KR100940140B1 - Arrangement for energy conditioning - Google Patents

Abstract

The present invention relates to a circuit arrangement that utilizes an associated grouping of energy paths, including a shielded circuit arrangement that can maintain and regulate electrically complementary energy confluence.

Description

Energy Regulators {ARRANGEMENT FOR ENERGY CONDITIONING}

1 is an associated location compass that determines relevant locations of various path extensions.

1A-1C illustrate the relevant locations of various path extensions disclosed in accordance with embodiments of the present invention.

2A is a circuit schematic diagram of a top view of an embodiment of 2B in accordance with an embodiment of the present invention.

2B is a plan view of an embodiment according to an embodiment of the present invention.

3A is a circuit schematic diagram of a top view of an embodiment of 3B in accordance with an embodiment of the present invention.

3B is a plan view of an embodiment according to an embodiment of the present invention.

3C is a plan view of a shield according to an embodiment of the present invention.

4A is a related top view of an embodiment in accordance with an embodiment of the present invention.

4B is a related top view of an embodiment in accordance with an embodiment of the present invention.

4C is a related top view of an embodiment in accordance with an embodiment of the present invention.

4D is a related top view of an embodiment in accordance with an embodiment of the present invention.

4E is a related top view of an embodiment in accordance with an embodiment of the present invention.

4F is a related top view of an embodiment in accordance with an embodiment of the present invention.

4G is a related top view of an embodiment in accordance with an embodiment of the present invention.

4H is a related top view of an embodiment in accordance with an embodiment of the present invention.

4I is a related top view of an embodiment in accordance with an embodiment of the present invention.

5A illustrates a stacked multiple circuit network including path groups in accordance with an embodiment of the present invention.

5B shows a stacked shield in accordance with an embodiment of the present invention.

5C illustrates a stacked multiple non-shared circuit network with VIAs including path groups in accordance with an embodiment of the present invention.

6 shows a related top view of a circuit arrangement variant according to an embodiment of the invention.

7 shows an associated top view of a circuit arrangement variant according to an embodiment of the invention.

This application is partly pending application for co-pending application serial number 09 / 982,553, filed Oct. 17, 2001, and partly filed for co-pending application serial number 09 / 996,355, filed November 29, 2001, 2001 Part of the continuing application for co-pending application serial number 10 / 023,467, filed December 17, 2005.
The application is also filed U.S. Provisional Application No. 60 / 302,429, filed Jul. 2, 2001, U.S. Provisional Application No. 60 / 310,962, filed August 8, 2001, and filed Jan. 8, 2002. Claims the advantages of US Provisional Application No. 60 / 349,954, and US Provisional Application No., filed June 12, 2002.
The present invention is directed to a balanced shielding device using complementary related groupings of energy paths, such as paths for various energy propagation functions for multiple energy regulation functions. Such shielding devices can be implemented as discrete or non-discrete embodiments that can maintain and regulate electrically complementary energy confluence.

Today, as the density of electronic devices increases, unwanted noise byproducts with increased density can limit electronic circuit performance. Thus, avoiding the effects of unwanted noise by-products, such as isolating or immunizing circuits against unwanted noise effects, is an important consideration in circuit arrangement and circuit design.

Differential and common mode noise energy can be generated and propagate along energy paths, cables, circuit board tracks or traces, high speed transmission lines and / or bus line paths. These energy conductors can act as antennas emitting an energy field, for example. This antenna-like operation exacerbates the noise problem, and at high frequencies, conventional passive devices that use propagation energy will experience increased levels of energy parasitic interference, such as various capacitive and / or inductive parasitic interferences.

This increase will be due, in part, to the combination of constraints arising from the functional or structural limitations of the prior art, along with the fundamental manufacturing or design instability and performance deficiencies of the prior art. These defects generate or induce unwanted unstable interference energy that can be fundamentally coupled to the associated electrical circuitry, thereby at least partially shielding from these parasitic and electromagnetic interferences. Thus, in a board frequency operating environment, solving these problems requires at least simultaneous filtering, careful system deployment with various grounding or anti-noise arrangements, and expensive isolation combined with at least partial electrostatic and electromagnetic shielding.

 Thus, it can be used in almost any circuit that provides an efficient, symmetrically balanced and sustainable simultaneous energy regulation function selected from at least one decoupling function, instantaneous suppression function, noise canceling function, energy cutoff function and energy suppression function. There is a need for a self-contained energy regulating device using a simple energy path device that may further include other elements coupled to separate or non-isolated elements.

Hereinafter, the present invention will be described with reference to the accompanying drawings.
This application is partly pending application for co-pending application serial number 09 / 982,553, filed Oct. 17, 2001, and partly filed for co-pending application serial number 09 / 996,355, filed November 29, 2001, 2001 As part of a continuing application of co-pending application serial number 10 / 023,467, filed December 17, 2005, each of which is incorporated herein by reference.
The application is also filed U.S. Provisional Application No. 60 / 302,429, filed Jul. 2, 2001, U.S. Provisional Application No. 60 / 310,962, filed August 8, 2001, and filed Jan. 8, 2002. Claims the advantages of US Provisional Application No. 60 / 349,954, and US Provisional Application No., filed June 12, 2002, each of which is incorporated herein by reference.

BRIEF DESCRIPTION OF THE DRAWINGS The drawings and description of the present invention have been simplified for the purpose of describing related elements in order to provide a thorough understanding of the present invention, and for the sake of clarity, many other elements appearing in typical energy control systems and methods have been omitted. Those skilled in the art will appreciate that other elements and / or steps may be desirable and / or required to implement the present invention. However, because such elements and steps are known and do not contribute to the understanding of the invention, the description of such elements and steps is not disclosed herein. The description herein is directed to modifications and variations of such elements and methods known to those skilled in the art. Also, the terminology used herein, which may include all or a portion of a whole, such as "energy", "system", "circuit", etc., may be considered to include all or part of the whole as used unless otherwise indicated. It will be apparent to those skilled in the art.

As used herein, an "energy path" or "path" may be at least one or a plurality of conductive materials, each of which is available for continuous energy propagation. The paths are conductive so that they can propagate a variety of electrical energy as compared to non-conductive or semiconductive materials that are directly or indirectly coupled to or adjacent to the path. The energy path is, for example, but not limited to, by allowing various energy control functions such as control functions that occur due to one or several aspects such as shielding, directionality and / or positioning of energy paths within the energy path device. To facilitate energy propagation, various devices having this orientation and / or positioning allow for interaction of the first energy with at least the propagation energy complementary to the first energy. The energy path may comprise an energy path portion, an entire energy path, a conductor, an energy conductor, an electrode, at least one process-generating conductor, and / or a shield. The multiple energy paths can include a plurality of respective elements or elements described below for the energy path. Further, as generally used herein, the conductor may be a separate conductive material portion, conductive plane, conductive path, path, wire, via, opening, conductive portion such as resistance wire, conductive material portion or for example at least one It may include an electrical plate such as a plate separated by the medium 801.

The shield can include a shield electrode, a shield path portion, a shielded path, a shielded conductor, a shielded energy conductor, a shielded electrode and / or at least one process-generated shielded path portion. The plurality of shields may include a number of devices described below with respect to the shield.

As generally used herein, the paths are complementary to the main bodies 80, 81 having various path extensions, denoted as 79 "X", 812 "X", 811 "X" and 99 "X". Or complementary directions. Main bodies 80 and 81 are three-dimensional physical relationships individually, in pairs, in groups and / or in multiples for distance, direction, position, overlap, non-overlap, alignment, partial alignment, overlap, non-overlap and partial overlap Can be in. The superimposed main body paths 80 comprise a pair of physically opposed and oppositely facing main body paths 80 which are, for example, electrically zero, electrically complementary, electrically different or electrically opposite or a combination thereof. .

