KR100988798B1 - Upper frame transfer and rotation equipment of semiconductor equipment - Google Patents

Abstract

The present invention relates to a top plate conveying and turning apparatus of a semiconductor device, the girder frame driving unit is mounted on the upper rail and the auxiliary rail of the upper frame and transported along; An upper plate elevating unit installed on the girder frame and elevating the upper plate; The lower connector is installed at the upper part of the supporting part of the lower part of the lower frame and is transported in the horizontal direction by the girder frame driving part, and the lower connector is coupled to both sides of the upper part which is lowered by the upper part lifting part. It is connected to the lower connector is made of a turning unit consisting of a drive unit for rotating the lower connector.

Therefore, the operation of transporting and turning the upper plate of the semiconductor equipment can be easily and automatically performed, and the turned upper plate is stably supported by the upper plate fixing cylinder, and the upper supporter is folded into the folding cylinder before the operator climbs to the upper part of the main body. Can be folded easily.

Lower frame, upper frame, folding cylinder, upper plate lifting part, turning part, upper plate

Description

Upper frame transfer and rotation equipment of semiconductor equipment

The present invention relates to a top plate transfer and turning device of a semiconductor device, and more particularly, it is possible to simplify the operation of transporting and turning the top plate of the semiconductor device, the turned top plate is stably supported, the operator to the top of the body The present invention relates to a top plate conveying and turning device for semiconductor equipment that can easily fold up the upper support before working.

In an assembly line of a liquid crystal display (LCD), semiconductor equipment for baking a liquid crystal display is installed. The semiconductor device includes a main body in which a plurality of liquid crystal display devices are built, and a top plate which is opened and closed at an upper part of the main body and on which a plurality of parts are installed. Such a semiconductor device may open up the inside of a main body after lifting a weighted upper plate to embed a liquid crystal display device therein or to install a plurality of components therein. The raised top plate is turned upside down so that its bottom faces upward, and then a plurality of parts are installed on the bottom of the top plate.

However, the top plate of the conventional semiconductor equipment, because of its large size and very heavy, it was very difficult to lift it upside down and to turn it on the top of the main body after flipping again after the assembly work of parts, and this series of operations are efficiently performed. It didn't work.

An object of the present invention for solving the above problems is to provide a top plate transfer and turning device of a semiconductor device to facilitate the operation of transporting and turning the top plate of the semiconductor equipment.

Another object of the present invention is to provide a top plate transporting and turning device for semiconductor equipment that allows the turned top plate to be stably supported.

Still another object of the present invention is to provide an upper plate transfer and turning device for semiconductor equipment, which allows the operator to easily fold the upper supporter before working on the upper part of the main body.

In order to achieve the above object, the upper plate conveying and turning device of the present invention is installed on one side of a semiconductor device formed of a main plate and an upper plate having intermediate connectors formed on both sides thereof, and lower horizontal bands and lower supporting legs supporting them. A lower frame provided with turning part supporting legs between the lower supporting legs; An upper frame installed on an upper portion of the lower frame and provided with upper horizontal stages having upper rails installed thereon, and upper support legs for supporting them, and an upper frame installed with a hinge shaft to fold the upper auxiliary stages provided with the auxiliary rails on the upper horizontal stages; Traverse wheels are mounted on the upper rail and the upper rail of the upper frame and transported along the transverse wheels, transverse motors connected to the transverse wheels to drive them, and connected to saddle frames supporting the transverse wheels. Girder frame driving unit consisting of a girder frame; A winding drum installed in the girder frame, a winding motor which is connected to the winding drum to rotate these, a speed reducer which is installed between the winding drum and the winding motor to decelerate and transmit the rotational force of the winding motor, to the winding drum. A wire wound and wound or unwound during rotation of the winding drum, an upper connector connected to the lower end of the wire and being elevated together with the wire when being lifted, connected to the upper plate, and connected to the girder frame and the upper connector and the wire It is installed around the upper plate lifting portion made of a wire guide cylinder to protect the wire; A lower connector which is installed on an upper part of the turning part supporting leg of the lower frame and is transported in the horizontal direction by the girder frame driving part, and which both sides of the upper plate lowered by the upper plate lifting part are coupled to, and an upper part of the turning part supporting leg. A turning part comprising a driving part installed and connected to the lower connector to rotate the lower connector; And a controller connected to the frame driving unit, the upper plate lifting unit, and the turning unit to control their driving.

