KR100968688B1 - The driving chip the surface processing equipment - Google Patents

The driving chip the surface processing equipment Download PDF

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KR100968688B1
KR100968688B1 KR20080016584A KR20080016584A KR100968688B1 KR 100968688 B1 KR100968688 B1 KR 100968688B1 KR 20080016584 A KR20080016584 A KR 20080016584A KR 20080016584 A KR20080016584 A KR 20080016584A KR 100968688 B1 KR100968688 B1 KR 100968688B1
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copper chip
copper
chip
hopper
friction
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KR20080016584A
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KR20090091373A (en
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김정태
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김정태
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F8/00—Manufacture of articles from scrap or waste metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies

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  • Manufacturing & Machinery (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

본 발명은 동칩의 표면 가공장치에 관한 것이며 각종 폐전선에서 생산된 직경이 0.5~1㎜이고, 길이가 2~4㎜인 동칩을 철 제강용 부원료로 사용하는 성형물을 제조할 때 압축 보조제 없이 성형제조할 수 있도록 동칩의 표면을 가공하기 위한 것이다.The present invention relates to a surface processing apparatus of a copper chip, and is formed without a compression aid when producing a molding using a copper chip having a diameter of 0.5 to 1 mm and a length of 2 to 4 mm produced in various waste wires as a subsidiary material for iron and steel. It is for processing the surface of the copper chip to be manufactured.

본 발명은 동칩 공급 호퍼에서 동칩을 1차 호퍼로 이송하고, 1차 호퍼의 동칩을 가공기 본체의 회전판에 공급하면 회전판이 회전하여 동칩을 마찰봉에 부딪히게 하여 충격 마찰로 가공하고, 1차 가공된 동칩은 2차 호퍼에 수납하였다가 1차 호퍼의 동칩 가공이 되면 2차 호퍼의 동칩이 가공기 본체로 공급되어 2차 가공이 이루어져 1차 호퍼에 수납되도록 구성한 것이다.The present invention transfers the copper chip from the copper chip supply hopper to the primary hopper, and if the copper chip of the primary hopper is supplied to the rotating plate of the machine body, the rotating plate rotates to make the copper chip hit the friction bar, and processed by impact friction, the primary processing When the copper chip is stored in the secondary hopper and the copper chip of the primary hopper is processed, the copper chip of the secondary hopper is supplied to the main body of the machine and the secondary chip is made to be stored in the primary hopper.

상기와 같은 본 발명은 동칩을 충격과 마찰로 동칩의 표면을 가공하고, 상기 공정으로 가공된 동칩은 압축 보조제 없이 철 제강용 부원료로 사용할 수 있도록 압축 성형 금형에서 소요 형상으로 성형 압축을 할 수 있는 특징이 있다.As described above, the present invention processes the surface of the copper chip by impact and friction with the copper chip, and the copper chip processed by the above process can be molded into a required shape in a compression molding mold so that it can be used as a raw material for iron steel without a compression aid. There is a characteristic.

철 제강용 부원료, 동칩, 충격, 마찰, 표면 가공 Subsidiary Materials for Iron Steel, Copper Chip, Impact, Friction, Surface Machining

Description

동칩의 표면 가공장치{The driving chip the surface processing equipment}The driving chip the surface processing equipment

본 발명은 동칩의 표면 가공장치에 관한 것이며 보다 구체적으로는 폐전선류에서 피복물을 제거한 동칩을 철 제강용 부원료로 사용하는 성형물을 제조할 때 동칩 소재의 접착성을 높일 수 있도록 표면을 가공하는 가공장치에 관한 것이다.The present invention relates to an apparatus for processing a surface of a copper chip, and more particularly, a processing apparatus for processing a surface to improve adhesiveness of a copper chip material when manufacturing a molding using the copper chip from which the coating is removed from waste wires as a subsidiary material for iron and steel. It is about.

각종 폐전선, 폐전화선, 전자기구의 폐코드선, 광 케이블선 등을 길이 2~4㎜ 정도로 절단하고, 피복물을 분리하면 동선은 직경이 0.5~1㎜이가 되고, 순도가 99.5~99.99%의 동칩이 생산된다.When cutting various waste wires, waste telephone wires, closed cord wires and optical cable wires of electronic equipment, etc., about 2 ~ 4mm in length and separating the coating, copper wires are 0.5 ~ 1mm in diameter, and the purity of 99.5 ~ 99.99% Copper chips are produced.