The path device comprises at least one conductively insulated pair of at least two energy paths, such as vias, openings or complementary paired paths, at least partially shielding at least partially through the conductive shields, at least partially shielding the at least one energy path. And a shield group forming a shielding structure that partially shields.

Embodiments enable energy propagation on conductively insulated pairs, such as complementary paired paths, to cause energy propagation on at least one shield group or common shield operating as an isolation circuit. This embodiment allows a low inductance path to be formed among at least a single pair of isolated and isolated parallel paths that serve as at least one separate and isolated circuit system. One embodiment provides energy propagating along at least one low inductance path and at least one other separate isolated circuit system utilizing energy propagating on at least one parallel path of at least two sets of isolated and separate parallel paths. Enable at least one parallel path of at least one low inductance path to use.

Embodiments used as part of a circuit assembly may have at least one path of relatively low inductance, while another path may be electrically coupled to an energy source or energy load. One of the plurality of second paths may have a low impedance available to the energy portion to be taken away from at least one energy source or at least one energy load of the circuit assembly. This low impedance path may not be electrically connected directly to at least one energy source or at least one energy load of the circuit assembly as one path of low inductance. The system can have both the lowest inductance path and the lowest impedance path that are not in the same path.

In contrast to capacitors found in applications where the equivalent series inductance (ESL) of a capacitor device is normally size dependent, the lowest impedance path and lowest inductance path for the circuit for energy regulation in the present invention is achieved regardless of the physical size of the device. Can be. This property depends on the preset capacitance formed by the preset layer of the present invention.

Path alignment allows the resistance of the conductive material in the path to primarily determine energy transfer or related efficiency or impact, for example, between at least one energy source and an energy consuming load of the integrated circuit. ESL can be a negligible factor rather than a key factor for decoupling voids that reduce transfer results or inductance.

In the path arrangement shown in FIGS. 1A, 1B, 1C, 5A, and 5B, where various propagation energies may be complementary, when placed in a circuit arrangement, the path arrangement causes energy to propagate within or along a predetermined energy path of the path arrangement. This allows for the mutual interaction of opposing portions of the magnetic field generated from the path generated by the propagation of energy field currents radiating outward from each complementary conductor set. Such joint interaction may be counteracted in embodiments in which certain paths may be partially or entirely shielded from other complementary paths and placed within a distance affected by other complementary paths. In addition, identity in the size and shape of each complementary path, including the spatial separation of shielding between paths and the conductive isolation of paths, can contribute to this offset. In addition, the shielding operation may indicate the relative location of the coupling of the paired paths to the conductive electrostatic shielding. The at least one complementary energy control function and electrostatic shielding dynamics described herein operate on various energies propagating in various directions along various preset paths, and can operate on circuits with dynamic operation using path devices.

Electromagnetic / electrostatically acting sub-couples of the impedance state may be along or within the path arrangement, or along closely connected external conductive portions conductively connected to separate or multiple groups of shields. It is formed inside, to form an energy control circuit. These electromagnetically / electrostatically acting impedance states can be formed, for example, due to the energization of a pair of path sets in one circuit part, but must be formed, for example, on another pair of path sets from another circuit part. It is not.

According to an embodiment of the invention, each shield may comprise a main body 81. The main bodies 81 are collectively and conductively coupled to one another and at the same time can almost enclose and shield the main body 80 of the energy path. In another embodiment of the present invention, the collective shielding main body 81 may only partially surround and shield the path main body 80 in at least one shielding portion.

According to the present invention, a balanced symmetric path arrangement can be generated from symmetry, complementary path size and shape of a given overlap shield and / or mutual positions and pairs of complementary paths. A manufacturable balanced or symmetrical physical path device in which dynamic energy propagation, interaction, pairing, or various dynamic quantities of matching up may occur, may operate with less than the fundamental limit of the accuracy of the test device. Thus, when portions of complementary energy amounts interact at the same time, the energy may be above the quantitative range of a typical test device. Thus, the range in which the measurements can be obtained can increase the degree of control, so that the electrical properties and the effects according to the electrical properties can be, for example, desired measurements, predetermined decisions on the operation or improvement to be provided and the arrangement of the corresponding elements, In particular it can be controlled by the arrangement of the elements to provide the desired measurement or effect. For example, the desired electrical properties may vary at least a portion of the complementary balancing, size, shape, and symmetry of at least one path pair, as described and illustrated below, for example, in FIGS. 1A, 1B, 1C, 5A, and 5B. Can be preset for the desired improvement.

Thus, for example, the range of energy interactions, mutual energy propagation timing and interference can be controlled by tolerances in the path arrangement. A manufacturing process or computer tolerance control, such as semiconductor process control, may control these tolerances, for example. Thus, the path of an embodiment can be formed using a fabrication process, such as a passive device process that will be apparent to those skilled in the art. The mutual energy propagation measurement can be omitted or suppressed by the formation and formation process of the path arrangement.

As described below, the path device comprises a sequentially positioned path group of combined electronic structures with balanced path groups. The balanced groups may comprise a preset path architecture in which the pairs are symmetrical, complementary and complementary to each other to form a pair equidistant from each side of the centered shield. For example, as shown in FIGS. 1A-4I, a symmetrical balance point may be provided for each pair of paths and the entire path hierarchy. Thus, a path having a predetermined predetermined size, shape and complementary position may be provided on one of the sizes of the shield disposed at the center for each separate circuit portion. The entire circuit may have complementary parts that are symmetrically divided into complementary physical forms that include a reversed image of a shielded, complementary size and shape in pairs where at least one inserted shield is inserted.

According to the present invention, each path may be a first interconnect substrate, for example wrapping or holding an integrated circuit wafer, deposit, etchant or the result of a doping process, the shield being for example a path substrate, an energy modulator. Or an energy control substrate, deposits, etchant, doping process results, for example, may have resistive properties. Additional elements can be used including conductive and non-conductive elements between the various paths. These additional elements may take the form of ferromagnetic materials or ferromagnetic dielectric layers and / or inductive ferroelectric inducing materials. Conductive and nonconductive multipath, conductive magnetic field impact material hybrids and conductive polymer sheets, various treated conductive and nonconductive materials, in addition to various combinations of materials and structural elements, to provide multiple energy control choices. Additional path structure elements may be provided comprising laminates, linear conductive deposits, multiple types of magnetic material shields and multiple shielding paths that are conductively doped and conductively deposited on the material and terminal solder, using selective shielding. have.

In addition, non-conductive materials can provide structural support for various pathways, and these non-conductive materials can support the entire energized circuit to maintain simultaneous, constant, and non-interfering energy propagation along the path. For example, the dielectric material may include one or more material element layers compatible with available processing techniques. These dielectric materials may be, for example, semiconductor materials such as silicon, germanium, gallium arsenide, or semiconductor materials such as, but not limited to, semi-insulating and insulating materials of predetermined K, high K, and low K dielectric constants.

The path and conductor material may be selected from the group consisting of Ag, Ag / Pd, Cu, Ni, Pt, Au, Pd and other conductive materials and metals. Combinations of these metal materials are suitable for the purposes described herein and may include suitable metal oxides, such as ruthenium oxides, which may be diluted with suitable metals, depending on the particular application. Another path can be formed of an almost resistive conductive material. Materials and processes or deposited polysilicon, sintered polycrystallin, metals, polysilicon silicates, and materials capable of forming paths from conductive, nonconductive, semiconductive materials, and / or mylar film printed circuit board materials, Or a material or process for forming a conductive region, such as polysilicon silicide, may be used in or with the routing device.

