KR100981632B1 - Array substrate, method of manufacturing the same and liquid crystal display apparatus having the same - Google Patents

Abstract

Disclosed are an array substrate, a method of manufacturing the same, and a liquid crystal display device having the same, which reduces defects caused by light leakage, contamination, and impact. The array substrate includes a substrate, a switching element, an organic film, a pixel electrode, and a protrusion. The switching element is formed on the substrate. The organic layer includes a contact hole formed on the substrate on which the switching element is formed and exposing a portion of the switching element. The pixel electrode is formed on a portion of the surface of the organic layer and an inner surface of the contact hole and is connected to the switching element. The protrusion is disposed on the pixel electrode to correspond to the contact hole, and fills the contact hole, and protrudes from the pixel electrode. Therefore, the contact hole connecting the pixel electrode and the switching element is buried to reduce defects due to light leakage, contamination and impact.

Description

ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME

1 is a plan view illustrating a liquid crystal display according to a first exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1.

3 is a cross-sectional view taken along line BB ′ of FIG. 1.

4A to 4L and 5A to 5L are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a first exemplary embodiment of the present invention.

6 is a plan view illustrating a liquid crystal display according to a second exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along the line CC ′ of FIG. 6.

8A to 8L are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a second exemplary embodiment of the present invention.

9 is a cross-sectional view illustrating a liquid crystal display according to a third exemplary embodiment of the present invention.

10A to 10L are cross-sectional views illustrating a manufacturing process of a liquid crystal display device according to a third exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: upper substrate 102: black matrix

104, 204: color filter 106: common electrode

108 liquid crystal layer 110 photoresist film

110a, 110b, 110c, 110d: protrusion 112: pixel electrode

114, 214: organic film 116: inorganic insulating film

118a: source electrode 118b: gate electrode

118c: drain electrode 118d: storage capacitor line

120: lower substrate 122, 124: mask

123a, 123b, 125: mask pattern

The present invention relates to an array substrate, a method of manufacturing the same, and a liquid crystal display having the same, and more particularly, to an array substrate, a method of manufacturing the same, and a liquid crystal display having the same, which reduce defects caused by light leakage, contamination, and impact.

A liquid crystal display (LCD) applies an electric field to a liquid crystal material having an anisotropic dielectric constant injected between color filter substrates on which thin film transistors are formed, and controls the intensity of the electric field to transmit the electric field. It is a display device that obtains a desired image signal by adjusting the amount of light.

The conventional liquid crystal display device includes a first substrate, a second substrate and a liquid crystal layer.

The first substrate includes a lower substrate, a switching element, an inorganic insulating layer, an organic layer, a pixel electrode, and a spacer, and the second substrate includes an upper substrate, a black matrix (BM), and a color. It includes a filter (Color Filter) and a common electrode (Common Electrode). The liquid crystal layer is interposed between the first substrate and the second substrate and sealed by a seal.

The switching element is formed on the lower substrate. The switching element includes a source electrode, a drain electrode and a gate electrode. The inorganic insulating layer is formed on the lower substrate on which the switching element is formed, and the organic layer is formed on the inorganic insulating layer to insulate the switching element from the liquid crystal or the pixel electrode. In addition, the thickness of the organic layer controls the thickness of the liquid crystal disposed between the pixel electrode and the common electrode by adjusting the distance between the pixel electrode and the common electrode. The pixel electrode is formed on the organic layer.

The black matrix is formed on the upper substrate. The color filter layer is formed on the upper substrate on which the black matrix is formed. The common electrode is formed on the color filter layer.

A contact hole exists in the organic layer to connect the pixel electrode with the drain electrode of the switching element. The pixel electrode receives a signal of the drain electrode through the contact hole and forms a voltage difference for driving the liquid crystal together with the common electrode.

The organic film is thicker than the switching element. Therefore, the contact hole exposing the switching element in the organic layer has a recessed shape compared to the surroundings.

