KR100963335B1 - LED Packaging Device and Method - Google Patents

Abstract

The present invention relates to a simple LED packaging device and a method for packaging an LED. The LED packaging method of the present invention includes a support plate and a chip having a lower contact point connected to a lower surface of a chip die with an LED chip on the upper surface. An LED packaging device having a side support attached to the upper surface of the support plate to pressurize the left and right sides of the die, respectively, and an upper support attached to the upper surface of the support plate to pressurize the upper surface of the LED chip through the provided upper contact point. And a chip die to which the LED chip is attached, which is slidably inserted and seated and fixed between the lower contact point of the support plate and the side support and the upper support, thereby simplifying the LED package process. Can improve the productivity and lower the product cost. In addition, when a defective LED chip occurs, only a chip die with a sliding-inserted LED chip may be replaced, thereby easily replacing the LED chip.

LED, Chip, Die, Bonding, Process, Lamp, Wire, Replacement, Slot, Molding

Description

Light emitting diode packaging device and packaging method of light emitting diodes {LED Packaging Device and Method}

The present invention relates to a light emitting diode (LED) packaging method, and more particularly, to simplify the LED packaging process to improve productivity and reduce process cost, and The present invention relates to an easy to replace LED packaging device and a packaging method thereof.

Light Emitting Diode (LED) is a semiconductor used to send and receive signals by converting electrical signals into infrared or light using the characteristics of compound semiconductors. It is semi-permanent, inexpensive and low in power consumption. Is characteristic. Accordingly, LEDs are used in various fields such as home appliances, remote controls, traffic lights, electronic signs, indicators, and various automation devices.

In general, the LED is used to fix the LED chip (Chip) in the cathode lead frame (cup) cup using a conductive bonding and to connect to the anode lead frame (gold lead) using a gold lead (Gold Wire) It is commercialized and used as an LED lamp through the process.

As the LED packaging method, a wire bonding method or a flip chip bonding method is used. Among the representative LED packaging method is an LED packaging method using a wire bonding method.

1 is a diagram illustrating an LED packaging process using a wire bonding method. 2A to 2D are views illustrating an actual packaging process of LEDs by the LED packaging process using the wire bonding method of FIG. 1.

As shown, the LED packaging method using a wire bonding method, first connecting the LED chip and the PCB substrate to the LED chip (LED Chip) to the lead frame (Lead Frame) (10a, 10b) for supplying current to the LED chip Silver epoxy bumping is applied to apply epoxy 12 at the position where the LED chip is to be fixed on the upper surface 11 of the cathode lead frame 10b among the lead frames 10a and 10b. (S10). FIG. 2A is a view showing a state in which the epoxy 12 is bumped on the top surface 11 of the cathode lead frame 10b, where a) in FIG. 2A is a top view thereof and b) in FIG. 2A is a front view thereof. As shown, it can be seen that the epoxy 12 is bumped on the top surface 11 of the cathode lead frame 10b.

Thereafter, the LED chip 13 is bonded to the silver epoxy bumping part (S20). This process is called a chip bonding process, a) in FIG. 2B is a top view by the chip bonding process, and b) in FIG. 2B is a front view thereof. As shown, it can be seen that the LED chip 13 is adhered to the epoxy bumped portion of the cathode lead frame 10b.

In order to fix the LED chip 13 bonded to the epoxy bumping part, the bumped silver epoxy is hardened using an oven (OVEN) (S30). This process is called a curing process.

After curing is completed, a wire bonding operation is performed for electrical connection between the lead frames 10a and 10b using the gold wire 14 (S40). FIG. 2C is a top view of the wire bonding process, and FIG. 2C b) is a front view thereof. As shown, the upper electrode of the LED chip 13 adhered to the anode lead frame 10a and the cathode lead frame 10b is connected to the gold wire 14.

When the wire bonding is completed, molding the LED chip 13 and the lead frames 10a and 10b to which the LED chip 13 is bonded by using an injection molded product, a mold cup 15, to complete LED packaging. (S50). 2D is a top view of the molded LED package, and b) of FIG. 2D is a front view thereof.

However, the conventional LED packaging method requires an epoxy bumping and an oven curing process to seat the LED chip 13 on the lead frame 10b, and gold to connect the LED chip 13 and the lead frame 10a. A bonding process using a wire is required. Accordingly, the conventional LED packaging method has a disadvantage in that productivity not only decreases due to a complicated process but also increases the process cost due to the use of gold wires. In addition, the LED package produced by the conventional LED packaging method, since the LED chip containing the light emitting portion is molded by the mold cup 15, the LED chip 13 due to poor light emission of the LED chip 13, etc. It is impossible to separate the mold cup 15 if it is to be replaced. Therefore, in this case, the entire LED package is separated from the installed substrate, and a new LED package needs to be installed on the substrate again.