Another feature of the top plate conveying and turning device of the semiconductor device of the present invention, the upper horizontal stages and the upper guides, the folding cylinder is installed so that the upper guides are automatically folded around the hinge axis.

Another feature of the top plate transfer and turning device of the semiconductor device of the present invention, the upper connector, the upper fixing portion fixed to the lower end of the wire guide cylinder, the first coupling portion connected to the upper fixing portion and the middle connector is seated The upper coupling groove is formed to be concave inwardly so that the upper coupling portion is formed to penetrate the upper coupling groove, and is provided on one side of the upper coupling portion and detached from the first coupling hole of the upper coupling hole and the first coupling portion. It consists of an upper cylinder with an upper cylinder rod.

Another feature of the upper plate transfer and turning device of the semiconductor device of the present invention, the wire guide cylinder is coupled to the lower portion of the girder frame and is installed around the wire to protect the hollow first pipe, the first A hollow second tube installed to slide on the inner circumferential surface of one tube and protecting the circumference of the wire, and a third hollow tube installed to slide on the inner circumferential surface of the second tube and protecting the circumference of the wire. Each time the lower end of the wire is elevated, the first pipe, the second pipe, and the third pipe are provided to be folded or unfolded in the direction of the central axis thereof.

Another feature of the top plate conveying and turning device of the semiconductor device of the present invention, the lower connector, the lower fixing portion fixed to the drive portion, and the second fixing portion connected to the lower fixing portion and the inner connector is recessed inwardly to be seated. A lower coupling part having a lower coupling groove and having a lower coupling hole formed therethrough so as to penetrate the lower coupling groove, and a lower cylinder rod provided at one side of the lower coupling part and detachable to the second coupling hole of the lower coupling hole and the second coupling part; The branch consists of a lower cylinder.

Another feature of the top plate conveying and turning device of the semiconductor device of the present invention, the drive unit, the drive motor is installed on the upper portion of the turning support, the reducer connected to the drive motor and the rotational power is transmitted, An electric gear connected to the reduction gear shaft to which the reduced power is transmitted, a worm shaft coupled to the center of the electric gear and rotated together; a worm coupled to the worm shaft and rotated together; The worm wheel is rotated by receiving the worm wheel, coupled to the center of the worm wheel is rotated together with the worm wheel shaft is connected to the lower fixing portion of the lower connector to rotate the lower connector.

In the present invention as described above, the lifting, conveying, and turning of the top plate is automatically performed by continuous operation. That is, when the upper connector is seated on the intermediate connector by the girder frame driver and the upper plate lifter, the upper cylinder is operated and fastened to each other. When the upper connector and the middle connector are fastened, the upper plate is lifted by the upper plate lifter, and the girder frame driver It is horizontally transferred to the turning part side by the. When the upper plate is horizontally transferred, the upper plate is lowered by the elevating unit so that the middle connector of the upper plate is seated on the lower connector, and when they are seated with each other, the lower cylinders are operated to be fastened to each other, and the turning unit is driven to rotate the upper plate. Therefore, the girder frame driving part, the upper plate lifting part, and the turning part can be automatically lifted, transferred, and turned by the controller while being controlled by the controller.

In addition, in the present invention, the turned top plate is stably supported. When the upper plate is turned by the turning part, the rod of the upper plate fixing cylinder is advanced and inserted into the upper plate fixing groove of the upper plate. Therefore, the four parts of the top plate are supported by the rod, thereby preventing the turned top plate from flowing. Therefore, since the turned top plate is stably supported by the top plate fixing cylinder, it is possible to accurately perform parts installation work on the bottom of the top plate.

And the upper support of the present invention can be folded. When the girder frame driving part and the upper plate lifting part are moved to the upper side of the semiconductor equipment to transfer the upper plate, the cylinder rod of the folding cylinder moves forward to unfold the upper guide about the hinge axis, and after the upper plate is transferred to the turning part side, the folding Fold the upper guide by retracting the cylinder rod of the cylinder. Therefore, after the upper plate is transferred to the turning part, the operator can easily fold the upper supporter before working on the upper part of the main body, so that the work of the upper part of the main body is not disturbed by the upper supporter.

Specific features and advantages of the present invention will become more apparent from the following description with reference to the accompanying drawings.