In the part with the contact hole, an orientation defect is likely to occur due to its discontinuous shape during the alignment process for aligning the liquid crystal. The misalignment may cause light leakage when the liquid crystal display is driven. In order to prevent the light leakage defect, there is a method of increasing the area of the contact hole. However, when the area of the contact hole is increased, the aperture rate of the pixel electrode may be reduced, thereby degrading the performance of the liquid crystal.

In addition, the contact hole may remain in the liquid contamination during the particle or wet etching, there is a problem such as the concentration of stress during the external impact occurs.

A first object of the present invention for solving the above problems is to provide an array substrate that reduces defects caused by light leakage, contamination and impact.

A second object of the present invention for solving the above problems is to provide a method of manufacturing the array substrate.

A third object of the present invention for solving the above problems is to provide a liquid crystal display device having the array substrate.

An array substrate according to an exemplary embodiment of the present invention for achieving the first object includes a substrate, a switching element, an organic layer, a pixel electrode, and a protrusion. The switching element is formed on the substrate. The organic layer includes a contact hole formed on the substrate on which the switching element is formed and exposing a portion of the switching element. The pixel electrode is formed on a portion of the surface of the organic layer and an inner surface of the contact hole, and is connected to the switching element. The protrusion is disposed on the pixel electrode to correspond to the contact hole, and fills the contact hole, and protrudes from the pixel electrode.

In order to achieve the second object, in the method of manufacturing an array substrate according to an embodiment of the present invention, first, an organic layer including a contact hole exposing a part of the switching element is formed on a substrate on which the switching element is formed. . Subsequently, a pixel electrode connected to the switching element is formed on a part of the surface of the organic layer and the inner surface of the contact hole. Subsequently, a photoresist film is formed on the pixel electrode and the organic film. Finally, a portion of the photoresist layer is removed to form a protrusion disposed on the pixel electrode to correspond to the contact hole, filling the contact hole, and protruding from the pixel electrode.

In order to achieve the third object, the liquid crystal display according to the exemplary embodiment includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate may include an organic layer including a substrate, a switching element formed on the substrate, a contact hole formed on the substrate on which the switching element is formed, and exposing a portion of the switching element, and a surface of the organic layer. And a pixel electrode formed on a portion of the contact hole and an inner surface of the contact hole, and a protrusion formed on the pixel electrode to correspond to the contact hole, filling the contact hole, and protruding from the pixel electrode. Include. The second substrate is coupled to face the first substrate. The liquid crystal layer is interposed between the first substrate and the second substrate.

Therefore, the contact hole connecting the pixel electrode and the switching element is buried to reduce defects due to light leakage, contamination and impact. In addition, the image quality is improved by increasing the aperture ratio.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example 1

1 is a plan view illustrating a liquid crystal display according to a first exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A 'of FIG. 1, and FIG. 3 is a line B-B' taken from the line of FIG. 1. It is a cross section.

1 to 3, the liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a lower substrate 120, a switching element, a storage capacitor line 118d, an inorganic insulating layer 116, an organic layer 114, a pixel electrode 112, and protrusions 110a and 110b. The second substrate includes an upper substrate 100, a black matrix 102, a color filter 104, and a common electrode 106. The liquid crystal layer is interposed between the first substrate and the second substrate and sealed by a seal.

The upper substrate 100 and the lower substrate 120 use glass of a transparent material that can pass light. The glass is alkali free. In the case where the glass has an alkali property, when alkali ions are eluted in the liquid crystal cell in the glass, the liquid crystal specific resistance is lowered, the display properties are changed, the adhesion between the seal and the glass is reduced, and the operation of the switching element is adversely affected.

The black matrix 102 is formed on the upper substrate 100 to block light. The black matrix 102 blocks the light passing through an area in which the liquid crystal cannot be controlled, thereby improving image quality. The black matrix 102 is formed by deposition and etching of an opaque material.

The color filter 104 is formed on the upper substrate on which the black matrix 102 is formed to selectively transmit only light having a predetermined wavelength.

