KR100984279B1 - Flipper device of semicondutor manufacturing system - Google Patents

Flipper device of semicondutor manufacturing system Download PDF

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Publication number
KR100984279B1
KR100984279B1 KR1020080044890A KR20080044890A KR100984279B1 KR 100984279 B1 KR100984279 B1 KR 100984279B1 KR 1020080044890 A KR1020080044890 A KR 1020080044890A KR 20080044890 A KR20080044890 A KR 20080044890A KR 100984279 B1 KR100984279 B1 KR 100984279B1
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KR
South Korea
Prior art keywords
unit
boat
picker
turn jig
turn
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Application number
KR1020080044890A
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Korean (ko)
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KR20090119064A (en
Inventor
김대영
조성민
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(주)동양반도체
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Priority to KR1020080044890A priority Critical patent/KR100984279B1/en
Publication of KR20090119064A publication Critical patent/KR20090119064A/en
Application granted granted Critical
Publication of KR100984279B1 publication Critical patent/KR100984279B1/en

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Abstract

The flipper apparatus of the laser manufacturing system according to the present invention comprises: a turn jig unit unit which binds a boat on which a plurality of semiconductor units are seated and rotates the boat by 180 °; And a picker unit unit which engages the rear surface of the boat rotated by 180 ° by the turn jig unit unit and seats the boat at a predetermined position.

Flipper, marking, boat

Description

Flipper device for semiconductor manufacturing system {FLIPPER DEVICE OF SEMICONDUTOR MANUFACTURING SYSTEM}

The present invention relates to a semiconductor manufacturing system, and more particularly to a flipper device of a semiconductor manufacturing system.

In general, a semiconductor manufacturing process is mainly composed of a fabrication (FAB) process and an assembly process. In the FAB process, an integrated circuit is designed on a silicon wafer to form a semiconductor chip, and in the assembly process, a lead frame is attached to the semiconductor chip. The semiconductor strip is shielded by a soldering process for forming a wire bonding or solder ball for conducting electricity between the semiconductor chip and the lead frame, and a molding process using a resin such as epoxy. (Strip) is formed. In general, semiconductor packages are manufactured in strip form through various processes such as molding, trimming, forming and singulation. Such a semiconductor package is subjected to the process by combining a plurality of packages in the form of a strip of strips for mass production.

Such strips often need to be flipped before and after the process, depending on their properties and manufacturing process. For example, in a BGA (Ball Grid Array) type package, the strip must be turned upside down to mark the lower surface of the loaded package after ball attaching to the upper surface in the previous process, or for linkage with the later process. And when the finished strip is to be turned upside down. In other words, when the strip is on-loaded and inverted and processed into a predetermined shape, and is offloaded in such a processed state, and the strip is on-loaded and processed into a predetermined shape and then reversed and offloaded. Can be.

Although some apparatuses for reversing strips have been disclosed so far in the semiconductor manufacturing process, such a conventional flipper device is separately installed between the onloading device and the processing device, or separately between the processing device and the offloading device. Such a semiconductor strip is inefficient because it is transported to a cutting device in a state of being seated on a chuck table by a predetermined picker means, and then cut into individual packages by rotating blades.

It is an object of the present invention to provide a flipper apparatus of an efficient semiconductor manufacturing system for flipping a plurality of units carried in a boat.

A flipper apparatus of a semiconductor manufacturing system according to the present invention includes: a turn jig unit unit which binds a boat on which a plurality of semiconductor units are mounted and rotates the boat by 180 °; And a picker unit unit which engages the rear surface of the boat rotated by 180 ° by the turn jig unit unit and seats the boat at a predetermined position.

It is preferable that the said turn jig unit part contains a vertical movement means and a front-back movement means, and the said picker unit part contains a vertical movement means.

The turn jig unit may control the rotation speed and the rotation angle by using a servo motor.

The turn jig unit may include: a turn jig for binding the boat and rotating the boat; A turn jig up and down moving unit which moves the turn jig up and down; A turn jig unit fixing part which fixes the turn jig vertically moving part; It is fixed to the base plate and the turn jig front and rear moving unit to move the turn jig unit fixing unit back and forth; made.