Embodiments of the present invention may utilize an internal shield architecture to ensure energy balancing schemes within various devices rather than specific circuit balancing. This balanced configuration comprises a shared, centered shield, and a shield of a particular size disposed in actual pairs to provide shielding simultaneously in electrically opposed shielded paired paths utilized by propagating energy. In this respect all the relevant positioning of the shields. This allows these electrically opposite complementary paths to be electrically and physically disposed on opposite sides of the common conductive shield that are centrally located and shared. The insertion of this central shared shield can form a voltage divider that divides the various circuit voltages in half and opposes half of the expected voltage energy for each pair of shielded conductors. The energized circuitry, including the shielded conductors, can be balanced electrically or in a charge facing manner and for a centrally disposed shield, for a common shared path, or for each isolated circuit system portion. Each common shared path of an isolated circuit system can be attached or coupled to a common area or common path to provide an external common zero voltage. Thus, this embodiment is in an inserted shielding relationship and additionally coupled and partially shielded pairs or groupings of various electrically or charge facing types supported by additional outer sandwich shields, denoted herein as IM, here forming a shielding structure. It may have multiple sets of shields electrically or physically disposed between at least one of the paths of the complementary pairs.

Preferred embodiments may also be arranged in one or more energy circuits that use different energy sources and supply one or more separate and distinct energy utilization loads. When energized for multiple energy conditioning operations and at the same time to provide efficient energy conditioning functions, for example electromagnetic interference filtering, suppression, energy decoupling and energy surge protection, each separate and distinct circuit is shared by a number of common ones. General purpose shielding structures and circuit reference images or nodes.

According to the present invention, the energy regulation function can maintain a well-balanced energy voltage reference and energy supply for each energy utilizing load in the circuit. The energized device may enable specific energy propagation using single or multiple isolated path devices and may not require balancing for a single centralized shield. The shield may be physically and electrically disposed between one or multiple energy sources and one or multiple energy consuming loads depending on the number of separate and insulated paths. The associated central location path for shielding is thus on the common plane and can be stacked in accordance with an embodiment.

When internally disposed and paired shielded paths are attached or conductively coupled to an externally manufactured path, the internally disposed paired shields can be enclosed within a caged shield structure, leading to adjacent shielding paths. It is possible to minimize internally generated energy revolutions and particles that can be exited or combined. These shielding modes utilize energy propagating in multiple paths and can isolate the electrostatic shielding caused by the energization of the shielding structure. Propagation energy propagating in a complementary manner provides an energy field of fields that oppose and cancel each other by close proximity of opposite propagation. Complementary and paired paths can provide internally balanced resistive load functionality.

The device according to the invention can mimic the function of at least one electrostatically shielded transformer. Transformers may be widely used to provide common mode isolation upon differential mode transfer between inputs to transfer energy magnetically from the primary winding to the secondary winding. As a result, the common mode voltage between the primary windings is eliminated. One disadvantage that occurs fundamentally in transformer manufacturing is the propagation energy source capacitance between the primary and secondary windings. As circuit frequency increases, capacitive coupling occurs until circuit isolation is compromised. If there is sufficient parasitic capacitance, high frequency RF energy can pass through the transformer and momentarily cause upset on the circuit on the other side of the isolation gap. A shield can be provided between the primary and secondary windings by coupling to a common path reference source designed to prevent capacitive coupling between multiple winding sets. The device according to the invention improves this and reduces the need for a transformer in the circuit. The device uses physical and related common paths to suppress parasitics, and associated positioning of the common path shields, complementary paired path layers, and various path layers to effectively function as transformers in combination with various external circuits. External conductive couplings to the conductive regions of the coupling and isolation circuit systems can be used. Once the isolation circuit system is temporarily upset, the transformer function of the device described herein, which is electrostatically shielded, is efficient for instantaneous suppression and prevention, and can operate simultaneously as a combined differential mode and common mode filter. Each set of associated shields and associated conductors may be conductively coupled to at least the same external path, for example to provide a transformer function.

Propagated electromagnetic interference can be the product of both electrical and magnetic fields. The device according to the invention is energy utilizing DC, AC, and AC / DC hybrid type propagation, including energy regulation in systems that may include various types of energy propagation forms and systems that may have one or more circuit propagation characteristics. Can be adjusted.

In a preferred embodiment, the peripheral conductive bonding material that joins or connects the outer part of the typical entity into the assembly by conductor bonding is at least in some form of angle, called openings or blinds or non-blind vias, as applicable terms for other routes. , Conductive or non-conductive adhesive to conductors that are parallel or perpendicular, which passes through or nearly passes each part of the preferred embodiment. For one embodiment of the invention, coupling to at least one or more loads, such as portions of integrated circuits, may include selective coupling or disconnection of various types of conductors, such as openings and vias.

Path fabrication may include forming one or more plated through-hole (PTH) vias through one or more path levels. Electrical packages generally include multiple interconnect levels. In such a package, the present invention may comprise a layering of the patterned conductive material on one interconnect level, which may be isolated from the patterned conductive material on another interconnect level, for example, by a dielectric material layer. have.

Connections or couplings between conductive materials at various interconnect levels may be made by forming openings, called vias or openings, in isolation or layers, which provide conductive structures to provide patterned or shaped conductivity from multiple levels. The material portions or paths are in electrical contact with each other. These structures may extend through one or more interconnect levels. The use of conductive, non-conductive or conductively filled openings and vias allows propagation energy to traverse preferred embodiments, such as using bypass or feedthrough path construction implementations. Implementations serve as supports, systems or subsystems that may include both or both of the layered active small and passive elements to provide the described benefits for regulating energy propagating between at least one source and at least one load. can do.

One embodiment of the present invention may provide a conductive architecture or structure suitable for inclusion in a packaging or integrated circuit package with other elements. Other elements may be coupled directly to the device for simultaneous physical electrical shielding by allowing simultaneous energy interactions to occur between grouped and energized complementary conductors supplied by different paths. Typical capacitive balances found between at least one shield path can be found when measuring both sides of the shared shield structure of an insulated circuit, and even within a portion of the isolated circuit even if a common non-specific dielectric or path conductive material is used. Can be maintained at the capacitive level. Accordingly, the complementary capacitive balancing or tolerance balancing characteristics of this type of electrical circuit, depending on element location, size, separation and attachment location, is a preferred implementation with an isolation circuit system manufactured internally with 3% capacitive tolerance. For divided shielded structures placed in the system, pass through a 3% capacitive tolerance conductively coupled and energized isolated circuit system maintained and corrected between the electrically opposite paired complementary paths of each isolated circuit system. Do it.

Preferred embodiments may utilize relatively inexpensive dielectric materials, conductive materials, and various other elements in a wide variety of ways. Because of the nature of the architecture, the resulting physical and electrical split structures allow for grouped and split voltages between adjacent elements and balanced voltages, and propagation energy interrupted or lost due to the effects of hysteresis and piezoelectric phenomena is the active device switching response time. Form, a reliable open energy that flows simultaneously on both electrical sides of the path from each source to the load and from the load to the source back to the source, minimizing to the extent that it can be maintained in the form of the ability to instantaneously present the various energy-consuming loads. can do.

The structured layer may be formed, embedded, enclosed, or inserted into various electrical systems and subsystems, for example, to perform line conditioning or decoupling and to modify the electrical energy transfer to the desired or preset electrical specificity. Expensive specialty dielectric materials that maintain specific or narrow energy regulation or voltage balancing are no longer needed for circuit bypass, feedthrough or energy decoupling operations.