The common electrode 106 is formed on the upper substrate 100 on which the black matrix 102 and the color filter 104 are formed. The common electrode 106 includes a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

The switching element includes a thin film transistor. The thin film transistor is formed on the lower substrate and includes a source electrode 118a, a gate electrode 118b, and a drain electrode 118c. The thin film transistor is formed on the lower substrate 120 through deposition, patterning, and etching processes. The gate line is connected to the gate electrode 118b of the thin film transistor to transmit a selection signal output from a driving circuit (not shown) to the thin film transistor, and the data line is connected to the source electrode 118a of the thin film transistor. The data voltage output from the driving circuit (not shown) is transferred to the thin film transistor. The drain electrode is connected to the pixel electrode 112 through a contact hole.

The storage capacitor line 118d is formed on the lower substrate 120 to overlap a portion of the drain electrode 119c to form a storage capacitor. The storage capacitor maintains a potential difference between the common electrode 106 and the pixel electrode 112.

The inorganic insulating layer 116 insulates the switching element from the liquid crystal layer. The organic layer 114 is formed on the inorganic insulating layer 116 to insulate the switching element from the liquid crystal layer or the pixel electrode 112. In addition, the distance between the pixel electrode 112 and the common electrode 106 is adjusted by the thickness of the organic layer 114 to form a liquid crystal layer disposed between the pixel electrode 112 and the common electrode 106. 108) is adjusted. The organic layer 114 also serves to flatten the bending caused by the switching element or the storage capacitor line 118d.

The pixel electrode 112 is formed on a portion of the surface of the organic layer 114 and an inner surface of the contact hole and is connected to the drain electrode 118c of the switching element through the contact hole. The pixel electrode 112 controls the liquid crystal in the liquid crystal layer 108 by a voltage applied between the common electrode 106 and the light transmission.

The protrusions 110a and 110b are formed corresponding to the position where the contact hole is located on the pixel electrode and fill the contact hole. The protrusions 110a and 110b are made of photoresist. The photoresist may have the same component as the organic layer 114. The protrusions 110a and 110b are formed through exposure and development after applying the photoresist on the lower substrate on which the pixel electrode is formed. Preferably, the protrusions 110a and 110b include a positive photoresist made of a thermosetting acrylic resin.

Referring to FIG. 2, the protrusion 110a may serve as a spacer for maintaining a cell gap between the first substrate and the second substrate. The cross-sectional shape of the protrusion 110a has a constant inclination without a step. Therefore, the area of the upper surface of the spacer has a constant value.

Referring to FIG. 3, another protrusion 110b protrudes from the pixel electrode 112, but has a height lower than a cell gap between the first substrate and the second substrate. When the height of the protrusion 100b is lower than the cell gap, the low protrusion 100b does not serve to maintain the cell gap.

The liquid crystal layer 108 is interposed between the first substrate 100 and the second substrate 120. The liquid crystal layer 108 is controlled by an electric field formed by the common electrode 106 and the pixel electrode 112 to adjust the transmission of light.

The seal (not shown) combines the first substrate 100 and the second substrate 120 and seals the liquid crystal in the liquid crystal layer 108.

4A to 4L and 5A to 5L are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a first exemplary embodiment of the present invention.

4A and 5A, a gate electrode 118a, a gate line, and a storage capacitor line 118d are formed on the lower substrate 120 to first form a switching element and a storage capacitor on the lower substrate 120. To form. The gate electrode 118a, the gate line, and the storage capacitor line 118d are formed through deposition, pattern formation, and etching of a conductive material.

Referring to FIGS. 4B and 5B, an insulating film is coated on the lower substrate 120 on which the gate electrode 118a, the gate line, and the storage capacitor line 118d are formed. Thereafter, a source electrode 118a and a drain electrode 118c are formed on the insulating film. A portion of the drain electrode 118c overlaps the storage capacitor line 118d to form a storage capacitor. The source electrode 118a and the drain electrode 118c are formed using a deposition, pattern formation, and etching process.