한편 제철소에서 철을 제강할 때에는 제강로에서 발생 되는 불순물을 태우기 위하여 고순도의 산소를 고압으로 제강로에 공급하게 되고, 또 제강 되는 철의 품질(성분, 재질)에 맞추기 위하여 순도가 높은 동(銅)을 부원료로 투입하게 된다.On the other hand, when steel is made in steel mills, high-purity oxygen is supplied to the steelmaking furnace at high pressure to burn impurities generated in the steelmaking furnace, and high-purity copper is used to match the quality (components and materials) of iron being made. ) As a subsidiary material.

상기에서 각종 폐전선에서 생산된 동칩을 상기 철 제강시에 제강용 부원료로 사용하게 되면 고압으로 송출되는 산소와, 제강로에서 발산되는 먼지(dust), 연기(fume) 등과 혼합되어 외부로 비산되고, 또 제강로의 고온에 의해서 순간적으로 탄화와 산화가 발생 되어 동 입자의 손실이 많고, 투입량을 정밀하게 조절할 수가 없게 되어 생산되는 철강의 품질(성분, 제질)을 제어하기 어려운 결점으로 상기 폐전선류에서 생산된 동칩은 생산된 상태로는 사용을 기피하게 된다.When the copper chips produced in the various wires are used as auxiliary materials for steelmaking during the steelmaking, they are mixed with oxygen discharged at high pressure, dust and smoke emitted from the steelmaking furnace, and scattered to the outside. In addition, carbonization and oxidation occur instantaneously due to the high temperature of the steel making furnace, which causes a lot of loss of copper particles, and it is difficult to control the quality (component, quality) of the steel produced due to the inability to precisely control the amount of waste wires. The copper chips produced by the company will be avoided as they are produced.

또 다른 방법으로는 직경이 1㎜이상인 동선(복수개를 꼬아서 만든 것도 포함), 동관, 동판 등을 200㎏의 단위로 묶은 부원료를 투입하게 되나 상기의 부원료는 재료에 묻은 각종 불순물로 인하여 동의 순도가 떨어지고 규격이 커서 제강로에서 투입하는데 능률적이지 못하고 제강 공정에서 철강의 품질을 제어하기 어려운 결점이 있다.In another method, a raw material containing a copper wire having a diameter of 1 mm or more (including a plurality of twisted pieces), a copper tube, and a copper plate in 200 kg units is added. Has a disadvantage that it is difficult to control the quality of steel in the steelmaking process because it is low and the specification is large and it is not efficient to input in the steel making furnace.

이를 개선하는 방법으로 상기의 각종 폐전선 등에서 생산된 동칩(직경이 0.5~1㎜, 길이가 2~4㎜)으로 규격의 성형물로 제조하여 사용하게 된다.In order to improve this, the copper chips produced in the various waste wires (diameter of 0.5 to 1 mm, length of 2 to 4 mm) are manufactured and used as a molded article of standard.

상기의 동칩은 규격의 성형금형에 투입하고 압축시켜서 생산하게 되면 상기 동칩은 표면이 매끄러워서 결속력이 형성되지 않아 성형이 이루어지지 않고 결속력이 없어 칩이 분리되므로 이를 해소하는 수단으로 동칩에 바인더를 넣고 혼합하게 된다.When the copper chip is produced by inserting it into a molding mold of a standard and compressing the copper chip, the copper chip has a smooth surface and no binding force is formed so that molding is not performed and the chip is separated. Will be mixed.

