KR100981648B1 - Testing apparatus of electron semiconductor by hand - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a passive semiconductor wafer inspection apparatus, and more particularly, a probe portion (9) of a probe (8) of a probe (8) on a wafer (5) can be used to adjust the mounting table (5) fixedly seating a semiconductor wafer. Each chip is inspected, and the upper and lower operating tables 10 on which the fixing table 5 is mounted are moved back and forth, left and right by pinions 11 and 21 that are pivotally adjusted with the rack gears 12 and 22. And a test bar 30 on which the probe 8 is installed above the fixing table 5 by means of a support bar 45 in which screw shafts 41 and 42 and screw shafts are screwed on both lower ends. At the same time it is configured to adjust the lifting movement by screwing rotation; It is characterized by inspecting by a probe while manually and precisely adjusting the semiconductor wafer position to provide excellent convenience and efficiency of operation.

Semiconductor, Wafer, Passive, Inspect, Probe, Electrical Properties, EDS

Description

Passive semiconductor wafer inspection apparatus {Testing apparatus of electron semiconductor by hand}

1 is a side view of the present invention.

2 is a plan view of the present invention.

3 is an enlarged cross-sectional view of the main portion of FIG.

4 is a conceptual diagram showing an operation relationship of the cam operating unit of the present invention.

** Description of the symbols for the main parts of the drawings **

5: holder 7: microscope

8: probe 10: upper platform

11,21: Pinion 12,22: Legge

15,25: rail 20: lower operating platform

30: inspection table 31: opening hole

41, 42: screw shaft 45: support bar

46: screw hole 47: stop pin

50: guide 51: guide

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor wafer inspection apparatus for determining good quality and defects by inspecting and analyzing electrical characteristics of each chip constituting a semiconductor wafer. In particular, the front and rear, left and right upper and upper probe inspection benches can be manually and conveniently It relates to a passive semiconductor wafer inspection apparatus for inspecting while moving up and down.

In general, a semiconductor is manufactured through a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into each chip.

In addition, between the fabrication process and the assembly process, an electronic die sorting process (hereinafter, referred to as 'EDS') is performed to inspect electrical characteristics of each chip constituting the wafer.

This EDS process is to check whether each chip constituting the wafer is defective, which is caused by a signal that is checked from the applied electrical signal by applying an electrical signal to the pattern (electrode pad) of each probe. Mainly use the inspection device to determine whether or not.

If the inspection result of each chip is judged as good in such an EDS process, the semiconductor wafer is manufactured as a finished product by a post process such as packaging.

On the other hand, the conventional inspection device before and after the fixed mounting of the fixed mounting semiconductor wafer, and the left and right to adjust the movement of the probe inspection table to move up and down, and the probe needle to examine the pattern of each chip. Since semiconductors tend to be highly integrated and miniaturized at the same time, the operation of moving and adjusting the needle of the probe to check the pattern of each chip as described above is very inconvenient, and there is a problem that the device is large and therefore difficult to use.

The present invention has been made to solve the problems of the prior art as described above, while fine-tuning the wafer is fixed to the fixed seat is observed through a microscope, the front and rear, left and right to adjust the wafer guide manually and the upper probe inspection table The purpose is to maximize the convenience and efficiency of work while moving up and down.

The object of the present invention described above,

In inspecting each chip on the wafer by the probe section of the probe while adjusting the fixing seat for fixing the semiconductor wafer back and forth, left and right, and up and down,

The upper operating base and the lower operating base, which is mounted on the center of the upper base of the base, are provided to be moved to move back and forth, left and right,

The upper and lower operating tables to adjust the upper and lower operating tables left and right, front and rear movement along the rail by installing a rake gear that is engaged with the pinion installed on one side, by rotating the pinion,

It is provided with a test stand to move the probe up and down to the upper portion of the fixing table, the screw shafts on both sides of the lower side of the test stand is arranged to rotate at the same time, the lower portion is screwed into the internal threaded hole of the support bar at the same time screw rotation By adjusting the lifting and lowering movement of the inspection table.

Hereinafter, a preferred embodiment for achieving the above object of the present invention will be described.

1 to 4, the passive semiconductor wafer inspection apparatus of the present invention is a microscope unit (( 7)) to inspect each chip on the semiconductor wafer by the probe section 9 of the probe 8,

The upper operating table 10 and the lower operating table 20, which is mounted on the upper center of the base 2, and the lower operating table 20 are provided to be moved back and forth, right and left,

The upper operating table 10 adjusts the left and right movement along the rail 15 by installing the rake gear 12 to be engaged with the pinion 11 on one side by rotating the pinion,

The lower operation table 20 is installed on the side of the pinion 21 is engaged with the pin gear 21 to adjust the front and rear movement along the rail 25 by rotating the pinion,

The test stand 30 is provided to move up and down, the probe (8) is installed to the upper side of the fixing stand (5) in the center opening hole 31, the pulleys are fitted to each other by a belt 43 on the lower side of the test stand The screw shafts 41 and 42 having mutually arranged (41 ') and 42' are rotatably arranged so that the lower part thereof is screwed into the internal groove 46 of the support bar 45 so that one side of the screw shaft 41 is formed. By rotating the screw shaft 41, 42 is rotated at the same time while the test stand 30 is made to move up and down.