1 is a schematic front view showing a state in which the upper plate is lifted to the upper side after the middle connector of the upper plate is coupled to the upper connector of the upper plate lifting portion, Figure 2 is a schematic side view showing a state in which the upper plate is installed in the turning device, Figure 3 As a schematic plan view of the upper plate transport and turning device of the semiconductor device of the present invention, the semiconductor device 120, the lower frame 10, the upper frame 20, the girder frame consisting of the body 121 and the upper plate 122 The driving unit 40, the upper plate lifting unit 50, the turning unit 80, the controller 110.

As shown in FIG. 3, a rod 137 of the top plate fixing cylinder 136 is inserted into the top plate 122 of the semiconductor device 120 to support the four corner portions of the top plate 122. Formed. Intermediate connectors 130 are coupled to front and rear middle portions of the upper plate 122 as shown in FIGS. 9 and 11A to 11C. The intermediate connector 130 is formed in the upper part of the middle fixing part 131 is fixed to the corresponding portion of the upper plate 122, the upper part of the middle fixing part 131 is formed integrally therewith and the first fastening hole 133 is formed The first coupling part 132 and the second coupling part 134 is formed integrally with the lower side of the middle fixing part 131 and the second coupling hole 135 is formed.

As shown in FIGS. 4A to 4C, the lower frame 10 is installed at one side of the semiconductor device 120 including the main body 121 and the upper plate 122, and supports the lower horizontal stages 12 and these. Lower support legs 11 are provided, and turning part support legs 13 are provided between the lower support legs 11.

The upper frame 20 is installed on the upper portion of the lower frame 10, as shown in Figures 4a to 4c. The upper frame 20 is provided with the upper horizontal feet 22 and the upper support legs 21 supporting them, the upper rail 23 is installed, the upper rail 22 is provided with an auxiliary rail 25 The upper supporters 24 installed are connected to the hinge shaft 26. Thus, the upper supporters 24 are folded about the hinge axis 26.

In the upper horizontal stages 22 and the upper guide 24, the folding cylinder 30 is installed so that the upper guide 24 is automatically folded about the hinge shafts 26, as shown in FIG. . This folding cylinder 30 is provided on one side of the upper horizontal stage 22, the end of the cylinder rod 31 is coupled to the coupling rib 32 fixed to one side of the upper support 24. Therefore, when the cylinder rod 31 is advanced back and forth, the upper sub-base 24 is folded to the upper horizontal stage 22 side.

6A through 6C, the girder frame driver 40 is mounted on the upper rail 23 and the auxiliary rail 25 of the upper frame 20 and traversed along them. And, the row motors 44 are connected to the row wheels 43 to drive them, the saddle frame 42 coupled to the row wheels 43 to support them, and the saddle frame supporting the row wheels 43. It consists of a girder frame 41 connected to the (42).

The upper plate lifting unit 50 is a winding drum 51 installed in the girder frame 41 and a winding motor connected to the winding drum 51 to rotate it, as shown in FIGS. 1, 2, and 7. 54, a reduction gear 53 which is installed between the winding drum 51 and the winding motor 54 to reduce and transmit the rotational force of the winding motor 54, and is wound around the winding drum 51 and wound up the winding drum 51. The wire 52 wound or unwound during rotation of the wire 52 is connected to the lower end of the wire 52, and the upper connector 70 connected to the upper plate 122 when the wire 52 is lifted up and down and connected to the upper plate 122, and the girder frame The wire guide cylinder 60 is connected to the 41 and the upper connector 70 and installed around the wire 52 to protect the wire 52.

The upper connector 70 of the upper plate lifting part 50 is fixed to the lower end of the wire guide cylinder 60, as shown in Figs. 7, 9, 10, 12a to 12c. And an upper coupling groove 73 connected to the upper fixing part 71 and recessed inwardly so that the first coupling portion 132 of the intermediate connector 130 is seated, and through the upper coupling groove 73. The upper coupling portion 72 is formed with a hole 74, and is provided on one side of the upper coupling portion 72 is detached to the first fastening hole 133 of the upper fastening hole 74 and the first coupling portion 132. It consists of an upper cylinder 75 having an upper cylinder rod 76.

