KR100433321B1 - Universal energy conditioning interposer with circuit architecture - Google Patents

Abstract

The present invention is intended to provide an electronic device, such as, but not limited to, a single plurality of integrated circuit chips, alone or in combination, and a mounting substrate to and from an energy source that accommodates conductive energy paths providing an energy utilization load. And an interposer substrate for interconnecting elements that may be composed of a substrate module, a printed circuit board, an integrated circuit chip, or other substrate. In addition, the interposer has a multi-layered, general purpose multifunctional common conductive shielding structure with conductive passageways for energy and EMI regulation and protection, and grouping with a circuit structure for energy regulation as related to integrated circuit device packaging. And a commonly shared and centered conductive passageway or electrode of a structure that allows for smooth energy interaction between the activated and activated conductive passageway electrodes and at the same time can be shielded. The present invention can be used between active electronic components and multilayer circuit guts. A method of manufacturing the interposer is not provided, but may be changed to an individual or property construction methodology that already exists or is to be developed.

Description

UNIVERSAL ENERGY CONDITIONING INTERPOSER WITH CIRCUIT ARCHITECTURE}

Interposer structures can be used in the manufacturing process of single chip modules (SCMs) and multiple chip modules (MCMs) to electrically connect one or more integrated circuit chips (ICs) to printed circuit boards, discrete IC electronic packaging, or other substrates. have. The interposer regulates various forms of energy passing along the contained internal interposer conductive passageway located between the energy source and an energy consuming load such as an IC. This interposer provides an energy path between the IC chip and the PC substrate or substrate and, if desired, between the different active component chips mounted on the interposer itself.

The main drawback of conventional techniques for the interconnection and packaging of IC chips in Multi Chip Modules (MCMs) arises from the thin thickness of the substrates used in conventional multi chip modules, resulting in energy supply to the IC chips. Has a relatively high impedance. This leads to unwanted noise, energy loss and excess thermal energy generation. These problems are relevant and can be important for the integrity of the system when guiding or delivering energy along a passageway through an interposer substrate.

Electrical systems have experienced short production life cycles over the last decade. Systems built just two years ago can be considered outdated for third and fourth generation changes in the same application. Thus, passive electronic components and circuits formed into these systems need to evolve very quickly. However, the evolution of passive electronic components has not kept pace. The performance of a computer or other electronic system is typically limited by the operating frequency of its slowest active element. To date, these elements have been microprocessor and memory components that have controlled certain functions and calculations of the overall system. Nevertheless, with the advent of new generation microprocessors, memory components and their data, the focus has changed. The strong pressure on the industry is to provide system users with improved processing energy and reduced unit costs. EMI generated in these environments must also be removed or minimized to meet international emission and / or sensitivity requirements.

Processor operating frequency (speed) is now matched by the development and dissemination of ultrafast random access memory (RAM) architectures. This breakthrough has boosted the overall system operating frequency (speed) to over 1 GHz. However, during this same period, passive component technology did not keep up with these new breakthroughs and only made gradual changes in configuration and performance. These advances and changes to the passive component structure mainly focus on production speeds that reduce component size, separate component electrode layering, dielectric discovery and modification of device fabrication techniques, or reduce unit production cycle times.

In addition to these high frequencies, energy paths typically have to be grouped or paired as electrical compensation elements or elements that work together and balance electrically and magnetically in an activated system. Attempts to deliver energy in line state using prior art components have led to significant levels of interference in the form of EMI, RFI, and capacitive and inductive parasitics. This increase is partly due to manufacturing imbalances and performance defects in passive components that cause or induce interference in related electrical circuits.

These problems created a new industry focus on passive components, but only a few years ago such focus was mainly caused by active components, such as common reference or ground paths, energy surges or sudden fluctuations in voltage fluctuations from humans, and other electromagnetic waves. It relates to interference from sources and conditions, such as voltage imbalances located on both sides of the device.

At higher operating speeds, EMI can also be generated from the electrical circuit path itself, which is desirable to shield from EMI. Differential and common mode noise energy can be generated, traversing along and around cables, circuit board tracks or traces, and traversing along most high speed transmission line or bus line passages. In most cases, one or more of these critical energy conductors can serve as antennas, thus generating energy fields that radiate from these conductors to further exacerbate the problem. Another source of EMI interference comes from these components when the active silicon component operates or switches. These problems, such as SSO, are a popular cause of circuit disturbances. Other problems include unshielded parasitic energy that freely couples to or onto the electrical circuit and causes significant interference at high frequencies.

US patent application Ser. No. 09 / 561,283, filed April 28, 2000, US patent application Ser. No. 09 / 579,606, filed May 26, 2000, US patent, filed Jun. 15, 2000 Application No. 09 / 594,447 filed US Provisional Application No. 60 / 200,327, filed Apr. 28, 2000, US Provisional Application No. 60 / 203,863, filed May 12, 2000, June 30, 2000 In addition to US Provisional Application No. 60 / 215,314, which is filed, it relates to a series of continuous improvements to a series of separate multifunctional energy conditioners. These multifunctional energy conditioners have a commonly shared and centered conductive electrode of a structure that can simultaneously interact with an activated paired conductive passageway electrode housed in an energy carrying conductive passageway. These energy carrying conductive passages can operate in opposite phase or charging manners with respect to each other and are separated from each other by physical shielding treatment.

The present invention provides energy and EMI conditioning and protection conductive passages with conventionally shared and centrally disposed conductive passageways or electrodes capable of smooth energy transfer and simultaneously shielding, such as decoupling operations between grouped and activated conductive passageways. A circuit interposer comprising a multi-layer, general purpose multifunctional common conductive shielding structure is provided. DETAILED DESCRIPTION The present invention is for energy regulation as related to integrated circuit (IC) device packaging or directly mounted IC modules, and more particularly ICs having energy paths that are the origin and end points of energy sources and energy consuming loads and these An interconnect medium between component packaging and / or external energy circuit connections or other substrates, for interconnecting energy utilizing integrated circuit chips to printed circuit boards, IC element packaging, or directly mounted IC modules.

More specifically, according to the present invention, paired or neighboring conductive passages or electrodes can each operate in a harmonious manner with respect to each other, but in a manner having opposite phases or being charged. The invention allows energy regulation in the form of EMI filtering and surge protection while maintaining a clearly flat, ie balanced voltage supply between the source and the energy consuming load when placed in the circuit and activated. Furthermore, various embodiments of the present invention provide for bypassing, while maintaining continuous equilibrium in an SSO (simultaneous switching operation) state without returning the disturbing energy parasitic component to the circuit system when the invention is being operated manually in the circuit. It can simultaneously and effectively provide energy conditioning functions including decoupling, energy storage.

1A is an exploded perspective view of one embodiment of a family multifunctional energy conditioner.

1B is an exploded perspective view of another embodiment of the family multifunctional energy conditioner shown in FIG. 1A.

FIG. 2 is a circuit diagram schematically showing the physical structure of FIGS. 1A and 1B when placed and activated in a large electrical system.

3 is a plan view of a portion of a portionless holeless embodiment element including a portion of a Faraday caged conductor shield structure and a portion of the bypass conductive passageway electrode.

4 is an exploded perspective view of a portion of a holeless embodiment element that forms a Faraday caged conductor shield structure including a holeless interconnected parallel common conductive shield structure.

5A is an exploded cross-sectional view of a holeless multilayer bypass configuration of the circuit structure used in the configuration of the present invention with outer image shielding.

FIG. 5B is a second exploded cross-sectional view of rotating the layered bypass shown in FIG. 5A by 90 °.

6A is an exploded cross sectional view of a layered configuration of an embodiment of the present invention with an outer image shield.

FIG. 6B is a partial view of the interposer configuration shown in FIG. 6A mounted over an integrated circuit die disposed into a portion of an integrated circuit package using wirelead or pin interconnects instead of ball grid interconnects.

7 is a plan view of an interposer configuration.

8A is a cross-sectional view of another interposer configuration shown in FIG. 7.

FIG. 8B is a partial cross-sectional view of the interposer configuration shown in FIG. 7 mounted between the integrated circuit package and the integrated circuit die in which the ball grid interconnect is shown.

9 is a detailed view of the solder ball interconnect of FIG. 8A.

10 is a partial outer plan view of an integrated circuit package schematically illustrating a prior art interposer with externally mounted individual arrays used to support energy regulation.

FIG. 11 is similarly shown in FIG. 10, but does not have a prior art interposer, but is part of an integrated circuit package with a new invention disposed between an integrated circuit package and an integrated circuit die in which a ball grid interconnect is shown. Exterior floor plan.

Based on the foregoing, multi-layered versatility with energy conductive passages sharing common and centered conductive passages or electrodes as part of the structure, allowing for energy regulation as well as allowing for multiple different functions simultaneously in one complete unit There was a need to provide a fabricated interposed circuit connection device using a common conductive shield structure.

In addition, the present invention includes at least one comprehensive embodiment or modification of the embodiment, which typically comprises a shared and centered conductive passageway or electrode as part of its structure.

In addition, the present invention not only concurrently physically and electrically shields a portion of the active chip structure, but also allows predetermined simultaneous energy interactions to occur between grouped and activated conductive passages to provide internal transfer energy within the new structure. To be supplied by a passage outside of the element of the embodiment.

The present application extends this concept and also provides a single, low cost system of circuit protection and regulation that helps multi-layer individual versions of various prior art devices to address or reduce the problems and obstacles of the industry as described above. A new circuit interposer is disclosed that includes a multilayer general purpose multifunctional common conductive shielding structure with conductive passageways replacing individual units of the same.

Thus, according to the present invention, a solution for low impedance energy distribution of hundreds of MHz or more lies in a thin dielectric energy planar technology that is much more effective than multilayer discrete decoupling capacitors.

It is an object of the present invention to provide energy decoupling to an active system load while simultaneously maintaining a constant and apparent voltage potential in the same part of the active component and its circuitry.

It is an object of the present invention to minimize or suppress unwanted electromagnetic emissions caused by differential and common mode currents flowing in the electron passages affecting the present invention.

It is an object of the present invention to provide a wide range of multilayer embodiments and, when attached to the circuit and activated, a number of dielectrics not limited by certain physical properties that can simultaneously provide simultaneous line regulation and protection as described below. It is to use material.

It is an object of the present invention in one integrated embodiment to constrain and exclude certain energies such as loads for simultaneous source and / or source decoupling, differential mode and common mode EMI filtering, capacitive and inductive parasitic components to the load. In addition, the ability to address problems and limitations not met by prior art devices, including, but not limited to, parasitic component confinement and surge protection, and performing these described capabilities when using conductive regions or passageways. To provide the user.

It is an object of the present invention to readily utilize with or without one or more external conductive attachment means in a conductive region disposed external to the invention originally produced. External connections to the conductive region can support embodiments of the present invention when protecting electronic system circuits.

The object of the present invention is not limited to the embodiments shown herein when produced, and does not limit the invention to a particular form, shape, or size for the plurality of possible embodiments of the invention, which may be produced, It is to provide a physically integrated shield restraint, a conductive electrode structure for use with an independent electrode material, and / or an independent dielectric material composition.

It is another object of the present invention to provide a constant and distinct voltage potential for various parts of the circuit.

