KR100963497B1 - Ink composition for inkzet marking of pcb and manufacturing method and marking method of ink - Google Patents

Abstract

The present invention relates to an ink composition for inkjet marking of a printed circuit board, and a method for manufacturing and marking inkjet marking ink for a printed circuit board, wherein the ink composition for inkjet marking of a printed circuit board is a UV-curable acrylate resin 100 to 100. 100 to 800 parts by weight of the acrylate functional monomer, 50 to 200 parts by weight of the UV photoinitiator for initiating and increasing the polymerization of the UV-curable acrylate resin and the acrylate functional monomer, and the color of the ink It is characterized by consisting of 50 to 150 parts by weight of a coloring agent for showing, and 25 to 230 parts by weight of a dispersant for inducing dispersion in the coloring agent.

In addition, the ink manufacturing method for inkjet marking of a printed circuit board of the present invention uses the above ink composition; The first step of forming 100 to 800 parts by weight of the acrylate functional monomer, 50 to 200 parts by weight of the UV photoinitiator, 50 to 150 parts by weight of the colorant and 40 to 280 parts by weight of the additive with respect to 100 to 120 parts by weight of the UV-curable acrylate resin. Wow; A second step of performing primary dispersion by placing the UV-curable acrylate resin, the acrylate functional monomer, the UV photoinitiator, and the colorant in the disperser or mixer in the raw material prepared in the first step; A third step of performing secondary dispersion by using a dispersion grinder to nano-size the primary dispersed raw material; Adding a additive to the dispersed raw material passed through the third step and performing a third dispersion while maintaining a temperature condition of 60 to 70 ° C .; Characterized in that the fifth step of filtering the mixed dispersion raw material passed through the fourth step using a filter of 1 ~ 10㎛.

Furthermore, the ink marking method for inkjet marking of a printed circuit board of the present invention includes a first step of inserting ink prepared by the above-described manufacturing method into an inkjet device; A second step of marking the letters or symbols for recognition by spraying and applying ink onto the PCB substrate in a state in which the inkjet equipment is set at a temperature of 25 ° C. to 70 ° C .; By the third process of curing the ink marked on the PCB by the second process using a UV curing machine having a light quantity condition of 500 ~ 1000mj / ㎠ or by heat curing for 20 to 45 minutes at a temperature of 150 ℃ Characterized in that made.

The present invention can overcome the disadvantages of the screen printing method applied to the existing PCB marking process, it is possible to form a high-density pattern and a fine pattern by the marking process of the coating method through the inkjet and inkjet ink, PCB By applying the inkjet coating method on the top, it can shorten the process, reduce the production cost and produce more environment-friendly than conventional.

Printed circuit board, marking process, inkjet, ink, coating, high density pattern, fine pattern, eco-friendly

Description

INK COMPOSITION FOR INKZET MARKING OF PCB AND MANUFACTURING METHOD AND MARKING METHOD OF INK} Ink Composition for Inkjet Marking of Printed Circuit Boards and Inkjet Marking Inks for Printed Circuit Boards

The present invention relates to an ink composition for inkjet marking of a printed circuit board, and a method for manufacturing and marking an inkjet marking ink for a printed circuit board using the same, and more particularly, to a character or symbol for recognition on a printed circuit board (PCB). Inkjet marking of printed circuit boards that enables the application of inkjet marking in the marking process, provides the appropriate ink for such inkjet marking, enables the formation of dense patterns, and improves the adhesion and hardness of the ink. It relates to an ink manufacturing method and a marking method for inkjet marking of an ink composition for a printed circuit board.

In the manufacturing process of a printed circuit board (hereinafter referred to as "PCB"), a marking process is a process of printing to display a character or symbol for recognition on a PCB substrate. The company applies a method of printing the necessary letters or symbols on the PCB by transferring the.

However, the marking process by the conventional pattern screen printing method has a problem in that there is a difficulty and limitation in forming a fine pattern due to the bleeding of the ink when printing a high density pattern, and in the case of small quantity production of various kinds of screens There was a drawback that the number is increased sharply, and since the use of the ink requires the cleaning of the used screen, there is a problem in that the cost of the cleaning solution and the cost of the cleaning liquid required during the cleaning are additionally added.

