KR100959929B1 - Jig for wafer transfer with high efficiency - Google Patents

Jig for wafer transfer with high efficiency Download PDF

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Publication number
KR100959929B1
KR100959929B1 KR1020090078331A KR20090078331A KR100959929B1 KR 100959929 B1 KR100959929 B1 KR 100959929B1 KR 1020090078331 A KR1020090078331 A KR 1020090078331A KR 20090078331 A KR20090078331 A KR 20090078331A KR 100959929 B1 KR100959929 B1 KR 100959929B1
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South Korea
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jig
wafer
hole
circumferential edge
center
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KR1020090078331A
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Korean (ko)
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노진명
권기석
김철수
노영호
정광보
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주식회사제4기한국
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Priority to KR1020090078331A priority Critical patent/KR100959929B1/en
Priority to PCT/KR2009/004970 priority patent/WO2011025083A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer transfer jig with high efficiency is provided to simultaneously process a plurality of wafers by loading the wafers on a plurality of holes which is formed on the inner side or the circumference of the jig. CONSTITUTION: A jig(200) in a disk shape is prepared. The jig is divided into a circumference(201) and an inner side(202). A plurality of holes is arranged along the circle in the inner side of jig. The inner circumference of the holes is divided into upper side and lower side. A protrusion part(300) is formed along the inner side of the jig.

Description

고효율 웨이퍼 이송용 지그{JIG FOR WAFER TRANSFER WITH HIGH EFFICIENCY}JIG FOR WAFER TRANSFER WITH HIGH EFFICIENCY

본 발명은 반도체 또는 LED 제조용 웨이퍼의 이송용 지그에 관한 것으로서, 보다 상세하게는 원판 형상의 지그에 다수 개의 홀을 형성하여 한 번에 다수의 웨이퍼를 이송함으로써 공정 시간을 단축시킬 수 있는 고효율 웨이퍼 이송용 지그에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for transferring wafers for manufacturing semiconductors or LEDs, and more particularly, to forming a plurality of holes in a disc-shaped jig to transfer a plurality of wafers at a time, thereby reducing process time. It is about a dragon jig.

일반적으로 웨이퍼는 반도체나 LED 및 기타 전자 재료용 기본 재료로서 그 요구되는 기능이나 특성에 따라 수많은 공정을 거쳐 완성된다. 또한, 각 공정이 끝날 때에는 이전 공정으로 인해 표면에 남아 있는 미세한 이물질을 제거하기 위한 세정공정을 거치게 되고, 세정공정 후에는 코팅이나 에칭공정을 거치게 된다.Generally, wafers are basic materials for semiconductors, LEDs, and other electronic materials, and are completed through numerous processes depending on their required functions and characteristics. In addition, at the end of each process, a cleaning process is performed to remove fine foreign matter remaining on the surface due to the previous process, and after the cleaning process, a coating or etching process is performed.

이렇게 반도체나 LED의 기본 재료로 형성되기까지의 웨이퍼는 각 공정 간의 요구되는 위치로 이송되어 져야 한다. 이러한 웨이퍼의 이송시에는 통상 동일한 공정을 수행하기 위한 복수개의 웨이퍼가 소정 단위 개수로 카세트에 수용되어 각 공정 설비로 이송되고, 이들 각 공정 설비에는 수용된 웨이퍼를 카세트로부터 인출하여 이송수단을 통해 공정 수행 위치로 이송시키는 이송장치를 구비하고 있다.Thus, the wafer until it is formed of the base material of the semiconductor or LED must be transferred to the required position between each process. In the transfer of such wafers, a plurality of wafers for carrying out the same process are usually accommodated in a cassette in a predetermined number of units and transferred to each process facility. In each of these process facilities, the wafers are taken out of the cassette and the process is performed through a transfer means. It is provided with a conveying apparatus for conveying to a position.