It is a further object of the present invention to use a standard manufacturing process and within the embodiments to be made of conductive and conductive or commonly found dielectric and conductive materials found to reach narrow capacity, induction and resistance tolerances between or along electrical passages. It is an object of the present invention to provide embodiments that simultaneously maintain a constant, unobstructed conductive passageway for transferring energy from a source to an energy utilization load.

Another object of the present invention is substantially parallel to the energy source and energy utilization load in the interposer when attached in a circuit between energy conduits and when attached to a circuit reference node or ground as a low circuit impedance path. It is to provide a means for lowering circuit impedance by providing and maintaining a conductive passage in a state.

Finally, it is an object of the present invention to convert a plurality of pairs or groups of paired electrical passages or conductors into regions or spaces partially surrounded by a plurality of commonly coupled conductive electrodes, plates, or passages very closely to one another. It is to provide an embodiment that can provide a user with a choice of external conductors or passages that are coupled and selectively coupled onto individual or common conductive passageways or electrode plates disposed within the same embodiment.

Numerous other arrangements and configurations to implement and form the above objects and advantages of the present invention to demonstrate the versatility and widespread use of general purpose energy regulating interposers having circuit structures for energy and EMI regulation and protection within the scope of the present invention. Also disclosed.

As used herein, the term “UECICA” is used to mean a general purpose energy regulating interposer having a circuit structure for energy and electromagnetic interference (EMI) regulation and protection, which is within the scope of the present invention. Refers to the individual version of the device.

In addition, as used herein, the term “AOC” means “predetermined region or space of physical convergence or coupling portion” defined as the physical boundaries of co-fabricated invention elements. Non-energization and activation are defined as the extent or extent of which electrons are in motion in and out of and / or to an area outside of the predetermined area within the individual and non-individual versions of UECICA. do.

Serial No. 09 / 008,769 of some continuing applications, filed Jan. 19, 1998, now patented as US Pat. No. 6,097,581, and filed Apr. 8, 1997, now patented as US Pat. No. 5,909,350. US Patent No. 6,018,448, Serial No. 08 / 841,940, Patent Application No. 09 / 561,283, filed Apr. 28, 2000, and Patent Application No. 09 / 579,606, filed May 26, 2000 Patent Application No. 09 / 594,447, filed Jun. 15, 2013, along with U.S. Provisional Application No. 60 / 215,314, filed Jun. 30, 2000 by Applicant of the present invention, discloses a separate multi-functional energy conditioner and multi-function. It relates to a continuous refinement of the family of energy controlled shielding structures, which are incorporated herein by reference.

The new UECICA starts with a combination of layered, stacked, electrically conductive, electrically semiconductive and nonconductive dielectrically independent materials in a variety of structures. These layers can be combined to form a unique circuit when placed in a system and energized. Embodiments of the present invention are both filled and unfilled, which may be referred to as common conductive path electrodes, differential phase conductors, deposits, plates, VIA, sometimes referred to herein as 'energy conductive paths'. It may comprise a layer of electrically conductive, electrically semiconductive and nonconductive material forming a group of conductive holes. Herein, the term "common conductivity" is used for other passages which are paired equally in an activated circuit with an electrically opposite passage that serves to electromagnetically, in most cases, have a 180 ° phase difference on the opposite side to the other side. It is a low-impedance common energy path, as opposed to the differential conductive path that is usually used, meaning a homogeneous energy path that can be joined together all in one conductive structure.

Dielectric, nonconductive and semiconducting media or materials may also be referred to simply as insulators, passageless or simply dielectrics. Some of these elements are generally to one another and to predetermined pairs or groups of similar elements, which may include various combinations of conductive passageways and their layerings in a predetermined or custom structure. It is in a parallel relationship. Other elements of the present invention may be in generally parallel relationship with each other, but may also be in general perpendicular relationship with other elements of the present invention.

When manufacturing the present invention, a predetermined device has just been described, such as a dielectric layer, a plurality of electrode conductive passages, sheets, laminates, deposits, a plurality of common conductive passages, shields, sheet laminates, or deposits. Used to join together a plurality of elements in different arrangements in overlapping, partial overlapping and non-overlapping positions with respect to different physical structures, and in the present invention, VIA, dielectric layers, Influenced by a predetermined arrangement sequence of the final manufactured result that connects a plurality of electrode conductive passageways, sheets, laminates, evaporators, a plurality of common conductive passageways, shields, sheets, laminates, or specific forms of the same element, such as evaporators Made identically with the same material receiving

Other conductive energy paths can cross and cross the various layers just described, and can usually be in a non-parallel or even vertical relationship for layers of the same group. Conductive and non-conductive spacers can be attached to various groups of layers and cross vertical paths in a predetermined manner, allowing various degrees and functions of energy regulation to occur with the portion of the transfer energy passing into and out of the AOC of the present invention. have.

For all embodiments of the invention described but not shown, the Applicant has considered the manufacturer to have a choice in some cases, which is the electrical properties of the invention after the invention has been manufactured, placed in a circuit, and activated. It is intended to combine various ranges of available materials to be selected or combined with the final composition of the present invention while still maintaining almost all or part of the desired degree of adjustment function. Materials for the construction of the present invention consist of one or more layers of material elements that are compatible with available processing techniques, but are not limited to any possible dielectric material. These materials may be silicon, germanium, gallium arsenide, or semiconducting materials such as semi-insulating materials or insulating materials, but are not limited to any material having a dielectric constant, i.

Similarly, the present invention is not limited to the following. That is, any possible conductive material such as magnets, nickel base materials, MOV type materials, ferrite materials; Any materials and processes capable of making conductive passageways suitable for conductive materials such as Mylar films or printed circuit board materials; There are any materials or processes that can make conductive regions such as, but not limited to, doped polysilicon, sintered polysilicon, metal, or polysilicon silicate, polysilicon silicide.

If or after the structural layer device is manufactured as an interposer that is not limited to just an IC package, the device may be molded, combined with various electrical packaging, other substrates, boards, electrical devices, electrical systems, or other electrical subsystems. Simultaneous energy regulation, decoupling may be performed to assist in changing the electrical transfer of energy to the desired electrical form or shape by embedding, embedding, enclosing or embedding.

The variant may serve as a possible system or subsystem electrical platform that accommodates both active and passive components, with additional circuitry, and most of the foregoing in regulating transfer energy from source to load and vice versa. It is made up of layers to provide the benefit of. Some prior art interposers already use a predetermined layered configuration with VIA to support or tap various conductive passageways or layers located between dielectric or insulating materials.

In addition, the present invention typically has at least one generic or modified embodiment with electrodes as part of a shared, centrally located conductive passageway or structure thereof.

In addition, the present invention partially provides simultaneous physical and electrical shielding treatment to the active chip structure, and provides predetermined simultaneous energy interaction between the grouped and activated conductive passages to be supplied by the passages external to the elements of the embodiment. By providing internal transfer energy within the new structural region.

Prior art discrete decoupling capacitors lose their effectiveness at about 500 MHz. For example, the mounting inductance for a 0603 size capacitor was reduced to about 300 pH. Assuming that the internal capacitance of the capacitor is 200pH, this is equivalent to a total of 500pH, which corresponds to 1.57 ohms at 500MHz. Thus, current individual capacitors are not used. Multiple components with low values of series resonant frequency and low ESR capacitors may be used to drive at low impedance at 500 MHz, but the capacitance required to achieve 500 MHz with 500 pH ESL is about 200 pF. Current substrate materials (FR-4, 4 millimeter dielectric) have 225 pF for every square inch of energy plane, which requires more than one individual capacitor per square inch. Typically, various interposers with a plurality of individual passive component structures cause a lack of electrical balance in the circuit, which, when present in an activated circuit system, creates additional discontinuities next.

A high-level technique using various interconnect platforms and methodologies for configurations to attach IC chips directly to a PCB or other package connection means is to provide low impedance from an energy path or electrode plane using a single embodiment.

It is impractical to use many individual low impedance decoupling capacitors in an interposer or PCB when low impedance energy planes cannot be used to connect them.

This use extends from this concept and is cost-effective for what we believe to be a new general-purpose system of circuit protection and regulation that helps to solve or reduce industrial problems and disturbances with a simple, exponential effect as described above. New interposer consisting of multiple layers of universally versatile common conductive shielding structures with conductive passageways that replace multiple individual versions of various prior art components into a single individual unit that provides a variation of a single component embodiment. Further discloses.

Thus, a solution for low impedance energy distribution of several hundred MHz or more is in thin dielectric energy plane technology, according to the invention, which is much more effective than a plurality of individual decoupling capacitors.

Therefore, it is an object of the present invention to compare a single manual capacitor component, or a plurality of manual adjustments, while maintaining a complete energy supply protocol for a single or a plurality of units of active components utilizing portions of energy transfer within the circuit. This is to allow it to operate more effectively over a wider frequency range than a network. Ideally, the invention may be general in its application potential, and by utilizing various embodiments of the predetermined grouped elements, the invention of operation will continue to perform effectively in systems operating above a frequency of 1 kHz.

To transmit electromagnetic interference energy, two energy fields are required: an electric field and a magnetic field. The electric field couples energy into the circuit through the potential difference between two or more points. When the electric field is changed in space, a magnetic field is generated. If you change the magnetic flux at any time, an electric field is generated. As a result, a pure electric field or a pure time varying magnetic field cannot exist independently of each other. Maxwell's one-way equation is known as the divergence of these fields based on Gauss's law. This equation applies to the accumulation of charge that creates an electrostatic field (“E-Field”) and is best observed between the two boundaries, namely conductivity and non-conductivity. The boundary condition behavior based on Gauss's law allows the conductive enclosure (also called Faraday cage) to serve as an electrostatic shield.

At predetermined boundaries or edges, charge is the result of predetermined design measures that take into account the final product efficiency that occurs and is activated within the circuit when the invention forms the particular manufacturing methods and techniques described herein. It can be maintained inside of the conductive boundary located inside the passage of.

The charge present outside the predetermined boundary or edge of the inner conductive boundary of the inner passageway of the present invention is also excluded from affecting the same energy field generated internally that tries to escape the same conductive passageway.

Maxwell's quadratic equation shows that there is only charge and no magnetized particles (no monopol). The charge is either positively or negatively charged. Magnetic fields are generated through the operation of current and electric fields. Current and electric fields ("E-Field") serve as point sources. The magnetic field forms a closed loop around an electric current that generates an energy field located along the activated conductive path. Maxwell's cubic equation, sometimes called Faraday's law of induction, describes a magnetic field (H-Field) that moves in a closed loop circuit, ie, generates a current. This cubic equation explains that the electric field is created by changing the magnetic field. Magnetic fields are typically found in transformers or winding objects such as electric motors, generators, and the like. Maxwell's third- and fourth-order equations both explain how the combined electric and magnetic fields propagate at the speed of light. This equation also illustrates the concept of a "skin effect", which can predict the effect of magnetic shielding treatment and even predict the effect of nonmagnetic shielding treatment.

There are two types of grounds commonly found in today's electronic products: earth ground and circuit ground. Earth is not an equipotential plane, so the earth ground potential can fluctuate. In addition, Earth has other electrical properties that are not conductive for use as return conductors in circuits. However, circuits are often connected to earth ground for protection against shock hazards. Another kind of ground or common conductive passage, ie a circuit common conductive passage, is a randomly selected reference node of a circuit node with respect to which other node voltages in the circuit are measured. All common conductive passage points in the circuit should not proceed with an external grounded trace on the PCB, carrier or IC package, but may go directly to the internal common conductive passage. This allows each current loop in the circuit to terminate freely on its own in all configurations that create a minimum path of minimum impedance for the portion of energy implemented in the new inventive AOC. This can be beneficial for frequencies where the minimum impedance path is mainly inductive.