The present invention has been made to solve the above-mentioned problems, to overcome the disadvantages of the screen printing method applied to the existing PCB marking process, and inkjet marking ink to be made using the inkjet marking process In addition to providing a high-density pattern and fine pattern, and by applying the inkjet coating method on the PCB, the ink composition for inkjet marking of the printed circuit board to shorten the process and reduce the production cost compared to the conventional And to provide a manufacturing method and marking method of the inkjet marking ink for printed circuit board using the same.

That is, the inkjet marking method can be applied to the marking process for marking letters or symbols for recognition on the PCB, providing the appropriate ink for the inkjet marking method, and enabling the formation of high density patterns, and the adhesion and hardness of the ink. To improve it.

The ink composition for inkjet marking of a printed circuit board of the present invention comprises 100 to 800 parts by weight of an acrylate functional monomer and 100 to 800 parts by weight of the UV curable acrylate resin, and the UV curable acrylate resin and the acrylate functional monomer. 50 to 200 parts by weight of a UV photoinitiator for initiating and increasing the polymerization, 50 to 150 parts by weight of a colorant for expressing the color of the ink, and 25 to 230 parts by weight of a dispersant for inducing dispersion to the colorant. do.

In addition, the ink manufacturing method for inkjet marking of a printed circuit board of the present invention uses the above ink composition; First step comprising 100 to 800 parts by weight of acrylate functional monomer, 50 to 200 parts by weight of UV photoinitiator, 50 to 150 parts by weight of colorant, and 25 to 230 parts by weight of dispersant based on 100 to 120 parts by weight of UV-curable acrylate resin. Wow; A second step of performing primary dispersion by placing the UV-curable acrylate resin, the acrylate functional monomer, the UV photoinitiator, and the colorant, the dispersant, the antifoaming agent, and the fluidity control additive in the disperser or mixer in the raw material prepared in the first step; ; A third step of performing secondary dispersion by using a dispersion grinder to nano-size the primary dispersed raw material; Adding a additive such as Wax to the dispersed raw material passed through the third step, and then performing a third dispersion while maintaining a temperature condition of 60 to 70 ° C .; Characterized in that the fifth step of filtering the mixed dispersion raw material passed through the fourth step using a filter of 1 ~ 10㎛.

Furthermore, the ink marking method for inkjet marking of a printed circuit board of the present invention includes a first step of inserting ink prepared by the above-described manufacturing method into an inkjet device; A second step of marking the letters or symbols for recognition by spraying and applying ink onto the PCB substrate in a state in which the inkjet equipment is set at a temperature of 25 ° C. to 70 ° C .; By the third process of curing the ink marked on the PCB by the second process using a UV curing machine having a light quantity condition of 500 ~ 1000mj / ㎠ or by heat curing for 20 to 45 minutes at a temperature condition of 150 ℃ Characterized in that made.

The present invention can overcome the disadvantages of the screen printing method applied to the existing PCB marking process, it is possible to form a high-density pattern and a fine pattern by the marking process of the coating method through the inkjet and inkjet ink, PCB By applying the inkjet coating method on the screen, direct patterning is possible immediately after the pattern drawing using a computer, without the need for screen production and cleaning process, and it consumes less ink than the screen printing method. This can shorten the delivery time and reduce the overall production cost.

Hereinafter, the present invention will be described in detail.

The ink composition for inkjet marking of a printed circuit board according to the present invention is for use in marking and marking letters or symbols for recognition on an PCB by inkjet, and includes a UV-curable acrylate resin, an acrylate functional monomer, a UV photoinitiator, and a colorant. And a mixed composition of the dispersant.

In addition, it may be configured so that the improvement of physical properties can be expected by adding alone or mixed with a wax, antifoaming agent or flow control agent as an additive.

The ink composition for inkjet marking is 100 to 800 parts by weight of acrylate functional monomer, 50 to 200 parts by weight of UV photoinitiator, 50 to 150 parts by weight of colorant, and dispersant 25 to 230 with respect to 100 to 120 parts by weight of UV-curable acrylate resin. It is preferable to make it consist of the mixing composition which adds a weight part.

Here, 10 to 60 parts by weight of the wax may be added to 100 to 120 parts by weight of the UV-curable acrylate resin, 5 to 20 parts by weight of the antifoaming agent, and 10 to 30 parts by weight of the fluidity regulator may be used. Can be.

The UV-curable acrylate resin plays a role in determining the overall physical properties such as heat resistance and insulation properties with respect to the ink composition composed of the mixed composition of the above raw materials, and if it exceeds 120 parts by weight, the use of an excessive diluent is inevitable, resulting in overall physical properties of the composition. This may be lowered and less than 100 parts by weight may lower the heat resistance and adhesion.

