KR100943470B1 - The device for coating photoresist and the method for driving the same - Google Patents

Abstract

The present invention relates to a photoresist coating apparatus capable of applying a photoresist having a uniform thickness and a method of driving the same. An inner stage provided with a magnet on a side of the direction and on which the substrate is mounted; A first coil and a second coil are formed inside each side of the inner stage to face the side and the bottom of the inner stage, and face the sides of the X and Y axes of the inner stage. An outer stage formed with a plurality of air holes penetrating the surface; A first external power supply unit applying power to the first coil to apply a magnetic force to the first coil of the external stage, and a second power supply unit applying power to the second coil to apply a magnetic force to the second coil; ; It is configured to include a pump for introducing air into the interior of the outer stage through the air hole, or suck the internal air of the outer stage.

Photoresist Coating Equipment, Internal Stage, External Stage, External Power Source, Coil, Air Hole, Pump

Description

Photoresist coating device and driving method thereof {The device for coating photoresist and the method for driving the same}

1 is an exploded perspective view showing a general liquid crystal display device

2 is a perspective view of a conventional photoresist coating apparatus

3 is an exploded perspective view of the nozzle unit of FIG. 2;

4 is a cross-sectional view of FIG.

Figure 5a is a graph showing the thickness of the photoresist along the I ~ I` direction of Figure 2 during the photoresist process by a conventional photoresist coating apparatus

Figure 5b is a graph showing the thickness of the photoresist along the II ~ II` direction of Figure 2 during the photoresist process by a conventional photoresist coating apparatus

6 is a perspective view of a photoresist coating apparatus according to the present invention

FIG. 7 is a cross-sectional view taken along the direction III-III ′ of FIG. 6.

8A and 8B are circuit diagrams of the first and second external power supply units of FIG. 6 and the first and second coils.

9A and 9B are cross-sectional views of the inner stage for explaining the fixing and the flow of the inner stage by the vacuum pump

10A and 10B are cross-sectional views of a substrate on which photoresist is formed                 

11A and 11B are circuit diagrams illustrating still another first and second external power supply units of FIG. 6 and first and second coils.

* Explanation of symbols on the main parts of the drawings

44 nozzle part 63 first external power supply

63a, 63b: first coil 64a: internal stage

64b: external stage 65: substrate

66: 2nd external power supply part 66a, 66b: 2nd coil

69: magnet

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoresist coating apparatus, and more particularly, to a photoresist coating apparatus and a driving method thereof capable of applying a photoresist having a uniform thickness to all portions of a substrate used in a liquid crystal display.

As the information society develops, the demand for display devices is increasing in various forms.In recent years, liquid crystal display (LCD), plasma display panel (PDP), electro luminescent display (ELD), and vacuum fluorescent display (VFD) have been developed. Various flat panel display devices have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as a substitute for CRT (Cathode Ray Tube) for the use of mobile image display device because of the excellent image quality, light weight, thinness, and low power consumption, and mobile type such as monitor of notebook computer. In addition, it is being developed in various ways, such as a television for receiving and displaying broadcast signals, and a monitor of a computer.

Such a liquid crystal display device may be broadly divided into a liquid crystal display panel displaying an image and a driving unit for applying a driving signal to the liquid crystal display panel, wherein the liquid crystal display panel has a space and is bonded to the first and second glasses. It consists of a liquid crystal layer injected between the board | substrate and the said 1st, 2nd glass substrate.

Here, the first glass substrate (TFT array substrate) includes a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and the respective angles. A plurality of thin film transistors which are switched by a plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing a gate line and a data line, and a signal of the gate line to transfer a signal of the data line to each pixel electrode Is formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G, and B color filter layer for expressing color colors, and a common image for implementing an image. An electrode is formed.

The first and second glass substrates have a predetermined space by spacers and are bonded by a sealant to form a liquid crystal between the two substrates.

Hereinafter, a structure of a general liquid crystal display device will be described with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a general liquid crystal display device.

As shown in FIG. 1, the liquid crystal display device includes a first substrate 1 and a second substrate 2 bonded to each other with the predetermined space, and between the first substrate 1 and the second substrate 2. It consists of the injected liquid crystal layer 3.