이러한 웨이퍼의 종래의 이송 과정을 살펴보면, 도 1에 도시된 바와 같이, 웨이퍼를 수납한 웨이퍼 카세트(30)가 장착되는 수 개의 카세트 장착부(3a)가 형성된 카세트 로더(3)로부터 보트(5)의 사이에는 작업자가 수동으로 트위저(7)를 사용하여 웨이퍼를 이송하는데, 상기 트위저(7)를 사용하는 작업자는 상기 보트(5) 및 카세트 로더(3)의 사이에 위치하여 미처리된 웨이퍼를 보트(5)로 이송시키거나, 상기 보트(5)로부터 소정의 공정과정을 마친 처리된 웨이퍼를 상기 카세트 로더(3)에 수납된 웨이퍼 카세트(1)로 이송시키며, 이와 같이 웨이퍼가 적재된 보트는 로딩되어 공정 챔버에서 공정이 진행된다. 그러나, 모든 이송작업이 트위저라는 수단을 통해 작업자가 수동으로 처리해야 하므로 시간이 상당히 오래 소요되는 문제가 있었다.Looking at the conventional transfer process of such a wafer, as shown in Figure 1, from the cassette loader (3) having a plurality of cassette mounting portion (3a) on which the wafer cassette 30, which accommodates the wafer, is mounted, In the meantime, the worker manually transfers the wafer using the tweezers 7, and the worker using the tweezers 7 is positioned between the boat 5 and the cassette loader 3 to move the unprocessed wafer to the boat ( 5) or the wafer which has been subjected to the predetermined process from the boat 5 is transferred to the wafer cassette 1 housed in the cassette loader 3, and the boat on which the wafer is loaded is loaded. The process proceeds in the process chamber. However, there is a problem that all the transfer work takes a very long time because the worker must handle manually through a means called tweezers.

이러한 문제를 해결하기 위해, 도 2에 도시된 바와 같이 복수 웨이퍼(10)를 탑재한 카세트(30)가 로딩부 상에 놓이고, 이에 대응 위치된 로봇(20)을 이용하여 카세트(30)로부터 웨이퍼(10)를 인출하고 탑재하는 기술이 등장하였다. 이와 같이 웨이퍼(10)를 인출한 로봇(20)은 이웃하여 설치된 여러 공정 챔버(40)로 웨이퍼(10)를 인계하는데, 웨이퍼(10) 표면에 포토레지스트의 접착 효율성을 높이도록 코팅(adhesion)하는 어드히젼 챔버로 이송하고, 이러한 과정을 마친 웨이퍼(10)를 다시 인출하여 코팅된 막질을 안정화시키는 가열 챔버와 가열 챔버에서 가열된 웨이퍼(10)를 다시 인출하여 냉각시키는 냉각 챔버로 이송시켜 작업이 이루어진다.In order to solve this problem, as shown in FIG. 2, a cassette 30 having a plurality of wafers 10 is placed on a loading unit, and the robot 30 positioned corresponding thereto is used to remove the cassette 30 from the cassette 30. The technique of taking out and mounting the wafer 10 has emerged. As such, the robot 20 which pulls out the wafer 10 takes over the wafer 10 to several process chambers 40 installed adjacent to each other, and the coating 20 enhances the adhesion efficiency of the photoresist on the surface of the wafer 10. Transfers the wafer 10 after the process is completed, and transfers the wafer 10 to the cooling chamber where the heated wafer 10 is redrawn and cooled in the heating chamber. This is done.

그러나, 이러한 종래의 웨이퍼 이송은 웨이퍼를 하나씩 공정 챔버로 이송하면서 작업을 수행해야 하므로 상당히 번거로움이 많았는데, 즉, 하나의 웨이퍼를 공정 챔버에 넣고 작업을 수행한 후에 상기 공정이 완료되면 꺼내어 다시 카세트에 인입후 다시 다른 챔버로 이동시켜 공정을 수행함으로써 시간이 상당히 오래 소요되어 작업 생산성에 문제가 있었다. However, this conventional wafer transfer is quite cumbersome because the work must be performed while transferring the wafers one by one into the process chamber, i.e., after the process is completed after one wafer is placed in the process chamber, it is taken out again. After entering the cassette and moving it to another chamber to carry out the process, the process took a long time, and thus there was a problem in the work productivity.

본 발명은 상술한 문제를 해결하기 위하여 안출된 것으로서, 한 번에 다수의 웨이퍼를 동시에 공정 수행함으로써 공정 시간을 획기적으로 단축시키고, 다양한 종류와 크기의 웨이퍼를 이송시켜 공정 처리하는 것을 그 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and the object of the present invention is to significantly shorten the process time by simultaneously processing a plurality of wafers at once, and to process the wafers by transferring wafers of various types and sizes. .