The UV-curable acrylate resin is used an oligomer having acryloyl (-CH2 = CHCO-) group, can be used by selecting any one of all the oligomers having acryloyl group or a combination of two or more, Urethane acrylates, epoxy acrylates, polyester acrylates and the like.

The UV-curable acrylate resin may be used by adding carboxylic acid to improve adhesion and heat resistance of the lower solder resist to the ink composition for marking the printed circuit board. At this time, it is preferable to use 45-60 weight part of carboxylic acids with respect to 100-120 weight part of UV-curable acrylate resins.

The acrylate functional monomer participates in the UV (Ultra Violet) reaction to supplement the physical properties of the UV-curable acrylate resin, and is used to match the final viscosity of the ink, more than 800 parts by weight or less than 100 parts by weight When applied to, it can affect the heat resistance, adhesion and discoloration of the ink.

As the acrylate functional monomer, a monomer having an acryloyl (-CH 2 = CHCO-) group may be used. Any one of all monomers having an acryloyl group may be selected or used in combination of two or more thereof. Polyethers, polyamides, urethanes, polyesters, etc. are mentioned, It is preferable to use what has a molecular weight of 5000 or less.

More specifically, the acrylate functional monomer may be used isobonyl acrylate, 2-hydroethyl-methacrylate, neo-pnethyl glycol diacrylate, lauryl acrylate, trimethylopropane triacrylate, dipentaerythritol-hexacrylate, dipentaerythritol pentacrylate, diacrylate of hydroxypivalaldehyde modified trimethylolpropane, and the like.

The said acrylate functional monomer can mix and use the monomer which has various functional groups, such as an epoxy group or a hydrocarbonyl group.

At this time, the epoxy group or the hydrocarbonyl group is preferably used 50 to 400 parts by weight based on 100 to 800 parts by weight of the acrylate functional monomer in order to improve adhesion, heat resistance, and hardness through the reaction with the solder resist.

In addition, it is also possible to use a polymer monomer having a molecular weight of 10000 ~ 30000 to improve the heat resistance and hardness of the ink, wherein the polymer monomer is preferably used 20 to 160 parts by weight based on 100 to 800 parts by weight of the acrylate functional monomer.

The UV photoinitiator serves to initiate and elevate the polymerization of the UV-curable acrylate resin and the acrylate functional monomer. When the UV photoinitiator is less than 50 parts by weight, the UV photoinitiator is insufficient in reactivity, resulting in a decrease in the tacky and physical properties of the coating film and 200 weight. Excessive parts cause deterioration of adhesion due to over-curing and unreacted photoinitiators.

The UV photoinitiator is 2-Benzyl-2- (dimethylamino) -1- (4- (4-morpholinyl) Phenyl) -1-butanone, 2-Hydroxy-2-methyl-1-phenyl-propane-1-one, Diaminobenzo Phenone, 2-Methyl-1- [4- (Methylthio) phenyl] -2-Mortholino Propan-1-one, 2.4-DIETHYL THIOXANTONE-9-ONE, 4- (DIMETHYLAMINO) BENZOIC ACID 3-MB, Bis (2 It can be used either one of 4,6-trimethylbenzoyl) -phenylphosphinoxide or diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide or a combination of two or more.

The colorant is used to represent the color of the ink, and inorganic pigments or organic pigments are used. If it exceeds 150 parts by weight, UV curing is not performed, resulting in deterioration of physical properties resulting from uncured and more than necessary to prevent such physical degradation. Since the amount of light is required, time and electricity consumption may be severe, and when less than 50 parts by weight, the coloring power may be insufficient to display a desired color.

The dispersant is intended to induce dispersion in the colorant (pigment) as an additive, and if less than 25 parts by weight or more than 230 parts by weight may cause phenomena such as layer separation and agglomeration of the colorant, and may significantly affect storage stability. .

It is preferable to use a high molecular weight block copolymer solution or an acrylate copolymer as the dispersant.

The wax is added to prevent the viscosity increase and bleeding of the ink, it is preferable to use selected from paraffins, Japan waxes, beeswax, light solders, when used in excess of 60 parts by weight deteriorated coating properties of the ink The adhesion may be lowered and cracks may be generated, and when used in an amount less than 10 parts by weight, it is impossible to prevent the increase and spread of the desired viscosity.

