KR100947441B1 - Lighting apparatus using light emitting diode - Google Patents

Lighting apparatus using light emitting diode Download PDF

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Publication number
KR100947441B1
KR100947441B1 KR1020070141497A KR20070141497A KR100947441B1 KR 100947441 B1 KR100947441 B1 KR 100947441B1 KR 1020070141497 A KR1020070141497 A KR 1020070141497A KR 20070141497 A KR20070141497 A KR 20070141497A KR 100947441 B1 KR100947441 B1 KR 100947441B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
heat dissipation
dissipation plate
wiring
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Application number
KR1020070141497A
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Korean (ko)
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KR20090073528A (en
Inventor
오광용
조유정
Original Assignee
서울반도체 주식회사
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Priority to KR1020070141497A priority Critical patent/KR100947441B1/en
Publication of KR20090073528A publication Critical patent/KR20090073528A/en
Application granted granted Critical
Publication of KR100947441B1 publication Critical patent/KR100947441B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting diode lighting apparatus, and provides a light emitting diode lighting apparatus including a heat dissipation plate made of a metal material and a light emitting diode mounted on a side of the heat dissipation plate.

Lighting device, heat dissipation plate, light emitting diode, reflector

Description

Light emitting diode lighting device {Lighting apparatus using light emitting diode}

The present invention relates to a lighting apparatus using a light emitting diode, and more particularly, to a light emitting diode lighting apparatus in which a light emitting diode is mounted on a side surface of a heat dissipation plate.

The light-emitting diode forms a P / N junction on a group III or V compound semiconductor on a wafer to apply forward current to induce light emission in the visible or near infrared and infrared wavelength bands to display, communicate, measure, control, illuminate, and It is applied to the field.

FIG. 1 is a schematic plan view of a LED lighting apparatus according to the prior art, and FIG. 2 is a cross-sectional view of the LED lighting apparatus illustrated in FIG. 1 taken along line II.

1 and 2, a light emitting diode lighting apparatus 50 according to the related art includes a printed circuit board board 10, a light emitting diode 20, a cover 30, and a phosphor layer 40.

A plurality of light emitting diodes 20 are mounted on the printed circuit board 10, and the cover 30 is attached to the printed circuit board 10. In this case, the cover 30 is attached to protect the light emitting diode 20 and is formed of a transparent material to transmit light emitted from the light emitting diode 20. The phosphor layer 40 is coated on the inner surface of the cover 30 to convert the light emitted from the light emitting diode 20 into wavelength to emit white light or various colors.

In general, the brightness of a light emitting diode is proportional to the current applied to the light emitting diode. However, in order to brighten the brightness of the light emitting diode, a high current must be applied. However, when a high current is applied, the light emitting diode is damaged due to heat emitted from the light emitting diode.

In addition, in the case of manufacturing a lighting device by mounting a light emitting diode on a printed circuit board as in the prior art, since the corresponding number of light emitting diodes should be mounted in order to illuminate a large area, the manufacturing cost of the lighting device increases. The problem arises.

The present invention is to overcome the above-mentioned conventional problems, to improve the heat dissipation efficiency to provide a light emitting diode lighting device with high product reliability.

In addition, it is to provide a light emitting diode illumination device that can illuminate a large area with a small number of light emitting diodes.

According to an exemplary embodiment of the present invention, a heat dissipation plate made of a metal material; And a light emitting diode mounted on a side surface of the heat dissipation plate.

An insulation layer formed on the heat dissipation plate; A power supply unit formed on the heat dissipation plate and supplying power to the light emitting diode; And a wire for electrically connecting the power supply unit and the light emitting diode.

The heat dissipation plate may be formed in the shape of a polygon.

It further includes a reflector disposed to surround the heat dissipation plate.

The light emitting diode may further include a light emitting diode mounted on a plane of the heat dissipation plate.

The thickness of the heat dissipation plate is formed equal to or larger than the size of the light emitting diode.

A fastening part formed at an end of the wiring is further included, and the light emitting diode is inserted into the fastening part and electrically connected to the wiring.

By mounting the light emitting diode on the side of the heat dissipation plate made of a metal material, it is possible to illuminate a large area while using less light emitting diode.