With regard to the grounding just as described above, there are at least three shielding treatment functions occurring within the present invention. First, in relation to the size of the differential conductive passageway, the external parasitic component originating from the common conductive passageway and originating from the sandwiched differential conductor as well as not originating in the accommodated differential passage is particularly capacitively coupled. Physical shielding of the differential conductive passageway achieved by active electrostatic suppression or minimization of parasitic components that prevents reverse attempts to join onto the sometimes referred to shielded differential passageway. Capacitive coupling is known as electric field ("E") coupling, and this shielding function results in electrostatic primary shielding against the electric field parasitic components. Capacitive coupling, including the passage of interfering transfer energy due to mutual or drift capacitance originating from differential conductive passageways, is suppressed within the novel invention. The present invention provides a method of layering and predetermining by almost completely enclosing the opposite phase conductor in a Faraday caged conductive shielding structure ('FCLS') that provides an electrostatic or Faraday shielding effect, and in both vertical and horizontal (intermixing) directions. Positioning of the layering position is used to block capacitive coupling.

In other prior art devices, where the shielding coating is not 100%, the shielding structure usually ensures that the circuit-to-shielding capacitance proceeds to the transfer energy reference common conductive passage instead of acting as feedback and bidirectional interactive elements. To ground. However, the present invention may use an internal transfer energy reference common conductive passage or image ground in the device for this purpose. The FCLS of this device establishes capacitive coupling between internal and external (to AOC) between potential noisy and sacrificial conductors by imposing any drift capacitance of the common conductive passage layer disposed between each differential conductive passage conductor. Used to suppress and prevent.

Second, conductor positioning shielding technique. This technique is used for inductive energy coupling and is also known as mutual induction removal or minimization of a portion of the energy delivered along separate, opposing conductive pathways.

Finally, physical shielding against RF noise. Inductive coupling is magnetic field coupling (“H”), so this shielding function performs shielding against magnetic shielding, which shielding occurs through mutual elimination or minimization within the device. RF shielding is a classic "metal barrier" for all kinds of electromagnetic fields, which is what most people believe to be. There are two aspects to protecting the circuit against inductive pickup. One aspect is to try to minimize the aggressive field at the source. This was accomplished by minimizing the area of the current loop at the source to improve field elimination or minimization. The other aspect is to minimize the inductive pickup in the sacrificial circuit by minimizing the area of such a current loop, according to Lenz's law, because the induced voltage is proportional to this area. So these two aspects are related to minimizing the area of the current loop, which is actually the same interlocking action. In other words, minimizing the aggressiveness of a circuit essentially minimizes its sensitivity. Shielding for inductive coupling simply means adjusting the dimensions of the current loop in the circuit. The RF current of the circuit is directly related to the signal and energy distribution network with bypassing and decoupling.

RF current is ultimately generated as a blend of clocks and other digital signals. Signal and transfer energy distribution networks should minimize the loop area for RF return current as much as possible. Bypassing and decoupling are related to the current draw that must occur through the delivery energy distribution network, which by definition is a large loop region for RF return current. In addition to this, it also relates to the loop area that must be reduced, the improperly received transmission line, and the electric field generated by excessive drive voltage.

If many current loops are involved, the best way to minimize the loop area is to use a common conductive path. The idea behind RF shielding is that the time varying EMI field induces a current in the shielding material. This restriction can be overcome by the freedom to use any material and dielectric in the assembly's configuration. More typically, the loss, commonly referred to as absorption loss, reradiation loss, or reflection loss, can be further controlled.

The common conductive path is a conductive surface that serves as a return conductor for all current loops in the circuit. The present invention provides a common conductive shield as a separate internal common conductive passageway, but sandwiched between the holeless conductors to provide a physically narrow or minimized energy loop between the active chip and the interposer to regulate energy. use. The structure with a hole-thru common conductive passageway behaves like a holeless element of the assembly as far as minimization of the loop area is concerned. The key to getting together the minimum loop area for all current loops is to make the common conductive path current distribute as freely as possible around the entire area of the component's common conductive path area element.

By surrounding the predetermined conductive passage electrode using a conductive caged structure constructed with one centrally disposed and shared common conductive passage or region, the common passage or region becomes a zero reference conductive passage with respect to the circuit voltage, It lies between at least two oppositely opposite phase or voltage potential conductive structures that are each individually arranged sequentially on either side of the sandwiched, centered and shared common conductive passageway or region just described.

The addition of two additional common conducting passages is just a configuration of the type that sufficiently performs the activated function of suppressing or minimizing the electric field (E-field), the magnetic field (H-field), the stray capacitance, the stray inductance, the parasitic component. As described, two differently activated passageways can now be added to the five common conductive passageways already disclosed into an electrically common structure that is almost completely enclosed, and oppositely charged or phased, adjacent or in contact, varying. It is possible to mutually eliminate or minimize the electric field of the easily arranged delivery energy passageway. In the final step for the horizontal layering process of the seven-layer interposer, two additional common passageways sandwich the first five layers as already described. For example, the SCM or MCM formed with the present invention can utilize the scheme used by the large SCM and MCM manufacturers, now for various third common conductive passages with respect to each other or grounding.

In the present invention, the supply path for a portion of the transfer energy and the return path for a similar portion of the transfer energy are separated by a micron distance and typically only by a common conductive passageway and some predetermined dielectric. Such a configuration can minimize or eliminate some of the circuit energy present in the magnetic field and generated by this very small current loop. Maintaining highly effective mutual rejection and minimization of the inductance of opposing but shielded differential conductive passageways affects minimal magnetic flux residual and minimizes sensitivity to inductive coupling regardless of the location of the interior of the elements of the present invention. Means.

The present invention mimics the function of an electrostatically shielded transformer. Transformers are also widely used to provide common mode (CM) isolation. These devices rely on differential mode (DM) transfers before and after their input to magnetically connect the primary winding to the secondary winding when attempting to transfer energy. As a result, the CM voltage before and after the primary winding is cut off. One drawback inherent in the manufacture of transformers is the transfer energy source capacitance between the primary and secondary windings. As the frequency of the circuit rises, capacitive coupling also increases, so circuit isolation is now compromised. If sufficient parasitic capacitance is present, high frequency RF energy (quick transients, ESD, lightning, etc.) can pass through the transformer and cause upset of the circuit in the other side of the isolation gap accommodated for such a transient. . Depending on the type and use of the transformer, shielding may be provided between the primary and secondary windings. This shield is structured to connect to a common conductive passage reference source to prevent capacitive coupling between two sets of windings.

Thus, the present invention is similar in energy transfer, ie energy transfer, and the operation of transformers and new devices not only effectively utilizes physical shielding to suppress parasitic components and the like, but also works effectively in new and unpredictable ways. To do this, the positioning of the layering, the connection of the layering, and the external combination for the external circuit are used.

If a system is inverted by AC line transients, this type of functional means will provide a fix. In prior art devices, the shield must be connected to an external common conductive passage in order to be effective for this type of use. However, the present invention provides an alternative to this principle.

Passive structures as used by the present invention can be formed to control or minimize both types of energy fields that can be found in electrical systems. The present invention need not be formed to better control one type of energy field than that of another type, but it is possible to make such specific adjustments to any one energy field over other types of energy fields. It is contemplated that different types of materials may be added or used to form the embodiments. In the present invention, the arrangement of the horizontal peripheral connections on the side of the passive component of the assembly, or the placement of the vertical holes through the passive elements, the selective coupling or non-engagement of the three VIAS and / or conductively filled holes Thereby, the transfer energy transfer path can be generated as if by a feed-through filtering device.

When the interposers of the prior art are placed and activated in a circuit, the manufacturing tolerances of the device are accompanied by the circuit and are revealed upon circuit activation. These imbalance variables are doubled by the addition of multiple passages, causing voltage imbalance in the circuit.

Uses of the present invention can be placed into differentially operated circuits, providing practically balanced electrical power and substantially equal capacitance, inductive and resistance tolerances for any one inventive unit, i.e. each pair within a device. And are equally and electrically balanced between the energy passages. The manufacturing tolerances or passage balances of the present invention between commonly shared central conductive passageways found within the present invention are levels which occur at the factory during the manufacture of the present invention, even with the use of common non-conductive materials, dielectrics or conductive materials. These materials are generic and common among the individual units. Thus, inventions manufactured with a 5% tolerance when produced as described in the disclosure, likewise placed 5% correlated between single or multiple paired energy passages of the invention when placed into an activated system Has electrical tolerance. This means that the present invention allows the use of relatively inexpensive materials due to the nature of the minimal structure of the configuration so that a suitable balance between the activated paired passageway or differential energy passage is achieved while the change is reduced.

Specialized dielectric materials, expensive and unusually used, not only maintain the energy control balance between the two system conductive passages, but also provide the opportunity to use a single balanced element that is homogeneous in the material constructed within the entire circuit. In an attempt to provide to the user, it is no longer required for numerous sophisticated bypass and / or energy decoupling operations. Although the new invention may be disposed between a plurality of paired or paired energy passages or differential conductive passages in the present invention, the common conductive passages constituting the present invention likewise are applied to all elements of the internal common conductive passages in the present invention. It may be connected to a third conductive passage or passages that are common and, if desired, common to an external conductive region.

The present invention simultaneously provides energy conditioning functions including bypassing, energy, energy line decoupling, and energy storage, such that the differential electrode surrounds the shielding structure within the embodiment, and almost all capacitive or energy parasitic components generated therein. This parasitic component attempts to escape from the enclosed confinement region surrounding each of the conductive passage electrodes. At the same time, the shielding structure is characterized by the fact that externally generated energy parasitic components, such as “floating capacitance”, are attached to a conductive region or passageway located inside or outside using conventional means known in the art and to a common conductivity. Separation and physical shielding treatment of the electrostatic shielding effect generated by the activation of the structure serves to prevent binding to the same material conductive passageway.

Attachment to external conductive areas includes industry recognized materials and processes used to achieve a connection that can be used openly in most cases without the additional constraints imposed by using different device configurations. Attachment methodology. Through other functions, such as the elimination or minimization of mutually opposing conductors, the present invention provides that low impedance paths may include "floating, non-potential conductive regions, circuit or system ground, circuit system return, chassis or PCB ground, or even earth ground." It is possible to form in a Faraday caged unit against an enclosed conductive common shield passageway capable of smoothly and continuously transferring energy to, but not limited to, an externally disposed conductive region.

The various attachment schemes described herein allow for a "0" voltage reference to be formed for individual pairs or plural pairs of differential conductors disposed on opposite sides of a shared center and common conductive passageway, and the centered interconnects used. The same but opposite for each unit of an individual pair of energy passages or structures between forging common conductive shield passages. The use of the present invention is that even with multiple SSO (simultaneous switching operations) between transistor gates disposed in an active integrated circuit without any return of the disturbing energy parasitic components within the attached circuit to the activated system as the present invention is operated manually. The Simultaneous Switching Operations state helps maintain and balance voltages.