이에 사용되는 ① 바인더 보조제로는 벤젠, 나프탈렌, 안트라센(Anthracene), 피렌(Pyrene), 페난트랜 퀴논(phenanthrene quinone) 등이 있고, ② 열가소성 폴리머로는 폴리에틸렌글리콜, 에틸렌비닐아세테이트, 부타디엔계 폴리머와, 열경화성 폴리머로는 폴리메틸메타크릴레이드, 에폭시, 불포화 폴리에스테르가 있고, ③ 계면활성제로는 바이온 계면활성제, 수포닉 엔-100(상품명), 윤활제로는 스테아린산아연, 스테아린산리튬, 미정질 왁스, 카누바 왁스 등이 있으며 이들 소재들을 선택하여 동칩과 함께 혼합하여 압축 성형으로 성형물을 제조하여 철 제강의 부원료로 사용하게 된다.The binder adjuvant used herein includes benzene, naphthalene, anthracene, pyrene, phenanthrene quinone, and the like. ② The thermoplastic polymer includes polyethylene glycol, ethylene vinyl acetate, butadiene-based polymer, Thermosetting polymers include polymethyl methacrylate, epoxy, and unsaturated polyesters. ③ Surfactants include bioactive surfactants, suponic en-100 (trade name), lubricants, zinc stearate, lithium stearate, microcrystalline wax, Kanuba wax and the like are selected and mixed with copper chips to produce a molding by compression molding to be used as a subsidiary material of iron and steel.

상기의 수단은 압축 성형시설외에 동칩과 바인더의 혼합설비, 건조설비, 이동설비, 소결설비, 냉각설비 등이 함께 구비되어야하고 시설이 대형화되고 단계별 공정을 거치게 되면서 철 제강에 사용되는 부원료인 동 성형물의 제조 원가가 상승 되는 결점이 있다.The above means should be equipped with a mixture of copper chips and binders, drying equipment, mobile equipment, sintering equipment, cooling equipment, etc. in addition to the compression molding equipment. There is a drawback that the cost of manufacturing is increased.

이에 본 발명은 상기와 같은 제반 결점을 해소하고 각종 폐전선에서 생산된 직경이 0.5~1㎜이고, 길이가 2~4㎜인 동칩을 철 제강용 부원료로 사용하기 위한 성형물을 제조할 때 압축 보조제 없이 동 성형물을 압축 성형제조할 수 있도록 동칩의 표면을 가공하는 동칩의 표면 가공장치를 제공함에 주된 목적이 있다.Accordingly, the present invention eliminates the above-mentioned shortcomings and is a compression aid when producing a molding for using copper chips having a diameter of 0.5 to 1 mm and a length of 2 to 4 mm produced in various waste wires as a subsidiary material for iron and steel. The main object of the present invention is to provide a surface processing apparatus for a copper chip which processes the surface of the copper chip so that the molded product can be compression molded.

본 발명에서 보인 도1은 가공공정도1 is a processing process diagram shown in the present invention

도2는 종단면도2 is a longitudinal cross-sectional view

도3은 표면 가공기의 단면예시도3 is a cross-sectional view of the surface processing machine

도4는 마찰봉의 사시도이다.4 is a perspective view of the friction bar.

본 발명은 도1 및 도2와 같이 동칩이 원료 공급 호퍼(1)에 공급되면 바켓 엘리베이터(2)를 타고 1차 호퍼(3)에 공급되게 구성하고, 1차 호퍼(3)의 동칩은 가공기 본체(7)의 회전판(4)에 공급되고, 회전판(4)의 회전력으로 동칩이 마찰봉(5)에 부딪혀 충격마찰이 발생 되면서 표면 가공이 이루어지게 구성하고, 가공기 본체(7)에서 가공되어 하방으로 낙하 된 동칩은 스크류를 통하여 바켓 엘리베이터(2)로 공급되어 2차 호퍼(3a)에 수납되게 구성하고, 1차 호퍼(3)의 동칩 가공이 완료되면 2차 호퍼(3a)에 담긴 동칩이 가공기 본체(7)의 회전판(4)으로 공급되고, 마찰봉(5)에 부딪혀 충격 마찰 되어 표면이 가공되어 낙하 되는 동칩은 하방의 스크류(6)를 통하여 바켓 엘리베이트(2)로 공급되어 1차 호퍼(3)로 수납되도록 구성하고, 동칩이 충격 마찰로 반복 가공이 이루어지게 구성한 것이다.In the present invention, when the copper chip is supplied to the raw material supply hopper 1 as shown in Figs. 1 and 2, it is configured to be supplied to the primary hopper 3 via the basket elevator 2, and the copper chip of the primary hopper 3 is a processing machine. It is supplied to the rotating plate 4 of the main body 7, the copper chip hits the friction bar 5 by the rotational force of the rotating plate 4, the impact friction is generated and the surface processing is made, and processed in the machine main body 7 The copper chip dropped downward is supplied to the bucket elevator 2 through the screw and accommodated in the secondary hopper 3a. When the copper chip processing of the primary hopper 3 is completed, the copper chip contained in the secondary hopper 3a is completed. The copper chip which is supplied to the rotating plate 4 of the main body 7 of the machine, hits the friction rods 5, is subjected to impact friction, and the surface is processed and dropped, is supplied to the bucket elevator 2 through the screw 6 below. It is configured to be stored in the car hopper (3), and the copper chip is repeatedly processed by impact friction. It will be configured.