In addition, by mounting the light emitting diode on the heat dissipation plate, it is possible to effectively discharge the heat emitted from the light emitting diode, it is possible to improve the durability of the lighting device.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

3 is a plan view of the LED lighting apparatus according to the first embodiment of the present invention, Figure 4 is a side view of the LED lighting apparatus shown in FIG.

3 and 4, the LED lighting apparatus 100 according to the first embodiment of the present invention includes a heat dissipation plate 110, an insulating layer 120, a power distribution unit 130, and a power supply unit 140. , A wiring 150, and a light emitting diode 160.

The heat dissipation plate 110 is formed in a polygonal plate shape and is made of a metal having excellent thermal conductivity, for example, copper or aluminum. In the present embodiment, the heat dissipation plate 110 is formed in the shape of an octagon, but this is only an example for description and may be formed in the shape of various polygons such as triangle, square or pentagon.

In addition, the thickness of the heat dissipation plate 110 is at least equal to or larger than the size of the light emitting diode 160.

The insulating layer 120 is formed on the heat dissipation plate 110. The insulating layer 120 is formed on one surface of the heat dissipation plate 110 and may also be formed on the side surface of the heat dissipation plate 110.

The power distribution unit 130 and the power supply unit 140 are formed on the heat dissipation plate 110 and perform a function of applying power supplied from the outside to the light emitting diode 160. In the present embodiment, the power supply unit 140 is formed in the form of a connector, but is not limited to the form of the power supply unit 140 may be formed in various forms.

In order to electrically connect the power distribution unit 130 and the light emitting diodes 160, one end of the wiring 150 is connected to the power distribution unit 130, and the other end of the wiring 150 is formed on the upper surface of the heat dissipation plate 110 or It extends to the side of the heat dissipation plate 160 through the bottom surface. In order to prevent electrical connection between the wiring 150 and the heat dissipation plate 110, the insulating layer 120 described above is interposed between the wiring 150 and the heat dissipation plate 110.

The light emitting diode 160 is mounted on the side surface of the heat dissipation plate 110. In this embodiment, the light emitting diodes 160 are mounted on each of eight side surfaces of the octagonal heat dissipation plate. As in the case of this embodiment, one light emitting diode may be mounted on one side, and several light emitting diodes may be mounted on one side as necessary.

In this case, the light emitting chip of the light emitting diode 160 may use a semiconductor PN junction diode. The semiconductor PN junction diode joins the P and N semiconductors, and then applies a voltage, and the holes of the P-type semiconductor move toward the N-type semiconductor and collect into the middle layer. In contrast, electrons of the N-type semiconductor move toward the P-type semiconductor and conduction bands. gather in the middle floor, the lowest point of the conduction band. These electrons naturally fall into the holes of the valence band, and at this point, they emit as much energy as the difference in height between the conduction band and the appliance band, that is, the energy gap, which is emitted in the form of light. In addition, various light emitting chips may be used. In addition, the light emitting chip may emit light having various wavelengths. For this purpose, for example, the light emitting chip may control the indium (In) content used as an active layer in a nitride-based light emitting diode or emit light having different wavelengths. It is also possible to use a combination of diodes, or a light emitting chip that emits light of a predetermined wavelength such as ultraviolet light and a phosphor.

In addition, the light emitting diode 160 is connected to the wiring 150 through soldering. As a result, the power applied through the power supply 140 and the power distribution unit 130 is connected to the light emitting diode 160 through the wiring 150. Is applied to.

When the light emitting diode illumination device is configured as in the embodiment of the present invention, heat emitted from the light emitting diode is easily discharged to the outside through the heat dissipation plate, thereby improving durability of the light emitting diode illumination device. In addition, since the light emitting diode is mounted on the side of the heat dissipation plate, it is possible to obtain an effect that is easy to illuminate a wider area.

FIG. 5 is a schematic perspective view of a LED lighting apparatus according to a second embodiment of the present invention. FIG. 6 is a view illustrating a process of mounting a LED to the LED lighting apparatus shown in FIG. 5. 5 is a side view illustrating a state in which a light emitting diode is mounted on the light emitting diode illuminating device shown in FIG. 5. The LED lighting apparatus according to the second embodiment of the present invention is different from the mounting method of the LED in comparison with the first embodiment of the present invention.

5 to 7, the LED lighting apparatus 200 according to the second embodiment of the present invention includes a heat dissipation plate 210, an insulating layer 220, a power distribution unit 230, and a power supply unit 240. , A wiring 250, a fastening part 255, and a light emitting diode 260.