The antifoaming agent is added to prevent the bubble of the ink or coating film, it is preferable to use polysiloxane containing silicon, if it is out of an appropriate amount of 5 to 20 parts by weight may adversely affect the adhesion to the lower coating film and heat resistance Physical properties may fall.

The fluidity regulator is added to improve the viscosity of the ink and improve the fluidity and improve the storage stability, it is preferable to use a hydrophilic pyrogenic silica or a special functional urea solution, if it is out of an appropriate amount of 10 to 30 parts by weight with the lower coating film It may adversely affect the adhesion and heat resistance and the coating film properties may be lowered because excessive diluent (monomer) must be added to obtain the desired viscosity.

In this case, as an additive for improving various physical properties of the ink, a foaming agent, a surfactant, an antioxidant, an antistatic agent, a brightening agent, etc. may be selectively used in addition to the above-mentioned additives, and are added in a very small amount.

On the other hand, the ink manufacturing method using the ink composition for inkjet marking of the printed circuit board according to the present invention as described above with reference to Figure 1, with respect to 100 to 120 parts by weight of the UV-curable acrylate resin in the first step (S1) A raw material is prepared so that 100-800 weight part of acrylate functional monomers, 50-200 weight part of UV photoinitiators, 50-150 weight part of coloring agents, and 25-230 weight part of dispersing agents are provided.

At this time, the UV curable acrylate resin, acrylate functional monomer, UV photoinitiator and dispersant in the composition material is provided in the liquid phase.

Here, the description which is insufficient about the above-mentioned composition raw material shall apply mutatis mutandis to the configuration of the above-described ink composition.

In the second step (S2), the UV-curable acrylate resin and the acrylate functional monomer, the UV photoinitiator, the dispersant and the colorant in the raw material prepared in the first step are put into a disperser or a mixer and mixed by primary dispersion.

In the third step (S3) to perform the secondary dispersion using a dispersion grinding machine to nano-size the primary dispersed mixed raw material.

After the additive is added to the dispersed mixed raw material passed through the third step in the fourth step (S4), the third dispersion is performed in a state in which the dispersion grinder is at a temperature condition of 60 to 70 ° C.

At this time, the additive to be added may be added one or more wax, antifoaming agent or flow control agent, 100 to 120 parts by weight of the UV curable acrylate resin, 10 to 60 parts by weight of the wax, antifoaming agent is 5 to 20 weight Is added in an amount of 10 parts by weight.

In the fifth step (S5) to filter the dispersed dispersed raw material of the fourth step using a filter of 1 ~ 10㎛ to prepare the ink to be used for inkjet marking of the printed circuit board.

In addition, in order to shorten the process of the first to fifth steps described above, various additives may be added to the third step of performing secondary dispersion to perform final dispersion.

On the other hand, the marking method of the ink prepared by using the ink composition for inkjet marking of the above-described printed circuit board with reference to Figure 2, the ink composition and the ink prepared by the ink composition and the ink manufacturing method described above in the first step (S11) Put it in the equipment.

In the second process (S12), the inkjet equipment filled with the ink is sprayed and applied onto the PCB under the condition of the temperature condition of 25 ~ 70 ℃ to mark letters or symbols for recognition in the shape designed on the computer.

At this time, the surface tension during the spraying of the ink is preferably in the condition of 20 ~ 40mN / m and the viscosity of the ink is preferably to be 5 ~ 20cps based on the discharge temperature.

In the third process (S13), the ink marked on the PCB substrate by the second process is cured using a UV curing machine having a light quantity condition of 500 to 1000mj / cm 3 or for 20 to 45 minutes at a temperature of 150 ° C. Heat cure.

In this case, in the case of using a UV curing machine, it is preferable to improve the adhesion and hardness of the ink that is applied and printed on the PCB by making a heating section in front of the UV curing machine. The UV curing machine uses an electrodeless lamp. It is desirable to improve the bleeding and hardness when marking, but may be used metal or mercury lamp.

1 is a flowchart illustrating a method of manufacturing ink for inkjet marking of a printed circuit board according to the present invention.

2 is a flowchart illustrating an ink marking method for inkjet marking of a printed circuit board according to the present invention.