The picker unit may include: a picker for binding a rear surface of the boat fastened to the turn jig; Picker up and down moving unit for moving the picker up and down; And a picker unit fixing part fixed to a support shaft fixed to the base plate and fixing the picker up and down moving parts.

In addition, the plurality of semiconductor units may be cut into a plurality of semiconductor strips.

As described above, the flipper device of the semiconductor manufacturing system according to the present invention is used to absorb and process a boat in which a plurality of units are seated. As a result, the semiconductor manufacturing system including the flipper device of the present invention can perform a continuous post-semiconductor process in large quantities.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention.

A flipper apparatus of a semiconductor manufacturing system according to the present invention includes: a turn jig unit unit which binds a boat on which a plurality of semiconductor units are seated and rotates the boat by 180 °; And a pick-up unit unit which engages the rear surface of the boat rotated by 180 ° by the turn jig unit unit and seats the boat at a predetermined position. As a result, the flipper device of the present invention enables to perform continuous post-semiconductor fixing such as laser marking in large quantities at one time.

1 is a view showing an embodiment of a flipper device 100 of a semiconductor manufacturing system according to the present invention. Referring to FIG. 1, the flipper device 100 includes a base plate 101, a support shaft 102, a boat shelf part 103, a turn jig unit part, and a picker unit part. Here, the turn jig unit part is used to bind a boat equipped with a semiconductor and rotate the bound boat 180 °, and the picker unit part is rotated 180 ° by the turn jig unit part to process the back of the semiconductor. And a surface opposite to the binding direction of the turn jig unit portion). In the flipper apparatus of the present invention, a method of adsorbing with a vacuum in a manner of binding a boat may be mainly used.

In the present invention, the semiconductor seated on a boat is mounted by cutting a plurality of semiconductor strips into a plurality. That is, the semiconductor mounted on the boat of the present invention has a plurality of semiconductor units cut into pieces. Accordingly, the flipper device 100 of the present invention performs a function of flipping a boat including a plurality of semiconductor units.

The turn jig unit of the present invention includes a turn jig 120, a turn jig adsorption part 122, a turn jig up and down moving part 124, a turn jig unit fixing part 126, and turn jig front and rear moving parts 128. do. The turn jig 120 is controlled to vacuum-adsorb the boat loaded on the boat shelf 103 to rotate the adsorbed boat by 180 °. To this end, the turn jig 120 of the present invention is implemented to freely control the rotation speed and the rotation angle by using a servo motor (not shown). The turn jig suction unit 122 sucks the boat loaded on the boat shelf unit 102 using a vacuum. The turn jig up and down moving part 124 is fixed to the turn jig unit fixing part 126 and is implemented to perform a function of moving the turn jig unit up and down. The turn jig before and after the moving part 128 is fixed on the base plate 101 and is implemented to perform a function of moving the turn jig unit fixing part 126 back and forth.

The picker unit of the present invention includes a picker 140, a picker adsorption part 142, a picker up and down moving part 144, and a picker fixing part 146. The picker 140 is used to suck the rear surface of the boat rotated by 180 ° and sucked by the turn jig 120 and seated at a predetermined position. The picker adsorption unit 142 adsorbs the rear side of the boat rotated 180 ° by the turn jig 120 using a vacuum. The picker up and down moving part 144 is fixed to the picker unit fixing part 146 and is implemented to move the picker unit up and down. The picker unit fixing part 146 is fixed to the support shaft 102 so that the picker unit part moves only up and down. Here, the support shaft 102 is fixed to the base plate 101 as shown in FIG.

The flipper device 100 of the present invention efficiently flips a boat on which a plurality of semiconductor units are mounted to perform a continuous post-semiconductor process in large quantities.