본 발명은 반도체나 LED 제조용 웨이퍼의 이송용 지그에 있어서, 원판 형상의 지그와, 상기 지그의 가장자리인 원주연과 상기 원주연 내측에 상기 지그와 동일한 중심을 갖는 동심원을 따라 관통 형성된 채 배열된 다수의 원형 홀과, 상기 홀의 내주면의 하부가 상기 홀의 중심 방향으로 돌출 형성된 단턱부와, 상기 원주연 또는 상기 원주연 내측에 형성된 홀의 내주면의 상부가 수평면과 50~70˚의 각도로 상기 홀의 중심을 향해 하향 경사지도록 형성된 경사부를 포함하되, 상기 원주연 내측에 형성된 홀의 단턱부의 지그 중심측 부분이 상기 홀의 중심방향으로 일정한 곡률 반경으로 라운드져 더 돌출 형성된 것을 특징으로 하는 고효율 웨이퍼 이송용 지그를 제공한다.The present invention is a transfer jig of a wafer for manufacturing a semiconductor or LED, a plurality of arranged in the form of a disk-shaped jig, a circumferential edge that is the edge of the jig and a concentric circle having the same center as the jig inside the circumferential edge A circular hole, a stepped portion of which the lower portion of the inner circumferential surface of the hole protrudes toward the center of the hole, and an upper portion of the inner circumferential surface of the hole formed in the circumferential edge or the circumferential edge of the circular hole at an angle of 50 to 70 degrees to the horizontal plane. It includes an inclined portion formed to be inclined downward, the jig center side portion of the stepped portion of the hole formed in the inner circumference is rounded to a constant radius of curvature in the direction of the center of the hole provides a highly efficient wafer transfer jig .

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본 발명에 따르면, 원판 형상 지그의 원주연 또는 그 내측에 다수 형성된 홀에 웨이퍼를 안착시켜 공정 챔버로 이송하여 공정수행을 함으로써, 한 번에 다수의 웨이퍼를 동시에 처리할 수 있고, 공정 시간을 획기적으로 단축시킬 수 있으며, 더불어 다양한 종류와 크기의 웨이퍼를 이송시켜 처리할 수 있는 우수한 효과를 제공한다.According to the present invention, by seating the wafer in the circumferential periphery of the disc-shaped jig or a plurality of holes formed therein, the wafer is transferred to the process chamber to perform a process, thereby simultaneously processing a plurality of wafers at a time, and dramatically reducing the process time. In addition, it can provide a good effect to transfer and process wafers of various types and sizes.

이하 첨부된 도면을 참고로 하여 본 발명에 대하여 상세하게 설명한다. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 일실시예인 이송용 지그의 평면도, 도 4는 본 발명에 따른 또다른 실시예인 이송용 지그의 평면도, 도 5는 본 발명에 따른 이송용 지그의 측면도, 도 6은 도 4의 A부분의 확대도, 도 7은 본 발명의 공정 순서를 나타낸 구성도이다.Figure 3 is a plan view of a transfer jig according to an embodiment of the present invention, Figure 4 is a plan view of a transfer jig according to another embodiment of the present invention, Figure 5 is a side view of the transfer jig according to the present invention, Figure 6 is a view 4 is an enlarged view of a portion A, and FIG. 7 is a configuration diagram showing the process sequence of the present invention.

도 3에 도시된 바와 같이, 본 발명은 원판 형상의 지그(200)가 구비되고, 상기 지그(200)는 그 가장자리 부분인 원주연(201)(圓周緣, circumferential edge)과 상기 원주연의 내측(202)으로 구분된다. As shown in Figure 3, the present invention is provided with a disc-shaped jig 200, the jig 200 is a circumferential edge (201) (circumferential edge) and the inner edge of the circumference (202).

이러한 상기 지그(200)의 가장자리인 원주연(201)에는 상기 지그(200)와 동일한 중심을 갖는 동심원(205)을 따라 동일한 직경을 갖는 다수의 원형의 홀(340)이 서로 일정한 거리를 유지하며 이격된 채 관통 형성되고, 이러한 홀(340)의 크기는 가공하고자 하는 웨이퍼의 규격에 맞춰 형성함으로써 다양한 크기의 웨이퍼를 처리하는 것이 용이하다. In the circumferential edge 201, which is an edge of the jig 200, a plurality of circular holes 340 having the same diameter along the concentric circles 205 having the same center as the jig 200 maintain a constant distance from each other. It is formed to be spaced apart from each other, the size of the hole 340 is formed in accordance with the size of the wafer to be processed, it is easy to process a variety of wafer size.