More specifically, the first substrate 1 has a plurality of gate lines 4 arranged in one direction at regular intervals to define the pixel region P, and the direction perpendicular to the gate lines 4. A plurality of data lines 5 are arranged at regular intervals, and pixel electrodes 6 are formed in the pixel regions P, and portions where the gate lines 4 and the data lines 5 cross each other. A plurality of thin film transistors T are formed on and off according to the driving signal of the gate line 4 to apply the image signal of the data line 5 to each pixel electrode 6.

In addition, the second substrate 2 includes a black matrix layer 7 for blocking light in portions other than the pixel region P, and R for expressing a color color corresponding to each pixel region P; G and B color filter layers 8 and a common electrode 9 for realizing an image are formed.

An alignment film (not shown) is formed on the surfaces of the first and second substrates 1 and 2 facing each other as described above, respectively, and rubbed to align the liquid crystal layer 3.

The thin film transistor T may include a gate electrode protruding from the gate line 4, a gate insulating film (not shown) formed on the front surface, an active layer formed on the gate insulating film above the gate electrode, and And a source electrode protruding from the data line 5 and a drain electrode opposed to the source electrode.

   The pixel electrode 6 uses a transparent conductive metal having a relatively high light transmittance, such as indium-tin-oxide (ITO).

The patterns of the gate line, the data line, and the black matrix formed on the first and second substrates of the liquid crystal display device configured as described above are patterned by a photo and etching process, in which case the above pattern is formed on the substrate. In order for the photoresist to be coated.

That is, the photoresist may use a positive and negative photoresist film, wherein the positive photoresist film is later removed to form a pattern, and the negative photoresist film, on the contrary, the light-received portion remains intact Will form.

Therefore, by performing the etching process using the patterned photoresist as a mask, a desired pattern (gate line, data line, black matrix, etc.) can be formed on the substrate.

Here, in applying the photoresist, it was common to use a method called spin coating.

In this spin coating method, the substrate is rotated at a high speed to drop a photoresist near the center of rotation, to cover the entire substrate by the centrifugal force of the substrate, and to remove unnecessary photoresist by centrifugal force. At the same time, it is a method of thinning.

According to this spin coating method, there is an advantage that the coating can be applied with a photoresist coating apparatus having a relatively simple structure, but as the substrate becomes larger, there is a limit to the spin coating method as described above.

In addition, as the degree of integration of semiconductor devices formed on the substrate increases, the thinning of the photoresist is required. However, in the spin coating method, since the thickness of the photoresist is dropped by the viscosity of the photoresist and the rotational speed of the substrate, The thinning itself has its limitations.

Therefore, a photoresist coating apparatus has been developed that can coat a photoresist of a desired thickness on the substrate without rotating the substrate.

Hereinafter, a conventional photoresist coating apparatus will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view of a conventional photoresist coating apparatus, Figure 3 is an exploded perspective view of the nozzle portion of Figure 2, Figure 4 is a cross-sectional view of FIG.

In the conventional photoresist coating apparatus, as shown in FIG. 2, a nozzle unit 44 for spraying photoresist on the entire surface of the stage 45 on which the substrate is largely seated and the substrate 43 seated on the stage 45 is mounted. It consists of).

More specifically, as shown in FIGS. 3 and 4, the nozzle unit 44 is connected to the supply pipe 21a to which the photoresist is supplied and has an inclination to the end of the supply pipe 21a, It has a slit 23 formed in the lower portion along the inclination, and moves the photoresist transferred from the supply pipe 21a along the left and right inclination and at the same time on the photoresist on the substrate 43 through the slit 23 It consists of the delivery pipe 21b which apply | coats a paste.

Referring to the operation of the photoresist coating apparatus configured as described above in detail.

First, when the photoresist is injected into the supply pipe 21a, the photoresist moves to the delivery pipe 21b through the supply pipe 21a, and the left and right sides of the delivery pipe 21b are inclined along the inclination of the delivery pipe 21b. To the end.

At this time, the photoresist is applied on the substrate 43 through the slits 23 formed at the bottom of the delivery tube 21b while moving along the inclination of the delivery tube 21b.

Here, as the stage 45 on which the substrate 43 is mounted moves in the direction of the arrow 42, photoresist is applied to all portions of the substrate 43.

However, the conventional photoresist coating apparatus has the following problems.

Figure 5a is a graph showing the thickness of the photoresist in the photoresist process by the conventional photoresist coating apparatus, the direction I ~ I` of Figure 2, Figure 5b is a photoresist process by the conventional photoresist coating apparatus 2 is a graph showing the thickness of the photoresist in the II-II` direction of FIG. 2.                         