2 is a view showing a driving sequence of the flipper device 100 of the semiconductor manufacturing system of the present invention. 1 and 2, the driving sequence of the flipper device of the present invention is as follows. The boat is input to the boat shelf 103 from the outside. Here, the boat is equipped with a plurality of semiconductor units. The turn jig 120 is lowered by the turn jig up and down moving part 126 to adsorb the boat input to the boat shelf 103. The turn jig suction part 122 of the turn jig 120 sucks the boat using a vacuum state. When the adsorption is completed, the turn jig 120 is raised by the turn jig up and down moving part 126. The boat sucked by the servo motor of the turn jig 120 rotates 180 °.

When the boat is rotated 180 ° by the turn jig 120, the picker 140 is lowered by the picker up and down moving part 144. At this time, the boat adsorbed by the turn jig 120 is rotated 180 ° so as to face upward as shown in FIG. 2. The picker adsorption unit 142 of the picker 140 adsorbs the rear surface of the boat adsorbed to the turn jig 120 by vacuum. When the adsorption of the picker 140 on the boat is completed, the turn jig 120 turns off the vacuum and is lowered by the turn jig lowering moving part 124. After falling, the turn jig 120 is retracted from the support shaft 102 by the turn jig before and after the moving part 128. Thereafter, the picker 140 is lowered by the picker up and down moving part 144 to deliver the adsorbed boat to the boat shelf 103. The picker adsorption unit 142 then turns off the vacuum to transfer the boat to the boat shelf 103. The picker 140 is then lifted by the picker up and down moving unit 144. This completes the driving of the flipper device of the present invention.

As described above, an optimal embodiment has been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a view showing an embodiment of a flipper device of a semiconductor manufacturing system according to the present invention.

FIG. 2 is a flowchart illustrating a driving sequence of the flipper device shown in FIG. 1.

* Description of the symbols for the main parts of the drawings *

100: flipper device 101: base plate

102: support shaft 103: boat shelf

120: turn jig 122: turn jig adsorption part

124: turn jig up and down moving part 126: turn jig unit fixed portion

128: moving unit before and after the turn jig 140: picker

142: picker adsorption part 144: picker up and down moving part

146: picker unit fixing part

Claims (7)

A turn jig unit unit which binds a boat on which a plurality of semiconductor units are mounted and rotates the boat by 180 °; And And a picker unit unit which engages the rear surface of the boat rotated by 180 ° by the turn jig unit unit and seats the boat at a predetermined position. The turn jig unit unit includes a vertical moving unit and a vertical moving unit. delete The method according to claim 1; The picker unit unit, Flipper apparatus of the semiconductor manufacturing system characterized by including a vertical movement means. The method according to claim 1, The turn jig unit unit, A flipper apparatus of a semiconductor manufacturing system, characterized in that the rotational speed and the rotation angle are controlled using a servo motor. The method according to claim 1, The turn jig unit unit, A turn jig for locking the boat and rotating the boat; A turn jig up and down moving unit which moves the turn jig up and down; A turn jig unit fixing part which fixes the turn jig vertically moving part; And A turn jig moving part fixed to a base plate and moving the turn jig unit fixing part back and forth; Flipper device of a semiconductor manufacturing system comprising a. The method according to claim 1, The picker unit unit, A picker for binding a rear surface of the boat bound to the turn jig; Picker up and down moving unit for moving the picker up and down; And A picker unit fixing part fixed to a support shaft fixed to a base plate and fixing the picker up and down moving parts; Flipper device of a semiconductor manufacturing system comprising a. The method according to claim 1, And the plurality of semiconductor units are cut into a plurality of semiconductor strips.
KR1020080044890A 2008-05-15 2008-05-15 Flipper device of semicondutor manufacturing system KR100984279B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080044890A KR100984279B1 (en) 2008-05-15 2008-05-15 Flipper device of semicondutor manufacturing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080044890A KR100984279B1 (en) 2008-05-15 2008-05-15 Flipper device of semicondutor manufacturing system

Publications (2)

Publication Number Publication Date
KR20090119064A KR20090119064A (en) 2009-11-19
KR100984279B1 true KR100984279B1 (en) 2010-09-30

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