KR100992308B1 - Multi-layer Circuit Substrate - Google Patents

Abstract

The present invention is to provide a multilayer circuit board which minimizes the generation of tilt of the image sensor mounted by maintaining the flatness of the multilayer circuit board by preventing the photo solder resist (PSR) formed on the mounting surface of the multilayer circuit board to partially aggregate. It is about.

A multilayer circuit board according to the present invention includes a substrate main body part having a laminated structure of a plurality of internal substrate layers and an upper substrate layer on which an image sensor is mounted and electrically connected to the substrate terminals; And a plurality of accommodating parts formed in a circuit pattern printed on the upper substrate layer so as to accommodate a part of a photo solder resist (PSR) applied to the upper substrate layer to maintain uniform flatness. It includes.

Printed circuit board, photo solder resist, circuit pattern, image sensor

Description

Multi-layer Circuit Substrate}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer circuit board, and more particularly, to a multilayer circuit board that maintains flatness to minimize tilt of mounting components used for mounting in electronic devices, electrical devices, and communication devices.

In general, a multilayer circuit board has a multilayer structure in which a plurality of circuit stacks are stacked and interconnected with each other. The multilayer circuit board has a merit that the circuit can be highly integrated and the circuit board can be miniaturized. It is widely used in the field, electric-electronic device and the like.

Recently, with the development of the portable terminal, various products equipped with a camera module have been released. In the case of a multilayer circuit board applied to the camera module, an image sensor is mounted so that an image captured by the lens is collected and converted into an electrical signal. It is then sent to an external display.

As the camera module develops the technology from the conventional 300,000 pixel class to the high pixel of 8 million pixels or more, as the pixel size of the image sensor becomes smaller, the tilt between the lens and the image sensor surface varies. It acts as a factor affecting sensitively.

In fact, the tilt between the lens and the image sensor, which was not considered at the pixel size of 3.2 μm, is subdivided and managed in units of minutes, 1 degree = 60 minutes, rather than degrees in the 1.4 μm pixel size product. have.

Therefore, there is a demand for technology development that can minimize the occurrence of tilt in mounting the image sensor on a circuit board.

The present invention is to solve the above problems of the prior art, the purpose is to prevent the photo solder resist (PSR) formed on the mounting surface of the multi-layer circuit board partially agglomerated to maintain the flatness of the multi-layer circuit board The present invention provides a multilayer circuit board which minimizes the generation of tilt of the mounted image sensor.

Multi-layered circuit board according to an embodiment of the present invention is a substrate body portion consisting of a laminated structure of a plurality of internal substrate layers, and an upper substrate layer mounted on the image sensor and electrically connected to the substrate terminal; And a plurality of accommodating parts formed in a circuit pattern printed on the upper substrate layer so as to accommodate a part of a photo solder resist (PSR) applied to the upper substrate layer to maintain uniform flatness. It may include.

In addition, the accommodating portion may be formed only in the inner pattern extending along the wiring of the circuit pattern connected to the substrate terminal toward the center of the upper substrate layer and having a size larger than that of the substrate terminal.

In addition, the accommodating portion may be recessed to a depth smaller than the thickness of the circuit pattern or may be formed through the circuit pattern.

In addition, the accommodation portion may be arranged in succession spaced at regular intervals.

In addition, the photo solder resist may be applied except for the substrate terminal such that the substrate terminal is exposed to the outside and electrically connected to the image sensor.

The multilayer circuit board according to the present invention prevents the photo solder resist (PSR) formed on the mounting surface of the multilayer circuit board from being uniformly distributed along the mounting surface and partially agglomeration so that the flatness of the multilayer circuit board is uniform. It is possible to keep it.

In addition, by keeping the flatness of the mounting surface of the multilayer circuit board uniformly, it is possible to prevent the generation of tilt of the mounted image sensor, thereby improving the resolution of the product and improving the reliability of the operation.

DETAILED DESCRIPTION OF EMBODIMENTS Specific details regarding embodiments of a multilayer circuit board according to the present invention will be described with reference to the drawings.

1 is a perspective view schematically illustrating a multilayer circuit board according to an exemplary embodiment of the present invention, FIG. 2 is a perspective view illustrating a substrate main body in the multilayer circuit board illustrated in FIG. 1, and FIG. 3 is a multilayer circuit diagram illustrated in FIG. 1. It is a top view which shows the board | substrate main body part from a board | substrate.

As illustrated in FIGS. 1 to 3, the multilayer circuit board according to the exemplary embodiment of the present invention includes a substrate main body 100 and a receiving unit 130.

The substrate main body 100 has a general rectangular plate shape, and has a laminated structure in which a plurality of internal substrate layers 112, 113, and 114 and the upper substrate layer 111 are stacked in a predetermined order.

The inner substrate layers 112, 113, and 114 are printed with an internal circuit 121 on one side thereof, and a via hole 104 for electrical connection between the layers is formed therethrough, and a plurality of layers are sequentially stacked to form a stack.

The upper substrate layer 111 is stacked on the uppermost layer of the stack of the inner substrate layers 112, 113, and 114, and the circuit pattern 120 and the image sensor 10 are mounted on the mounting surface A on which the image sensor 10 is mounted. Substrate terminals 10 are formed to be electrically connected to each other.