In the conventional photoresist coating apparatus, the photoresist supplied through the supply pipe 21a moves along the inclination of each delivery pipe 21b, and at this time, reaches the end 24 of the delivery pipe 21b. The photoresist no longer moves and accumulates at the end 24.

Therefore, the photoresist more than necessary is accumulated at the end of the slit 23 formed below the delivery pipe 21b by the necessary photoresist accumulated at the end 24 of the delivery pipe 21b. The amount of photoresist applied to the substrate 43 through the slit 23 is not uniform.

That is, as shown in FIG. 5A, a photoresist having a higher thickness than that of other portions is formed at the edge 41 of the substrate 43 to which the photoresist is applied corresponding to the end of the slit 23. There is a problem.

In addition, since the traveling speed of the stage 45 is not constant, the thickness of the photoresist applied to the substrate 43 in the traveling direction 42 of the stage 45 is also shown in FIG. 5B. It appears uneven in all areas of (43).

The present invention has been made to solve such a problem, by reciprocating the substrate on which the photoresist is formed in the vertical and horizontal directions, the photoresist formed on the substrate is rearranged by the reciprocating motion in the vertical and horizontal directions It is an object of the present invention to provide a photoresist coating apparatus capable of keeping its thickness uniform in all parts of a substrate.

The photoresist coating apparatus according to the present invention for achieving the above object, in the photoresist coating apparatus for applying the photoresist to the substrate of the liquid crystal display device, a magnet is provided on the side of the X-axis and Y-axis direction An inner stage on which the substrate is mounted on an upper surface thereof; A first coil and a second coil are formed inside each side of the inner stage to face the side and the bottom of the inner stage and face the X and Y axes of the inner stage, and a surface facing the bottom of the inner stage. An outer stage formed with a plurality of air holes penetrating the surface; A first external power supply unit applying power to the first coil to apply a magnetic force to the first coil of the external stage, and a second power supply unit applying power to the second coil to apply a magnetic force to the second coil; ; It is characterized in that it comprises a pump for introducing air into the interior of the outer stage through the air hole, or suction the internal air of the outer stage.

Here, a gap of a predetermined interval is formed between each side of the inner stage and each side of the outer stage.

The magnets provided in the X-axis direction of the inner stage have different polarities, and the magnets provided in the Y-axis direction have different polarities.

The magnets provided in the X-axis and Y-axis directions of the inner stage may have the same polarity.

The first and second external power supply units may output an AC signal having a high frequency.

The first coil and the second coil, which are supplied with the power of the first external power supply unit and the second external power supply unit, may generate magnetic forces having the same polarity in the direction of the internal stage, respectively.

The first coil and the second coil which are supplied with the power of the first external power supply unit and the second external power supply unit generate magnetic forces of different polarities in the direction of the internal stage, respectively.

It characterized in that it further comprises a nozzle unit for injecting a photoresist on the substrate.

In addition, the driving method of the photoresist coating apparatus configured as described above comprises the steps of mounting and fixing the substrate on the inner stage; Securing the inner stage to an outer stage surrounding the inner stage; Applying the photoresist to the entire surface of the substrate seated on the inner stage while moving the outer stage in one direction; Separating the inner stage from the bottom of the outer stage by a predetermined distance such that the inner stage has fluidity; And reciprocating the inner stage in the vertical and horizontal directions.

Hereinafter, a photoresist coating apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

6 is a perspective view of a photoresist coating apparatus according to the present invention, FIG. 7 is a cross-sectional view taken along the direction of III-III ′ of FIG. 6, and FIGS. 8A and 8B are the first and second external power supply units of FIG. It is a circuit block diagram with a 2nd coil.

9A and 9B are cross-sectional views of the inner stage for explaining the fixing and flow of the inner stage by the vacuum pump, and FIGS. 10A and 10B are cross-sectional views of the substrate on which the photoresist is formed.

The photoresist coating apparatus according to the present invention, as shown in Figure 6 and 7, a nozzle portion 44 for injecting a photoresist on the entire surface of the substrate 65; An inner stage 64a positioned below the nozzle unit 44 and provided with magnets 69 on side surfaces in the X-axis and Y-axis directions, respectively, to seat the substrate 65 on an upper surface thereof; The first coils 63a and 63b and the second coil 66a, which surround side and bottom surfaces of the inner stage 64a and face the X and Y axis sides of the inner stage 64a, respectively. 66b) an outer stage 64b formed on the surface facing the bottom of the inner stage 64a and having a plurality of air holes 68 therethrough; The first external power supply unit 63 and the second coil 66a, which apply power to the first coils 63a and 63b to apply magnetic force to the first coils 63a and 63b of the external stage 64b. A second power supply unit 66 for applying power to the second coils 66a and 66b to impart a magnetic force to the light source; It is configured to include a pump 67 for introducing air into the outer stage 64b through the air hole 68, or to suck the air inside the outer stage 64b.