The device according to the invention can be arranged between each isolation circuit and multiple paths in pairs or between different paths, as described below. The device of this embodiment can operate efficiently over a wide frequency range compared to a single discrete capacitor or inductor element and can continue to perform efficiently in an isolation circuit system operating above, for example, GHz.

As described below, the device of the embodiment can perform shielding function in this wide frequency range. Physical shielding of electrically opposite and adjacent complementary paths minimizes parasitic components generated from common path sizes associated with the complementary path size and from energized static suppression or inserted complementary conductors and prevents external parasitic elements. Can be generated from. In addition, the positioning of the shield relative to the highly conductive shield can be used to prevent inductive energy and "H-field" coupling. This technique is known as inductive offset.

Parasitic coupling is known as electrical field coupling. The shielding function described below provides the main shielding of various shielded paths electrostatically against electric field parasitic components. Thus, parasitic coupling including interference paths of propagation energy by mutual or stray parasitic energy generated from complementary conductor paths can be suppressed. The device according to the invention can block inductive coupling, for example, by wrapping conductors of opposite phase in a universal shielding architecture by means of stacked conductive hierarchical progression, for the vertical and horizontal positions of each layer and path. To provide an electrostatic or Faraday shielding effect on the path location. Shielded path architecture allows internal and external parasitic coupling between potential noise conductors and damaging conductors to be larger than, for example, smaller paired complementary paths, but between each complementary path conductor pair to contain and contain stray parasitics. It can be used to suppress and prevent by providing a plurality of common path layers disposed in.

In addition, as described below, the positioning of the shield in relation to the highly conductive shield may be used for inductive energy and “H-field” coupling. Such erasure is achieved by physical shielding energy, but at the same time utilizes complementary paired paths contained within the area size corresponding to the shield size and arranged to insert paired complementary paths. The device according to the invention is suitable for using shields separately as internal shields or groupings to isolate and insert electrically opposing complementary path pairs, and to physically tight or minimize between each shield and active load. Provides energy and circuit loop propagation paths. The proximity of the shield to the unshield allows the energy to be provided along the shield even if direct isolation exists due to the 801 material type or spacing.

Flux offsets of energy paired and electrically opposite or propagating along different paths arise from the spacing of the paths separated by very small spacings for electrically complementary operation of opposite phases, contributing to the formation of a shield in series. Simultaneous stray parasitic suppression and containment occur and energy regulation is directed.                     

Additional shielding energy currents can be distributed around the device shield architecture when obtaining the minimum area for multiple current loops in an isolated circuit system. Many of the shields described below can be electrically coupled as a reference node or chassis ground in an isolation circuit, and can be thought of as a commonly used reference path for the circuit. Thus, several groups of internally paired complementary paths include propagation energy from one or more energy sources propagating along an external path connected to a circuit by a conductive material. Energy enters the device, regulates and delivers to each load.

The shielding structure allows a portion of the shield to act as a low impedance path for dumping and suppression, as well as at least partially blocking unwanted electromagnetic interference noise and energy return to each energized circuit. In one embodiment, the shield disposed therein can be conductively connected to the conductive region to properly utilize the shielding structure for low impedance to prevent dumping and suppression of unwanted electromagnetic interference noise and energy and at least partially return. do. In addition, another set of shields disposed therein can be conductively connected to the second conductive region, to adequately shield the shielding structure against low impedance to dump and suppress unwanted electromagnetic interference noise and energy and to prevent at least partially return. Use it. The conductive regions can be electrically or electrically isolated from each other.

Simultaneous suppression of energy parasitics can contribute to the shielding path structure enclosing with the cancellation of mutually opposing energy fields, contributing to electrically opposing shielded paths, and in several isolation circuits to obtain a modulating effect on propagation energy. It can contribute to the energy propagating along the various circuit paths interacting at. This adjustment switches as a result of the predetermined potentials used instantaneously and opposingly by these pairs, where several pairs of paths are placed on the shield and used by the energy found along the routing of the low and high impedance shields. It can include the effect of minimizing H-field energy and E-field energy simultaneous functions, such as isolation circuitry that includes and maintains a defined electrical region adjacent to dynamic simultaneous low impedance and high impedance shielding paths with respective potentials.

The various distance relationships generated by the positional overlap of energy routing in the isolation circuits are combined with various dynamic energy transfers to enhance and eliminate the various levels of harmful energy decay normally occurring in active devices or loads. This efficient energy regulation within this passive layer architecture combines two complementary paths and provides a third path suitable for enclosing and dispersing energy in multiple isolation circuits and attached or conductively coupled circuits when shielded. This enables the formation of a dynamic "0" impedance energy "black hole" or energy drain. Thus, the electrically opposed energy can be separated by dielectric material and / or embedded shielding structure, enabling dynamic proximity spacing relationships within specific circuit architectures, enabling the use of mutual enhancement cancellation and static suppression phenomena. It takes advantage of the propagation energy and associated distance that allows the layered conductive and dielectric elements to be highly efficient in energy processing capability.                     

According to the present invention, the device can use a single low impedance path or a common low impedance path as the voltage reference, while using circuits maintained and balanced within the relevant electrical reference points, the distribution of parasitic elements and harmful energy parasitics in an isolated circuit system. Keep the ingredients to a minimum. The various attachment schemes described herein allow for a "0" volt criterion as described below, which can be developed for each pair or multiple pairs of complementary conductors disposed on both sides of the shared center shield. In addition, the multiple switching of the operating state along the transistor gate disposed in the active integrated circuit allows the voltage to be maintained and balanced to minimize the harmful energy parasitics in the isolation circuit.

The shield may be combined using the principles of a caged conductive shield structure to create one or more shields. The conductive coupling of the shield with the large external conductive area suppresses the radiated electrostatic discharge and provides a large conductive area where loss of voltage and surge occurs. One or more of a plurality of conductive or dielectric materials with different electrical properties may be retained between the shields. Particular complementary paths include a plurality of common conductive structures that perform different phase adjustments to the structure of a plurality of paired or opposite phases or charges that make up half of the total sum of the complementary paths made. Half of the complementary paths form the first multiple path and the other half form the second multiple paths. The sum of the complementary paths of the first and second plurality of paths can be electrically uniformly separated, although the same number of paths can be used simultaneously, but half of the total sum of the individual complementary paths is for example arranged oppositely. It operates in a range from 1 degree to nearly 180 degrees out of phase. Small amounts of dielectric material, such as sub-micron, are used as conductive material separation between paths in addition to embedded shields, which may not be physically or conductively coupled directly to one of the complementary shielded paths. have.

The outer group region can be combined or conductively connected as an optional common path. An additional number of paired external paths can be attached to lower the circuit impedance. This low impedance phenomenon can occur using either selective or auxiliary circuit return paths.

The shielding architecture allows the shields to be coupled to each other, allowing energy to easily propagate along newly formed low impedance paths and to remove unwanted electromagnetic interference or noise from these generated low impedance paths.

In Figures 1A-5B, several common principles of both common and individual variations of the preferred embodiment configured in the cavity plane variants (FIGS. 1A-4I) and the stacked variants (FIGS. 5A and 5B) are shown.