4C and 5C, an inorganic insulating layer 116 is subsequently applied to the entire surface of the lower substrate 120 on which the switching element and the storage capacitor line 118d are formed.

4D and 5D, the organic layer 114 is then coated on the inorganic insulating layer 116. The thickness of the organic layer 114 is thicker than the thickness of the inorganic insulating layer 116.

4E and 5E, a portion of the organic layer 114 and the inorganic insulating layer 116 are subsequently removed to form a contact hole exposing a portion of the drain electrode 118c. The contact hole is on the drain electrode 118c and is preferably positioned where the drain electrode 118c and the storage capacitor line 118d overlap.                     

4F and 5F, a transparent conductive material is subsequently applied onto the organic layer 114 on which the contact hole is formed. The transparent conductive material may be indium tin oxide (ITO) or indium zinc oxide (IZO). Subsequently, a portion of the transparent conductive material is removed by patterning and etching to form the pixel electrode 112 on a portion of the surface of the organic layer 114.

4G and 5G, a photoresist component is applied on a portion of the surface of the pixel electrode 112 and the organic layer 114 where the pixel electrode 112 is not formed. 110). The photoresist film 110 fills the contact hole. In this case, instead of the photoresist, the same component as the organic layer 114 may be applied. Preferably, the photoresist component is an acrylic positive photoresist. The photoresist film 110 includes a polymer compound having a property of decomposing upon receiving light such as ultraviolet rays.

Subsequently, the photoresist film 110 is exposed using the mask 122.

Referring to FIG. 4H, when the spacer 110a is formed on the contact hole, light may not pass through the contact hole by using the opaque portion 123a on the mask 122 and the contact hole may be formed. It allows light to pass through parts that do not exist. The polymer compound is present in the part where the light does not pass, but the polymer compound is decomposed in the part where the light is irradiated. On the other hand, referring to FIG. 5H, when the spacer 110a is not formed on the contact hole, some light may pass through the contact hole using the slit portion 123b on the mask 122. To be able. In addition to the slit, a translucent material may be used. In this case, the exposure time and the interval between the slits are adjusted so that the photoresist film 110 in the contact hole is not exposed.

Subsequently, the exposed photoresist film 110 is developed to form protrusions 110a and 110b. When the photoresist film 110 is developed, a portion where the polymer is decomposed by complete exposure is removed, and a portion where light is blocked by an opaque portion remains, and a portion where only a portion of light is irradiated by the slit is Part remains.

Referring to FIG. 4I, a spacer 110a is formed on the contact hole by the opaque portion 123a. A contact hole exists below the spacer 110a, and the contact hole is filled by the photoresist component. The cell gap between the first substrate and the second substrate is maintained by the spacer 110a.

Referring to FIG. 5I, a low protrusion 110b is formed on the contact hole by the slit portion 123b. The lower protrusion 110b does not maintain a cell gap unlike the spacer 110a.

In this case, the distribution of the spacer 110a and the lower protrusion 110b may be adjusted by adjusting the pattern of the mask 122. In some cases, only the spacer 110a may be present on the contact hole, or only the low protrusion 110b may be present on the contact hole. When only the low protrusion 110b is present on the contact hole, a cell gap is maintained by using a ball spacer or by forming a separate column spacer on the switching element or line.                     

Accordingly, the lower substrate 120, the switching element, the storage capacitor line 118d, the inorganic insulating layer 116, the organic layer 114, the pixel electrode 112, the spacer 110a, and the low The first substrate including the protrusion 110b is formed.

4J and 5J, a black matrix 102 is then formed on the upper substrate 100. The black matrix is formed by etching a portion after depositing an opaque material on the upper substrate.

Subsequently, the color filter 104 is formed on the upper substrate 100 on which the black matrix 102 is formed. In order to form the color filter, a material that passes only light having a specific wavelength is applied on the upper substrate 100 on which the black matrix 102 is formed, and then a part of the color filter is removed. In this case, the upper substrate 100 itself may be dyed without depositing a separate material to form the color filter.

