KR100977759B1 - Distributing board mounted with air-cooling passage - Google Patents

Abstract

PURPOSE: A distribution panel is provided to prevent the malfunction of a semiconductor device by extending a heat pipe, which is connected to the heating body of the semiconductor device, to an air-cooled passage. CONSTITUTION: A unit(10) comprises a main case(11), a heating element(12), and a heat dissipation housing(13). Electric power devices are arranged inside the main case. The heating element transfers heat generated from the heating body of a semiconductor device to the air. The heating element is a heat pipe. An air injection hole is formed in the front side of the heat dissipation housing. An air discharging part is formed in the back side of the heat dissipation housing. An air-cooled passage is formed inside the heat dissipation housing.

Description

Distribution board mounted with air-cooling passage

The present invention relates to a switchboard having an air-cooled flow path, and more particularly, to a switchboard having an air-cooled flow path that prevents a malfunction of the semiconductor device due to overheating by cooling an exothermic state of the semiconductor device through an endothermic action.

In general, a switchgear is an enclosure that performs monitoring, control, and protection of an electric system, and is an assembly made of a device such as an instrument, a relay, and a switchgear, a support to which the device is attached, and a conductor that electrically contacts the devices.

In particular, many electric motors are used in power distribution systems such as factories and buildings in power distribution boards for air conditioning and heating systems, water and sewage control, elevator operation, and air conditioning. As operational stabilization and reliability become important, the role of the motor control panel for driving and controlling these motors more stably becomes more important.

The motor control panel performs a function of distributing low-voltage electric power supplied from a power transformer to a plurality of electric motors and monitoring and blocking an overcurrent flow. For this purpose, the motor control panel includes power devices for controlling motors such as wiring breakers (MCCB), indicator lamps, operation switches, current transformers, electronic over current relays (EOCRs), and magnetic relays. Consists of a number of units installed.

These motor control power devices are installed in a limited number of unit spaces, and each unit can be individually inspected in order to perform internal inspection.

Recently, the demand for low-voltage three-phase / single-phase motors has increased significantly in mid- and large-sized customers with the increase in electric shock demand. Moreover, as the customer power system becomes more complex and larger, the load system becomes more complicated, and thus the operation of the power equipment is consequently increased. As reliability becomes increasingly important, the role of the motor control panel for driving and controlling these motors more quickly and reliably becomes more important.

By the way, among the power devices configured in the unit of the conventional motor control panel, the magnetic relay has a noise operation, the contact wear and contact failure due to the arc generation, there is a problem that the life of mechanical and electrical characteristics is limited. .

In addition, the instantaneous increase in starting current relative to the rated current at motor startup affects the life of the motor.

Accordingly, in order to solve such a problem, recently, a contactless relay (MSCR) using a semiconductor device is used.

The contactless relay using the semiconductor device does not generate electrical noise and noise during operation, does not generate arc during contact, and does not cause contact wear and poor contact, and has high reliability for contact operation, and is most suitable for motor load. Implement a startup method having a startup characteristic.

However, such a solid state relay enters a high temperature state due to heat generation during operation, as well as deterioration in performance, malfunction, and short circuit or damage of an internal circuit.

Accordingly, the present invention has been made to solve the above problems, by connecting a heat pipe to the heating element of the semiconductor device provided in the power devices, especially solid-state relay in the unit, by extending the heat pipe in the air-cooled flow path An object of the present invention is to provide a switchboard having an air-cooled flow path that can improve the cooling performance of the relay device.

In order to achieve the above object, a switchboard having an air-cooled flow path according to the present invention includes a main body case in which a front side is opened and power devices are installed in an inner rear side; A heat transfer element connected to a heat generator of a semiconductor element among the power devices installed in the main body case and receiving heat generated from the heat generator and transferring the heat to air; And a unit including a heat dissipation housing having a front / rear opening at the same time and having a flow path formed therein and extending the heat transfer element so as to communicate with the air-cooled flow path.

The heat dissipation housing is characterized in that the communication port is formed over the entire surface from the front surface to the back surface, one side of the back surface is characterized in that the discharge port of a narrower size than the inlet formed on the front surface.

The discharge port is formed to protrude from the rear surface of the main body case, characterized in that configured to be connected to or separated from the vertical discharge duct located in the rear part of the unit.

The outer bottom surface of the heat dissipation housing is characterized in that the groove of the long hole is integrally communicated with the communication port is formed.