Here, the nozzle unit 60 is connected to the supply pipe 21a to which the photoresist is supplied and the end of the supply pipe 21a with left and right slopes, as described above with reference to FIG. It has a slit 23 is formed along the transfer, the transfer of the photoresist on the substrate 65 through the slit 23 while moving the photoresist transferred from the supply pipe 21a along the left and right inclination It is comprised including the pipe 21b.

Here, a predetermined gap d is formed between the inner stage 64a and the opposing surface of the outer stage 64b, which causes the inner stage 64a to flow inside the outer stage 64b. It means space that can be.

In addition, the magnets 69 formed on the X and Y axes of the inner stage 64a have different polarities.

For example, the magnet 69 of the N pole and the S pole is provided on the side of the X axis of the inner stage 64a, and the magnet 69 of the N pole and the S pole is provided on the side of the Y axis, respectively.

In addition, as illustrated in FIG. 8A, the first coils 63a and 63b provided on the X-axis surface of the external stage 64b receive power supplied from the first external power supply 63. As shown in FIG. 8B, the second coils 66a and 66b provided on the surface of the Y-axis of the external stage 64b receive power supplied from the second external power source 66.

Here, the power source is preferably to use a high frequency AC signal.

In addition, the first external power supply unit 63 and the second external power supply unit 66 operate alternately.                     

That is, when the first external power supply unit 63 is in an 'on' state, the second external power supply unit 66 remains in an 'off' state, and when the second external power supply unit 66 is in an 'on' state, The first external power supply unit 63 maintains an 'off' state.

Here, the four magnets 69 provided on each side of the X-axis and the Y-axis of the inner stage 64a are respectively provided with first and second coils provided inside the X-axis and Y-axis surfaces of the outer stage 64b. Corresponding to 63a, 63b and 66a, 66b, respectively, and configured to face each other.

In addition, the air hole 68 formed below the outer stage 64b is a passage through which air is injected or discharged by the pump, and as shown in FIG. 9A, the outer stage through the air hole 68. When the air of 64b is sucked in, the inner stage 64a placed on the outer stage 64b is fixed to the bottom surface of the outer stage 64b by the suction force.

On the contrary, as shown in FIG. 9B, when air is introduced into the outer stage 64b through the air hole 68, the inner stage 64a which is in close contact with the outer stage 64b is As it is floated up by the introduced air, the frictional force between the inner stage 64a and the outer stage 64b is reduced.

This makes the inner stage 64a easily move even with a small force applied from the outside.

Referring to the driving method of the photoresist coating apparatus configured as described above in detail.

First, the substrate 65 is seated on the inner stage 64a, and the substrate 65 and the inner stage 64a are tightly fixed to each other so that the substrate 65 does not flow.

Subsequently, the inner stage 64a is fixed in close contact with the outer stage 64b so as not to flow.

That is, the air inside the outer stage 64b is allowed to flow out through the air hole 68 formed in the outer stage 64b, and the inner stage 64a is connected to the outer stage by the suction force generated. Make sure that it is tightly fixed to the bottom of 64b).

The photoresist is applied to the substrate 65 on which the inner stage 64a is seated while the inner stage 64a is fixed to the outer stage 64b.

That is, the nozzle unit 44 is positioned above the substrate 65 and the photoresist is supplied to the supply pipe 21a of the nozzle unit 44.

Then, the photoresist supplied to the supply pipe 21a of the nozzle unit 44 moves along the inclination of the delivery pipe 21b, and at the same time, the substrate through the slit 23 formed under the delivery pipe 21b. It is applied onto 65.

At this time, as the outer stage 64b moves in one direction, the inner stage 64a fixed to the outer stage 64b also moves in the same direction, and the inner stage 64a moves by the inner stage 64a. The substrate 65 fixed to the stage 64a also moves in the same direction.

Accordingly, the photoresist is applied to all parts of the substrate 65, wherein the applied photoresist 70 has different thicknesses at all parts of the substrate 65, as shown in FIG. 10A. And is formed.                     