Thus, all kinds of parasitic components are minimized from reversing the capacitance, induction and resistance tolerances or balances that have been made into the inactivated invention. The prior art has allowed the influence from free parasitic components in both directions to disrupt the circuit, in spite of best efforts to date, as opposed to all prior art devices.

As mentioned above, the transmitted electromagnetic interference can be the product of both electric and magnetic fields. To date, the art has focused on filtering EMI from circuits or energy conductors that carry high frequency noise using DC energy or current. However, the present invention can regulate energy using DC, AC and AC / DC mixed delivery of energy along conductive paths found in electrical systems or test equipment. This includes using the present invention to regulate the energy of systems with many different types of energy transfer formats and systems with many kinds of circuit transfer characteristics within the same electrical system platform.

The principle of Faraday caged conductor shielding is used when common conductive paths are coupled to each other, to groups of these conductive paths, and to reduce overvoltage and surge, and to simultaneously suppress or minimize parasitic and other transients. The shielding structure cooperates with a large external conductive passageway, passage area or surface that provides a large conductive surface area that initiates electrostatic function. When the plurality of common conductive passages just described are electrically coupled as one of a system, circuit reference node, or chassis ground, these passages are reference common conductivity for the circuit in which the present invention is placed and activated as is commonly used. It can depend on the passage.

One or more of the plurality of conductive or dielectric materials having different electrical properties with respect to each other may be inserted and maintained between the common conductive passageway and the differential electrode passageway. While a particular differential passageway may consist of a plurality of common conductive structures, the transfer conductive structure performs differential phase adjustment on a "junction" or on a plurality of pairs of opposite phases or charge structures, all of which are housed therein. It forms half of the sum of the differential conductive passageways produced. In addition, the sum of these conductive passageways can usually be equally electrically separated, where the same number of passages are used simultaneously, but half of the sum of the individual differential conductive passages has an approximately 180 ° phase difference from the oppositely placed groups. It is in a state. Microns of dielectric and conductive materials typically comprise a predetermined form of dielectric with interposing and shielding functional common conductive passageways, and in most cases conductive passageways that operate differentially within the invention or its AOC. It does not bind physically to either.

In contrast to the prior art, the novel invention interposers when activated by attaching to a circuit reference node or common conductive passageway used as a low circuit impedance passageway into a circuit between these energy conduits and by a portion of the transfer energy. It provides a means for reducing circuit impedance promoted by providing interaction of mutually opposing conductive paths maintained within and in a substantially parallel relationship to the circuit energy source and the energy utilization load of the circuit. At the same time, the entire set of mutually opposing conductive passage elements is substantially parallel to each other in any parallel relationship to each other, but in parallel with the first set of just described first set of parallel mutually conductive It may remain physically perpendicular to the passage element.

The user has the option of connecting to an external GnD region, an optional common conductive return path, or simply an internal circuit or system circuit common conductive passage or common conductive node. In some applications, it may be required by the user to attach externally to an additional number of paired external conductive passages that are not original differential conductive passageways for use in reducing circuit impedance occurring within the present invention. . Such low impedance path phenomena can occur either selectively or by using an auxiliary circuit return path. In this case, upon activation, the various internal and simultaneous functions that occur to create a low impedance conductive passage along a common conductive passage therein for the new inventive structure are substantially parallel and within the interposer differential conductive passage. Used by a portion of the energy passing along, the interposer typically operates at any location, is physically disposed between the various conductive passageways, moves from an energy consuming load and energy source, and into an activated circuit Attached to the road. The differential conductive energy path may use a “0” voltage reference image node or “0” voltage common conductive path node of a circuit created along an internal conductive path in combination with a common conductive energy path shield, which shield may be a differential conductive path. Is almost completely enclosed and cooperates as a common conductive structure bonded together to facilitate energy transfer along a low impedance path rather than a differential path, thereby providing a fraction of the energy regulated within the AOC of the new interposer during activation and passive operation. Instead of stepping into the circuit, it allows unwanted EMI or noise to move into this generated path.

As a part of the overall interposer invention, by means of a plurality of attached internal common conductive electrode passages constituting the Faraday caged conductive shielding structure, the external common conductive region or return passage is at least one common which simultaneously takes on multiple shielding treatment functions during activation. Closely spaced internally in a substantially parallel arrangement at a distance of only microns from the differentially acting conductive passageway, which itself is an extension of the external differential conductive element with respect to the position disposed at both sides of the conductive passageway It can be a substantially extended version itself. This may be due to printed circuit boards (PCBs), accessory cards, memory modules, test connectors, connectors, signal chip modules (SCMs) or multi-chip modules (MCMs), or other integrated circuits that use interposer interconnects at subsequent activations. It occurs inside other embodiments such as, but not limited to, package interposers.

Further objects and advantages of the present invention will become apparent to those skilled in the art with reference to the detailed description in conjunction with the accompanying drawings.

Returning now to FIG. 1A, the physical structure of the multifunctional energy conditioner 10 is shown in an exploded perspective view. The multifunctional energy conditioner 10 consists of a plurality of common conductive passages 14 in at least two electrode passages 16A, 16B, where each electrode passage 16 has two common conductive passages 14. ) Sandwiched between them. At least one pair of electrical conductors 12A, 12B is disposed through the insulating holes 18 or the coupling holes 20 of the plurality of common conductive passages 14 and includes the electrical conductors 12A, 12B. The electrode passages 16A and 16B are also selectively connected to the coupling holes 20 of the electrode passages 16A and 16B as well. The common conductive passage 14 consists of a conductive material, such as a metal, in other or preferred embodiments, which passage is used to manufacture conventional multilayer chip capacitors or multilayer chip energy regulating elements and the like. Similar to the process, conductive materials may be deposited onto dielectric materials or laminates (not shown). At least one pair of insulating holes 18 passes through each common conductive passage 14 such that the electrical conductor 12 can pass while maintaining electrical isolation between the common conductive passage 14 and the electrical conductor 12. Are arranged. The plurality of common conductive passageways 14 may be formed with fastening holes 22 which are optionally arranged in a predetermined corresponding position, which is adapted to each of the plurality of common conductive passageways 14 through standard fastening means such as screws and bolts. Or, in the case of other embodiments (not shown), means for allowing the device to be manufactured and combined into a standard monolithic multilayer embodiment similar to the processes used in the industry to manufacture chip energy regulating elements of the prior art and the like. It is for surely combining with each other. The fastening holes 22, which can then place conductive terminal bands (not shown), or even means of solder attachment of materials and materials of general industry also provide a multifunctional energy conditioner 10 enclosing the electronic system or device. Or to other non-conductive or common conductive surfaces such as chassis, and this multifunctional energy conditioner 10 is used in a mutually coupled state.

The electrode passages 16A, 16B are similar to the common conductive passages 14 because they are made of a conductive material, or in other embodiments, because the conductive material can be laminated onto a dielectric laminate (not shown), Or thereby a new embodiment can be manufactured and combined into a standard monolithic multilayer embodiment similar to the process used in the industry to produce prior art chip energy regulating elements and the like, wherein the electrical conductors 12A, 12B Similar in that they allow placement through each hole. Unlike the combined common conductive passage 14, the electrode passages 16A, 16B are optionally electrically connected to one of the two electrical conductors 12. The electrode passage 16 is shown smaller than the common conductive passage 14 as shown in FIG. 1A, although this is not required, but in this configuration the electrode passage 16 is a means of physical coupling of the fastening hole 22. Or to prevent interference with other bonding methods (not shown), ideally inserted into the common conductive passage 14, so that these electrode passages have a smaller conductive area than the common conductive passage 14. .

The electrical conductor 12 provides a current path that flows in the direction indicated by the arrows located at both ends of the electrical conductor 12 as shown in FIG. 1A. Electrical conductor 12A provides a path for transfer of electricity and electrical conductor 12B provides a path for return of energy. Although only a pair of electrical conductors 12A, 12B are shown, Applicants have described a plurality of pairs of electrical conductors 12A, 12B in which the multifunctional energy conditioner 10 is joined together to make a high density multiconductor multifunctional energy conditioner. As well as being configured to filter the electrode passages 16A, 16B and the common conductive passage 14.

Other elements that make up the multifunctional energy conditioner 10 have one or a plurality of electrical characteristics, and include a central common conductive passage 14, two electrode passages 16A and 16B, and two outer common conductive passages ( 14) A portion of the electrical conductors 12A, 12B passing between are isolated in a manner that isolates these passages and conductors from each other, except for the connections made by the electrical conductors 12A, 12B and the coupling holes 20. Surrounding material 28. The electrical properties of the multifunctional energy conditioner 10 are determined by the choice of the material 28. For example, when the X7R dielectric material is selected, the multifunctional energy conditioner 10 will primarily have capacitive properties. The material 28 may also be a metal oxide varistor material that will provide capacitive and surge protection properties. Other materials, such as ferrite and sintered polycrystals, can also be used, in which case the ferrite material provides inherent inductance with surge protection characteristics in addition to the removal or minimization of high performance common-mode noise that contributes to the elimination or minimization of mutual coupling. . The sintered polycrystalline material provides conductive, dielectric and magnetic properties. Sintered polycrystals are described in detail in US Pat. No. 5,500,629, which is incorporated herein by reference.

With continued reference to FIG. 1A, the physical relationships of the common conductive passage 14, the electrode passages 16A, 16B, the electrical conductors 12A, 12B, and the material 28 will now be described in more detail. The starting point is the central common conductive passageway electrode 14. Insulation holes 18 in each of these passageways allows electrical conductors 12 paired by these central passageways 14 to maintain electrical isolation between these common conductive passageways 14 and the two electrical conductors 12A, 12B. It is arranged to pass through. On either side of the central common conductive passage electrode 14, either side, the electrode passages 16A, 16B each have a pair of electrical conductors 12A, 12B disposed therethrough. Unlike the central common conductive passage electrode 14, only one electrical conductor 12A or electrical conductor 12B is isolated from each electrode passage 16A or electrode passage 16B by an insulating hole 18. It is. One of the pair of electrical conductors 12A, 12B is electrically coupled to each of the associated electrode passages 16A or 16B via a coupling hole 20. The engagement holes 20 may be integral with the interface with one of the pair of electrical conductors 12 through standard connection means such as solder welding, resistance welding or other standard connection method techniques, or the physical and Ensure electrical connection. In order to impart proper function to the multifunctional energy conditioner 10, the upper electrode passage 16A is electrically connected to the opposite electrical conductor 12A rather than that to which the lower electrode passage 16B is electrically coupled, i.e., the electrical conductor 12B. Must be combined. The multifunctional energy conditioner 10 may optionally be comprised of a plurality of outer common conductive passages 14.

These outer common conductive passageways 14 provide significantly larger conductive cavity conductive passageways and / or image planes, wherein the plurality of common conductive passageways 14 are electrically connected to the outer edge conductive band 14A by conductive terminal materials. Of large size to be physically separated from the differential conductive passages 16A, 16B and / or a plurality of electrical conductors such as, for example, electrical conductors 12A, 12B by connecting, tensioning means or by conventionally used solder-like materials. It is directly attached to the outer conductive surfaces 14A and 14B (not shown). The connection to the external conducting area helps to reduce radiated electromagnetic emissions and provides a representative area for weakening overvoltage and surge. Connections to the outer conductive region may be any inductive and parasitic drift that can radiate or be absorbed by a plurality of differential electrical conductors, such as differential conductive passages 16A, 16B and / or electrical conductors 12A, 12B. Helps to curb or minimize static

The main construction of the Faraday caged conductive shield structure is that the common passages are joined together as described above, and the grouped common conductive passages cooperate together with the large external conductive regions, suppress radiated electromagnetic emissions, and suppress overvoltage and surges. It is used to provide a large conductive surface area that weakens and initiates the electrostatic function of simultaneous suppression or minimization of parasitic and other transient components of the Faraday caged conductive shielding structure. This is particularly true when the plurality of common conductive passages 14 are electrically coupled to earth ground but rely on providing a unique common conductive passage in the circuit for placing and activating the present invention. As described above, between the common conductive passage 14 and the two electrode passages 16A, 16B, a material 28, which may be one or more of a plurality of materials with different electrical properties, is inserted and held therein. have.