The inner substrate layers 112, 113, 114 and the upper substrate layer 111 are all formed of a resin substrate of the same material, and have substantially the same size and shape. That is, only the arrangement position and the structure of the formed circuit pattern are different but are formed of the same resin substrate.

In the preferred embodiment of the present invention, the inner substrate layers 112, 113, and 114 and the upper substrate layer 111 are described as being made of a resin substrate, but are not limited thereto, and may be made of ceramic green sheets.

Guide holes 106 are formed in the same position near the edges of the internal substrate layers 112, 113, 114 and the upper substrate layer 111 so that the housing (not shown) of the camera module is easily coupled at the correct position on the multilayer circuit board. Guide them to do so.

In this case, it is preferable that the guide holes 106 are formed through the same size and shape, and the guide holes 106 are formed separately in each layer and laminated, as well as the guide holes 106 in the stacked layers. ) May be provided by passing through at a time.

On the other hand, the lower surface of the image sensor 10 is applied by applying a photo solder resist (PSR) 140 which is a non-conductive insulating material on the circuit board on which the circuit pattern 120 and the substrate terminal 102 are formed. To isolate the electrical connection to the

Therefore, in order to prevent tilt in the image sensor 10 mounted on the multilayer circuit board, it is very important that the PSR 140 is uniformly applied to maintain uniform flatness. Forming the receiving portion 130 to solve this.

As shown in the drawing, the accommodating part 130 accommodates a portion of the PSR 140 applied to the upper substrate layer 111 to maintain the uniform flatness. 120 is formed in a plurality of intaglio.

The accommodating part 130 extends toward the center of the upper substrate layer 111 along the wiring 122 of the circuit pattern connected to the substrate terminal 102 and is wider than the size of the substrate terminal 102. It is formed only in the inner pattern 124 formed in the size of the size.

That is, unlike the wiring 122 having a narrow fine line shape among the circuit patterns 120, the inner pattern 124 is formed to occupy a relatively large area at the center of the upper substrate layer 111, and includes a receiving portion. The 130 is formed in the inner pattern 124 to accommodate a part of the applied PSR 140 so that the PSR 140 can be uniformly distributed without being agglomerated.

Therefore, when the conventional PSR is applied onto the substrate, the portion where the circuit pattern 120 is formed is relatively thicker than the portion where the PSR 140 is not formed, so that the PSR 140 may not be uniformly applied, particularly in the center of the substrate. In the internal pattern 124, the PSR partially aggregates, and thus the flatness of the substrate may not be uniform.

As a result, by maintaining the flatness of the mounting surface of the multilayer circuit board uniformly, it is possible to prevent the generation of the tilt of the mounted image sensor 10, thereby improving the resolution of the product and improving the reliability of the operation.

On the other hand, the accommodating part 130 may be spaced apart at regular intervals and continuously arranged, and may be recessed to a depth smaller than the thickness of the circuit pattern 120 or may be formed through the circuit pattern 120.

In addition, the number of the accommodating parts 130 is adjusted according to the amount and flatness of the PSR 140 applied to the surface of the circuit pattern 120 by filling or blocking the accommodating part 130 with a non-conductive material. Can be adjusted to maintain uniform flatness.

As shown in FIG. 4, the PSR 140 coated on the mounting surface A of the circuit pattern 120 and the upper substrate layer 111 including the accommodating part 130 has the substrate terminal 102 facing outward. Except for the substrate terminal 102 to be exposed and electrically connected to the sensor terminal 12 of the image sensor 10 through wire bonding.

Therefore, the PSR 140 applied on the multilayer circuit board is applied to the entire surface of the substrate except for the substrate terminal 102, but the PSR 140 is uniformly applied through the receiving portion 130, thereby providing a uniform flatness of the substrate. Is maintained.

In addition, when the image sensor 10 is mounted on the substrate coated with the PSR 140, no tilt occurs, so that an image incident on the window 11 of the image sensor 10 has excellent resolution.

1 is a perspective view schematically illustrating a multilayer circuit board according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view illustrating a substrate body in the multilayer circuit board of FIG. 1.

3 is a plan view illustrating a substrate main body in the multilayer circuit board illustrated in FIG. 1.

4A and 4B are a plan view and a sectional view schematically showing a state in which PSR is applied on the multilayer circuit board shown in FIG.

Claims (5)

A substrate main body having a plurality of internal substrate layers and a stacked structure of an upper substrate layer on which an image sensor is mounted and electrically connected to the substrate terminals; And A plurality of accommodating parts formed in a circuit pattern printed on the upper substrate layer so as to receive a part of photo solder resist (PSR) applied to the upper substrate layer to maintain uniform flatness; Multilayer circuit board comprising a. The method of claim 1, The accommodating part may be formed only on an inner pattern extending toward the center of the upper substrate layer along the wiring of the circuit pattern connected to the substrate terminal and formed to have a size larger than that of the substrate terminal. . The method of claim 1, And the receiving portion is recessed to a depth smaller than the thickness of the circuit pattern, or is formed through the circuit pattern. The method of claim 1, The receiving part is a multilayer circuit board, characterized in that arranged in succession spaced at regular intervals. The method of claim 1, And the photo solder resist is applied except for the substrate terminal so that the substrate terminal is exposed to the outside and electrically connected to the image sensor.

Images