The recess may further include an opening opened in a state in which the side wall is integrally received from the outer bottom surface of the heat dissipation housing toward the inner space.

The front of the unit is provided with a front door that can be opened and closed in a state accommodated in the switchboard, the front door is characterized in that the vent is formed in a position corresponding to the inlet of the heat dissipation housing.

The heating element is connected to the heating element of the semiconductor element is extended to the upper side by the side of the main body case and bent at the interface with the heat dissipation housing, characterized in that it extends along the opening of the heat dissipation housing.

The inlet is formed in the front position that meets the communication port and the boundary forming a boundary with each other, the boundary portion is characterized in that it is configured to extend upward from the inlet to expand the communication port relative to the inlet.

The heating element is characterized in that the heat pipe (Heat-Pipe).

As described above, according to the switchboard having an air-cooled flow path according to the present invention, a heat pipe having excellent heat transfer is connected to the heating element of the semiconductor element, and the air-cooled flow path structure of natural cooling using the convection phenomenon and the Venturi effect together with the heat pipe. Adopted in a separate housing, there is an effect that can prevent the malfunction of the semiconductor element due to heat generation, as well as short circuit or damage of the internal circuit.

1 to 3 are front, side and back views showing a switchboard having an air-cooled flow path according to the present invention.
4 shows the cooling action of the unit according to the invention.
5 is an exploded perspective view showing a unit according to the present invention.
6 is a perspective view showing a switchboard on which a unit according to the present invention is mounted.
7 to 9 are front, plan and side views showing a unit mounted on a switchboard according to the present invention.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3 are a front view, a side view and a rear view showing a switchboard having an air-cooled flow path according to the present invention, and FIG. 4 is a view showing a cooling operation of the unit according to the present invention.

In addition, Figure 5 is an exploded perspective view showing a unit according to the present invention, Figure 6 is a perspective view showing a switchboard equipped with a unit according to the present invention, Figures 7 to 9 show a unit mounted to the switchboard according to the present invention. Front view, top view and side view.

1 and 2 is a view showing the appearance of the switchboard 100 according to the present invention, in particular the motor control panel for driving and controlling the motor more stably, a circuit breaker for controlling various motors as shown 1) A plurality of units 10 having built-in lamps are arranged up and down, and the front door is composed of an operation handle 21 and a display device 22 such as an operation handle and a voltage and ammeter on the front of the outside ( 20) is provided.

In addition, as shown in Figure 3, the opening and closing handle 31 of the rear door 30 is made of a push-turn type to be opened and closed using a door key, when the rear door 30 is closed completely closed The structure does not allow to check and check the internal power equipment without opening the rear door 30.

The unit 10 includes a box-shaped main body case 11 having an open front surface, and inside the rear surface of the unit 10, a circuit breaker (MCCB) 1, an electronic overcurrent relay (EOCR) 2, and a solid state contact using a semiconductor device. Electric motor control power devices such as a relay (MSCR, 3) are installed.

Specifically, the electric circuit controlling device for the electric motor will be described above. The circuit breaker 1 can open and close a circuit manually in a normal state, and shuts down the circuit in an abnormal state such as a short circuit failure, thereby inputting the input power. It will cut off the supply of.

In addition, the electronic overcurrent relay 2 has an operating current value detected by a current detection module (not shown) that detects the magnitude of the operating current that normally passes without the operation of the circuit breaker 1. If it exceeds, it serves to cut off the power supply to the motor (not shown).

The solid-state relay 3 functions to supply / block power to the motor in accordance with a signal generated by the electronic overcurrent relay 2 or an operation signal of an operation switch (not shown).

In the unit 10 composed of such electric motor control power devices, after the external power is input through a power supply unit (not shown), the circuit breaker 1 and the electronic overcurrent relay 2 and the contactless relay ( Power is supplied to the motor through 3). In case of abnormality such as short circuit in this process, the circuit is automatically cut off by the circuit breaker 1 to cut off the power supply to the motor. If the reference value is larger than the set reference value, the electric power supply to the motor is cut off by the contactless relay 3 by the electronic overcurrent relay 2, thereby protecting the motor.

Among these power devices, the contactless relay 3 is unable to exhibit proper performance as it enters a high temperature state due to heat generation during operation, and thus, it is necessary to consider heat dissipation corresponding to temperature.