도 5에 도시된 바와 같이, 상기 홀(340)의 내주면(內周面)은 상부(203)와 하부(204)로 구분되는데, 상기 홀(340)의 내주면의 하부(204)에는 상기 홀(340)의 중심 방향으로 단턱부(300)가 돌출되어 형성되어 웨이퍼(100)가 지그에 안착될 수 있도록 구성된다.As shown in FIG. 5, an inner circumferential surface of the hole 340 is divided into an upper portion 203 and a lower portion 204, and a lower portion 204 of the inner circumferential surface of the hole 340 is formed in the hole 340. The stepped portion 300 protrudes in the center direction of the 340 and is configured to allow the wafer 100 to be seated on the jig.

또한, 상기 원주연의 내측(202)에도 상기 지그(200)와 동일한 중심을 갖는 동심원(206)을 따라 다수의 원형 홀(340)이 형성되어 웨이퍼 이송 및 처리 효율을 증대시켜 공정 시간을 더더욱 단축시키는 것이 바람직한데, 상기 원주연(201)을 따라 형성된 홀(340)과 같이 상기 원주연의 내측(202)을 따라 형성된 홀(340)의 내주면의 하부(204)에도 상기 홀의 중심방향으로 단턱부(300)가 돌출 형성된다.In addition, a plurality of circular holes 340 are formed on the inner side 202 of the circumference along the concentric circle 206 having the same center as the jig 200, thereby increasing wafer transfer and processing efficiency to further shorten the process time. Preferably, the lower portion 204 of the inner circumferential surface of the hole 340 formed along the inner side 202 of the circumferential edge, such as the hole 340 formed along the circumferential edge 201, is stepped toward the center of the hole. 300 is formed to protrude.

이때, 도 4에 도시된 바와 같이, 상기 원주연의 내측(202)을 따라 형성된 홀의 단턱부(340)는 지그 중심측의 단턱부(330)가 다른 방향의 단턱부보다 더 돌출 형성되는 것이 바람직하고, 상기 지그 중심측의 단턱부(330)는 위에서 보았을 때 원호의 형상으로 돌출 형성된다. 이는 로봇암(500)의 흡착부(520)가 지그를 진공 흡착하여 보다 안전하게 이송시킬 수 있는 공간을 제공하기 위함이다. At this time, as shown in Figure 4, the stepped portion 340 of the hole formed along the inner side 202 of the circumferential edge it is preferable that the stepped portion 330 of the jig center side is formed to protrude more than the stepped portion in the other direction And, the stepped portion 330 of the jig center side is formed to protrude in the shape of an arc when viewed from above. This is to provide a space for the adsorption unit 520 of the robot arm 500 to vacuum-suck the jig for safer transport.

그리고, 도 5에 도시된 바와 같이, 상기 원주연(201) 또는 원주연의 내측(202)을 따라 형성된 홀(340)의 내주면의 상부(203)는, 수평면과 일정한 각도(α)를 이루면서 상기 홀의 중심을 향해 하향하여 경사지도록 형성되어 있는데, 이와 같이 상기 홀의 내주면의 상부(203)가 하향 경사짐으로써 웨이퍼(100)에 물리적 손상을 가하지 않고 안전하게 홀(340)에 가공된 단턱부(300)로 안착시킬 수 있도록 안내할 수 있다.5, the upper portion 203 of the inner circumferential surface of the hole 340 formed along the circumferential edge 201 or the inner side 202 of the circumferential edge forms an angle α with a horizontal plane. The upper portion 203 of the inner circumferential surface of the hole is inclined downward so as to be inclined downward toward the center of the hole. Thus, the stepped portion 300 safely processed in the hole 340 without physically damaging the wafer 100. You can guide them to rest.