In FIG. 1A, the relevant locations of the various path extensions disclosed in accordance with the present invention are shown. The portion of the balanced and complementary symmetrical device using the center shielding path labeled 8 " XX "-" X " M is adapted to the device as the support point of the balanced conductive portion of the cavity plane variant. A path arrangement is shown comprising at least a first and a second plurality of paths, wherein the first plurality of paths are arranged to be isolated from each other and have at least one pair of paths having a direction of a first complementary relationship. Also, at least a first half of the second plurality of paths is arranged to be isolated from the second half of the second plurality of paths, and at least two paths of the second plurality of paths are insulated from the paths of the first plurality of paths. The path device may also include a material that separates the path of the path device, for example, a dielectric, ferromagnetic material, or a varistor. The paths of the first half of the second plurality of paths are electrically connected to each other, and the paths of the second half of the second plurality of paths are electrically connected to each other. The total number of paths in the first half of the second plurality of paths is an odd number greater than one, and the total number of paths in the second half of the second plurality of paths is also an odd number greater than one. According to the invention, the paths of the first half of the second plurality of paths are located in the first overlapping alignment, the paths of the second half of the second multiple paths are located in the second overlapping alignment, and the first and second overlapping alignments. The shape is the coplanar alignment, the mutually overlapping alignment defined herein.

In non-coplanar alignment, the path of the first half of the second multiple paths is located in the first overlapping alignment, the path of the second half of the second multiple paths is located in the second overlapping alignment, and the first and second overlapping alignments. The shapes are placed on top of each other. In one device, at least four paths are insulated.

Embodiments of the invention may include at least three multiple paths, including a first multiple path and a second multiple path. The first and second multiple paths may include the number of paths in the first multiple path with the same and opposite number of paths found in the second multiple paths. The number of first and second plurality of paths is of substantially the same size and shape, and can be complementarily arranged and can also operate in an electrically complementary manner. Thus, pairing of the first and second multiple paths can result in the same number of first and second multiple paths. The preferred embodiment provides for at least one first and second shield to enable a separately isolated low circuit impedance path. Structurally, the shield may be made by a second multiple path and a fourth multiple path. Each of the plurality of shields may include shields of the same size and shape. Each of the third and fourth multiple paths can be conductively coupled. Conductive bonding can be accomplished by several methods and materials known to those skilled in the art. Thus, when the third and fourth multiple paths are grouped as two shield sets using the first and second multiple receiving shields, the third and fourth multiple paths are low circuitry for energy propagation to regulate circuit energy. It can be coupled to a common path to form an impedance path.

The paths can be further arranged in the bypass device such that when faced, the main body path 80 is shown as mirror images, for example 812NNM, 811NNE, Except for path extensions such as 812SSW and 811SSW, they are nested and aligned.

Within many paths, the individual paths have approximately the same size and shape and can be connected conductively. However, individual paths of one multipath may not be challengingly combined with paths of another multipath. There are situations where individual paths in one multiple path can be connected to separate paths in another multiple path, for example, where the first multiple shield and the second multiple shield are externally connected to the same conductor.

The common element may include energy flowing along conceptual energy indicators 600, 601, 602, 603 showing dynamic energy transfer in a shielded bypass path in the cavity plane as shown in FIGS. 1A-1C. Embodiments may provide at least multiple shields for the formation of multiple isolated low circuit impedance paths for multiple circuits.

In FIG. 1A, the path may be shielded by an associated common path and may include a main body path 80 with at least one path extension 812 "X". This illustrated shield may include a main body shield path 81 having at least one path extension 99 "X" / 79 "X". Shields are sandwiched and rare metals or base metals traditionally used in co-cured electronic devices or conductive materials such as Ag, Ag / Pd, Cu, Ni, Pt, Au, Pd or compounds of these metal oxides and glass frits The main body 799 surrounds a conductive inner path formed of a conductive material from the family. Capacitance and resistance values can be made in one path family, for example by using ruthenium oxide as the resistive material and Ag / Pd as the conductive material, as described below. In addition, changing the path shape will change the resistance and capacitance values. The change can be made by changing the material from which the route is made. For example, a conductive metal such as silver can optionally be added to the metal oxide / glass frit material to lower the material resistance.

Multiple paths 865-1 and 865-2 are shown formed in the cavity and separated on the same material portion 801. The paths of the path paths 865-1 and 865-2 of each cavity surface can be made of a conductive material 799 or a mixture of conductive material and other materials, denoted here as 799 "X". Each cavity surface path 865-1, 865-2 can be formed as a bypass path, each path comprising a main body path 80 having a corresponding main body edge and periphery 803A, 803B and at least It may include one path adjacent extension 812 "X". Each cavity surface path 865-1, 865-2 can include at least one path adjacent extension 812SSW, 811SSW, with some of the main body edges 803A, 803B extending therefrom. The extension 812 "X" is part of the path material formed in conjunction with the main body path 80 from which the extension extends. Main body path 80, 812 "X" can be found as an extension 799 or 799 "X" of material that extends above the received average peripheral edge 803 "X". Extensions 812 " X ", 79 " X " may be disposed as adjacent portions of the path in which they are formed. Each main body path may have edges 803A and 803B spaced apart from the edge 817 by a distance 814F. Edge 817 can include material 801. Edges 803 " x " of the coplanar main body path can be disposed at a distance 814J and spaced apart. The path extensions 812SSW and 811SSW may conductively connect the main body path 80 and the external paths 890SSW and 891SSW, respectively. The external path may be disposed at the edge 817. The main body path 80 disposed in the cavity surface may be sandwiched between the cover areas of the two layers of the main body path 81 of the cavity surface.

The combination of mutually opposing fields cancels or minimizes the impact. The closer the complementary symmetrical shield is, the better the cancellation effect of the opposing energy propagation. The more overlapping the directions of the complementary symmetrical shields, the better the suppression and cancellation of parasitic components.                     

In FIG. 1A, the edges of the multiple cavity shields may be indicated by dashed lines 805A and 805B. The main body path 81 of each of the plurality of shields is larger than the sandwiched main body path 80 of the corresponding sandwiched path. This may form an insertion area 806 relative to the position of the shield and the remaining path. The sizes of the main body paths 80 and 81 can be about the same, so that the inserted positional relationship can be minimized in certain embodiments. Increased parasitic suppression is obtained by the inserted path including the main body 80 to be shielded by the large main body path 81. For example, the insertion of the main body 80 of the path 865-1 may result in a material 801 separating the path 865-1 and the adjacent central cavity plane path 800-IM-1 as shown in FIG. 1B. Can be separated by an interval of 1 to 20+ times the spacing provided by the thickness.

Multiple coplanar shield edges 805A, 805B can be disposed and spaced apart at a distance 814K, and can be a gap 814 with respect to edges 805A, 805B and edge 817. Other spacing 814J associated with edges 803A and 803B may be provided. Also, a gap 814F may exist between 803 " X " and the edge 817. Each coplanar shield may include a plurality of adjacent path extensions, such as, for example, portions 79NNE, 79SSE, 99NNE, 99SSE extending from the plurality of coplanar shield edges 805A, 805B. The plurality of coplanar shields may include a plurality of outer path materials 901NNE, 901SSE, 901NNE, 901SSE disposed at edge 817. Conceptual energy indicator 602 represents various dynamic energy movements within the coplanar paths 865-1 and 865-2. Unwanted energy is delivered to the coplanar shield upon provision by a shield providing a low impedance path, which can be further electrically connected to another path or conductive area.