In addition, as the demand for LED is applied to the lighting field is increasing, it is necessary to gradually increase the die size of the LED chip 13 in order to respond to changes in the lighting market in the future. However, in the process of mounting the LED chip 13 through bonding on the lead frame as in the prior art, there is a problem in that a die of a bulky LED chip cannot be packaged. In order to solve this problem, the volume of the upper surface of the lead frame 10b for seating the lead frame 10b and the LED chip 13 should be large, which is a problem in that the unit cost increases.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide an LED packaging device and a packaging method of LEDs that can improve productivity by simplifying the packaging process.

Another object of the present invention is to provide an LED packaging device and a method of packaging an LED that can reduce the process cost in the LED packaging process.

It is still another object of the present invention to provide an LED packaging device and a method for packaging LEDs that allow easy replacement of LED chips from LED packaged products.

Still another object of the present invention is to provide an LED packaging device for lighting and a packaging method for LED for lighting, which can reduce the product cost as the die size of the LED chip increases when a lighting product using the LED is to be configured. There is.

LED packaging method according to an embodiment of the present invention for achieving the above object, the support plate is provided with a lower contact point connected to the lower surface of the chip die with the LED chip, the upper and left sides of the chip die Providing an LED packaging device having a side support attached to an upper surface of the support plate to pressurize each support, and an upper support attached to the upper surface of the support plate to pressurize the upper surface of the LED chip through an provided upper contact; ; And a chip die to which the LED chip is attached, slidingly seated and fixed between the lower contact point of the support plate and the side support and the upper support.

Preferably, the upper support is made of a conductive material integrally with the upper contact. In addition, the lower contact is connected to the anode lead frame, the upper contact is connected to the cathode lead frame. The upper support is formed on one side of the upper contact point is connected to the upper surface of the LED chip, the other side is fixed to the extension extending to the support plate.

The side support and the upper support support the side surfaces of the chip die and the upper surface of the LED chip by elastic pressing. The side support is preferably formed by bending the distal end of the side where the chip die is inserted. In addition, the side support is composed of a non-conductor.

The upper support and the side support is formed integrally and attached to the support plate.

On the other hand, LED packaging device according to an embodiment of the present invention for achieving the above object, the support plate having a lower contact point connected to the lower surface of the chip die with the LED chip is provided on the upper surface; Side supports attached to an upper surface of the support plate to respectively support left and right sides of the chip die seated at the lower contact point; And an upper support attached to the upper surface of the support plate to pressurize and support the upper surface of the LED chip through the provided upper contact point.

The LED packaging device according to the present embodiment includes a socket in which a hole through which the LED chip is coupled is formed, and a lower side of which is molded together with the anode lead frame and the cathode lead frame; And it is composed of a light-transmitting or yag material for transmitting the light emitted from the LED chip, and further comprises a cap coupled to the upper side of the socket.

According to the present invention, it forms a support plate having a lower contact that is connected to the lower surface of the LED chip die attached to the LED chip, and when the LED chip die is inserted in the sliding manner by pressing the side of the inserted LED chip die The LED package packaging process is achieved by forming a side chip support on the support plate so as not to be detached, and including an upper support which is connected to the upper surface of the LED chip and the inserted LED chip die does not escape to the top of the support plate. It can be done more simply, thereby improving productivity and lowering product cost. In addition, when the LED chip is defective, only the inserted LED chip die can be replaced, so the LED chip can be easily replaced.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the same elements in the figures are represented by the same numerals wherever possible. In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

3 is a view showing an LED packaging device employing a slot (SLOT) method according to a preferred embodiment of the present invention.

The LED package 100 of the present embodiment is a method of contacting using the contacts of the LED chip (Chip).

As shown, the LED package 100 of the present embodiment includes a support plate 110, side supports 132 and 134, and an upper support 140.

The support plate 110 is a plate whose top surface is in contact with and seated on the bottom surface of the LED chip die. The support plate 110 is provided with a lower contact portion 120 in contact with the bottom surface of the LED chip.

The side supports 132 and 134 correct the fluidity of the LED chip seated on the lower contact portion 120 of the support plate 110 and support it so as not to shake from side to side. The side supports 132 and 134 are in contact with the left and right sides of the LED chip through the contact surfaces 132a and 134a, and have elastic properties that support the LED chips while pressing them from the left and right sides.

