately center portion of the reference line L.

The shaft coupling groove 231 is provided at the center of the base plate 121 and is recessed a predetermined depth from the surface of the base plate 121, so that the end of the drive shaft 125 is inserted into the shaft coupling groove 231. By being combined. The shaft coupling groove 231 is formed to be aligned with the coupling even if the coupling position of the drive shaft 125 and the base plate 121 is not separately aligned. For example, the shaft coupling groove 231 has a triangular shape, and in particular, the alignment pin 235 is formed at the center portion of the coupling edge 231a which is a corner of the triangle formed by the shaft coupling groove 231. The coupling edges 231a are formed in parallel with the reference line L so as to be provided respectively.

Meanwhile, a positioning groove 232 may be formed at the coupling edge 231a to determine the position of the alignment pin 235. For example, the alignment pin 235 is provided inside the shaft coupling groove 231 but is provided outside a predetermined portion of the coupling edge 231a to accommodate the alignment pin 235. A portion of the engagement edge 231a extends outwardly. In addition, the positioning groove 232 may have a groove shape having a semi-circular cross section with respect to the coupling edge 231a so as to surround the outer periphery of the alignment pin 235. That is, the positioning groove 232 assists the shaft coupling groove 231 and the driving shaft 125 in the assembly process of the susceptor 102 and determines the position of the alignment pin 235. Play a role.

Since the shaft coupling groove 231 has a triangular shape parallel to the reference line L, and the alignment pin 235 is provided at the center of the coupling edge 231a, the driving shaft is formed in the shaft coupling groove 231. By combining the 125 and the position of the drive shaft 125 and the base plate 121 is aligned and coupled. In addition, the aligner 123 has an advantage that the operator can easily assemble the drive shaft 125 and the base plate 121 because the operator can easily determine whether the alignment position even when viewed by the naked eye.

In addition, when assembling the lift pin assembly 104 to the base plate 121, the position of the lift pin 141 may be easily aligned using the aligner 123, and In the assembling process, the lift pin 141 may be inserted into the pin guide hole 124 at the misaligned position, thereby preventing the risk that the lift pin 141 may be damaged. In addition, the misaligned lift pin assembly 104 may prevent a malfunction when loading / unloading the wafer W into the susceptor 102.

An end portion of the drive shaft 125 may be formed with a coupling shaft coupling flange 251 having a shape corresponding to that of the drive shaft 125 so as to be inserted into the shaft coupling groove 231 and having a predetermined thickness.

Here, the shaft coupling flange 251 increases the contact area between the drive shaft 125 and the base plate 121 so that the drive shaft 125 can stably support the base plate 121. In addition, the shaft coupling flange 251 and the shaft coupling groove 231 has a center of gravity of the drive shaft 125 and the base plate so that the center of the drive shaft 125 and the center of the base plate 121 coincide with each other. It may have an equilateral triangle shape located at the center of the (121).

However, the shape and size of the aligner 123 is not limited by the drawings and may have various sizes and shapes. For example, the shaft coupling groove 231 may have a triangular shape in which the alignment pin 235 is located at a vertex. The shaft coupling groove 231 has a shape in which the driving shaft 125 and the base plate 121 have the vertical direction of the center portion with respect to the reference line L in the position of the alignment pin 235. And may be disposed at substantially various positions.

In addition, in the above-described embodiment, since six wafers W are arranged, the drive shaft 125 is rotated at 120 ° intervals so that the susceptor 102 can be aligned with the loading / unloading position of the wafer W. The aligner 123 has a triangular shape so as to be described as an example. However, the aligner 123 may be appropriately selected according to the number of wafers W seated on the susceptor 102 and the rotation angle of the driving shaft 125. The form of 123 will be changed substantially.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

1 is a longitudinal sectional view for explaining an atomic layer deposition apparatus according to an embodiment of the present invention;

FIG. 2 is a bottom plan view of the susceptor for explaining the arrangement and alignment of the wafer in the atomic layer deposition apparatus of FIG. 1; FIG.

3 is an exploded perspective view of the susceptor and the drive shaft in FIG. 2.