In FIGS. 1B and 1C, the layer sequence includes a first multiple coplanar paths 865-1 and 865-2, a second multiple coplanar paths 855-1 and 855-2, and a third multiple coplanar paths. 1-IM, 825-2-IM, 815-1, 815-2, 800-1-IM, 800-2-IM, 810-1, 810-2, 820-1-IM, 820-2-IM) Is shown against. The first, second, third multi-cavity paths may be stacked to form the implementations 3319, 3200, 3201. The third multiple coplanar path can provide shielding. Multiple cavity shields 825-1-IM, 825-2-IM; 815-1, 815-2; 800-1-IM, 800-2-IM; 810-1, 810-2; 820-1 The main bodies 81 of IM, 820-2-IM may have approximately the same size and shape, and may be spaced apart at co-planar locations on different layers of material 801. The first multiple coplanar paths 865-1, 865-2 can have at least corresponding, opposing and complementary second multiple coplanar paths 855-1, 855-2. These first and second multiple coplanar paths, when facing each other, may have main body paths 80 co-formed and aligned except for several adjacent path extensions 812 "X", 811 "X". have. As shown in FIGS. 1B and 1C, a pair of outer coplanar paths 820-1-IM and 825-1-IM serve as path shields for the multiple paths of other conductively connected paths to the main body 81. Improve shielding effectiveness.

As shown in various embodiments 3199, 3200, and 3201, the extension portion 79NNE of the shield 825-2-IM, 815-1, 800-1-IM, 810-1, 820-1-IM. , 79SSE) and the extension portions 99NNE and 99SSE of the shields 825-2-IM, 815-2, 800-2-IM, 810-2, and 820-2-IM may vary. In FIG. 1B, for example, extensions 79NNE and 79SSE may be spaced diagonally from extensions 99NNE and 99SSE and arranged on opposite sides of main body 81. In FIG. 1C, for example, the extensions 79NNE and 79SSE may be spaced apart on the same line as the extensions 99NNE and 99SSE and arranged on opposite sides of the main body 81. In FIG. 1B, extensions 812NNE and 811NNE extend and are spaced apart from the same edge 812 of the layer of material 801, and extensions 812SSW and 811SSW are opposite edges of the layer of material 801. Extend toward 812 and spaced apart from it. In FIG. 1C, paths 865-1 and 865-2 can be mirror images as described below. Compared to FIG. 1B, extensions 812NNE and 811NNE may be spaced apart so as to extend toward opposite edges 817 of material layer 801. Extensions 812SSW and 811SSW are spaced apart so as to extend toward opposite edges of the layer of material 801 such that extensions 812NNE and 811SSW are opposite edges 812 "X of each layer of material 801. Extends toward ").

In Figures 2A and 2B, Figure 2A shows a schematic diagram of the embodiment of Figure 2B in accordance with the present invention. FIG. 2B shows a route arrangement comprising an arrangement of first, second, third, fourth, fifth, sixth, seventh, eightth, nineth, and tenth paths, where at least the third and fourth paths are for example spaced apart from one another Can be arranged in the cavity surface. 2B shows the first and second paths disposed below the third and fourth paths, and the fifth and sixth paths disposed above the third and fourth paths, and the seventh and eighth disposed above the fifth and sixth paths. Ninth and tenth paths disposed over the path and the seventh and eighth paths. These paths may have various internal adjacent path extensions 812 "X", 811 "X", 79 "X", 99 "X", respectively, and may be separate elements having the same minimum number of layers. Internal adjacent path extensions 812 "X", 811 "X", 79 "X", 99 "X" and conductively connected external paths 890 "X", 891 "X", 802 "X", 902 " X ″) may be connected to the internal path of the multiple coplanar paths of the main body paths 80 and 81.

In FIGS. 3A and 3B, a schematic diagram of the embodiment of FIG. 3B is shown, wherein the external path can be selectively conductively connected in at least two isolation circuit portions. 3B shows a route arrangement comprising a minimum arrangement of first, second, third, fourth, fifth, sixth, seventh, eightth, nineth, and tenth paths, where at least the third and fourth paths are for example spaced apart from one another Can be arranged in the cavity surface. The apparatus shown in FIG. 3B includes first and second paths disposed below the third and fourth paths, and fifth and sixth paths disposed above the third and fourth paths, and fifth and sixth paths disposed above the fifth and sixth paths. And the ninth and tenth paths disposed over the seventh and eighth paths and the seventh and eighth paths. These paths may have various internal adjacent path extensions 812 "X", 811 "X", 79 "X", 99 "X", respectively, and may be separate elements having the same minimum number of layers.

In Fig. 3C, a plan view of the shield according to the invention is shown. The embodiment shown in FIG. 3C includes at least one additional path as compared to FIG. 3B. This additional path 1100 -IM "X" may be one of at least a number of shields in the path stack, which may extend between two circuit portions. Path 1100 -IM "X" may be one of at least two sandwich shields in the path stack. The shield may extend between the two circuits by adding a (1100-IM "X") path that is electrically connected and centered to the outer (1100-IM "X") shield. Path 1100-IM "X" may have at least one extension, shown as two extensions 1099NNE, 1099SSE, and may enable sandwiched shields for all paths within the present invention. have. At least three shields may be connected to each other and may include a central shield that divides the energy load or energy source of the isolation circuit or two divided circuits.

The shield 00GS can be electrically connected with other shields and can be arranged to affect the energy propagation of the isolation circuit. The isolation circuit can be sandwiched by a shield. The shield may be electrically connected to a conductive area insulated from other conductive areas to effect energy propagation.

4A-4I illustrate assembled devices of various embodiments in accordance with the present invention. The devices of FIGS. 4A-4I show path devices including a minimum arrangement of first, second, third, fourth, fifth, six, seven, eight, nine, and ten paths, where at least the third and fourth paths are examples. For example, they may be spaced apart from one another and arranged in the cavity surface. The first and second paths are disposed below the third and fourth paths, the fifth and sixth paths are disposed above the third and fourth paths, and the seventh and eighth paths are disposed above the fifth and sixth paths. And the ninth and tenth paths are disposed on the seventh and eighth paths. These paths may have various internal adjacent path extensions 812 "X", 811 "X", 79 "X", 99 "X", respectively, and may be, for example, assembled final separation elements.

In Figure 5A, a number of non-shared circuit stacks are shown that include path groups in accordance with the present invention. 5A includes a marker 1000 showing the continuation of the stacking arrangement for the next column of FIG. 5A. Conceptual energy indicators 600, 601, 602, 603 indicate energy flow. Material 799 may be deposited on material 801 to device 6900 shields labeled 815-1, 800-1, 810-1-IM, 815-2, 800-2-IM and 810-2. Can be. Shields 810-A and 810-B are separate shields of at least a portion of the isolation circuit system. Shields 815-A and 815-B are separate shields of at least a portion of the isolation circuit system. Shields 820-A and 820-B are separate shields of at least a portion of the isolation circuit system. Shields 825-A, 825-B are separate shields of at least a portion of the isolation circuit system. Conductors 855-1 and 855-2 are separated and shielded paths in a bypass structure. Conductors 865-1 and 865-2 are separated and shielded paths in a bypass structure. In FIG. 5A, the path arrangement is shown to include at least six path directions of two types of paths, where each direction of the paths of the at least six path directions provides conductive isolation from the remaining path directions.

5B shows a laminated shield structure in accordance with the present invention. 5B shows an embodiment similar to that of FIG. 5A, where two path sets 855 " X ", 865 " X " are omitted for clarity, and the shield of FIG. &Quot;, 865 " X "). The path extension 79 "X" may be rotated 90 degrees with respect to the various path extensions 811 "X" and 812 "X". As shown by the conceptual energy indicator, the result of this configuration defeats the expansion of the two path sets 855 " X ", 865 " X " of the two isolation circuits and the shield of the isolated circuit pairs 855A and 865A. It can be improved by placing it relatively near 90 degrees to be invalid for the various path extensions 855B, 865B.