At this time, the support bar 45 is inserted into the guide tube 50 to form a guide hole 51 of a predetermined length up and down the outer circumference and the stop pin 47 protruding in the radial direction of the guide tube 50 By the guide hole 51 of) configured to be raised and lowered to a predetermined length,

The lower end of the support bar 45 is installed in close contact with the lower end of the cam operating part 57 on the rotating shaft 55 having the rotating handle 56 on one side, and is configured to move up and down by the rotating operation of the rotating shaft.

Then, the lower side of both sides of the inspection table 30 is configured to provide a constant lifting operation by the guide rod 61 and the guider 62.

Moreover, the said microscope part 7 is also comprised so that fine adjustment to back, front, and left and right of a microscope by operation of operation knobs 7a and 7b is possible.

As reference numerals, H1, H2, and H3 represent operating handles, respectively.

Hereinafter, the operation and operation of the present invention will be described.

BACKGROUND OF THE INVENTION In general, a semiconductor device inspects electrical characteristics of each chip constituting a wafer after a fabrication process of forming a pattern on the wafer.

First, the semiconductor wafer is fixedly seated on the holder 5.

This fixes the wafer by the vacuum suction method.

In this state, the fixing table 5 is finely observed with the microscope section 7 on the pattern of each chip on the wafer while being moved up and down, left and right, and moved to the center opening hole 31 of the inspection table 30. The probe unit 9 is applied to the electrical signal to check whether the defective by the signal checked from the applied electrical signal, and the defective is to be removed because it checks with a marker (not shown).

The movement adjustment of the fixing stand 5 first rotates the rotation shaft 55 in a state of holding the rotation handle 56.

At this time, the support bar 45 is lowered while the cam operating part 57 on the pivot shaft 55 supports the support bar 45 while releasing the support.

At this time, the support bar 45 is controlled to descend as much as the length of the guide pin 51 of the guide pipe 50 of the outer stop pin 47.

When the support bar 45 is lowered as described above, the inspection table 30 is lowered by the lowered length.

As described above, the lowering control by the rotating shaft 56 and the cam operating part 57 adjusts the raising and lowering many heights at once.

As such, the degree of descent is again finely adjusted in the adjusted state.

This rotates one side of the screw shaft 41 by gripping and rotating the operating handle H3. At this time, the pulley 41 'on the screw shaft 41 and the pulley 42' on the other screw shaft 42 are rotated. The other screw shaft 42 is also rotated while interlocking with each other by the belt 43.

As such, the rotation of the screw shafts (41) (42) is to adjust the degree of finely while being screwed in the screw hole 46 of the support bar (45).

In this way, when the work for adjusting the lowering of the inspection table 30 is completed, the wafer holder 5 is to be moved back and forth, left and right.

This is controlled by holding the operating handle (H1) by rotating the pinion (11) while moving the left and right rake gear 12 installed on one side of the upper operating table (10) along the rail (15).

And, by holding the operation handle (H2) by rotating the pinion (21) is to adjust the lag gear 22 installed on one side of the lower operating table 20 while moving back and forth along the rail (25).

In this way, each chip on the semiconductor wafer is accurately positioned in the probe section 9 of the probe 8 to perform the inspection operation as described above.

On the other hand, in the present invention, the front and rear, left and right adjustment operation may be performed first, and then up and down adjustment operation may be performed, and the operation order may be changed according to the convenience of the operation.

As described above, the inspection apparatus of the present invention observes the microstructure of the fixing fixture on which the wafer is fixed and fixed, and adjusts the wafer fixing mechanism back and forth, left and right by the rack and pinion, as well as screw rotation of the screw shaft. The cam operation has the effect that the convenience and efficiency of the operation is excellently provided while manually adjusting the movement of the cam operation while moving up and down.

Claims (2)

The base 5 is fixed to and seated on the semiconductor wafer while the front and rear, left and right, up and down movement adjustment is performed with the microscope portion 7 and the probe portion 9 of the probe 8 is placed on the semiconductor wafer. In inspecting each chip, The upper operating table 10 and the lower operating table 20, which is mounted on the upper center of the base 2, and the lower operating table 20 are provided to be moved back and forth, right and left, The upper operating table (10) is installed to the left and right gears (12) engaged with the pinion (11) installed by rotating the pinion to adjust the left and right along the rail (15), The lower operation table 20 is installed to the rear gear gear meshing with the pinion 21 is installed on one side by rotating the pinion to adjust the forward and backward movement along the rail 25, The test stand 30 is provided to move up and down, the probe (8) is installed to the upper side of the fixing stand (5) in the center opening hole 31, the pulleys are fitted to each other by a belt 43 on the lower side of the test stand The screw shafts 41 and 42 having mutually arranged (41 ') and 42' are rotatably arranged so that the lower part thereof is screwed into the internal groove 46 of the support bar 45 so that one side of the screw shaft 41 is formed. Manual semiconductor wafer inspection apparatus, characterized in that the screw shaft (41) (42) by rotating the rotational movement at the same time made to adjust the lifting and lowering of the inspection table (30). The method of claim 1, The support bar 45 is inserted into the guide tube 50 forming a guide hole 51 of a predetermined length up and down the outer circumference, and the stop pin 47 protruding in the radial direction of the guide tube 50. It is configured to be lifted and lowered to a predetermined length by the guide hole 51, The lower end of the support bar 45 is installed in close contact with the lower end of the cam operating portion 57 on the rotating shaft 55 having a rotating handle 56 on one side, and configured to move up and down by the rotating operation of the rotating shaft. Manual semiconductor wafer inspection apparatus, characterized in that.

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