To this end, in a preferred embodiment according to the invention, as shown in the accompanying drawings, the contactless relay 3 is connected to the contactless relay 3 mounted on the side and the back of the main body case 11 It is provided with a heating element for receiving the heat generated from the transfer to the air. At this time, the heating element is made of a plate heat pipe (Heat-Pipe, 12).

The heat pipe 12 is made of a material such as copper, stainless steel, ceramics, tungsten, for example, a porous fiber, etc. may be used as the inner wall, and various materials may be selectively used in consideration of heat transfer characteristics. .

In addition, the heat pipe 12 has a working fluid, which is a specific heat transfer medium, is built into the inner space of the sealed vacuum state, so that when the one end of the sealed inner space is heated, the working fluid is absorbed and dissipated by an external heat source. While repeating the heat transfer is instantaneously without a separate power or additional device, the heat conductivity is also a quick and effective heat transfer medium, extending to the upper side of the body case 11 and at the same time with the heat dissipation housing 13 to be described later It is bent at the interface and extends horizontally along the outer bottom surface of the heat dissipation housing 13.

The heat dissipation housing 13 is provided above the main body case 11, and is firmly fixed through a conventional fastening member (not shown).

The heat dissipation housing 13 is a housing having a front and a rear surface having a predetermined thickness and a flow path formed therein. The heat dissipation housing 13 is capable of drawing in or drawing out from an interior accommodation space of the switchboard 100, and extends from the front side to the back side. A communication port 15 is formed over the surface, and one side of the rear surface is provided with a discharge port 16 having a smaller size than the front surface. That is, the entire front surface of the heat dissipation housing 13 is an inlet 14 through which outside air is introduced, and the introduced outside air is discharged through the communication port 15 to the discharge port 16.

At this time, the outer bottom surface of the heat dissipation housing 13 is formed with a long groove 17 having a predetermined width in the transverse direction, the groove 17 is in communication with the internal space of the communication port 15 integrally. Done. That is, the recess 17 has a rectangular opening 19 formed at the outer bottom surface of the heat dissipation housing 13, that is, the side wall 18 is opened toward the inner space, that is, the communication port 15. .

The plate-shaped heat pipe 12 extends along the opening 19, and it is necessary for the heat pipe 12 to seal the opening 19 for excellent cooling performance for the contactless relay. That is, since the width of the groove 17 and the width of the heat pipe 12 are substantially coincident with each other, the heat pipe 12 blocks the opening 19 so that the outside air introduced through the inlet 14 is reduced. This flows smoothly toward the discharge port 16 without leaking toward the groove 17 side.

In addition, the opening 19 provided with the groove 17 is an installation surface on which the heat pipe 12 is accommodated, and as shown in FIG. 4, the opening 19 has the same function as the venturi passage using the Bernoulli principle.

Here, the venturi passage is a flow path in which the flow rate increases when the flowing air passes through a narrow passage, and the flow rate decreases in a wide space of air, and the pressure decreases in the venturi passage in which the velocity of the fluid increases. Pressure increases in passages where the velocity of the fluid decreases.

In this case, when the outside air introduced through the inlet port 14 passes through the communication port 15, the speed of the air increases at a position where the groove 17 is provided to decrease the pressure therein. Air heat radiated from the heat pipe 12 is diffused while moving upward.

At this time, when the flow rate of air is increased, the air heat radiated from the heat pipe 12 is increased due to a larger pressure difference.

In addition, since the hot air heat emitted from the heat pipe 12 is blocked by the recess 17 of the heat dissipation housing 13, it can be avoided from the burn due to the user's carelessness.

The discharge port 16 formed on the rear surface of the heat dissipation housing 13 is formed to protrude a predetermined portion from the rear surface of the main body case 11, and a part of the projected discharge hole 16 is shown in Figure 2, the switchboard 100 It can be connected to or disconnected from the vertical duct 40 located behind each unit 10 of the.

When the discharge port 16 of the heat dissipation housing 13 is connected to the vertical duct 40, the communication port 15 together with the air heat radiated from the heat pipe 12 by the external air introduced through the inlet 14. It is discharged to the outside through the discharge port 16 and the vertical duct 40.

Particularly, as shown in FIG. 4, a stepped boundary portion 14a is formed at a front position where the inlet 14 and the communication port 15 meet each other, and the boundary 14a is an inlet ( It extends vertically upwards from 14) is configured so that the communication port 15 is expanded relative to the inlet port (14).