FIG. 1B shows another embodiment for the multifunctional energy conditioner 10, which further comprises a circuit board connection to the multifunctional energy conditioner or means of coupling of electrical conductors. It is included. In practice, the plurality of common conductive passageways 14 are electrically connected together through the sharing of individually disposed outer edge conductive bands or bands 14A and / or 14B (not shown) at each conductive electrode outlet. Next, coupling and / or connection is made to the same external conductive surface (not shown) which may have a voltage potential when the invention is placed and activated in a portion of a large circuit. This voltage potential is provided through conductive bands 14A and / or 14B (not shown) and internal common conductive passages 14 of the embodiment, in addition to conductive elements (shown or Cooperating with an external conductive surface region or regions through any one of the illustrations).

In addition, each of the differential electrode passages 16A, 16B has its own outer edge conductive band or surface 40A, 40B, respectively. To maintain electrical isolation between the electrode passages 16A, 16B and their respective conductive bands 40A, 40B while at the same time maintaining electrical isolation between the other portions of the multifunction energy conditioner 10, the respective electrode passages 16 ) Is stretched, and as a result, the stretched portion of the electrode passage 16A faces opposite to the direction in which the electrode passage 16B faces. In addition, the stretched portion of the electrode passage 16 exceeds a distance in which the plurality of common conductive passages 14 extends to additional distances isolated from the outer edge conductive bands 40A, 40B by the additional material 28. Extend. Electrical connection between each band and their associated passage is achieved through physical contact between each band and each of its associated common conductive or conductive electrode passageways.

FIG. 2 shows a quasi-schematic circuit of the active portion of the circuit when the physical embodiment of the multifunctional energy conditioner 10 is coupled to and activated in a large circuit. The line to line energy regulating element 30 consists of electrode passages 16A and 16B, in which case the electrode passage 16A is coupled to one 12A of a pair of electrical conductors and the other electrode passage ( 16B is coupled to the opposing electrical conductor 12B, thereby providing two parallel passages needed to form the energy regulating element. The central common conductive passage electrode 14 is an essential element in all embodiments or concepts of the present invention and is conductive band 14, 14b when combined with two external common conductive passages 14 sandwiched outside. ) As a unique common conductive passageway 34, 34b, described as connecting the large external conductive region 34 (not shown) and the line-to-line energy regulation element 30 (not shown), It also serves as one of two parallel passages for each of the lines versus the common conductive passageway energy regulating elements 32.

A second parallel passage required for each of these lines versus the common conductive passage energy regulating element 32 is provided in the corresponding electrode passage 16B. With careful reference to FIGS. 1 and 2, the energy regulation pathway relationship will be apparent. Isolation of the central common conductive passage 14 from each electrode passage 16A or 16B with material 28 having electrical properties results in a common mode extending between the electrical conductors 12A and 12B. Energy regulation network with bypass energy regulating element 30 and a line to common conductive passage decoupling energy regulating element 32 coupled from each electrical conductor 12A, 12B to a large outer conductive region 34. It becomes

The large outer conductive region 34 will be discussed in more detail below, but for the time being it may be more intuitive to think of it as equivalent to earth ground or circuit ground. The large outer conductive region 34 is electrically conductively coupled to the circuit or earth ground by conventional means in the art, such as soldering or mounting screws inserted through the fastening holes 22, to form a common conductive passageway to be joined. May be combined with the center and an additional common conductive passage 14 to couple with the central passage 14 that will form one or more of 14, or in the same common conductive region or passage (not shown) Laminated directly as an enclosure or grounded chassis, standard planar multilayer ceramic embodiment (not shown) of an electrical device using externally deposited conductive materials such as 14A and 14B coupled together. If the multifunctional energy conditioner 10 works equally well with the inherent common conductive passageway 34 coupled to the earth or circuitry common conductive passageway, one of the advantages of the physical structure of the multifunctional energy conditioner 10 is to be desired. Depending on the energy conditions that arise, physical grounding connections may be unnecessary for some specific applications.

Referring again to FIG. 1A, further features for the multifunctional energy conditioner 10 are demonstrated by each of the flux fields 24, 26 in the clockwise and counterclockwise directions. Although Maxwell's fourth-order equation was identified as Ampere's law, the magnetic field originates from two sources, one source is described as the flow of current in the form of a carried charge, and the other source is in a closed loop circuit. The change in the moving electric field is then explained by the method of simultaneously generating the magnetic field. Of the two sources just mentioned, the transported charge describes how the electric and magnetic fields (EH Fields) can be suppressed or minimized in the new interposer device when the conductive source path and the return energy path are so arranged. A description of how a current generates a magnetic field, relating to what can be used to do so.

In passive components or layered structures used in energy delivery networks, the concept of flux removal or flux minimization needs to be used to minimize RF current. Since the magnetic flux line moves counterclockwise within the transmission line or line conductor or layer, when the RF return path is generated parallel to and adjacent to the corresponding source trace, it is observed in the return path (counterclockwise field). The magnetic flux line to be turned will be in the opposite direction with respect to the source path (clockwise field). When combining clockwise and counterclockwise fields, a removal or minimization effect is observed.

If unwanted magnetic flux lines are removed or minimized between the source and the return path, then no radiated or transmitted RF flow can exist except within a small boundary inside the conductive passage. However, by using the techniques described herein, small boundaries avoiding RF energy are important in high speed applications and are effectively accommodated by an activated shielding structure that almost completely surrounds the differential conductive path. The concept of performing flux removal or minimization is particularly simple if the opposing conductors can be arranged in the vertical and horizontal directions with respect to the ground within a micron distance to each other. The suppression or minimization techniques of the present invention, which occur simultaneously with each other during the removal or minimization of flux, are invented but follow the conventional theory because they define the use of image planes or nodes. Regardless of how well the passive components are designed, the magnetic and electric fields are typically present in some small amounts that are not valid, even at speeds of more than 2 dB and more. However, when effectively removing or minimizing magnetic flux lines and then combining these removal or minimization techniques using image planes and shielding processing structures, then EMI cannot exist.

To further illustrate this concept, once the direction of the individual flux field is determined, this direction can be plotted using Ampere's law and using the right hand law. In doing so, each person places his thumb in parallel to indicate the direction of current flow through the electrical conductors 12A, 12B as indicated by arrows at both ends of the conductor. Once the thumb is pointing in the same direction as the current flow, the direction of bending the remaining fingers in the hand indicates the direction of rotation of the flux field. The electrical conductors 12A, 12B are placed adjacent to each other so that these conductors provide more than one current loop, as also found in many I / O and data line configurations, so that the multifunction energy conditioner 10 The incoming and outgoing currents are reversed with each other, thus generating or disposing each of the closely spaced opposing flux fields 24, 26 which eliminates or minimizes each other, thereby eliminating or minimizing inductance due to the device.

Low inductance is advantageous in modern I / O and high speed data lines because the improved switching speeds and fast pulse rise rates of modern equipment create unacceptable voltage spikes that can only be handled by low inductance surge devices and networks. It will also be apparent that the labor intensive aspect of using the multifunctional energy conditioner 10 provides an easy and inexpensive manufacturing method as compared to combining individual components found in the prior art. Since the connection only needs to be made at both ends of the electrical conductor 12, it provides a line-to-line capacitance to the circuit of approximately half of the capacitance value measured for each line in the common conductive passage. It was developed literally within the embodiments. This not only provides flexibility to the user, but also offers the possibility of saving time and space when manufacturing large electrical systems utilizing the present invention.

A portion of the Faraday caged common conductive shield structure found in the present invention is shown in detail in FIGS. 3 and 4. Thus, the description will be made while moving freely between FIGS. 3 and 4 to disclose the importance of the Faraday caged common conductive shielding structure to be performed in combination with various external common conductive passageways. FIG. 3 shows a portion 800B that forms part of a complete Faraday caged common conductive shield structure 20 as shown in FIG. 4.

In FIG. 3, the differential conductive bypass electrode passage 809 is sandwiched between the shared central, common conductive passage 804/804-IM of the structure 20 and the common conductive passage 810 (not shown in FIG. 3). And the common conductive passage 810 rests on the passage 809 in FIG. 4. Dielectric material or dielectric medium 801 is disposed above and below the bypass passage 809. In addition to the common conductive passages 804 / 804-IM, 810, the passages 809 are in most cases separated from each other by approximately parallel insertion positions of a predetermined dielectric material or dielectric medium 801, The dielectric material or dielectric medium 801 is disposed or deposited between the respective conductive passage applications during the manufacturing process. All of the common conductive passageways 860 / 860-IM, 840, 808, 804 / 804-IM, 810, 830, 850 / 850-IM are offset by a predetermined distance 814 from the outer edge 800B of the embodiment. It is. In addition, all of the differential conductive passages 809 are offset by an additional distance 806 from the outer edge 817 of the embodiment 800B, such that the outer edge 803 of the differential conductive passage 809 has a common conductivity. Overlapped by the edge 805 of the passageway. Thus, the differential conductive passage 809 always includes a smaller conductive region than any of the conductive regions of any of the common conductive passageways when calculating its total conductive region. All of these common conductive passageways generally have almost the same manufacturing capability to produce conductive regions that are uniform in size as well as others in general configuration. Thus, any one of the sandwiched common conductive passageways has a total of the top and bottom conductive regions that are always larger than the top and bottom conductive regions combined for either of the differential conductive passages, and is a Faraday caged common conductive shield structure It is always almost completely physically shielded by the conductive region of any common conductive passage.

Referring to Figure 4, common passageways 860 / 860-IM, 840, 808, 804 / 804-IM, 810, 830, 850 / 850-IM likewise provide dielectric material that provides support and outer casing of interposer components. It can be seen that it is surrounded by 801. Conductive connection material or structure 802A, 802B is the common passage of structure 20 in at least two aspects, as depicted in FIG. 4 and as depicted for 804 / 804-IM in FIG. 3. Is applied to a portion of the common shield passageway structure edge 805. This allows the electrical regulation function to operate properly in this type of embodiment. Dividing structure 20 into smaller, paired, Faraday cage-like conductive structure portions, for example individually as common conductive passageways 804 / 804-IM, 808 and 810, and now common conductive material connections 802A, Conductive structure 900A further configured together with 802B is shown, and these common conductive material connections 802A, 802B form a single common conductive center shield structure 900A of large structure 20, and the large structure ( 20, when configured by itself, operates sufficiently alone as one of the common conductive caged shielding structures 900A, and is connected in a similar manner to the circuit.

Disclosed in the bypass or pending application cited therein, as shown in FIG. 3, to adjust additional differential conductive passages (not shown) as part of a large stack of interposers using common conductive passage electrodes. Although not shown, a feedthrough configuration may be added in a predetermined manner.