Thereafter, a transparent conductive material is coated on the upper substrate 100 on which the black matrix 102 and the color filter 104 are formed to form a common electrode 106. The transparent conductive material is indium tin oxide (ITO) or indium zinc oxide (IZO).

Accordingly, a second substrate including the upper substrate 100, the black matrix 102, the color filter 104, and the common electrode 106 is formed.

4K and 5K, the first substrate and the second substrate are then joined to face each other. In this case, the pixel electrode 112 of the first substrate faces the color filter 104 of the second substrate. The cell gap between the first substrate and the second substrate is maintained by the spacer 110a.

4L and 5L, the liquid crystal layer 108 is interposed between the first substrate and the second substrate. The liquid crystal layer 108 may be formed by a vacuum injection method or a dropping method. In the dropping method, the first substrate is joined to the second substrate after the dropping layer 108 is dropped.

Finally, a seal (not shown) is used to seal the liquid crystal layer and to fix the first substrate and the second substrate.

Example 2

6 is a plan view illustrating a liquid crystal display according to a second exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along the line CC ′ of FIG. 6.

In the present exemplary embodiment, the remaining components except for the mask 124, the mask pattern 125, and the spacer 110c are the same as those of the first exemplary embodiment, and thus, detailed descriptions thereof will be omitted.

6 to 7, the liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a lower substrate 120, a switching element, a storage capacitor line 118d, an inorganic insulating layer 116, an organic layer 114, a pixel electrode 112, and protrusions 110c and 110d. The second substrate includes an upper substrate 100, a black matrix 102, a color filter 104, and a common electrode 106. The liquid crystal layer is interposed between the first substrate and the second substrate and sealed by a seal.                     

The upper substrate 100 and the lower substrate 120 use glass of a transparent material that can pass light.

The black matrix 102 is formed on the upper substrate 100 to block light.

The color filter 104 is formed on the upper substrate on which the black matrix 102 is formed to selectively transmit only light having a predetermined wavelength.

The common electrode 106 is formed on the upper substrate 100 on which the black matrix 102 and the color filter 104 are formed.

The switching element includes a thin film transistor. The thin film transistor is formed on the lower substrate and includes a source electrode 118a, a gate electrode 118b, and a drain electrode 118c.

The storage capacitor line 118d is formed on the lower substrate 120 to overlap a portion of the drain electrode 119c to form a storage capacitor.

The inorganic insulating layer 116 insulates the switching element from the liquid crystal layer. The organic layer 114 is formed on the inorganic insulating layer 116 to insulate the switching element from the liquid crystal layer or the pixel electrode 112.

The pixel electrode 112 is formed on a portion of the surface of the organic layer 114 and an inner surface of the contact hole and is connected to the drain electrode 118c of the switching element through the contact hole.

The protrusions 110c and 110d are formed at positions corresponding to the contact holes on the pixel electrode 112 and fill the contact holes. The protrusions 110c and 110d are made of photoresist. The photoresist may have the same component as the organic layer 114. The protrusions 110c and 110d are formed through exposure and development after applying the photoresist on the lower substrate on which the pixel electrode is formed. Preferably, the protrusions 110c and 110d include a positive photoresist made of a thermosetting acrylic resin.

Referring to FIG. 7, the protrusion 110c may serve as a spacer for maintaining a cell gap between the first substrate and the second substrate. The protrusion 110c has a stepwise cross-sectional shape. Therefore, the upper surface of the spacer has a narrower area than the spacer of the first embodiment due to the stepped shape. The area of the upper surface of the spacer is adjusted by changing the stepped shape.

Another protrusion 110d protrudes from the pixel electrode 112, but has a height lower than a cell gap between the first substrate and the second substrate. When the height of the protrusion 100d is lower than the cell gap, the low protrusion 100d does not play a role of maintaining the cell gap.

The liquid crystal layer 108 is interposed between the first substrate 100 and the second substrate 120.

The seal (not shown) combines the first substrate 100 and the second substrate 120 and seals the liquid crystal in the liquid crystal layer 108.