The wire guide cylinder 60 of the upper plate lifting portion 50 is coupled to the lower portion of the girder frame 41 and installed around the wire 52 to protect the first pipe as shown in FIG. 7. 61, a hollow second tube 62 which is installed to slide on the inner circumferential surface of the first tube 61, and protects the periphery of the wire 52, and is installed so as to slide on the inner circumferential surface of the second tube 62; And a third pipe 64 having a hollow shape to protect the circumference of the wire 52, and the first pipe 61, the second pipe 62, and the third pipe whenever the lower end of the wire 52 is elevated. The tube 64 is adapted to fold or unfold in the direction of its central axis.

Here, a second bush (63) is provided around the upper end of the second tube (62) so as to be in contact with the inner circumferential surface of the first tube (61), and the second tube (62) around the upper end of the third tube (64). The third bush 65 is provided to be in contact with the inner circumference of the inner circumferential surface.

Turning unit 80, as shown in Figure 1, 2, 7, 7, 8a, 8b, 9 is installed on the upper part of the turning part supporting leg 13 of the lower frame 10 and the girder frame driving unit The lower connector 100 coupled to both sides of the upper plate 122 lowered by the upper plate elevating unit 50 after being transported in the horizontal direction by the upper portion 40, and installed on the upper portion of the turning support leg 13 and the lower portion Is connected to the connector 100 consists of a drive unit 81 for rotating the lower connector (100).

The lower connector 100 of the turning part 80 includes a lower fixing part 101 fixed to the driving part 81 to be described later, as shown in FIGS. 9, 10A, 10B, and 13A to 13C, and a lower part. The lower coupling groove 103 is formed to be connected to the fixing portion 101 and recessed inwardly so that the second coupling portion 134 of the intermediate connector 130 is seated, and penetrates the lower coupling groove 103. Lower coupling part 102 and a lower cylinder rod provided at one side of the lower coupling part 102 and attached to and detached from the lower fastening hole 104 and the second fastening hole 135 of the second coupling part 134. And a lower cylinder 105 having 106.

The drive part 81 of the turning part 80 is a casing 82 provided in the upper part of the turning part support leg 13, and the drive provided in the outer peripheral surface of this casing 82 as shown to FIG. 8A and 8B. The reduction gear 84 which is connected to the motor 83, the drive motor 83 and the rotational power is transmitted, and the electric gear 86 which is connected to the reduction gear shaft 85 of the reduction gear 84 and the reduced speed is transmitted. And a worm shaft 89 coupled to the center of the electric gear 86 and rotated therewith, the worm 90 coupled to the worm shaft 89 and rotated together with the worm shaft 90, and engaged with the worm 90 to apply the power thereof. The worm wheel 91 is coupled to the center of the worm wheel 91 and rotated by being received and rotated together and connected to the lower fixing part 101 of the lower connector 100 to rotate the lower connector 100. )

Here, the worm shaft 89 is installed at both ends of the first lower cover 87 and the second lower cover 88 provided on both lower sides of the casing 82, and the worm wheel shaft 92 is provided with a casing 82. Both ends of the first upper cover 93 and the second upper cover 94 installed at both sides of the upper side thereof are installed to rotate.

The controller 110 is connected to the folding cylinder 30, the transverse motor 44, the winding motor 54, the upper cylinder 75, the drive motor 83, the lower cylinder 105, the upper plate fixed cylinder 136 To control them.

The top plate transfer and turning device of the semiconductor device of the present invention having such a configuration is operated as follows.

First, when the winding motor 54 of the upper plate lifting unit 50 is driven to rotate the reducer 53 and the winding drum 51, the wire 52 is released from the winding drum 51 and is connected to the end of the wire 52. The connected upper connector 70 is lowered. As the upper connector 70 descends, the first pipe 61, the second pipe 62, and the third pipe 64 of the wire guide cylinder 60 are expanded to protect the wire 52.

When the upper connector 70 is lowered and the upper coupling groove 73 is seated on the first coupling part 132 of the intermediate connector 130, the upper coupling hole 74 of the upper connector 70 and the intermediate connector 130 are disposed. The first fastening holes 133 coincide with each other. In this state, the upper cylinder 75 of the upper connector 70 is operated so that the upper cylinder rod 76 is advanced and inserted into the upper fastening hole 74 and the first fastening hole 133. Therefore, the upper connector 70 and the intermediate connector 130 is fastened to each other.

When the upper connector 70 and the intermediate connector 130 are fastened to each other, the winding motor 54 is reversely rotated to wind the wire 52 on the winding drum 51, thereby as shown in FIG. 1. 122 is lifted to the upper side of the main body 121.