<Explanation of symbols for main parts of the drawings>

100: atomic layer deposition apparatus 101: process chamber

102: susceptor 103: showerhead

104: lift pin assembly 105: transfer chamber

106: transfer unit 111: doorway

112: door 121: base plate

123: aligner 124: pin guide hole

125: drive shaft 130: deposition gas supply unit

141: lift pin 145: pin lift

151: buffer unit 161: transfer robot

162: handling arm 165: drive unit

231: shaft coupling groove 231a: coupling edge

232: positioning groove 235: alignment pin

251: shaft coupling flange L: baseline

W: wafer

Claims (14)

In a susceptor for an atomic layer deposition apparatus, A base plate on which a plurality of wafers are seated; A lift pin assembly configured to be liftable to protrude above the base plate to support the wafer; A drive shaft coupled to a lower portion of the base plate to rotate and move the base plate; And An aligner disposed along the outer periphery of the shaft coupling groove and the shaft coupling groove formed in the lower surface of the base plate and including a plurality of alignment pins for detecting whether the driving shaft and the base plate are aligned; Susceptor for atomic layer deposition apparatus comprising a. The method of claim 1, The lift pin assembly, A lift pin provided through the base plate and arranged in a triangular shape to support the wafer at three points; And An elevating part provided below the base plate to elevate the lift pin; Including, A susceptor for an atomic layer deposition apparatus, wherein the lift pins and the lift units are connected to lift and lift six lift pins on which two adjacent wafers are seated at the same time. The method of claim 2, Susceptor for an atomic layer deposition apparatus, characterized in that the bottom side of the two triangles formed by the six lift pins that are lifted at the same time is positioned on the reference line. The method of claim 3, The base plate has a disk shape, the plurality of wafers are disposed radially along the circumferential direction of the base plate, The reference line is a susceptor for an atomic layer deposition apparatus, characterized in that the straight line perpendicular to the radial direction of the base plate. The method of claim 3, The axial coupling groove susceptor for an atomic layer deposition apparatus, characterized in that the corner has a polygonal shape formed parallel to the reference line. The method of claim 5, The shaft coupling groove has a triangular shape, the alignment pin is a susceptor for an atomic layer deposition apparatus, characterized in that provided in the central portion of each corner of the shaft coupling groove. The method of claim 1, Susceptor for atomic layer deposition apparatus characterized in that the end of the drive shaft has a shape corresponding to the shaft coupling groove and the coupling flange is inserted into the shaft coupling groove. The method of claim 7, wherein The shaft coupling groove is a susceptor for an atomic layer deposition apparatus, characterized in that it has an equilateral triangle shape in which the center and the center of gravity of the base plate coincides. A process chamber in which a plurality of wafers are accommodated and a deposition process is performed; A transfer chamber provided adjacent to the process chamber and allowing a wafer to enter and exit the process chamber; A susceptor provided in the process chamber to seat a plurality of wafers; A transfer unit provided in the transfer chamber to simultaneously load / unload two wafers into the susceptor; And An aligner provided below the susceptor and including a plurality of align pins for detecting whether the position of the susceptor is aligned with the loading / unloading position of the wafer; Including, The aligner includes a shaft coupling groove for coupling the susceptor and the drive shaft, the align pin is provided around the shaft coupling groove to detect whether the susceptor and the drive shaft is aligned. Vapor deposition apparatus. 10. The method of claim 9, The susceptor includes a base plate on which the plurality of wafers are seated, the shaft coupling groove is formed in the bottom surface of the base plate, and the alignment pin is formed on the outer peripheral portion of the shaft coupling groove in the shaft coupling groove. Atomic layer deposition apparatus characterized in that provided along. The method of claim 10, Wherein the susceptor is six wafers are seated, the alignment pin is arranged in three equilateral triangles so that the susceptor is aligned to the loading / unloading position of the wafer as the drive shaft rotates at intervals of 120 ° An atomic layer vapor deposition apparatus. The method of claim 11, The shaft coupling groove has a triangular shape, the alignment pin is an atomic layer deposition apparatus, characterized in that provided in the central portion of each corner of the shaft coupling groove. The method of claim 12, The transfer part comprises two handling arms to hold and transfer two wafers at the same time, And the shaft coupling groove is formed such that an edge of the shaft coupling groove is perpendicular to a moving direction of the handling arm when the shaft coupling groove is aligned at the loading / unloading position of the wafer. The method of claim 10, An end portion of the driving shaft has a shape corresponding to the shaft coupling groove, the atomic layer deposition apparatus characterized in that the coupling flange is inserted into the shaft coupling groove.

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