The discharge port 16 is discharged by the external air flowing into the inlet 14 when the air heat rising and flowing backward in the front of the hot air emitted from the heat pipe 12 hits the boundary portion 14a and descends downward. This is to guide in the () direction.

Here, the outlets 41 and 41 ′ of the vertical duct 40 are located on the top surface of the switchboard 100 along the vertical duct 40 or on the rear side through the installation of a separate horizontal duct (not shown). It may be located.

On the other hand, as shown in Figures 1 and 6, the front door 20 of the switchboard 100 according to the present invention is to be opened and closed in a state in which the unit 10 is accommodated in the switchboard 100.

At this time, when the front door 20 is closed, the air vent 23 is formed at the front of the position corresponding to the inlet 14 formed in the heat dissipation housing 13 of the unit 10 so that the outside air is vented ( 23 may be introduced into the inlet 14, so that cooling of the contactless relay 3 occurs continuously.

On the other hand, the air-cooled flow path structure according to the present invention is a flow path structure made of a natural cooling method, it is not necessary to be particularly limited to the heat dissipation housing 13 located on the upper portion of the unit 10, and in various positions such as side walls, bottom surfaces, etc. Can be adopted.

As a result, the present invention provides the heat pipe by interposing a heat pipe 12 connected to a heating element of the contactless relay 3 between flow paths through which external air is introduced through the inlet port 14 and discharged to the outside through the outlet port 16. High temperature air heat discharged through the (12) is an invention to be smoothly discharged to the outside via the flow path and the vertical duct (40).

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and the general knowledge in the art to which the present invention pertains without departing from the gist of the present invention as claimed in the claims. Anyone with a variety of modifications can be made, as well as such changes are within the scope of the claims.

10 unit 11 body case
12 heat pipe 13 heat dissipation housing
14 inlet 14a: boundary
15: communication port 16: discharge port
17 groove 18: side wall
19: opening 20: front door
21: operating device 22: display device
23: vent 30: rear door
31: opening and closing handle 40: vertical duct
41,41 ': outlet

Claims (9)

A main body case in which the front side is opened and the power devices are installed in the inner rear side;
A heat transfer element connected to a heat generator of a semiconductor element among the power devices installed in the main body case and receiving heat generated from the heat generator and transferring the heat to air; And,
2. A switchboard having an air-cooled flow path, characterized in that a unit is formed in which a flow path is formed at the same time as the front and rear surfaces thereof are opened, and a heat dissipation housing is installed to extend and communicate with the air-cooled flow path.
The method of claim 1,
The heat dissipation housing is a switchboard having an air-cooled flow path characterized in that the communication port is formed over the entire surface from the front surface to the rear surface, one side of the rear surface is provided with a discharge port of a narrow size compared to the inlet formed on the front surface.
The method of claim 2,
The discharge port is formed to protrude from the back of the main body case, the switchboard having an air-cooled flow path, characterized in that configured to be connected to or separated from the vertical duct located at the rear of the unit.
The method of claim 2,
An outer bottom surface of the heat dissipation housing switchboard having an air-cooled flow path, characterized in that the groove of the long hole is integrally communicated with the communication port.
The method of claim 4, wherein
The groove is a switchboard having an air-cooled flow path further comprises an opening that is opened in a state in which the side wall is integrally received toward the inner space from the outer bottom surface of the heat dissipation housing.
The method of claim 1,
The front of the unit is provided with a front door that can be opened and closed in the state accommodated in the switchboard, the front door is a switchboard having an air-cooled flow path, characterized in that the vent is formed at a position corresponding to the inlet of the heat dissipation housing.
The method of claim 1,
The heating element is connected to the heat generating element of the semiconductor element is a switchboard having an air-cooled flow path characterized in that it extends up the side of the body case and bent at the interface with the heat dissipation housing extending along the opening of the heat dissipation housing.
The method of claim 6,
The inlet is formed in the front position meets the communication port and the boundary forming a boundary with each other, the boundary portion extends upwardly from the inlet port is configured to expand the communication port relative to the inlet port, characterized in that the switchboard having an air-cooled flow path .
The method according to any one of claims 1 to 8,
The heating element is a switchboard having an air-cooled flow path, characterized in that the heat pipe (Heat-Pipe).

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