When the upper plate 122 of the semiconductor device 120 is lifted upward, the transverse motor 44 of the girder frame driving unit 40 is driven to rotate the transverse wheel 43. As the transverse wheel 43 is rotated, the girder frame driving part 40 is transported along the auxiliary rail 25 of the upper support 24 and the upper rail 23 of the upper horizontal support 22.

When the girder frame driving part 40 is transferred and the upper connector 70 is positioned above the turning part 80 as shown in FIG. 14, the driving of the transverse motor 44 is stopped, and the winding motor of the upper plate lifting part 50 54 is driven. When the winding motor 54 is driven to rotate the reducer 53 and the winding drum 51, the wire 52 is released from the winding drum 51 and the upper connector 70 connected to the end of the wire 52 is lowered. ,

As shown in FIGS. 7 and 15, the second coupling part 134 of the intermediate connector 130 is seated in the lower coupling groove 103 of the lower connector 100. When the intermediate connector 130 is seated on the lower connector 100, the upper connector 70 is separated from the intermediate connector 130, and the lower connector 100 is fastened to the intermediate connector 130.

That is, the upper cylinder 75 of the upper connector 70 is operated so that the upper cylinder rod 76 is formed from the first fastening hole 133 of the intermediate connector 130 and the upper fastening hole 74 of the upper connector 70. The lower cylinder 105 of the lower connector 100 is operated so that the lower cylinder rod 106 is connected to the second fastening hole 135 of the intermediate connector 130 and the lower fastening hole 104 of the lower connector 100. To be inserted). In this way, the upper connector 70 is separated from the intermediate connector 130 of the upper plate 122, and the lower connector 100 of the turning portion 80 is fastened to the intermediate connector 130 of the upper plate 122.

 When the upper plate 122 is mounted to the turning unit 80, the girder frame driving unit 40 and the upper plate lifting unit 50 are transferred to an initial position as shown in FIG. 16, and the upper plate 122 is turned, The turning process is as follows.

When the driving motor 83 of the turning unit 80 is driven, the reduction gear 84 and the reduction shaft 85 rotate, and the electric gear 86 rotates. When the electric gear 86 is rotated, the worm shaft 89 is rotated and the worm 90 installed on the worm shaft 89 is rotated. When the worm 90 rotates, the worm wheel 91 engaged with the worm 90 rotates and the worm wheel shaft 92 rotates. When the worm wheel shaft 92 is rotated, the lower connector 100 fixed thereto is rotated, and the upper plate 122 fixed to the lower connector 100 rotates as shown in FIG. 16.

The top plate transfer and turning device of the semiconductor device of the present invention has the following advantages.

First, in the present invention, the lifting, conveying, and turning operations of the upper plate 122 are automatically performed by continuous operation. That is, when the upper connector 70 is seated on the intermediate connector 130 by the girder frame driving part 40 and the upper plate lifting part 50, the upper cylinder 75 is operated to be fastened to each other, the upper connector 70 and the middle part. When the connector 130 is fastened, the upper plate 122 is raised by the upper plate elevating unit 50, and is horizontally moved toward the turning unit 80 by the girder frame driving unit 40. When the upper plate 122 is horizontally transferred, the upper plate is lowered by the elevating unit 50 so that the middle connector 130 of the upper plate 122 is seated on the lower connector 100, and when they are seated with each other, the lower cylinder 105 is operated. They are fastened to each other, the turning unit 80 is driven to rotate the top plate 122. Therefore, the girder frame driving unit 40, the upper plate lifting unit 50, and the turning unit 80 may be automatically lifted, transferred, and turned by the upper plate 122 of the weight while being controlled by the controller 110.

In addition, the turned top plate 122 is stably supported in the present invention. When the upper plate 122 is turned by the turning unit 80, the rod 137 of the upper plate fixing cylinder 136 is advanced to be inserted into the upper plate fixing groove 123 of the upper plate 122. Therefore, the four parts of the top plate 122 is supported by the rod 137 to prevent the turned top plate 122 from flowing. Therefore, since the turned top plate 122 is stably supported by the top plate fixing cylinder 136, it is possible to accurately perform parts installation work and the like on the bottom of the top plate 122.