8A to 8L are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a second exemplary embodiment of the present invention.

Referring to FIG. 8A, first, a gate electrode 118a, a gate line, and a storage capacitor line 118d are formed on the lower substrate 120 to form a switching element and a storage capacitor on the lower substrate 120. .

Referring to FIG. 8B, an insulating film is coated on the lower substrate 120 on which the gate electrode 118a, the gate line, and the storage capacitor line 118d are formed. Thereafter, a source electrode 118a and a drain electrode 118c are formed on the insulating film.

Referring to FIG. 8C, an inorganic insulating layer 116 is subsequently coated on the entire surface of the lower substrate 120 on which the switching element and the storage capacitor line 118d are formed.

Referring to FIG. 8D, an organic layer 114 is then coated on the inorganic insulating layer 116.

Referring to FIG. 8E, a portion of the organic layer 114 and the inorganic insulating layer 116 are subsequently removed to form a contact hole exposing a portion of the drain electrode 118c.

Referring to FIG. 8F, a transparent conductive material is subsequently applied onto the organic layer 114 on which the contact hole is formed. Subsequently, a portion of the transparent conductive material is removed by patterning and etching to form the pixel electrode 112.

Referring to FIG. 8G, a photoresist component is applied on a portion of the surface of the pixel electrode 112 and the organic layer 114 where the pixel electrode 112 is not formed, thereby forming the photoresist layer 110. Form. The photoresist film 110 fills the contact hole. In this case, instead of the photoresist, the same component as the organic layer 114 may be applied. Preferably, the photoresist component is an acrylic positive photoresist. The photoresist film 110 includes a polymer compound having a property of decomposing upon receiving light such as ultraviolet rays.

Subsequently, the photoresist film 110 is exposed using the mask 124.

Referring to FIG. 8H, when the spacer 110c is formed on the contact hole, light is not allowed to pass through the center of the contact hole by using the pattern 125 on the mask 124. Only part of the light passes through the periphery of the image and all light passes through the part where the contact hole does not exist. The mask pattern 125 includes an opaque portion and a slit. The polymer compound is still present in the portion where the light does not pass, but only a part of the polymer compound is decomposed in the part where only a part of the light passes, and all the polymer compound is decomposed in the part where all the light passes.

On the other hand, when the spacer 110c is not formed on the contact hole, some light passes through the peripheral portion and the center portion of the contact hole by using the slit portion on the mask 124 as in the first embodiment. Do it. In addition to the slit, a translucent material may be used. In this case, the photoresist layer 110 inside the contact hole is not exposed by adjusting the exposure time and the interval between the slits.

Subsequently, the exposed photoresist film 110 is developed to form protrusions 110c and 110d. When the photoresist film 110 is developed, a portion where the polymer is decomposed by complete exposure is removed, and a portion where light is blocked by an opaque portion remains, and a portion where only a portion of light is irradiated by the slit is Part remains.

Referring to FIG. 8I, the photoresist remains at the center of the contact hole by the mask pattern 125 including the opaque portion and the slit, but some photoresist is removed at the periphery of the contact hole. Accordingly, a spacer 110c having a stepwise cross-sectional shape is formed on the contact hole. The upper surface of the spacer has a smaller area than the spacer in the first embodiment due to the stepped shape. A contact hole exists below the spacer 110c, and the contact hole is filled by the photoresist component.

On the other hand, when the spacer is not formed on the contact hole, a low protrusion is formed.

In this case, the distribution of the spacer 110c and the lower protrusion may be adjusted by adjusting the pattern of the mask 124. In some cases, only the spacer 110c may be present on the contact hole, or only a low protrusion may be present on the contact hole. When only low protrusions exist on the contact hole, a cell gap is maintained by using a ball spacer or by forming a separate column spacer on the switching device.

Accordingly, the lower substrate 120, the switching element, the storage capacitor line 118d, the inorganic insulating layer 116, the organic layer 114, the pixel electrode 112, the spacer 110a, and the low The first substrate including the protrusion 110b is formed.