The upper support 140 supports the LED chip so that the LED chip mounted on the support plate 110 is not separated from the upper portion of the support plate 110. At this time, the upper support 140 is provided with a phase contact portion 140a in contact with the upper surface of the LED chip.

In the present embodiment, the upper support 140 including the lower contact portion 120 and the upper contact portion 140a of the support plate 110 is made of a conductive material, and the side supports 132 and 134 are made of non-conductors. Support and secure the LED chip die. Accordingly, the upper support 140 performs the same function as the gold wire connecting the LED chip and the anode lead frame in the LED package process using the conventional wire bonding method.

Therefore, the present invention is fixed by mounting the LED chip by slidingly inserting the LED chip into the support plate 110 using the side supports (132, 134) and the upper support (140), wherein the upper support 140 is made of a conductive material, Adhesive fixing of LED chips using epoxy used in LED packaging process and wire bonding process using gold wire are not required. Accordingly, the LED packaging process can be performed more simply to provide the LED package, and the cost of the product can be lowered because no gold wire is required. In addition, by fixing the LED chip in the slot manner by the side supports 132 and 134 and the upper support 140 without using an adhesive such as epoxy, it is possible to replace the LED chip more easily.

In the present embodiment, the side supports 132 and 134 and the upper support 140 may be integrally manufactured and attached to the support plate 110.

4A and 4B are views illustrating an example of inserting and mounting an LED chip by an LED packaging process according to an embodiment of the present invention. 4A shows an example in which an LED chip is inserted and mounted with one (1 or one) Bonding LED die composed of an upper N layer underneath the upper P layer, and FIG. 4B shows the P layer and N on the upper side of the LED chip. The figure shows an example in which two (2 or two) Bonding LED chip dies with a layer pad PAD are inserted and mounted.

As shown in a) and b) of FIG. 4A, the one bonding LED die 200 is slid mounted in a slotted manner between the side supports 132, 134 and the upper support 140.

In addition, as shown in a) and b) of FIG. 4B, the two bonding LED die 220 is slidably mounted in a slot manner between the side supports 132 and 134 and the upper supports 140a and 140b.

5 is a flowchart illustrating an LED packaging method employing a slot method according to an exemplary embodiment of the present invention.

As shown in the drawing, first, the support plate 110 having the lower contact point 120 connected to the lower portion of the LED chip die 200 to which the LED chip is attached is provided (S110). Thereafter, the side supports 132 and 134 are attached to the upper left and right sides of the support plate 110 (S120).

An upper support 140 having an upper contact point 140a connected to an upper portion of the LED chip die 200 is attached to an end between the side supports 132 and 134 attached to the upper surface of the support plate 110 (S130). Steps S110 to S130 in the present embodiment may be performed as one step by integrating each step without sequentially performing the step.

Thereafter, the LED chip die 200 to which the LED chip is attached is slidably inserted between the side supports 132 and 134 and the upper support 140 (S140). Accordingly, the LED chip die 200 is fixed through each support (132, 134, 140) (S150).

6 to 9 are diagrams illustrating an actual LED lamp manufacturing process using the LED package to which the slot method is applied according to an embodiment of the present invention.

FIG. 6 is a view illustrating a structure of a lead frame for inserting an LED chip 200 into a package for manufacturing a lamp according to the present embodiment and fixing the LED chip 200 from above. FIG. 6A is a top view of the LED chip 200 inserted into the package and the anode lead frame 310 is positioned on the LED chip 200, and FIG. 6B is a front view thereof. 6C is a side view thereof. In the drawing, one side of the anode lead frame 310 is provided with an upper support 140c of the LED chip that performs the same function as the upper support 140 of FIG. 3.

FIG. 7 illustrates a cap for protecting an LED chip sliding and inserted in a slot manner.

In the figure, a) of FIG. 7 is a top view of the cap 400, b) of FIG. 7 is a front view of the cap 400, and c) of FIG. 7 is a side view of the cap 400.

The cap 400 has a circular shape having a rounded upper portion and transmits (transmits) light emitted from the LED chip 200 and protects the LED chip 200 from the outside. In addition, the lower portion of the cap 400 is a portion that is coupled to the socket 500 shown in FIG. In the present embodiment, the cap 400 may be made of a transparent material, or may be made of a yag material.

8 is a view showing a socket coupled to the lower portion of the cap 400 according to an embodiment of the present invention.

8 a) is a top view of the socket 500, b) is a front view of the socket 500, and c) is a side view of the socket 500.