Claims (10)

About 100-120 weight part of UV-curable acrylate resins 100 to 800 parts by weight of acrylate functional monomer; 50 to 200 parts by weight of a UV photoinitiator for initiating and increasing the polymerization of the UV-curable acrylate resin and the acrylate functional monomer; 50 to 150 parts by weight of a colorant for expressing the color of the ink; And 25 to 230 parts by weight of a dispersant for inducing dispersion to the colorant; Consisting of, The acrylate functional monomer may be used by adding 20 to 160 parts by weight of an epoxy group or a hydrocarbonyl group with respect to 100 to 800 parts by weight of an acrylate functional monomer, or a polymer monomer having a molecular weight of 10000 to 30000 by using an acrylate functional monomer. An ink composition for inkjet marking of a printed circuit board, which is used by adding 20 to 160 parts by weight with respect to 100 to 800 parts by weight. The method of claim 1, Printed circuit characterized in that 10 to 60 parts by weight of wax, 5 to 20 parts by weight of antifoaming agent, 10 to 30 parts by weight of flow control agent are added to the UV curable acrylate resin 100 to 120 parts by weight, and at least one of them is added. Ink composition for inkjet marking of a substrate. The method of claim 1, The UV-curable acrylate resin is an oligomer having acryloyl (-CH2 = CHCO-) group is used, the acrylate functional monomer is characterized in that a monomer having acryloyl (-CH2 = CHCO-) group is used. An ink composition for inkjet marking of a printed circuit board. The method of claim 1, The UV photoinitiator is 2-Benzyl-2- (dimethylamino) -1- (4- (4-morpholinyl) Phenyl) -1-butanone, 2-Hydroxy-2-methyl-1-phenyl-propane-1-one, Diaminobenzo Phenone, 2-Methyl-1- [4- (Methylthio) phenyl] -2-Mortholino Propan-1-one, 2.4-DIETHYL THIOXANTONE-9-ONE, 4- (DIMETHYLAMINO) BENZOIC ACID 3-MB, Bis (2, Ink composition for inkjet marking of a printed circuit board, characterized in that any one selected from 4,6-trimethylbenzoyl) -phenylphosphinoxide, Diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, or a combination of two or more thereof. . The method of claim 1, The UV-curable acrylate resin for the inkjet marking of a printed circuit board to improve the physical properties of the ink by adding 45 to 60 parts by weight of carboxylic acid with respect to 100 to 120 parts by weight of the UV curable acrylate resin Ink composition. delete First step comprising 100 to 800 parts by weight of acrylate functional monomer, 50 to 200 parts by weight of UV photoinitiator, 50 to 150 parts by weight of colorant, and 25 to 230 parts by weight of dispersant based on 100 to 120 parts by weight of UV-curable acrylate resin. ; A second step of performing primary dispersion by placing a UV-curable acrylate resin, an acrylate functional monomer, a UV photoinitiator, a dispersant, and a colorant in a disperser or a mixer in the raw material provided in the first step; A third step of performing a second dispersion using a dispersion grinder to nano size the first dispersed raw material; A fourth step of performing a third dispersion in a state in which a temperature is maintained at 60 to 70 ° C. after adding an additive to the dispersed raw material passed through the third step; And A fifth step of filtering the mixed dispersion raw material having passed through the fourth step using a filter of 1 to 10 μm; An ink manufacturing method for inkjet marking of a printed circuit board, characterized in that it is produced by. The method of claim 7, wherein In the fourth step, the additive is one or more of wax, an antifoaming agent, and a fluidity regulator. The wax is added in an amount of 10 to 60 parts by weight based on 100 to 120 parts by weight of the UV-curable acrylate resin, and the antifoaming agent is 5 to 20 parts by weight. It is added by part, the fluidity control agent ink manufacturing method for inkjet marking of a printed circuit board, characterized in that added to 10 to 30 parts by weight. A first step of inserting the ink manufactured by the manufacturing method of claim 7 or 8 into an inkjet apparatus; A second step of marking the letters or symbols for recognition by spraying and applying ink onto the PCB substrate in a state in which the inkjet equipment is set at a temperature of 25 ° C. to 70 ° C .; The ink marked on the PCB by the second process is cured by using a UV curing machine having a light quantity condition of 500 to 1000mj / cm 3 or a third process of thermal curing at a temperature of 150 ° C. for 20 to 45 minutes. An ink marking method for inkjet marking of a printed circuit board, characterized in that. The method of claim 9, The ink marking method of the inkjet marking of the printed circuit board, characterized in that the surface tension during the injection of the ink is set to 20 ~ 40mN / m, the viscosity of the ink is 5 ~ 20cps.

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