Thereafter, the inner stage 64a is separated from the outer stage 64b so that the inner stage 64a can flow freely.

That is, this time, on the contrary, by blowing air into the outer stage 64b through the air hole 68 of the outer stage 64b, the inner stage 64a is separated from the outer stage 64b. do.

At this time, the inner stage 64a is separated from the outer stage 64b and in a floating state from the bottom of the outer stage 64b by the introduced air.

That is, since the inner stage 64a is supported by the introduced air, the friction force with the outer stage 64b is reduced.

Subsequently, the power supply of the first external power supply unit 63 is applied to the first coils 63a and 63b provided on the X-axis surface of the external stage 64b.

As described above, the power source is a high frequency AC signal, and is a signal in which the polarity (positive polarity (+) or negative polarity (−)) of a voltage or a current is changed in a fast cycle with time.

Accordingly, the first coils 63a and 63b provided on the surface of the X-axis of the external stage 64b generate magnetic force by an applied power source, and their magnetic force direction changes with time.

At this time, the first coil 63a provided on the left surface of the outer stage 64b and the first coil 63b provided on the right surface of the outer stage 64b generate magnetic forces having the same polarity in the direction facing each other.                     

As described above, when the first coils 63a and 63b provided on the left and right surfaces of the outer stage 64b generate magnetic force by the power source, the inner stage 64a moves left and right along the X axis by the magnetic force. It will reciprocate.

That is, for example, when the power supply of the first external power supply unit 63 is a positive signal (+), all of the first coils 63a and 63b provided on the surface of the X axis of the external stage 64b are internal. N-polar magnetic force is generated in the direction of the stage 64a, so that the first coil 63a on the left side pushes the N-polar magnet 69 provided on the left side of the inner stage 64a. The first coil 63b provided on the right side attracts the S-polar magnet 69 provided on the right side of the inner stage 64a.

As a result, by the magnetic force applied by the first coils 63a and 63b of the outer stage 64b, the inner stage 64a moves from left to right along the X axis.

At this time, before the inner stage 64a reaches the right side surface of the outer stage 64b, the power supplied from the first external power supply unit 63 is converted into negative polarity (-), and the negative polarity (- The magnetic force direction of the first coils 63a and 63b provided on the left and right surfaces of the outer stage 64b is changed by the signal.

That is, the first coils 63a and 63b provided on the left and right surfaces of the outer stage 64b generate a magnetic pole of S polarity in the direction of the inner stage 64a.

Then, this time, on the contrary, the first coil 63a provided on the left side of the outer stage 64b attracts the N-polar magnet 69 provided on the left side of the inner stage 64a. The first coil 63b provided on the right side of the stage 64b pushes out the S-polar magnet 69 provided on the right side of the inner stage 64a.

As a result, the inner stage 64a moves from right to left at this time by the magnetic force applied by the first coils 63a and 63b of the outer stage 64b.

In this way, the power of the first power supply unit 63 is repeatedly changed before the inner stage 64a reaches the surface of the outer stage 64b so that the inner stage 64a becomes the outer stage 64b. It will reciprocate in the left and right direction from inside.

Subsequently, the first external power supply 63 is turned off, and the second external power supply 66 is turned on to supply power output from the second external power supply 66 to the second coils 66a and 66b. ), This time the inner stage 64a is reciprocated in the vertical direction.

The vertical reciprocating motion of the inner stage 64a is performed in the same manner as the reciprocating motion in the horizontal direction described above.

As a result, the inner stage 64a reciprocates in the vertical and horizontal directions so that the substrate 65 seated on the inner stage 64a also reciprocates in the same direction as the inner stage 64a.

Here, the inner stage 64a is reciprocated vertically and horizontally in the gap d between the inner stage 64a and the outer stage 64b.                     

 Accordingly, the photoresist 70 coated on the substrate 65 is shaken in the same direction by the vertical and horizontal reciprocating motions, and thus the raised portions of the photoresist 70 are settled, The settled portion is compensated by the raised portion, so that the photoresist 70 formed on the substrate 65 maintains almost the same thickness in all portions of the substrate 65, as shown in FIG. 10B.

This is attributable to the fact that the photoresist 70 is somewhat hardened when the photoresist 70 is applied onto the substrate 65 by the nozzle portion 44, but is somewhat hardened.

In addition, in the photoresist coating apparatus as described above, magnets 69 having the same polarity on each side of the inner stage 64a may be configured and operated.