All that is needed for a suitable device is that the conductive interconnect material connections 802A, 802B maintain physical and electrical contact with a portion of the common passage edge electrode 805 of each respective common conductive passage, and each differential passage is at least Functionality may be mentioned so long as it is sandwiched by two common conductive passages, and since the differential conductive passages are generally stepped backwards in the same placement relationship, embodiments of each of the stacked but separated differential electrodes Can operate the minimization and suppression functions of the unit in a balanced state with respect to the conductive material region as just described.

Returning to FIG. 4, a paired differential energy transfer shielded container composed of conductive passages similar to 809 and 818 (not shown) in FIG. 3 utilizes conductive connection materials or structures 802A, 802B, and Conductive passages are electrically connected to one another in a conventional circuit system composed of a conductive material generally known and used in the present invention, which may be practiced using prior art methodologies.

Before embodiment 20 of FIG. 4 is placed in a circuit and activated, structures 802A, 802B electrically connect conductive paths to each other in a conventional circuit system, and form externally located conductive paths or regions (shown in FIG. 4). Or the same external conductive passage (not shown) is preferably electrically connected without providing any conductive interference or gap between each conductive structure 802A, 802B.

In FIG. 3, the single caged structure 800B is a mirror image of the single caged structure 800C, which includes a built-in differential electrode 818 (not shown) and outlet / inlet sections 812A, 812B (shown). Conductive passage extension structures 812A, 812B (not shown) are positioned at generally opposite placement positions with respect to each other or to its paired counterparts in a multipaired application form, and Conductive passage 809B of conductive structure 809A with conductive / outlet section 812A Conductive structure 809B with inlet / outlet section 812B (not shown), which can be about 180 degrees in the opposite direction to the direction of the differential electrode. Except that the conductive passage differential electrodes (not shown) are operated in electrical equilibrium with each other. While these two common conductive caged structures or differential structures housed within common containers 800C and 800B are positioned and electrically parallel in relationship, structures 800C and 800B made up of structure 900A are common in the same center. Most importantly, it is shared with the conductive sharing passages 804 / 804-IM, which, when considered separately, form part of the small caged structures 800C and 800B, respectively. 800C and 800B together create a single large conductive Faraday caged common conductive shield structure 900A, which serves as a double or paired shielded common conductive passageway container.

Each container 800C, 800B may have differential electrodes of equal number and equal size, which electrodes do not have to be physically opposite to each other within structure 900A, but are usually oriented physically and electrically parallel, respectively. It is. The large conductive Faraday caged common conductive shield structure 900A has 800C and 800B individual shielded structures that co-operate when activated and can be commonly accepted, such as reflux solder conductive epoxy and adhesives, etc. (not shown). There is an electrical one at activation when attached to the same external common conductive path region by common conductive material connections 802A, 802B by possible means of the industrial attachment method.

The predetermined arrangement relationship of the common conductive electrodes is shown in FIG. 4, and common conductive electrodes 810, 808 with a centrally disposed common shield 804/804 -IM are connected to common conductive material connections 802A, 802B. It is a state connected to the external common conductive path | route or area | region, and is a part of the element which comprises one common conductive shielding structure 900A. Common conductive cage type 800B is an element of the invention, i.e., an energy regulating interposer with a circuit structure.

The central common conductive shared passageway 804 / 804-IM is an additional sandwich on the outside to be considered a Faraday caged conductive shield 900A that is inactive with respect to the intermediate position between the differential electrodes 809 and 818 (not shown). Two common electrode passages 808 and 810 arranged in a manner are required. In addition, the central common passage 804 / 804-IM will be used simultaneously by both differential electrodes 809 and 818, but at the same time have the opposite result for charge switching.

The following subdivided such criteria for common conductive passages 804 / 804-IM, and also applies to common conductive passages 808 and 810. Common conductive passages 804 / 804-IM are offset by distance 814 from the edge of the present invention. One or more portions 811A, 811B of common conductive passageway electrodes 804/804 -IM penetrate through material 801 and are attached to common conductive bands or conductive material structures 802A, 802B. Although not shown, common 802A and 802B electrically connect common common paths 804 / 804-IM, 808, and 810 to each other, and when used, other common conductive paths 860 / 860-IM, 840, 830, 860 / 860-IM).

This offset distance and region 806 in FIG. 3 allows the common conductive passageway 804 / 804-IM to extend beyond the electrode passageway 809 to shield a portion of the energy flux field (not shown). The field does not have an electrostatic shielding effect in an activated Faraday caged system, between other internal electrode passages (not shown), such as 818, or to the reduction or minimization of peripheral fields that couple to external differential electrode passage elements. It is generally intended to extend beyond the edge 803. The horizontal offset distance 806 can be said to be approximately 0-20 + times the vertical offset distance 806 between the electrode passage 809 and the common conductive passage 804/804 -IM. The offset distance 806 may be optimized for a particular application, but all distances 806 superimposed among each individual passageway are ideally the same as manufacturing tolerances allow. Minor dimensional differences are not significant in the distance between the passageways and in the region 806, unless the electrostatic shielding functionality (not shown) of the structure 900A or the structure 20 is incompatible.

In order to connect the electrode 809 to an energy passage (not shown) that is external to the electrode 809 but disposed on both sides of the 880B, the electrode 809 is connected to the conductive passage material deposit or the electrodes 809A and 809B. And one or a plurality of portions 812 extending beyond the edge 805 of the common conductive passageway 804 / 804-IM, 808 compared to the connection regions 812A, 812B that are sequentially conductively connected. By the connection regions 812A and 812B, the bypass electrode 809 can be electrically connected to an energy passage (not shown) on both sides. Note that element 813 is a central axis point that dynamically represents a three-dimensional energy regulation function occurring within the interposer invention (not shown) and is relative to the final size, shape, and position of the embodiment in the activated circuit. Should be.

Referring now to FIG. 4, the concept of a general purpose multifunctional common conductive shielding structure (for use with the applicant's individual non-interposer energy conditioner) is shown. The general purpose multifunctional common conductive shielding structure 20 is comprised of multiple stacked common conductive caged shielding structures 900A, 900B, 900C as illustrated, and then a multilayered common conductive caged structure or container in a substantially parallel relationship. (800A, 800B, 800C, 800D) (each referred to collectively as 800X). Each common conductive caged structure 800X includes at least two common conductive passage electrodes 830, 810, 804/804-IM, 808 or 840. The number of stacked common conductive caged structures 800X is not limited to the number shown here, and may be any pair of integers. Thus, the number of stacked common conductive caged shielding structures 900X is likewise not limited to the number shown here, but may be an integer in pairs or an integer in holes. Although not shown in other applications, each paired common conductive caged structure 800X sandwiches at least one conductive passage electrode as discussed above in connection with FIG. 3. The common conductive caged structure 800X is shown separately, the fact that the structures are paired together, and that any form of paired conductive passageway can be inserted into each common conductive caged structure 800X. It is to emphasize. As such, the common conductive caged structure 800X has a universal use in pairing together to create a large common conductive caged shield structure 900X, which is depicted as 900B, 900A and 900C, respectively. And may be used in combination with conductive passages paired in individual or non-individual configurations, such as, but not limited to, embedded in a portion of a silicon or PCB discrete component network, and the like.

The common conductive path electrodes 830 810, 804 / 804-IM, 808, 840 are all conductively interconnected as shown in 802A and 802B (s) and connected to an external conductive region (not shown). S). Each common conductive passage electrode 830 810, 804/804-804 -IM, 808, 840 is formed on dielectric material 801 to create an edge 805, likewise providing opposite side bands of dielectric material 801. do.

As described in FIG. 3, dielectric material 801 is formed from conductive passage electrodes (not shown) sandwiching respective common conductive passage electrodes 830 810, 804/804-IM, 808, 840. Isolate non-conductively. In addition, as described in connection with FIG. 3, 800B and 800C, which constitute at least two cages, such as large caged shielding structure 900A, are versatile lines for use in both layered embodiments of the present invention. It is required to construct a regulating structure. Thus, there is a common conductive caged structure 800X that requires at least two, as provided in FIG. 4 for each of 900A, 900B, and 900C. Regardless of whether the process has been reached due to the amount of shielding layer used or the final morphology, the resulting common common conductive passages for any sequence (except dielectric materials, etc.) should appear as the following specific structure: That is, a first common conductive passage, then a conductive passage (not shown), then a second common conductive passage, a second conductive passage (not shown), and then a third common conductive passage should appear. In the previous result, the second common conductive passageway becomes an element located in the center of the resultant. An additional layered body of the desired passageway, which is a further result of the manufacturing sequence, is produced, for example, as follows: a third conductive passage (not shown), followed by a fourth common conductive passage, a fourth conductive passage (not shown), and then Create a fifth common conductive passageway. If an image shielding configuration is desired to be used as shown in FIG. 4, such as passages 850 / 850-IM, 860 / 860-IM, sandwiched common conductive passages 850 / 850-IM, 860 /. There is no difference in the first layer output except for the final set with 860-IM). Moreover, the result of most manufacturing sequences is as follows. I.e. (except for dielectric materials, etc.), after the 860 / 860-IM common conductive passage is disposed, the first common conductive passage, then the conductive passage (not shown), then the second common conductive passage, the second conductive passage (Not shown) and the third common conductive passage, the third conductive passage (not shown), then the fourth common conductive passage, the fourth conductive passage, then the fifth common conductive passage, and finally the 850 / 850-IM common conductive passage 4 will be the result generation structure for this example. In summary, most chips, holeless through embodiments of Applicant's individual non-interposer energy conditioners are sandwiched between three common conductive electrodes, 808 (not shown), 804 / 804-IM, and 810 (not shown), respectively. And at least two electrodes 809 and 809 '(not shown) arranged at the top and at least two electrodes 809 and 809' (not shown) connected to the external structures 809A and 809A '(not shown). Each of the three common conductive electrodes 808 (not shown), 804 / 804-IM, and 810 (not shown) and the connected outer structures 802A, 802B will allow them to form a single large Faraday caged shield structure 900A. One is connected in such a way as to be considered conductive. Thus, a single large Faraday caged shield structure 900A is attached to a large outer conductive region (not shown), the combination of which is conductors 809 and 809 sandwiched within the caged shield structure 900A. '(Not shown) helps to perform active line conditioning and filtering at the same time when transferring energy in the oppositely phased and charged manner. Connecting each of the combined common conductive and enclosing multiple common shielding passages 808 (not shown) and 810 (not shown) with a common centrally located common conductive passage 804 / 804-IM is shown in FIG. 5B. Similar to the extension of the outer conductive element 6803, the common conductive elements are sandwiched from one another but at a distance to receive the dielectric medium from the outer conductive element, such as 6803 shown in FIG. 5B. It will be inserted in such multiple parallel manners with distance separators or 'loop regions' of microns relative to the compensated phase differential electrodes separated by them.

Thereby the extension of the outer conductive element, such as 6803 shown in FIG. 5B, first transfers energy along or in part of 809 and 809 ′ (not shown), the active combination just described being the differential conductor of assembly 900A. In this case, it is possible to perform the electrostatic shielding function which improves and generates an efficient and simultaneous adjustment function. The inner and outer parallel arrangement group form of the combined common conductivity 900A can also escape from or enter into portions of the differential conductors 809 and 809 '(not shown) used by some of the energy. Non-parasitic components and electromagnetic emissions are removed or suppressed, where a portion of the energy is transferred along the conductive passages (not shown) to the active assembly load (s) described further below with FIG. 5A.