즉, 웨이퍼(100)는 홀의 내주면의 상부(203)에 형성된 경사면을 따라서 미끄러지면서 하강하여 최종적으로는 손상없이 단턱부(300)상에 용이하게 안착할 수 있는 것이다. 이 때, 도 6에 도시된 바와 같이, 홀의 내주면의 상부(203)가 수평면과 이루는 각도(α)는 50 ~ 70도인 것이 바람직하다. 상기 각도가 70°보다 크면 웨이퍼(100)의 위치가 홀(340)의 위치와 조금이라도 어긋날때 웨이퍼(100)가 단턱부(300)에 용이하게 안내되지 못하고, 잘못된 센터링(centering)으로 웨이퍼가 손상될 수 있으며, 그 각도가 50°보다 작으면 경사가 너무 완만하여 웨이퍼(100)와 경사면의 마찰면적이 커져 오히려 웨이퍼가 단턱부(300)상에 정확히 안착되는 것을 방해하여 웨이퍼가 비스듬히 놓여 후속공정의 처리가 곤란할 수도 있다.That is, the wafer 100 slides down along the inclined surface formed on the upper portion 203 of the inner circumferential surface of the hole, and thus can be easily seated on the stepped portion 300 without any damage. At this time, as shown in Figure 6, it is preferable that the angle alpha that the upper portion 203 of the inner circumferential surface of the hole forms with the horizontal plane is 50 to 70 degrees. If the angle is greater than 70 °, when the position of the wafer 100 is slightly shifted from the position of the hole 340, the wafer 100 may not be easily guided to the step 300, and the wafer may be misaligned. If the angle is smaller than 50 °, the inclination is too gentle to increase the friction area between the wafer 100 and the inclined surface, which prevents the wafer from accurately seating on the stepped portion 300, thereby causing the wafer to be placed obliquely. Treatment of the process may be difficult.

이하에서는 본 발명의 작동 과정을 도면을 참조하여 상세하게 설명한다.Hereinafter, the operation of the present invention will be described in detail with reference to the drawings.

도 7에 도시된 바와 같이, 먼저 인입용 카세트(400)에 장착되어 있는 다수의 웨이퍼(100)를 로봇암(500)에 의해 로딩부(700)에 위치한 지그(200)의 홀(340)상에하나씩 적재한다. 이 때, 웨이퍼가 정확히 안착될 수 있도록 위치 조정을 위해 로봇암(500)에 놓여진 웨이퍼(100)를 인입용 버퍼부(550)의 안착부에 잠시 안착시킨 후에 로봇암(500)을 후퇴시켰다가 로봇암의 웨이퍼 로딩부가 상기 인입용 버퍼부(550)의 안착부에 정확히 맞도록 로봇암(500)을 위치시킨 후에 인입용 버퍼부(550)로부터 인출하여 로딩부(700)에 있는 지그(200)의 홀(340)에 하나씩 안착시킨다. 이는 로봇암(500)이 인입용 카세트(400)로부터 웨이퍼 인출시 웨이퍼가 로봇암(500)의 잘못된 위치에 놓여진 채로 이송장치로 운반되는 것을 방지하기 위함이 다.As shown in FIG. 7, first, a plurality of wafers 100 mounted on the cassette 400 for pulling in are placed on the holes 340 of the jig 200 positioned in the loading unit 700 by the robot arm 500. Load one by one. At this time, the wafer 100 placed on the robot arm 500 is temporarily settled on the seating part of the inlet buffer part 550 to adjust the position so that the robot arm 500 is retracted. The robot arm 500 is positioned so that the wafer loading portion of the robot arm exactly fits the seating portion of the pulling buffer portion 550, and then is drawn out from the pulling buffer portion 550 to be jig 200 in the loading portion 700. 1) to be seated in the hole (340). This is to prevent the robot arm 500 from being transported to the transfer apparatus while the wafer is withdrawn from the cassette 400 for the wafer while being placed at the wrong position of the robot arm 500.