11A and 11B are still another circuit diagrams illustrating the first and second external power supply units of FIG. 6 and the first and second coils.

At this time, however, the first coils 63a and 63b formed inside the left and right surfaces of the external stage 64b receive power from the first external power supply unit 63 as illustrated in FIG. 11A, The second coils 66a and 66b formed inside the left and right surfaces of the external stage 64b are applied by the second external power supply unit 66 as illustrated in FIG. 11B.

As described above, the internal stage 64a of the photoresist coating apparatus configured as described above also reciprocates in the vertical and horizontal directions.

For example, when the same magnet 69 of N polarity is provided on both the X-axis and the Y-axis side of the inner stage 64a, the first coils 63a and 63b of the outer stage 64b are firstly provided. When the positive polarity (+) power output from the external power supply unit 63 is input, the first coil 63a provided on the left surface of the external stage 64b receives the magnetic force of N polarity toward the internal stage 64a. And the first coil 63b formed on the right surface of the outer stage 64b generates a magnetic pole of S polarity in the direction of the inner stage 64a.

Then, the first coil 63a located on the left side of the outer stage 64b pushes out the N-polar magnet 69 formed on the left side of the inner stage 64a, and the right side of the outer stage 64b. The first coil 63b positioned at attracts the N-polar magnet 69 formed on the right side of the inner stage 64a.

Thus, the inner stage 64a moves from left to right. Thereafter, as described above, the internal stage 64a is moved from right to left by converting the power of the first external power supply 63a to negative polarity (−).

In this manner, the inner stage 64a can be reciprocated in the vertical and horizontal directions.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

The photoresist coating apparatus and driving method thereof according to the present invention as described above has the following effects.

In the photoresist coating apparatus according to the present invention, an inner stage having magnets formed on each side thereof is moved in a vertical direction and a left and right direction by using a magnetic force generated by a coil formed in an outer stage surrounding the inner stage.

Accordingly, the substrate seated on the inner stage also reciprocates in the same direction as the inner stage, whereby the photoresist applied to the substrate sinks the raised portion by the up, down, left and right reciprocating movements, and the settled portion is raised. Compensated by the part, it maintains almost the same thickness in all parts of the substrate.

Claims (9)

In the photoresist coating apparatus for applying the photoresist to the substrate of the liquid crystal display device, An internal stage provided with magnets on side surfaces of the X-axis and Y-axis directions, the substrate being seated on an upper surface thereof; A first coil and a second coil are formed inside each side of the inner stage to face the side and the bottom of the inner stage and face the X and Y axes of the inner stage, and a surface facing the bottom of the inner stage. An outer stage formed with a plurality of air holes penetrating the surface; A first external power supply unit applying power to the first coil to apply a magnetic force to the first coil of the external stage, and a second power supply unit applying power to the second coil to apply a magnetic force to the second coil; ; And a pump for introducing air into the outer stage through the air hole or sucking the inner air of the outer stage. The method of claim 1, And a gap of a predetermined interval is formed between each side of the inner stage and each side of the outer stage. According to claim 1, The magnets provided in the X-axis direction of the inner stage have different polarities, and the magnets provided in the Y-axis direction have different polarities. The method of claim 1, The photoresist coating apparatus, characterized in that the magnets provided in the X-axis and Y-axis direction of the inner stage all have the same polarity. The method of claim 1, The first and second external power supply unit is a photoresist coating apparatus, characterized in that for outputting a high frequency AC signal. The method of claim 1, The photoresist coating apparatus of claim 1, wherein the first coil and the second coil, which are supplied with the power of the first external power supply unit and the second external power supply unit, respectively, generate magnetic forces having the same polarity toward the inner stage. The method of claim 1, The photoresist coating apparatus of claim 1, wherein the first coil and the second coil, which receive power from the first external power supply unit and the second external power supply unit, respectively generate magnetic forces having different polarities in the direction of the inner stage. The method of claim 1, The photoresist coating apparatus further comprises a nozzle unit for injecting a photoresist on the substrate. Mounting and securing the substrate to the inner stage; Securing the inner stage to an outer stage surrounding the inner stage; Applying the photoresist to the entire surface of the substrate seated on the inner stage while moving the outer stage in one direction; Separating the inner stage from the bottom of the outer stage by a predetermined distance such that the inner stage has fluidity; And reciprocating the inner stage in up, down, left, and right directions.

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