5B shows a laminated shield structure in accordance with the present invention. 5B shows an embodiment similar to that of FIG. 5A, where two path sets 855 " X ", 865 " X " are omitted for clarity, and the shield of FIG. &Quot;, 865 " X "). The path extension 79 "X" may be rotated 90 degrees with respect to the various path extensions 811 "X" and 812 "X". As shown by the conceptual energy indicator, the result of this configuration negates the expansion of the two path sets 855 " X ", 865 " X " of the two isolation circuits and the shield of the isolated circuit pairs 865B and 865A. It can be improved by placing it relatively near 90 degrees to be invalid for the various path extensions 865B, 865A.

As noted above, in embodiments of the present invention, the plurality of complementary or paired shielded paths may include a first and a second plurality of paths. The energy may, for example, utilize multiple pairs of feedthroughs or bypass paths in a generally parallel and uniform manner. The path element may be non-isolated and include conductive openings and conductive through-vias to provide propagation energy and generally maintain a non-parallel or vertical relationship and additionally maintain an electrical relationship separated from the coupling circuit. These paths can maintain balancing internally and can take advantage of electrical oppositions formed along opposite complementary pairs. This relationship to complementary path pairs can occur, while paths and energy have opposite behavior within an externally attached shield structure.

In FIG. 5C, a related top view is shown for a stacked multiple non-shared circuit network having vias and including path groups in accordance with the present invention. The device according to the invention shown in FIG. 5C comprises a hole-through energy regulator. The hole-through energy regulators are configured such that the energy propagation principle described herein is maintained and utilizes multiple sets of paths for energy conditioning processing. In FIG. 5C, an invalid path set with a path device 6969 is shown. Path device 6969 is similar to FIG. 5B, without path extensions 79 " X ", 811 " X ", 812 " X ", and having functions from different directions relative to main bodies 80,81. 8879 "X", 8811 "X", and 8812 "X" vias are replaced.

In FIG. 5C, during the fabrication process, conductive holes 912, vias or conductive openings may be used in interconnect 8806 integrated circuits, using mechanical drilling, laser drilling, etching, punching, or other hole forming techniques. It may be formed through the above path layer. Each particular interconnect 8906 may allow several paths to be electrically connected or isolated. Each particular interconnect 8906 may extend through all layers of the route device 6969 or may be constrained above or below by one or more layers. Path device 6969 may include an organic substrate, such as an epoxy material or a patterned conductive material. If an organic substrate is used, standard printed circuit board materials such as, for example, FR-4 epoxy-glass, polyimide-glass, benzocyclobutyl, teflon, other epoxy resins, and the like may be used in various embodiments. In alternative embodiments, the routing device may comprise an inorganic material such as, for example, a ceramic. In various embodiments, the thickness of the level may be about 10-1000 microns. Interconnect 8806 between the various conductive layers selectively removes the dielectric material and conductive material to expose the conductive material of low conductive layer 904 and, for example, by conductive paste 799A or electrolytic plating 799B. It can be formed by filling the holes thus formed by removal.

 Interconnect 8806 may connect the exposed conductive layer to the relevant side of path device 6970. Interconnect 8806 may take the form of a pad or land to which an integrated circuit may be attached, for example. Interconnect 8806 may be formed using known techniques, such as filling a selectively removed portion of the dielectric, for example by conductive paste, electroplating, photolithographic or screen printing. As such, the path arrangement 6969 may include a patterned conductive material 904 of one or more layers separated by a non-conductive layer and interconnected by interconnects 8906. Other techniques for interconnecting and isolating the various layers of patterned conductive material 799 may be used. For example, rather than forming and selectively removing portions of various conductive materials 799 and non-conductive layers 801, the openings between the various layers may be desired portions of the various conductive materials 799 and non-conductive layers 801. Can be included by selectively adding. Removal techniques, such as chemical mechanical planarization, are used to physically remove multiple layers of different types of conductive and non-conductive materials, allowing the formation of desired openings for various interconnects.

 The path arrangement 6969 is constructed using a plurality of openings, a set of multilayer energy control paths, the substrate shape being adapted to control the propagation energy. Path device 6969 is combined with a multilayer common conductive Faraday caged shielding technique to enclose the propagation path to control the binding energy of known conductively filled openings such as vias 8879 "X", 8811 "X", 8812 "X". The propagation energy can be adjusted using the method. The interconnection of the path device and the IC may be made in a wire junction interconnect, flip flop ballray array interconnect, microbolg interconnect, combinations thereof, or any other standard industry acceptable method. For example, the "flip flop" type of integrated circuit means that the input / output terminals occur at some point on their surface, just like any other path on the flip. After the IC chip is ready to be attached to the path device 6969, the chip can be flipped over or attached by solder bumps or balls to the matching pads on the top surface of the path device 6969. Optionally, the integrated circuit can be wire bonded by connecting input / output terminals to the path device 6969 using connection wires to pads on the top surface of the path device 6969.

The circuitry in path device 6969 can serve as a source-to-load path device requiring capacitance, noise suppression, and / or voltage damping. This capacitance can be provided in the form of a capacitance formed and inserted in the path arrangement 6969. This capacitance can be coupled to the integrated circuit load using a pair of paths and shields as described above. Additional capacitance can be provided in the circuit electrically connected to the integrated circuit to provide voltage damping and noise suppression. Adjacent off chip energy sources can provide capacitance along a low inductance path to the load. The common shield path can be used as a "0" volt circuit reference node for off chip energy sources and common conductive insertion energy path configurations.

Path device 6969 may be connected to the integrated circuit by connection methods and connections 799A and 799B that are commonly acceptable in the industry, including bumpless build up layer (BBUL) packaging. This technology enables high performance, thin and light packages, and low power consumption. In a BBUL package, a silicon die or IC is inserted into a package with a path device operable as a first level interconnect. Thus, the BBUL package does not attach directly to the IC surface. For example, the electrical connections between the die and one or more of the various shields and packages need not necessarily be C4 solder bumps and can be made of copper wire. These features combine to create a thinner and lighter package than other IC packages while delivering high performance and low power consumption. The BBUL can enhance a manufacturer's ability to couple multiple silicon devices to the path device 6969.

Shielded paths 8811, 8812, 8879 can be electrically connected between each energy source and load of the IC by common industrial techniques, to regulate propagation energy. The shield 8879 may be conductively connected to the shield including 1055-2. The shield including 8811 and 8812 and other conductive portions thereof may be electrically connected to respective complementary paths that form nonpolar charges prior to connection, such that each layer 8811 and 8812 functions in an energy propagation direction. And to prevent layers 8811 and 8812 from changing from inputs and outputs to outputs and inputs, as will be appreciated by those skilled in the art.

In the stack variant shown in Figures 5A, 5B and 5C, an additional three paths (1100-IM- "X"), including one between 810-1 and 810-2, denoted 1100-IM- "C". Can be divided into equal numbers on the opposite surface of the 1100-IM- "C" placed balanced symmetric total path number. The addition of 1100-IM-1 and 1100-IM-2 connected to the 1100-IM-C creates a common or shielded structure (not shown). The shield of the shield structure may or may not be about the same size. The shield may or may not be physically isolated from other shields with respect to one or more embodiments of the present invention. Thus, the shield may or may not be electrically or electrically isolated from other shields with respect to one or more embodiments of the present invention.