The heat dissipation plate 210 made of a metal material is formed in a polygonal plate shape, and an insulating layer 220 is formed on the heat dissipation plate 210. The power distribution unit 230 and the power supply unit 240 are formed on the heat dissipation plate 210 and perform a function of applying power supplied from the outside to the light emitting diode 260.

In order to electrically connect the power distribution unit 230 and the light emitting diodes 160, one end of the wiring 250 is connected to the power distribution unit 230, and the other end of the wiring 250 may be an upper surface or a lower surface of the heat dissipation plate 210. Through the surface, it is formed extending to the side of the heat dissipation plate 260. In order to prevent electrical connection between the wiring 250 and the heat dissipation plate 210, the wiring 250 is formed on the insulating layer 220.

The fastening part 255 is formed to be connected to the other end of the wiring 250. In the present embodiment, the fastening part 255 is integrally formed with the wiring 250. However, the present invention is not limited thereto, and the fastening part 255 may be manufactured separately from the wiring 250 and then bonded to the fastening part 255.

One end of the fastening part 255 is connected to the other end of the wiring 250, the other end of the fastening part is formed to be in close contact with the side of the heat dissipation plate 210, and the middle region of the fastening part 255 is a heat dissipation plate ( 210 is spaced apart from the side.

The light emitting diode 260 is mounted on the side surface of the heat dissipation plate 210. The light emitting diode 260 includes a package body 261 composed of a light emitting chip and a molding part and a lead frame 263. The lead frame 263 of the light emitting diode 260 is mounted in a manner of being inserted into and fixed to the fastening part 255.

In the present embodiment, the light emitting diode is connected to the wiring only by the contact between the lead frame 263 and the fastening portion 255 of the light emitting diode 260, but in order to more securely fix the light emitting diode to the wiring, the conductive resin may be connected to the lead frame. It may be applied to the contact area of the fastening part.

8 is a schematic side view of a LED lighting apparatus according to a third embodiment of the present invention. The LED lighting apparatus according to the third embodiment of the present invention differs from the above-described embodiments in that it includes a reflector, and the rest of the configuration is similar, and the following description will focus on different configurations.

Referring to FIG. 8, the LED lighting apparatus 300 according to the third embodiment of the present invention may include a heat dissipation plate 310, an insulating layer 320, a power distribution unit (not shown), a power supply unit (not shown), The wiring 350 includes a light emitting diode 360 and a reflector 370.

The heat dissipation plate 310 made of a metal material is formed in a polygonal plate shape, and an insulating layer 320 is formed on the heat dissipation plate 310. The power distribution unit and the power supply unit are formed on the heat dissipation plate 310 and perform a function of applying power supplied from the outside to the light emitting diode 360.

The wiring 350 is formed on the insulating layer 320, and the light emitting diode 360 is mounted on the side surface of the heat dissipation plate 310 and connected to the wiring 350.

The reflector 370 is formed to surround the heat dissipation plate 310 and attached to the heat dissipation plate 310. The reflector 370 may use a metal material, plastic, glass, or the like, and may be formed in a conical shape, but the material and shape of the reflector are not limited thereto. In addition, when the reflector 370 is formed of a material having a low reflectance such as plastic or glass, the reflector 370 may be coated with a material having excellent reflectance such as aluminum or silver to improve the reflectance. have.

As such, when the reflector is provided, an effect of controlling the emission angle of the light emitted from the light emitting diode is obtained.

9 is a schematic side view of a LED lighting apparatus according to a fourth embodiment of the present invention.

9, the LED lighting apparatus 400 according to the fourth embodiment of the present invention includes a heat dissipation plate 410, an insulating layer 420, a power distribution unit (not shown), a power supply unit (not shown), The wiring 450 includes a first light emitting diode 460, a reflector 470, and a second light emitting diode 480.

The heat dissipation plate 410 made of a metal material is formed in a polygonal plate shape, and an insulating layer 420 is formed on the heat dissipation plate 410. The insulating layer 420 is formed on the top, bottom and side surfaces of the heat dissipation plate 410. The wiring 450 is formed on the insulating layer 420.

The first light emitting diode 460 is mounted on the side of the heat dissipation plate 410, and the second light emitting diode 480 is mounted on the top or bottom surface of the heat dissipation plate 410. In addition, the reflector 470 is formed to surround the heat dissipation plate 410 and is attached to the heat dissipation plate 410.