Referring now to FIGS. 5A and 5B, a further embodiment of the layered general purpose multifunctional common conductive shield structure of the present invention is a bypass referred to below as a “by-pass shield structure”. Shown in configuration 6800. This bypass shield structure 6800 may also take the configuration of a "feed-thru shield structre" 6800 for the relative stacking positions of each static embodiment. Between these two valid configurations, two stacked common conductive shielding structures 1000A, 1000B or common conductive passages 6808, 6810, 6811, 6812 and central common intrinsic conductive passages that can constitute each embodiment In examining the positional relationship of 6680, there is relatively no difference. Although appearing physically similar in an arrangement relationship, the "feed through shield structure" 6800 and the "bypass shield structure" 6800 may each still make equally possible functional contributions to the energy regulation of the circuit. However, the manner in which non-common passages 6809 and 6807 are constructed and sequentially arranged for circuit passage attachments also determines the final form of energy regulation output that can be expected in the circuit. Regardless of the configuration, the various shielding processing functions, both physical and electrical, operate approximately the same for the energy delivered (not shown) in the AOC of the bypass shield structure 6800.

Referring specifically to FIG. 5A, the bypass shield structure 6800 is shown in a cross-sectional view extending in the longitudinal direction, and the two common conductive shield structures 100A, forming the present embodiment of the bypass shield structure 6800, Seven layers of common conductive passage stacks. In FIG. 5B, the bypass shield structure 6800 is shown in a cross sectional view perpendicular to the cross sectional view shown in FIG. 5A.

5A and 5B, the bypass shield structure 6800 is connected with a plurality of elements 6808, 6810, 6811, 6812, and then activated to consist of 6804-IM, 6811-IM, and 6812-IM. And a central common conductive sharing passage 6804 that forms a zero voltage reference for the circuit (not shown), which is only relatively relative to a commonly attached active circuit element (not shown). Although formed, it is not formed until the connection of 6802A and 6802B by the connecting means 6805 to the outer conductive surface 6803 is made. Upon activation, the circuit (not shown) is a passively operated general purpose multifunctional common conductive shield scheme utilized by the energy source (not shown) and the energy utilization load (s) using the equilibrium transfer energy being made available. 6800, wherein an active active component (not shown) in the circuit (not shown) requires some of the energy. The elements just described, including some of all of the common conductive elements in the series of connections to 6803 as just described, are the active circuit elements 6807, 6820, 6809, 6821, zero voltage reference, 6811-IM, 6804- For each of the IM, 6812-IM, and with a central common conductive shared passage 6804, two utilized by differential conductive passages 6809, 6807 and elements 6820, 6821 conductively coupled to each of them. Generating electrically balanced energy in a circuit (not shown) while forming a third common electrical node that is separate from individual discrete differential nodes.

To couple the bypass shield structure 6800 to the activated circuit, each of the differential conductive passages 6809 and 6809 is inserted into one of two common conductive shield structures. The first common conductive shielding structure 100A is formed between the common conductive passage 6810 and the central common conductive sharing passage 6804. The second common conductive shield structure 1000B is formed between the common conductive passage 6808 and the central common conductive sharing passage 6804. To use the bypass shield structure 6800, the first differential conductive passage 6809 is disposed within the first common conductive shield structure such that the dielectric material (from the common conductive passage 6810 and the central common conductive sharing passage 6804) can be used. 6810). This dielectric material 6810 separates and electrically isolates the first differential conductive passage 6807 from the first common conductive shielding structure. In addition, a second differential conductive passage 6809 is disposed within the second common conductive shield structure and is separated by dielectric material 6810 from common conductive passage 6808 and central common conductive sharing passage 6804.

In this case, the first and second differential conductive passages 6809 and 6809 are electrically connected to the external conductive energy passages 6620 and 6821, respectively. Such electrical connection may be made by any means known to those skilled in the art, including but not limited to the following means, including soldering, resistance interference sockets, and conductive adhesives. Bypass shield structure 6800 has additional outer shield structures 6811, 6812 that sandwich these shield structures sandwiched with dielectric material 6801 interposed between two common conductive shield structures 100A, 1000B. Is completed by Each outer shield structure 6811, 6812 forms an image structure 6811-IM, 6812-IM just described, which, when activated, is an outer conductive portion of the shield 6811, 6812 (not shown). And an outer conductive portion of the external common conductive electrode structure (s) 6802A, 6802B, and by the external common conductive structure 6803 a zero voltage reference with 6804-IM and a relatively large skin region. Form. The outer skin surface formed by the external common conductive electrode structure (s) 6802A, 6802B and the outer shielding image structures 6811-IM, 6812-IM absorbs energy when the circuit is activated and then 6809 and 6807 It serves as an additional enclosure shield structure for the differential conductive passages. Part of the energy when the bypass shield structure 6800 is attached by known means 6805, such as brazing material, to the external common conductive passage 6803 of the energy conditioning circuit assembly (ECCA). Moves along with the generated low impedance passageway present therein along with the external connection 6805 to the common conductive structural elements 6812, 6808, 6804, 6810, 6811, 6802A, 6802B and the third conductive passage 6803. The passage 6803 can return to its source.

The external common conductive electrode structure (s) 6802A, 6802B are connected to the electrical circuit by means known in the art, and thus the present invention is not limited to individual structures, but may be formed, for example, in silicon in an integrated circuit. have. In operation, the bypass shield structure 6800 and the two common conductive shield structures 100A, 1000B effectively operate within the region of the converging AOC 6813 and zero voltage references 6804-IM, 6811-IM, and 6812-IM. Expand This AOC 6813 is the energy center balance point of the circuit.

As a result of when the bypass shield structure 6800 is activated in the circuit, not only increases physical shielding treatment from externally generated and internally transmitted parasitic elements 6816 (indicated by double arrows), but also a common conductive passage The electrodes 6812, 6808, 6804, 6810, 6811, 6802A and 6802B, provide low impedance paths generated along the surface to the external conductive passage 6803. The electrostatic function (not shown) occurs in an activated state with respect to the energy parasitic component 6816, which is otherwise part of the external and internal energy parasitic component 6816 that may interfere with a portion of the delivered energy. Represents. The double arrow shows the exchange of charged electrons representative of the electrostatic function and occurs in the activated state to capture parasitic component 6816 within the shielded container. This two-way arrow likewise provides a simultaneous but opposite filling effect that occurs along the "skin" of the conductive material located within each individual container.

Turning now to FIG. 6A, a layering sequence of surface mount energy conditioning interposer 30 having a circuit structure is shown. Interposer 30 consists of at least two differential conductive passageways 303 and 305. The interposer 30 also consists of at least three common conductive passage layers 302, 304, and 306, which passages are electrically interconnected and surround the differential conductive passages 303, 305 up and down. As already disclosed, a large Faraday caged common conductive shielding structure is formed near each paired differential passageway. In one embodiment, the interposer 30 is an image shielding layer laminated to additional common conductive passage layers 301/301 -IM, 307/307 -IM, i.e., outer common conductive passage layers 302, 306. It is composed. In addition, these image shielding layers 301/301 -IM and 307/307 -IM are electrically interconnected to other common conductive passage layers 302, 304, and 306. A centrally located common conductive passage 304 separates the differential conductive passages 303 and 305. Since the common conductive passage 304 is shared, the passage forms a Faraday caged conductive shield structure that surrounds both the first and second differential conductive passages 303 and 305.

Each common conductive passage layer 301/301 -IM, 302, 304, 306, 307/307 -IM is a conductive electrode material 400 deposited in a layer surrounded by at least a portion of its circumference by an insulating band 34. It is composed of This insulating band 34 is made of non-conductive material or dielectric material. Protruding through an insulating band 34 on the outer periphery of each common conductive passage layer 301 / 301-IM, 302, 304, 306, 307 / 307-IM may be applied to a common conductive passageway or other external connection to another shield. In addition, there are electrode extensions 32 and 35 that facilitate the connection between the common conductive paths and the I / Os of the various IC chips. Similarly, the first and second differential conductive layers 303, 305 consist of a conductive electrode material 400 laminated to a layer surrounded by at least a portion of its outer circumference by each of the insulating bands 37, 38. These insulating bands 37, 38 are made of a non-conductive material, i.e., a dielectric material, or even no conductive material may be present in the same layer of the material in which the conductive material resides. These insulation bands 37, 38 are generally wider than the insulation band 34 of each common conductive passage layer 301/301-IM, 302, 304, 306, 307/307 -IM, and as a result are already discussed. As noted, there is an overlap or extension of the common conductive passage layer beyond the edges of the first and second differential conductive passages. The first and second differential conductive layers 303, 305 each comprise multiple positioning electrode extensions 36, 39, which, in addition to the connection to an external energy source and / or lead frame, have internal direct Facilitate connection to circuit traces or loads.

With respect to the previous embodiment, the layers 301 / 301-IM, 302, 304, 305, 306, 307 / 307-IM are stacked on top of each other and sandwiched in a parallel relationship with each other. . Each layer is separated from the layers above and below by dielectric material (not shown) to form an energy conditioning interposer 30.

In FIG. 6B, an integrated circuit 380 is shown in the form of an IC or DSP package 310 mounted in a carrier and configured with connected wire pin outputs (not shown). As schematically indicated at 300, the integrated circuit die is left with one section removed and exposed for consideration of internal and external interconnect features showing the finished energy conditioning interposer 30 of FIG. 6A. It is disposed inside the IC package 310. Interposer 30 includes electrode terminal bands 320 and 321 in which all common conductive passageways are coupled and connected together at their respective electrode extensions 32 and 35. These common conductive electrode terminal bands 320, 321 may also be connected to the metal thin filmed portion of the IC package 310 to be used as a "0" voltage reference, or to serve as a low impedance passage return portion. May be connected to circuitry for some of the energy exiting interposer 30 (not shown). The interposer 30 also includes a differential electrode terminal band 330 corresponding to the first differential electrode 303 and a differential electrode terminal band 340 corresponding to the second differential electrode 305. These differential electrode terminal bands 330 and 340 are utilized to provide energy and provide a connection point for connection to the energy utilizing internal load 370 of the IC die 380. It should be noted here that for depiction the inposer 30 is typically physically larger in dimension than the active component or IC that regulates energy once attached.

There are many IC package pin outputs 350 located around the IC carrier edge 392 for signals in the return path, but only one pin output, used for energy entry, and labeled 391B, for energy recovery. There is only one pin output stage used and labeled 391A. The IC package 310 comprises a pair of power inlets in which a plurality of power entry points are connected to each of the differential electrode terminal bands 340, 330 by adhesive wires 393A, 393B or other conductive passageways or conventional interconnecting means. It is designed in such a way that it is reduced to / return pins 391A and 391B. A single power entry inlet is provided by the pins 391A and 391B, and by accessing the electrode terminal bands 330 and 340 of the interposer 30 to this power entry inlet, the integrated circuit package ( For 310, noise that interferes with internal or external circuitry is reduced. Such a connection is made by standard means known in the art, such as, but not limited to, wire bond jump lines and the like and is determined by the end use requirements of the user.