Odd shields may be connected to each other to allow formation of common criteria or nodes using other shields. Since a certain number of extensions in almost all directions can be used for the joining, the number of shields 1100-IM- "X" is not configured to use extensions 1099NNE, 1099SSE, such as shield 00GS. Do not. Relative balancing and complementary symmetrical devices may be formed with respect to the center shield 8 "XX" or 800 / 800-IM as the device reference of the balanced conductive part. At least partial flux field cancellation along or between paired electrically opposed complementary paths occurs in such balanced but shifted implementations. In addition, simultaneous stray energy parasitics, complementary charge suppression, physical and electrical shield containment, and Faraday effects can occur. This result can be achieved at least in part because the magnetic flux energy moves along the shield parallel or adjacent to the corresponding path of the RF return path. Thus, the magnetic flux energy can be measured or observed relative to the return path.

The shifted paths are relatively balanced and are complementary and symmetrically arranged with respect to a central shield, such as shield 800 / 800- "X" -IM, for example shield 800 / 800-IM. Relative shifted, balanced, complementary and symmetrical shields and path arrangements may be included.

Preferred embodiments of Figures 1A, 1B, 1C-4I include these "shifted" embodiments. These shifted embodiments can include multiple layers with shields, paths, shields, paths and shields. Each of these multiple layers may be centered and complementary to the central shield 800 / 800- "X" -IM, such as for a coplanar variant, for example, and the entire multiple layers may be Can be central to Although individual shields may be shifted to generate separate unbalance, for example, between certain matched pairs of paths, complementarity and balancing may be maintained for the center shield and the main center shield. The shifting exposes a portion of at least one path outside the periphery of the overlapping shield to allow parasitic components and change eg impedance characteristics.

For example, a given path may be shifted five points to the left. Such shifting can occur in matched pairs with respect to the center shield, so that the recognized matching pair paths of opposing polarities are shifted by 5 points, or the paths of five adjacent opposing polarities are shifted by 1 point to maintain complementarity and balancing. To help. In addition, the path remains within the perimeter of the overlapping shield, which can nevertheless shift down. Nevertheless, such a shift down to the shield may result in balancing. However, some embodiments, not shown, may include situations in which the path is pulled toward the center of the shield and maintains the shield exhibiting different electrical characteristics such as inductive operation in a balanced or unbalanced state.                     

In FIG. 6, multiple stacked circuits are shown including implementation 6900, conductive energy paths, insulated energy sources, insulated energy utilization loads, and insulated common conductive paths. The conductive energy path may be conductively coupled to embodiment 6900 by a conductive bonding material such as, for example, soldering or the like. Via 315, a conductive path continuous below the substrate surface, may be coupled to conductive paths and may include a conductive material that serves as an adjacent conductive path for propagating energy. The insulated common conductive path may not be directly connected to an isolated energy source or an isolated energy utilizing load. As noted above, embodiment 6900 may include four multiple paths, each including electrically insulated electrodes and shields. The shield can be conductively coupled. The conductively coupled shield can be externally coupled to an insulated common conductive path that is not directly conductively coupled to the electrode using a conductive bonding material. As shown in FIG. 6, the electrodes 815-1, 800-1-IM, and 810-1 may be conductively coupled to 802GA and 802GB. The electrodes 815-2, 800-2-IM, and 810-2 may be conductively coupled to 902GA and 902GB. These bonds may not be conductively coupled to the first or second plurality of electrodes. In this configuration, two isolated circuits may use two isolated circuits, such as REF1 and REF2 of FIG. 6, with isolated and separate voltage references and isolated common impedance paths.

In FIG. 7, a stacked cavity planar multiple circuit is shown including an implementation 3210, a conductive energy path, an isolated energy source, an isolated energy utilization load, and an isolated common conductive path. The conductive energy path may be conductively coupled to embodiment 3210 by a conductive bonding material. Via 315, a conductive path continuous below the substrate surface, may be coupled to conductive paths and may include a conductive material that serves as an adjacent conductive path for propagating energy. The insulated common conductive path may not be directly connected to an isolated energy source or an isolated energy utilizing load. As noted above, embodiment 3210 may include four multiple paths, each including electrically insulated electrodes and shields. The conductively coupled shield can be externally coupled to an insulated common energy path that is not conductively coupled to the first and second multiple electrodes to the electrodes in this cavity surface structure. The third plurality of electrodes 815-1, 800-1-IM, and 810-1 may be conductively coupled to 802GA and 802GB, and 815-2, 800-2-IM, and 810-2 may be 902GA, 902GB. It may be conductively coupled to, and may not be conductively coupled to the first or second electrodes. In this configuration, the two isolated circuits may use isolated and isolated voltage references such as REF1 and REF2 of FIG. 7, separate and insulated common impedance paths, and at least one separate respective low inductance path.

4A to 7, the terminal electrodes 890A, 890B, 891A, 891B, 802GA, 802GB, 902GA, and 902GB may be single or multiple layers. Terminal electrodes 802GA, 802GB, 902GA, 902GB may be disposed in each other portion of the sintered body. Each main body electrode layer 81 or 80 and associated electrode extension 99 / 79G "X" or 812 "X" are connected to associated terminal electrodes 802GA, 802GB, 902GA, 902GB, 890A, 890B, 891A, 891B. It is possible to define an electrode that is extended and conductively coupled to it.

The present invention can be used for many energy conditioning functions using a jointly connected shielded structural element corresponding to a center tap of a resistor / voltage divider network. This resistor / voltage divider network can be configured using a ratio of several isolated circuit resistors. However, several insulated integrated circuit resistors can be replaced by a device according to the invention, which for example utilizes a specific conductive / resistive material 799A or generates resistive properties of the path material 799. Or use a variable physical arrangement. The voltage division function may be present when portions of the common shared path shielding structure are used to define a common voltage reference disposed on each side of each of the common path shielding structures.

In an embodiment, the number of path pairs complemented or initially complemented vertically during manufacture, or paired in the cavity surface as described above, may be multiplexed in a predetermined manner to produce multiple path elements having physical or electrical parallelism. Can be.

In addition, although not shown, the device of the present invention may be assembled in silicon and directly integrated into an integrated circuit microprocessor circuit or microprocessor chip packaging. Suitable methods for electrically depositing conductive materials such as plating, sputtering, vapor, electrical, screening, stenciling, vacuum, and chemical methods can be used, including chemical vapor deposition (CVD).

While certain embodiments have been described with respect to positions as "top" or "above", or "top" or "bottom" or any other position or orientation description, these descriptions are for illustrative purposes only and are not intended to be limiting. The invention may be implemented in a number of different embodiments, including energy regulation embodiments as an electronic system in the form of an energy regulator for an electronic assembly, an energy conditioning substrate, an integrated circuit package, an electronic assembly or an energy conditioning system, and Can be assembled using. Other embodiments will be apparent to those skilled in the art.

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The present invention can be used in almost any circuit providing an efficient, symmetrically balanced and sustainable simultaneous energy regulation function selected from at least one decoupling function, instantaneous suppression function, noise canceling function, energy cutoff function and energy suppression function. It is effective to provide a self-contained energy control device using a simple energy path device that can further include other elements coupled to a discrete or non-isolated device.

Claims (46)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete At least a first and a second plurality of paths, The first plurality of paths comprising at least a pair of paths, which are disposed in mutually complementary and electrically isolated positions from each other, The second multipath of at least a first number of paths is arranged to be electrically insulated from the second multipath of a second number of paths, and the second multipath is at least two paths electrically insulated from the first plurality of paths Including them, At least two paths of the second plurality of paths of the first path number are electrically connected to each other, At least two paths of the second plurality of paths of the second path number are electrically connected to each other. delete delete delete delete delete delete The method of claim 15, The first plurality of paths comprises a plurality of vias, The second plurality of paths are a plurality of shielding paths. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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