And the upper guide 24 of the present invention can be folded. When the girder frame driving unit 40 and the upper plate lifting unit 50 are moved to the upper side of the semiconductor device 120 to transfer the upper plate 122, the cylinder rod 31 of the folding cylinder 30 is advanced to the upper supporter ( 24 to spread out about the hinge shaft 26, and after the upper plate 122 is transferred to the turning part 80 side, the cylinder rod 31 of the folding cylinder 30 is reversed so that the upper supporter 24 is opened. Fold. Accordingly, after the upper plate 122 is transferred to the turning part 80, the operator can easily fold the upper supporter 24 before working on the upper part of the main body 121 so that the main body 121 is moved by the upper supporter 24. The work on the top is not disturbed.

1 is a schematic front view showing a state in which the upper plate is lifted up after the middle connector of the upper plate is coupled to the upper connector of the upper plate lifting unit;

Figure 2 is a schematic side view showing a state where the top plate is installed in the turning device

3 is a schematic plan view of FIG.

Figures 4a to 4c is a schematic front view, side view, top view showing the lower frame and the upper frame

FIG. 5 is a partially enlarged plan view illustrating the folding cylinder of FIG. 4C; FIG.

6a to 6c is a front view, a side view, a plan view showing a girder frame drive unit

Figure 7 is a partially enlarged side view showing the upper plate lifting portion

8A and 8B are a schematic partial enlarged front sectional view and a partially enlarged side sectional view showing a turning part;

Figure 9 is an exploded side view showing the upper connector, lower connector, the middle connector

10A and 10B are schematic front and side views showing a state in which an upper connector, a lower connector, and an intermediate connector are coupled to each other;

11A to 11C are front views, side views, and plan views showing intermediate connectors;

12a to 12c is a front view, a side view, a bottom view showing the upper connector

13A-13C are a front view, a side view, and a top view of a lower connector

FIG. 14 is a schematic front view of the girder frame driving unit driven in the same state as shown in FIG. 1 to move the upper plate to the upper side of the turning unit.

15 is a schematic front view showing a state where the upper elevating portion is lowered and the middle connector of the upper plate is coupled to the lower connector of the turning portion;

Figure 16 is a schematic front view showing a state in which the upper plate is rotated by the turning part is operated

* Description of the symbols for the main parts of the drawings *

10: lower frame 11: lower support leg

12: lower horizontal band 13: turning support leg

20: upper frame 21: upper support leg

22: upper horizontal band 23: upper rail

24: upper support stand 25: auxiliary rail

26: hinge axis 30: folding cylinder

31: cylinder rod 32: coupling rib

40: girder frame drive unit 41: girder frame

42: saddle frame 43: transverse wheel

44: traverse motor 50: upper plate lifting part

51: winding drum 52: wire

53: reducer 54: winding motor

60: wire guide cylinder 61: the first tube

62: Hall 2 63: Bush 2

64: Hall 3 65: Bush 3

70: upper connector 71: upper fixing part

72: upper coupling portion 73: upper coupling groove

74: upper fastening hole 75: upper cylinder

76: upper cylinder rod 80: turning part

81: drive portion 82: casing

83: drive motor 84: reducer

85: reducer shaft 86: electric gear

87: first lower cover 88: second lower cover

89: worm shaft 90: worm

91: worm wheel 92: worm wheel shaft

93: first upper cylinder 94: second upper cylinder

100: lower connector 101: lower fixing part

102: lower coupling portion 103: lower coupling groove

104: lower fastening hole 105: lower cylinder

106: lower cylinder rod 110: controller

120: semiconductor equipment 121: main body

122: top panel 130: intermediate connector

131: middle fixing part 132: first coupling

133: first fastening hole 134: second coupling portion

135: second fastening hole 136: top plate fixing cylinder

137: load

Claims (6)