상기에서 미설명된 부호 10,10a는 에어 실린더, 11은 개폐판을 표시한 것이다.Reference numerals 10 and 10a, which are not described above, indicate an air cylinder and 11 denotes an opening and closing plate.

상기와 같은 본 발명은 각종의 폐전선류에서 생산된 동칩의 표면을 가공기 본체에서 여러 차례를 반복으로 충격 마찰로 가공하게 되면 표면이 가공되어져 압축 성형공정에서 동칩간의 접착성이 향상되어 압축 보조제 없이 동칩을 그대로 금형에서 압축 성형을 하여서 철 제강용 부원료로 사용하는 성형물을 제조할 수 있게 되는 특징이 있다.In the present invention as described above, if the surface of the copper chip produced in various waste wires is repeatedly processed by impact friction in the main body of the machine, the surface is processed and the adhesion between the copper chips in the compression molding process is improved, the copper chip without a compression aid It is characterized by being able to manufacture a molding to be used as a subsidiary material for steelmaking by compression molding in a mold as it is.

상기와 같은 본 발명은 도1 및 도2와 같이 각종의 폐전류에서 생산된 구경이 0.5~1㎜이고, 길이가 2~4㎜인 동칩을 원료 공급 호퍼(1)에 공급하게 되면 동칩은 바켓 엘리베이터(2)를 타고 상승 되어져 1차 호퍼(3)의 에어 실린더(10)와 연결된 개폐판(11)은 열려지고 2차 호퍼(3a)의 에어 실린더(10a)에 연결된 개폐판(11a)은 닫혀진 상태가 되고 상기 동칩은 1차 호퍼(3)에 수납된다.As described above, the present invention provides a copper chip having a diameter of 0.5 to 1 mm and a length of 2 to 4 mm to a raw material supply hopper 1 produced in various waste currents as shown in FIGS. 1 and 2. Opening and closing plate (11a) connected to the air cylinder (10a) of the secondary hopper (3a) is opened and lifted by the elevator (2) is connected to the air cylinder (10) of the primary hopper (3) It is in a closed state and the copper chip is stored in the primary hopper 3.

상기 1차 호퍼(3)에 수납된 동칩은 도2 및 도3과 같이 가공기 본체(7)내의 회전판(4)으로 공급되면 상기 동칩은 회전판(4)의 회전력에 의해서 가속력이 형성되어 마찰봉(5)으로 튀어나가게 되고 마찰봉(5)에 부딪힌 동칩은 충격 마찰이 발생 되면서 동칩의 표면이 마모된다.When the copper chip accommodated in the primary hopper 3 is supplied to the rotating plate 4 in the main body of the machine 7 as shown in FIGS. 2 and 3, the copper chip has an acceleration force formed by the rotational force of the rotating plate 4, thereby providing a friction bar ( 5) The copper chip that is thrown out and hit the friction bar (5) is abrasion of the surface of the chip as the impact friction occurs.

상기에서 마찰봉(5)에 부딪친 동칩은 표면에 충격 마찰로 인한 가공이 이루어지고 낙하 되는 동칩은 스크류(6)를 통하여 바켓 엘리베이터(2)를 통하여 상승 되고, 1차 호퍼(3)측의 통로에 있는 에어 실린더(10)의 개폐판(11)은 닫히고 2차 호퍼(3a)측의 통로에 있는 에어 실린더(10a)의 개폐판(11a)은 열려 상기의 동칩은 2차 호퍼(3a)에 수납이 이루어지게 된다.The copper chip hit by the friction rod 5 is processed by the impact friction on the surface, the copper chip is dropped through the bucket elevator (2) through the screw (6), the passage on the primary hopper (3) side The opening / closing plate 11 of the air cylinder 10 in the opening is closed, and the opening / closing plate 11a of the air cylinder 10a in the passage on the side of the secondary hopper 3a is opened, and the copper chip is connected to the secondary hopper 3a. The storage is made.