What has been described above is merely an exemplary embodiment of the LED lighting apparatus according to the present invention, and the present invention is not limited to the above-described embodiment, and as claimed in the following claims, it departs from the gist of the present invention. Without this, anyone skilled in the art to which the present invention pertains will have the technical spirit of the present invention to the extent that various modifications can be made.

1 is a schematic plan view of a LED lighting apparatus according to the prior art.

FIG. 2 is a cross-sectional view of the LED lighting apparatus illustrated in FIG. 1 taken along line II.

3 is a plan view of the LED lighting apparatus according to the first embodiment of the present invention.

4 is a side view of the LED lighting apparatus shown in FIG. 3.

5 is a schematic perspective view of a LED lighting apparatus according to a second embodiment of the present invention.

FIG. 6 is a diagram illustrating a process of mounting a light emitting diode to the light emitting diode lighting apparatus illustrated in FIG. 5.

FIG. 7 is a side view illustrating a state in which a light emitting diode is mounted on the light emitting diode illuminating device shown in FIG. 5.

8 is a schematic side view of a LED lighting apparatus according to a third embodiment of the present invention.

9 is a schematic side view of a LED lighting apparatus according to a fourth embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

110, 210, 310, 410: heat dissipation plate

120, 220, 320, 420: insulation layer

130, 230: power distribution

140, 240: power supply

150, 250, 350, 450: wiring

255: fastening part

160, 260, 360, 460: Light Emitting Diode

370, 470: reflector

Claims (7)

A heat dissipation plate made of a metallic material having at least an upper surface, a lower surface and a side surface; A light emitting diode mounted on a side of the heat dissipation plate; A power supply unit formed on an upper surface of the heat dissipation plate and supplying power to the light emitting diode; A wire electrically connecting the power supply unit and the light emitting diode; And And an insulating layer formed on the heat dissipation plate and interposed between the heat dissipation plate and the wiring. delete The method of claim 1, The heat dissipation plate is a light emitting diode illumination device, characterized in that formed in the shape of a polygon. The method of claim 1, And a reflector arranged to surround at least a side of the heat dissipation plate. The method of claim 1, And a light emitting diode mounted on a bottom surface of the heat dissipation plate. The method of claim 1, The thickness of the heat dissipation plate is a light emitting diode illumination device, characterized in that formed in the same or larger than the size of the light emitting diode. The method of claim 1, Further comprising a fastening portion formed at an end of the wiring to include a portion spaced apart from the side of the heat dissipation plate, The light emitting diode includes a lead frame, The light emitting diode is a light emitting diode illumination device, characterized in that the lead frame is inserted into the spaced portion formed in the fastening portion, and electrically connected to the wiring.
KR1020070141497A 2007-12-31 2007-12-31 Lighting apparatus using light emitting diode KR100947441B1 (en)

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KR1020070141497A KR100947441B1 (en) 2007-12-31 2007-12-31 Lighting apparatus using light emitting diode

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Application Number Priority Date Filing Date Title
KR1020070141497A KR100947441B1 (en) 2007-12-31 2007-12-31 Lighting apparatus using light emitting diode

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KR100947441B1 true KR100947441B1 (en) 2010-03-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130094973A (en) * 2012-02-17 2013-08-27 엘지이노텍 주식회사 Lighting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100629496B1 (en) * 2005-08-08 2006-09-28 삼성전자주식회사 Led package structure and manufacturing method for the same
KR200430022Y1 (en) * 2006-07-05 2006-11-02 주식회사 티씨오 Lighting for High brightness light emitting diode
KR20070013669A (en) * 2005-07-27 2007-01-31 소니 가부시끼 가이샤 Radiator for light emitting unit, and backlight device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070013669A (en) * 2005-07-27 2007-01-31 소니 가부시끼 가이샤 Radiator for light emitting unit, and backlight device
KR100629496B1 (en) * 2005-08-08 2006-09-28 삼성전자주식회사 Led package structure and manufacturing method for the same
KR200430022Y1 (en) * 2006-07-05 2006-11-02 주식회사 티씨오 Lighting for High brightness light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130094973A (en) * 2012-02-17 2013-08-27 엘지이노텍 주식회사 Lighting device

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