Referring to FIG. 8J, a second substrate including an upper substrate 100, a black matrix 102, a color filter 104, and a common electrode 106 is formed.                     

Referring to FIG. 8K, the first substrate and the second substrate are then coupled to each other.

Referring to FIG. 8L, a liquid crystal layer 108 is interposed between the first substrate and the second substrate.

Finally, a seal (not shown) is used to seal the liquid crystal layer and to fix the first substrate and the second substrate.

Example 3

9 is a cross-sectional view illustrating a liquid crystal display according to a third exemplary embodiment of the present invention.

In the present embodiment, the remaining components except for the position of the color filter 204 and the thickness of the organic layer 214 are the same as those of the first embodiment, and thus detailed descriptions thereof will be omitted.

Referring to FIG. 9, the liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a lower substrate 120, a switching element, a storage capacitor line 118d, an inorganic insulating layer 116, a color filter 204, an organic layer 214, a pixel electrode 112, and a protrusion. The second substrate includes an upper substrate 100, a black matrix 102, and a common electrode 106. The liquid crystal layer is interposed between the first substrate and the second substrate and sealed by a seal.

The upper substrate 100 and the lower substrate 120 use glass of a transparent material that can pass light.                     

The black matrix 102 is formed on the upper substrate 100 to block light.

The common electrode 106 is formed on the upper substrate 100 on which the black matrix 102 is formed.

The switching element includes a thin film transistor. The thin film transistor is formed on the lower substrate and includes a source electrode 118a, a gate electrode 118b, and a drain electrode 118c.

The storage capacitor line 118d is formed on the lower substrate 120 to overlap a portion of the drain electrode 119c to form a storage capacitor.

The inorganic insulating layer 116 insulates the switching element from the liquid crystal layer.

The color filter 204 is formed on the inorganic insulating layer 116 to selectively transmit only light having a predetermined wavelength.

The organic layer 214 is formed on the inorganic insulating layer 116 on which the color filter 204 is formed to insulate the switching element from the liquid crystal layer or the pixel electrode 112.

The pixel electrode 112 is formed on a portion of the surface of the organic layer 114 and an inner surface of the contact hole and is connected to the drain electrode 118c of the switching element through the contact hole.

The protruding portion is formed at a position corresponding to the contact hole on the pixel electrode and fills the contact hole. In this case, the protrusion may serve as a spacer for maintaining a cell gap between the first substrate and the second substrate.

The liquid crystal layer 108 is interposed between the first substrate 100 and the second substrate 120.

The seal (not shown) combines the first substrate 100 and the second substrate 120 and seals the liquid crystal in the liquid crystal layer 108.

10A to 10L are cross-sectional views illustrating a manufacturing process of a liquid crystal display according to a third exemplary embodiment of the present invention.

Referring to FIG. 10A, first, a gate electrode 118a, a gate line, and a storage capacitor line 118d are formed on the lower substrate 120 to form a switching element and a storage capacitor on the lower substrate 120. .

Referring to FIG. 10B, an insulating film is coated on the lower substrate 120 on which the gate electrode 118a, the gate line, and the storage capacitor line 118d are formed. Thereafter, a source electrode 118a and a drain electrode 118c are formed on the insulating film.

Referring to FIG. 10C, an inorganic insulating layer 116 is subsequently coated on the entire surface of the lower substrate 120 on which the switching element and the storage capacitor line 118d are formed.

Referring to FIG. 10D, a color filter 204 is formed on the inorganic insulating layer 116. In order to form the color filter 204, a process of applying a material that passes only light having a specific wavelength on the inorganic insulating layer 116 and then removing a part thereof is repeated.

Referring to FIG. 10E, an organic layer 214 is coated on the inorganic insulating layer 116 on which the color filter 204 is formed. Subsequently, a part of the inorganic insulating film 116 and the organic film 214 is removed to form a contact hole exposing a part of the drain electrode 118c.