상기 2차 호퍼(3a)에 동칩의 수납이 완료되면 에어 실린더(10)(10a)는 역순으로 동작되어 1차 호퍼(3)측의 개폐판(11)은 열리고, 2차 호퍼(3a)의 개폐판(11a)은 닫히게 되고, 2차 호퍼(3a)에 수납된 동칩은 가공기 본체(7)의 회전판(4)으로 공급되고 회전판(4)의 회전에 따라 동칩은 마찰봉(5)으로 날아가 마찰봉(5)에 부딪히는 충격으로 동칩의 표면에 가공이 이루어지게 된다.When the storage of the copper chip is completed in the secondary hopper 3a, the air cylinders 10 and 10a are operated in the reverse order so that the opening and closing plate 11 on the side of the primary hopper 3 is opened and the secondary hopper 3a is opened. The opening / closing plate 11a is closed, and the copper chip housed in the secondary hopper 3a is supplied to the rotating plate 4 of the main body of the machine 7 and, as the rotating plate 4 rotates, the copper chip flies to the friction rod 5. The impact hits the friction rods 5, so that processing is performed on the surface of the copper chip.

상기와 같은 방식을 수리 반복하여서 동칩은 압축 성형에 적합한 상태로 표면을 가공하게 된다.By repairing and repeating the above method, the chip is processed to a surface suitable for compression molding.

상기에서 회전판(4)의 회전력과 마찰봉(5)의 표면 상태에 따라 가공상태는 영향을 받게 된다.According to the rotational force of the rotary plate 4 and the surface state of the friction bar 5, the machining state is affected.

즉 가공기 본체(7)에 설치된 회전판(4)의 속도가 빠르게 되면 마찰봉(5)에 부딪히는 동칩의 가속력이 커져 가공 효율이 높아지게 되고, 또 도4와 같이 가공기 본체(7)에 고정 설치되는 마찰봉(5)은 표면 입자를 미세하게 하고 고밀도 소재를 선택하게 되면 마찰봉(5)은 마모가 적어지고 마찰효율이 증대된다.That is, when the speed of the rotating plate 4 installed in the main body of the machine 7 becomes faster, the acceleration force of the copper chip that strikes the friction rod 5 increases, thereby increasing the processing efficiency, and as shown in FIG. 4, the friction fixed to the main body of the machine 7 is fixed. When the rod 5 is finer surface particles and the high-density material is selected, the friction rod 5 is less wear and friction efficiency is increased.

또 상기에서 가공기를 거친 동칩은 1차 호퍼(3)와 2차 호퍼(3a)를 번갈아가면서 모아지고, 또 가공되면서 1차 호퍼(3)와 2차 호퍼(3a)를 거치면서 모아진 동 칩은 가공기의 회전판(4)으로 공급될 때 동칩의 공급량은 회전판(4)을 회전시키는 모터의 용량에 따라 조정된다.In addition, the copper chip which passed through the processing machine is collected by alternating the primary hopper 3 and the secondary hopper 3a, and the copper chip collected through the primary hopper 3 and the secondary hopper 3a while being processed. When supplied to the rotating plate 4 of the processing machine, the supply amount of the copper chip is adjusted in accordance with the capacity of the motor for rotating the rotating plate 4.

상기와 같은 본 발명은 동칩을 가공하고 1차 호퍼(3)와 2차 호퍼(3a)를 번갈아가면서 반복 가공하는 작업을 자동으로 이루어지게 전기회로를 구성하게 되면 무인 자동으로 가공할 수 있게 된다.The present invention as described above can be processed unattended automatically if the electrical circuit is configured to automatically process the operation of the copper chip and the primary hopper (3) and the secondary hopper (3a) alternately.