As shown, the socket 500 has a shape in which the outer portion of the upper side thereof is engaged with the inner side of the lower portion of the cap 400 to be rotatably coupled. In addition, a protruding hole 500a through which the LED chip 200 is coupled is formed at the central portion of the socket 500. The lower side of the socket 500 is molded together with the cathode lead frame 320 and the anode lead frame 310.

FIG. 9 is a diagram illustrating an example of fastening an LED lamp using a lead frame, a cap, and a socket into which the LED chip formed by FIGS. 6 to 8 is inserted.

As shown, the socket 500 is written on the lead frames 310 and 330 which are inserted into the LED chip 200 and fixed by the upper support 140c, and the lower part of the socket 500 is connected to the lead frames 310 and 330. Are molded together. In addition, the upper portion of the socket 500 is coupled to the cap 400 is rotationally inserted.

When the LED chip 200 is to be replaced, the LED chip 200 may be easily replaced by simply removing the cap 400 from the socket 500.

In the foregoing, certain preferred embodiments of the present invention have been shown and described. However, the present invention is not limited to the above-described embodiments, and any person having ordinary skill in the art to which the present invention pertains may make various modifications and equivalents without departing from the gist of the present invention attached to the claims. Other implementations may be possible. Therefore, the true technical protection scope of the present invention should be defined only by the appended claims.

1 is a diagram illustrating an LED packaging process using a wire bonding method.

2A to 2D are views illustrating an actual packaging process of LEDs by the LED packaging process using the wire bonding method of FIG. 1.

3 is a view showing an LED packaging device employing a slot (SLOT) method according to a preferred embodiment of the present invention.

4A and 4B are views illustrating an example of inserting and mounting an LED chip by an LED packaging process according to an embodiment of the present invention.

5 is a flowchart illustrating an LED packaging method employing a slot method according to an exemplary embodiment of the present invention.

6 to 9 are diagrams illustrating an actual LED lamp manufacturing process using the LED packaging device is applied slot method according to an embodiment of the present invention.

Claims (16)

A support plate having a lower contact point connected to a lower surface of a chip die to which an LED chip is attached is provided on the upper surface, a side support attached to the upper surface of the support plate so as to pressurize the left and right sides of the chip die, respectively, and an upper contact point provided thereto. Providing an LED packaging device having an upper support attached to an upper surface of the support plate so as to pressurize and support the upper surface of the LED chip through; And And a chip die to which the LED chip is attached, slidingly seated and fixed between the lower contact point of the support plate and the side support and the upper support. The method of claim 1, The upper support is an LED packaging method, characterized in that consisting of a conductive material integrally with the upper contact. The method of claim 1, The lower contact point is connected to the cathode lead frame, the upper contact point is an LED packaging method, characterized in that connected to the anode lead frame. The method of claim 1, The upper support is an LED packaging method, characterized in that the upper contact point is connected to the upper surface of the LED chip is formed on one side, the other side is extended to the support plate and fixedly attached. The method of claim 4, wherein The side support and the upper support, the LED packaging method, characterized in that for supporting the side of the chip die and the upper surface of the LED chip, respectively. The method of claim 1, The side support is LED packaging method characterized in that the end portion of the side is inserted into the chip die is formed curved. The method of claim 1, LED packaging method, characterized in that the side support is composed of a non-conductor. The method of claim 1, And the upper support and the side support are integrally formed and attached to the support plate. A support plate having a lower contact point connected to a lower surface of the chip die to which the LED chip is attached; Side supports attached to an upper surface of the support plate to respectively support left and right sides of the chip die seated at the lower contact point; And LED packaging device comprising an upper support attached to the upper surface of the support plate to support the upper surface of the LED chip through the provided upper contact. The method of claim 9, And the lower contact point is connected to the cathode lead frame and the upper contact point is connected to the anode lead frame. The method of claim 9, LED packaging device, characterized in that the upper support is composed of a conductive material integrally with the upper contact. The method of claim 9, The upper support is an LED packaging device, characterized in that the upper contact point is connected to the upper surface of the LED chip is formed on one side, the other side is extended to the support plate and fixedly attached. The method of claim 12, The side support and the upper support, the LED packaging device, characterized in that to support by pressing the side of the chip die and the upper surface of the LED chip, respectively. The method of claim 9, LED side packaging device, characterized in that consisting of the insulator. The method of claim 9, LED packaging device, characterized in that the upper support and the side support is formed integrally. The method of claim 10, A hole through which the LED chip penetrates is formed therein, and a lower side of the socket is molded together with the cathode lead frame and the anode lead frame; And LED packaging device comprising a cap made of a light-transmitting or yag material for transmitting the light emitted from the LED chip, coupled to the upper side of the socket.

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