Referring to FIG. 10F, a transparent conductive material is subsequently applied onto the organic layer 214 on which the contact hole is formed. Subsequently, a portion of the transparent conductive material is removed by patterning and etching to form the pixel electrode 112.

Referring to FIG. 10G, a photoresist component is applied on a portion of the surface of the pixel electrode 112 and the organic layer 114 where the pixel electrode 112 is not formed, thereby forming a photoresist layer 110. Form. The photoresist film 110 fills the contact hole.

Subsequently, the photoresist film 110 is exposed using the mask 122.

Referring to FIG. 10H, when the spacer 110a is formed on the contact hole, the pattern 123a on the mask 122 is used.

Referring to FIG. 10I, the exposed photoresist film 110 is subsequently developed to form the spacers 110a. In this case, a low protrusion may be formed without forming a spacer on the contact hole.

Accordingly, the lower substrate 120, the switching element, the storage capacitor line 118d, the inorganic insulating layer 116, the organic layer 114, the pixel electrode 112, the spacer 110a, and the low A first substrate is formed comprising the protrusions.

Referring to FIG. 10J, a second substrate including an upper substrate 100, a black matrix 102, and a common electrode 106 is formed.

Referring to FIG. 10K, the first substrate and the second substrate are then coupled to each other.

Referring to FIG. 10L, a liquid crystal layer 108 is interposed between the first substrate and the second substrate.

Finally, a seal (not shown) is used to seal the liquid crystal layer and to fix the first substrate and the second substrate.

In the above embodiments of the present invention, the protrusion is a photoresist and is formed through an exposure and development process, but a person skilled in the art will understand that the protrusion may be formed by a deposition, patterning, and etching process. Could be.

According to the present invention as described above, the contact hole connecting the pixel electrode and the switching element is buried to reduce the defect due to light leakage phenomenon, contamination and impact. In addition, the image quality is improved by increasing the aperture ratio.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

Claims (9)

Board; A switching element formed on the substrate; An organic layer formed on the substrate on which the switching element is formed and including a contact hole exposing a portion of the switching element; A pixel electrode formed on a portion of a surface of the organic layer and an inner surface of the contact hole and connected to the switching element; And A first and second protrusions disposed on the pixel electrode to correspond to the contact hole and filling the contact hole and protruding from the pixel electrode; And the first and second protrusions have different heights. The array substrate of claim 1, wherein the first and second protrusions comprise photoresist. The method of claim 1, And a color filter formed on the substrate adjacent to the switching element. Forming an organic layer including a contact hole exposing a part of the switching element on a substrate on which the switching element is formed; Forming a pixel electrode connected to the switching element on a portion of a surface of the organic layer and an inner surface of the contact hole; Forming a photoresist film on the pixel electrode and the organic film; And Removing a portion of the photoresist film to form first and second protrusions on the pixel electrode, the first and second protrusions disposed corresponding to the contact holes, filling the contact holes, and protruding from the pixel electrodes; And the first and second protrusions have different heights. The method of claim 4, wherein the forming of the first and second protrusions Exposing the photoresist film using a mask; And And developing the exposed photoresist film to form protrusions on the contact hole. The method of claim 5, wherein the mask comprises a slit or a translucent material. An organic film including a substrate, a switching element formed on the substrate, a contact hole formed on the substrate on which the switching element is formed, and exposing a portion of the switching element, a portion of the surface of the organic film and the contact A pixel electrode formed on an inner surface of the hole and connected to the switching element, and first and second protrusions disposed on the pixel electrode to correspond to the contact hole, filling the contact hole, and protruding from the pixel electrode; A first substrate comprising; A second substrate opposed to the first substrate; And A liquid crystal layer interposed between the first substrate and the second substrate, The first and second protrusions have different heights. The liquid crystal display of claim 7, wherein the first protrusion includes a function of maintaining a cell gap between the first substrate and the second substrate. The liquid crystal display of claim 8, wherein the first protrusion has a stepwise cross-sectional shape.

Images