도1은 본 발명의 가공공정도1 is a process chart of the present invention

도2는 본 발명의 종단면도Figure 2 is a longitudinal cross-sectional view of the present invention

도3은 본 발명의 표면 가공기의 단면예시도Figure 3 is a cross-sectional view of the surface treatment machine of the present invention

도4는 본 발명에서 마찰봉의 사시도Figure 4 is a perspective view of the friction bar in the present invention

※도면의 주요부분에 대한 부호 설명※ Explanation of the main parts of the drawings

1 : 원료 공급 호퍼 2 : 바켓 엘리베이터1: raw material supply hopper 2: bucket elevator

3 : 1차 호퍼 3a : 2차 호퍼3: 1st Hopper 3a: 2nd Hopper

4 : 회전판 5 : 마찰봉4: rotating plate 5: friction bar

6 : 스크류 7 : 가공기 본체6: screw 7: machine body

Claims (3)

삭제delete 각종 폐전선에서 생산된 직경이 0.5~1㎜이고, 길이가 2~4㎜인 동칩을 철 제강용 부원료로 사용하는 성형물을 제조할 때 압축 보조제 없이 성형제조할 수 있도록 동칩의 표면을 충격 마찰로 가공할 수 있도록 구성하는 동칩의 표면가공장치에 있어서 동칩을 원료 공급 호퍼(1)에 공급되면 바켓 엘리베이터(2)를 타고 1차 호퍼(3)에서 수납되게 하고, 1차 호퍼(3)의 동칩은 가공기 본체(7)의 회전판(4)에 공급되면 상기 회전판(4)의 회전력으로 동칩은 마찰봉(5)에서 충격 마찰로 표면 가공이 이루어지게 하고, 가공된 동칩은 스크류(6)를 통하여 바켓 엘리베이터(2)로 이동되어 2차 호퍼(3a)에 수납되도록 하고, 1차 호퍼(3)의 동칩 가공이 완료되면 2차 호퍼(3a)의 동칩이 가공기 본체(7)의 회전판(4)으로 공급되고 마찰봉(5)에서 충격 마찰 되어 표면이 가공되면 바켓 엘리베이터(2)로 이동되어 1차 호퍼(3)로 수납되도록 하고, 상기의 충격 마찰가공시 가공된 동칩이 1차 호퍼(3)와, 2차 호퍼(3a)를 번갈아 가면서 반복 공정으로 수행할 수 있도록 구성한 것을 특징으로 한 동칩의 표면 가공장치When manufacturing moldings using copper chips of 0.5 ~ 1mm in diameter and 2 ~ 4mm in length produced from various waste wires as sub-materials for steelmaking, the surface of the copper chips can be subjected to impact friction so that they can be molded without compression aids. In the surface processing apparatus of the copper chip configured to be processed, when the copper chip is supplied to the raw material supply hopper 1, the copper chip of the primary hopper 3 is accommodated in the primary hopper 3 via the basket elevator 2. When the silver chip is supplied to the rotating plate 4 of the main body of the processing machine 7, the copper chip is subjected to surface processing by the frictional friction at the friction bar 5 by the rotational force of the rotating plate 4, and the processed copper chip is provided through the screw 6. It is moved to the bucket elevator (2) to be stored in the secondary hopper (3a), and when the copper chip processing of the primary hopper 3 is completed, the copper chip of the secondary hopper (3a) is rotated plate 4 of the processing machine main body (7) If the surface is machined by impact friction at the friction bar (5) It is moved to the data (2) to be accommodated in the primary hopper (3), and the copper chip processed during the impact friction process is carried out in an iterative process by alternating the primary hopper 3 and the secondary hopper (3a). Copper chip surface processing equipment, characterized in that configured to 삭제delete
KR20080016584A 2008-02-25 2008-02-25 The driving chip the surface processing equipment KR100968688B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005248274A (en) * 2004-03-05 2005-09-15 Sumitomo Electric Ind Ltd Soft magnetic material and method for producing green compact
KR20070052727A (en) * 2007-05-02 2007-05-22 김정태 The same an adult form matter steel manufacture bases cu-chipping a use manufacture a method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005248274A (en) * 2004-03-05 2005-09-15 Sumitomo Electric Ind Ltd Soft magnetic material and method for producing green compact
KR20070052727A (en) * 2007-05-02 2007-05-22 김정태 The same an adult form matter steel manufacture bases cu-chipping a use manufacture a method

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