지그(200)는 회전이 가능하도록 설계되어 있고, 로봇암(500)과 가장 가까운 곳에 위치하는 홀(340)의 하측에 네 개의 실린더(351,352,353,354)가 구비되어 로봇암(500)이 웨이퍼(100)를 운송해 오면 네 개의 실린더(351,352,353,354)가 홀(340)의 상부로 상승하게 된다. 이와 같이 상승 이동한 4개 실린더들은 동일한 높이를 갖고 있어 로봇암(500)에 의해 운반된 웨이퍼(100)가 중심을 잃지 않고 정확히 놓일 수 있도록 되어 있다. 상기 실린더들에 웨이퍼(100)가 놓여지면 실린더들은 다시 하강하면서 홀(340)의 단턱부(300)에 웨이퍼가 정확히 안착된 후, 지그(200)는 회전하여 다음 홀(340)에 또 다른 웨이퍼가 놓일 수 있도록 한다. 이러한 작업을 계속 반복함으로써 지그(200)의 다수의 홀(340)에 처리될 웨이퍼를 모두 안착시키게 된다.The jig 200 is designed to be rotatable, and four cylinders 351, 352, 353, and 354 are provided below the hole 340 positioned closest to the robot arm 500, so that the robot arm 500 is provided with the wafer 100. The four cylinders 351, 352, 353, 354 will be raised to the top of the hole 340 when transporting. As such, the four cylinders moved upwardly have the same height so that the wafer 100 carried by the robot arm 500 can be accurately placed without losing its center. When the wafers 100 are placed in the cylinders, the cylinders are lowered again, and after the wafers are accurately seated in the stepped portions 300 of the holes 340, the jig 200 rotates to further wafers in the next holes 340. To be placed. By repeating this operation, all of the wafers to be processed are seated in the plurality of holes 340 of the jig 200.

상기 과정이 끝나면 처리될 웨이퍼가 모두 안착된 지그는 로봇암의 진공 흡착부(520)에 의해 흡착되어 공정 챔버(600) 내로 이송된 후 공정 작업이 시작된다. 상기 공정 챔버(600) 내에서 해당 공정이 완료되면 로봇암(500)은 공정 챔버(600)내의 지그(200)를 언로딩부(800)로 운송하고, 공정이 완료된 웨이퍼를 인출용 카세트(450)에 하나씩 인입시킨다. 다만, 정확한 위치 조정을 위해 인출용 버퍼부(560)의 안착부에 웨이퍼를 안착시킨 후 다시 인출용 카세트(450)로 이송하게 되는 것이다. 이와 같이 해당 공정이 완료된 웨이퍼는 외부로 인출하여 다음 공정을 수행하게 된다.After the process is completed, the jig in which all the wafers to be processed are seated is adsorbed by the vacuum adsorption unit 520 of the robot arm, transferred to the process chamber 600, and the process operation is started. When the process is completed in the process chamber 600, the robot arm 500 transports the jig 200 in the process chamber 600 to the unloading unit 800, and the wafer for which the process is completed is taken out of the cassette 450. ) One by one. However, the wafer is placed on the seating portion of the takeout buffer 560 for accurate position adjustment and then transferred to the takeout cassette 450 again. As such, the wafer having completed the process is taken out to perform the next process.

이 때, 공정 챔버(600) 내에서 공정이 진행 중인 동안에도, 로봇암(500)을 이용하여 인입용 카세트(400)로부터 로딩부(700)에 있는 다른 지그에 웨이퍼를 안착시키는 작업을 수행함에 의해 공정 챔버(600)내로의 진입하기 전에 미리 대기할 수도 있고, 로봇암(500)을 이용하여 언로딩부(800)에 있는 공정이 완료된 웨이퍼가 안착된 또 다른 지그로부터 웨이퍼를 하나씩 인출하여 인출용 카세트(450)로 운반할 수도 있으므로, 공정 시간이 대폭 단축될 수 있다.At this time, while the process is in progress in the process chamber 600, the robot arm 500 is used to mount the wafer from the draw cassette 400 to another jig in the loading unit 700. By waiting before entering into the process chamber 600 by using, or by using the robot arm 500, the wafer is withdrawn from another jig on which the wafer in the unloading unit 800 is completed is seated one by one Since it can also be carried in the cassette 450, the process time can be significantly shortened.

도 1은 종래의 웨이퍼 수동 이송공정을 나타낸 개략도.1 is a schematic view showing a conventional wafer manual transfer process.

도 2는 종래의 웨이퍼 이송장치의 사시도.2 is a perspective view of a conventional wafer transfer apparatus.

도 3은 본 발명에 따른 일실시예인 이송용 지그의 평면도.3 is a plan view of a transfer jig according to one embodiment of the present invention.