It is installed on one side of the semiconductor device 120 consisting of the body 121 and the upper plate 122 formed with the intermediate connector 130 on both sides, the lower horizontal stage 12 and the lower support legs 11 for supporting them A lower frame 10 having turning part supporting legs 13 between the lower supporting legs 11; It is provided on the upper portion of the lower frame 10, the upper horizontal feet 22, the upper rail 23 is provided and the upper support legs 21 for supporting them are provided, the upper horizontal feet 22 are supported An upper frame 20 installed as a hinge shaft 26 such that upper rails 24 provided with rails 25 are folded; Transverse wheels 43 mounted on the upper rail 23 and the auxiliary rails 25 of the upper frame 20 and transported along the transverse wheels, and a transverse motor connected to the transverse wheels 43 to drive them. A girder frame driver 40 formed of (44) and a girder frame 41 connected to the saddle frames 42 supporting the transverse wheels 43; Winding drum 51 installed on the girder frame 41, a winding motor 54 connected to the winding drum 51 to rotate it, and installed between the winding drum 51 and the winding motor 54 And a reducer 53 for reducing and transmitting the rotational force of the winding motor 54, a wire 52 wound around the winding drum 51 and wound or unwound during rotation of the winding drum 51, and the wire ( 52 is connected to the lower end of the upper 52 and the upper connector (70) connected to the upper plate 122 when the lifting and lifting of the wire 52, and connected to the girder frame (41) and the upper connector (70) An upper plate elevating unit 50 formed around the wire 52 and made of a wire guide cylinder 60 protecting the wire 52; Of the upper plate 122 which is installed at the upper part of the turning part supporting leg 13 of the lower frame 10 and is transported in the horizontal direction by the girder frame driving part 40 and then lowered by the upper plate lifting part 50. Turning part consisting of a lower connector 100 is coupled to both sides, the driving unit 81 is installed on the upper portion of the turning support leg 13 and connected to the lower connector 100 to rotate the lower connector 100 ( 80); And a controller 110 connected to the driving unit 81, the upper plate elevating unit 50, and the turning unit 80 to control the driving thereof. According to claim 1, wherein the upper horizontal stage 22 and the upper support 24, The top plate transport and turning device of the semiconductor device, characterized in that the folding cylinder (30) is installed so that the upper support (24) is automatically folded around the hinge axis (26). The method of claim 1, wherein the upper connector 70, An upper fixing part 71 fixed to the lower end of the wire guide cylinder 60; The upper coupling groove 73 is formed to be connected to the upper fixing portion 71 and recessed inwardly so that the first coupling portion 132 of the intermediate connector 130 is seated, and penetrates the upper coupling groove 73. An upper coupling portion 72 in which a fastening hole 74 is formed, An upper cylinder 75 provided on one side of the upper coupling portion 72 and having an upper cylinder rod 76 attached to and detached from the first coupling hole 133 of the upper coupling hole 74 and the first coupling portion 132. Top plate transport and turning device of a semiconductor device, characterized in that consisting of. The method of claim 1, wherein the wire guide cylinder 60, The first tube 61 of the hollow shape is coupled to the lower portion of the girder frame 41 and installed around the wire 52 to protect it, and installed to slide on the inner circumferential surface of the first tube 61. Hollow second pipe 62 to protect the circumference of the wire 52, and hollow third pipe installed to slide on the inner circumferential surface of the second pipe 62, and protects the circumference of the wire 52 (64), so that whenever the lower end of the wire 52 is elevated, the first tube 61, the second tube 62, the third tube 64 is folded or unfolded in the direction of the central axis thereof Top plate transfer and turning device of a semiconductor device, characterized in that. The method of claim 1, wherein the lower connector 100, A lower fixing part 101 fixed to the driving part 81; The lower coupling groove 103 is formed to be connected to the lower fixing part 101 and is recessed inwardly so that the second coupling part 134 of the intermediate connector 130 is seated, and the lower coupling groove penetrates the lower coupling groove 103. A lower coupling part 102 having a hole 104 formed therein; A lower cylinder 105 provided at one side of the lower coupling part 102 and having a lower cylinder rod 106 attached to and detached from the lower fastening hole 104 and the second fastening hole 135 of the second coupling part 134. Top plate transport and turning device of a semiconductor device, characterized in that consisting of. The method of claim 5, wherein the drive unit 81, Drive motor 83 installed on the upper portion of the turning part support 13, the reducer 84 is connected to the drive motor 83, the rotational power is transmitted, and the reducer shaft 85 of the reducer 84 The worm shaft 89 is coupled to the electric gear 86 and the decelerated power is transmitted, coupled to the center of the electric gear 86 and rotated together with the worm shaft 89 and rotated together with the worm shaft 89. Worm 90, the worm wheel 91 is engaged with the worm 90 is rotated by receiving its power, and coupled to the center of the worm wheel 91 is rotated together with the lower height of the lower connector 100 Upper plate transport and turning device of the semiconductor device, characterized in that consisting of a worm wheel shaft 92 is connected to the government 101 to rotate the lower connector (100).

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