도 4는 본 발명에 따른 또 다른 실시예인 이송용 지그의 평면도.4 is a plan view of a transfer jig according to another embodiment of the present invention.

도 5는 본 발명에 따른 이송용 지그의 측면도.Figure 5 is a side view of the jig for transfer according to the invention.

도 6은 도 4의 A부분의 확대도.6 is an enlarged view of a portion A of FIG. 4.

도 7은 본 발명의 공정 순서를 나타낸 구성도.7 is a block diagram showing a process sequence of the present invention.

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

3:카세트 로더 3a:카세트 장착부3: cassette loader 3a: cassette mounting part

5:보트 7:트위저5: Boat 7: Tweezers

10:웨이퍼 20:로봇암10: wafer 20: robot arm

30:카세트 40:공정 챔버30: cassette 40: process chamber

100:웨이퍼 200:지그100: wafer 200: jig

201:원주연(圓周緣) 202:원주연의 내측201: Wonjuyeon 202: Inner side of Wonjuyeon

203:내주면(內周面) 상부 204:내주면(內周面) 하부203: Upper inner circumferential surface 204: Lower inner circumferential surface

205:원주연의 동심원 206:원주연 내측의 동심원205: concentric circles of the circumference 206: concentric circles of the inner circumference

300:단턱부 330:지그 중심측의 단턱부
335:경사부 340:홀300: step part 330: step part of the jig center side
335: Tilt part 340: Hall

351,352,353,354:실린더 400:인입용 카세트351,352,353,354: Cylinder 400: Drawer cassette

450:인출용 카세트 500:로봇암 450: Drawer cassette 500: Robot arm

520:흡착부 550:인입용 버퍼부 520: adsorption part 550: retraction buffer part

560:인출용 버퍼부 600:공정 챔버560: take-out buffer 600: process chamber

700:로딩부 800:언로딩부 700: loading part 800: unloading part

Claims (5)

반도체나 LED 제조용 웨이퍼의 이송용 지그에 있어서, In the jig for transferring the wafer for semiconductor and LED manufacturing, 원판 형상의 지그와,Jig of disc shape, 상기 지그의 가장자리인 원주연과 상기 원주연 내측에 상기 지그와 동일한 중심을 갖는 동심원을 따라 관통 형성된 채 배열된 다수의 원형 홀과,A plurality of circular holes arranged in a circumferential edge which is an edge of the jig and formed through a concentric circle having the same center as the jig inside the circumferential edge; 상기 홀의 내주면의 하부가 상기 홀의 중심 방향으로 돌출 형성된 단턱부와,A stepped portion in which a lower portion of the inner circumferential surface of the hole protrudes toward the center of the hole, 상기 원주연 또는 상기 원주연 내측에 형성된 홀의 내주면의 상부가 수평면과 50~70˚의 각도로 상기 홀의 중심을 향해 하향 경사지도록 형성된 경사부를 포함하되,An upper portion of the inner circumferential surface of the hole formed in the circumferential edge or the circumferential edge includes an inclined portion formed to be inclined downward toward the center of the hole at an angle of 50 to 70 degrees with a horizontal plane, 상기 원주연 내측에 형성된 홀의 단턱부의 지그 중심측 부분이 상기 홀의 중심방향으로 일정한 곡률 반경으로 라운드져 더 돌출 형성된 것을 특징으로 하는 고효율 웨이퍼 이송용 지그.The jig center side portion of the stepped portion of the hole formed inside the circumferential edge is rounded to a predetermined radius of curvature in the center direction of the hole and further protruded. 삭제delete 삭제delete 삭제delete 삭제delete
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Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH07201836A (en) * 1993-12-28 1995-08-04 Fuji Electric Co Ltd Structure of wafer holder in manufacturing apparatus for semiconductor device

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JP2007109771A (en) * 2005-10-12 2007-04-26 Matsushita Electric Ind Co Ltd Tray for plasma treatment apparatus
KR101292626B1 (en) * 2006-09-15 2013-08-01 주성엔지니어링(주) Substrate safe arrival device and apparatus for substrate processing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201836A (en) * 1993-12-28 1995-08-04 Fuji Electric Co Ltd Structure of wafer holder in manufacturing apparatus for semiconductor device

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