Returning to FIG. 7, a cross-sectional view is a variation of the embodiment of FIG. 7, which is FIGS. 8A and 8B, in which the applicant describes all three of the functions and configurations of the interposer 60/61 of the embodiment shown here. It is free to move between the drawings.

In FIG. 7, the interposer 60/61 is shown in this case in a plan view and in most cases, but not in all cases, the opposite view and appearance of this interposer 60/61 in plan view in FIG. It should be noted quickly that it is almost identical to that shown.

In an embodiment of the present invention, now referring to FIG. 7, interposers 60/61 have vias 63, 64, 65, which vias 63/64 are interposer 60/61 surrounded by material 6312. It is interconnected with a conductive energy transfer passage through a plurality of substrate layers within the body of 61 and is surrounded by a conductive material 6309. This embodiment typically uses a paired path or a three path configuration. In a paired, two-path configuration, interposers 60/61 use both via 64 and via 65 for IN energy transfer paths, but OUT energy transfer paths. Uses a pair of two-way I / O circuit passages using vias 66 for the sake of simplicity. A circuit reference node (not shown) may be provided by a user for an internal conductive passage (not shown) predetermined by the user for a portion of the transfer energy provided from inside the load or AOC depending on the correct connection of the circuit outside the interposer 60/61. It can be found and used near or inside the AOC of the interposer 60/61 by a portion.

Three-way conductive passage I / O configurations are preferred, using vias 65 for IN energy transfer, vias 64 for energy transfer or return to the OUT path, and as separate common energy transfer passages and reference attachments. Center via 66 is used. A portion of the energy transferred in any direction between the energy utilization node (not shown) and the energy source (not shown) by the vias 66 can form a path along a common conductive passageway or region that is specified outside of the AOC. And move to a low impedance energy path created within the AOC that provides or shares voltage potential for circuitry within the AOC of the interposer. This low impedance energy path, i.e., the region, is generated as energy from an external path circuit, transferred through the differential paths 60C, 60D, and is an external conductive path on either or multiple sides of the interposer 60/61. Continue to. A portion of the energy delivered within the AOC of the interposer 60/61 is delivered to the common conductive passageways 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM and vias 66. The via is in this case interconnected with a common conductive passage within the AOC of the interposer 60 to transfer energy along the external common conductive passage.

Depending on the usage, there are some variations on the embodiment of the interposer 60/61 that are not illustrated in FIGS. 8B and 8A but are easily assumed by the applicant, which variants include vias 64, 65, 66. Has only the IC mounting side in a state configured as shown in FIG. However, depending on the external passageway connection being made or planned to be used, a variant of the interposer 60, i.e., another interposer of the present invention, may be a common conductive passageway 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, One of the vias 64, 65, 66 conductive by the group having the same or alternating coupling to the vertically disposed internal horizontally conductive passageway such as 6204 / 6204-IM, 60C, 60D, It may consist only of two or three.

FIG. 8B shows a common conductive via passage 66 that completely passes through to the opposite side 6314, but a simple two-way passage configuration is simply the energy input passage [generated common passage 6200 / 6200-IM, 6201. , 6202 / 6202-IM, 6203, 6204 / 6204-IM), but without via passage 66 passing to opposite side 6314, vias consisting of both 64 and 65 can be used, but 6309 as a return energy path. The conductive passage 6309 created by combining the common passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM can be used, as shown in FIG. Passes through the via 66 and moves through the internal AOC of the device 60/61 and finally to the outside of the internal AOC of the device 60, with material 6308 or conductive attachment node (not shown). Conductive passages attached to the outside, such as made wire bonding means (shown in ) And a part of the energy back to its source by. In addition, the dotted line 60E is the interposer embodiment 61 or that (60 or similar) of the common passageway 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM of this interposer. A similar perimeter or dividing line of the non-transmissive configuration, which does not create a conductive attachment in the interior 60/61 towards 6309 disposed in the 6314S portion of the interposer 60, 61, and is shown in FIG. 8A. As shown in FIG. 8B, the common conductive passage electrodes 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM of the interposer 60 are coupled to the via 66 only. It is not coupled to the material 6308 as shown. In the case of the interposer 61, the common conductive passage electrodes 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM do not penetrate the dielectric or insulating material 6309, and this implementation is performed. It should be emphasized that out of the 6314S of the form, it engages with the conductive material 6309 applied to the interposer embodiment 60 as shown in FIG. 8B. However, these common conductive path electrodes 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM are still 60D as demarcated or bounded by dashed line 60F in FIG. And extend closer to 6314S than the 60C differential passage. Because of this arrangement of the differential and common passages with respect to each other, the new half-composite interposers serve as electrostatic shielding due to these types of passage configurations, many of which are detailed within the disclosure. It is explained in a similar way.

These various passage configurations show device versatility, although the common conductive passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM appear to have limited positioning criteria. Vias 64, 65, and 66 are much more flexible and versatile in positioning configuration, shape, and size, and provide all sorts of energy regulation functions and passage configurations as one of ordinary skill in the art or envisioned. It shows that it can be used to. The interposers 60/61 incorporate a plurality of apertures, multi-layered energy regulation passage sets and substrate embodiments in substrate form to regulate transfer energy along a passageway provided to an active element such as, but not limited to, an integrated circuit chip or chips. It is configured to use. This interposer 60/61 utilizes a partially enclosed differential conductive electrode or passageway in combination with a multilayer common conductive Faraday caged shielding technique to provide for conductively filled holes known in the art as VIA. The delivery energy is controlled by using a complex energy control methodology. Substrate interconnections for IC and mounting structures can include wire-bond interconnects, flip-chip ball-grid array interconnections, micro ball grid interconnects, combinations thereof, or other standard industry recognized methodologies. It is expected to either.

As shown in FIGS. 7 and 8B, conductive material 6309 may be applied or deposited on the side of 6312 of interposer 60 and may be used as an auxiliary energy return passage. The common conductive passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM, both shown in FIG. 8B, are not only differential vias 60C, 60D, It will form the lowest impedance path for the high impedance path along 65 or 64).

Thus, the common conductive passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM, and vias 66, shown in both FIGS. 8B and 8A, are interposers when activated. As is positioned electrically within the activated circuit, it is used as a " 0 " voltage circuit reference node (not shown) found both inside and outside of the common conductive interposer energy path configuration (not shown).

The interposer 60 is connected to the integrated circuit 4100 by a commonly accepted industrial connection method. On one side of the interposer 60, various differential conductive passages, including vias 65, are electrically connected between an energy source (not shown) and a load (not shown), and various vias, including vias 64. Electrically connected by conventional industrial means between an energy source (not shown) and an energy source (not shown) in the return passage where the differential conductive path includes a conductive passage via 66 for a portion of the transfer energy. It is. Vias 65 and 64 do not have any polar charge before the hook-up, each of which provides energy transfer functionality as long as the consistency of the power supply of each type is maintained once initiated for the device. It will be appreciated by those skilled in the art that this will prevent them from changing from input to output.

FIG. 8A shows an interposer 61 taken from a cross sectional view “A” of the main embodiment of the energy conditioning interposer taken from FIG. 7 surrounded by a non-conductive outer surface 6314. The interposer 61 includes a conductive differential energy passage electrode 60 -C coupled to the conductive diesel passage 64 and a conductive differential energy passage electrode 60 -D coupled to the conductive diesel passage 65. Each of which is indicated at 6205 by standard means known in the industry. The differential energy passage 60-C and the differential energy passage 60-D are separated from each other by a central shared common conductive energy passage 6202, and the common conductive energy passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM, respectively, from the top and bottom of the interposer 61. These common conductive energy passages 6200 / 6200-IM, 6201, 6202, 6203, 6204 / 6204-IM are interconnected by conductive diesel passage 66 as indicated by 6308 by standard means known in the industry. It is. The outer maximum conductive energy paths 6200 / 6200-IM, 6204 / 6204-IM serve as image shielding electrodes, and each of the common conductive energy paths 6201 and 6203 adjacent to these paths as indicated by 4011. Away from in the vertical direction. The conductive diesel passages 64, 65, 66 are optionally isolated in a predetermined manner from the common conductive passages and the differential conductive passages by gaps 6307, which gaps are space filled with dielectric media or isolators or insulating materials. It may be either a simple cavity of a conductive material or an actual deposited material that will prevent the coupling of the various conductive interposer passageways.

It should be noted that the conductive gas passages 64 and 65 pass through various conductive and dielectric materials and are optionally coupled to the conductive differential energy passage electrodes of the interposer 61 as required by the user. These transit passages 64 and 65 may be selected to accommodate energy input, output or image passage duty as required with transit passage 66. The conductive diesel passages 64, 65, 66 are electrically connected to the external elements as discussed previously. These connections may be in the form of connections recognized in the industry. 8A and 8B, and pads of conductive seating pads 63 for gravity or adhesive batch processing using eutectic solder balls or solder balls 4007, which is an industry standard equivalent. The connection is made using an adhesive or solder ball flux 4005 for the dragon or an industry recognized contact material.

Turning now to FIG. 8B, interposer 60 has a common conductive edge terminal material 6309 extending along the side of the interposer to surround its periphery as already shown in FIG. 7, Same as the interposer 61 shown in FIG. 8A. In addition, common conductive edge terminal material 6309 is electrically connected to common conductive energy paths 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM but is not made in FIG. 8A. Note that Interposer 60 is also shown connected to integrated circuit die 4100. This integrated circuit die 4100 is also shown with a protective glob coating or encapsulment material 6212 just above the die surface. The energy regulating interposer 60 is also mounted on the substrate 8007 or substrate surfaces to which the IC assembly is attached by ball grids 8009, 8010, or by other means commonly used in industry. IC package pin 8009 provides an interconnect to a board or socket connector that receives a signal or ground connection that does not necessarily travel into the interposer path, but an 8010 path connection, not shown, connects the interposer path for energy transfer. Can be. It should be noted that 4011 is a predetermined layering use spacing or passage spacing that is universally part of the considerations of the present invention. These interconnects merely provide that they can be modified for standard industry means of connecting IC packages to PCBs, PCB cards, and the like. In the case of MCM or SCM interconnects, interposers 60, or 61 may be attached directly to the substrate circuit using standard industry methodology.

In FIG. 9, a portion of FIG. 8A is enlarged to show a portion of the actual external interconnection elements for the diesel fuel structures 64, 65, 66. It should be noted that the inner conductive passageway is conventional but the point of attachment is not shown here. In addition, the surface conductive material 6209 is connected. The conductive capture pad 63 is disposed on one side of the nonconductive portion 6312 of the interposer 61 near the conductive diesel passage 66, for vias to fill with material 66 ′ during the manufacturing process. After being generated by a laser or drill machining process that leaves a cavity, or as shown in FIG. 8A, common conductive passageways 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM. After the 66 'deposition of bonding 6308 to the same, it consists of a small diameter shaped passageway of conductive material 66A that is optionally coupled with or without 6308 by standard means known in the art. . In addition, the capture pad 63 is formed in a hole opposite the non-conductive material 6312 of the interposer 61, which leads to the conductive capture pad 63 which is also deposited on the bottom of the interposer 61. Coincides with the conductive diesel passage 66. An industry recognized contact material 4005 or primer 4005, which is an adhesive solder ball flux 4005, is then applied, followed by application of conductive solder balls 4007 of the type commonly found in the art.

The actual manufacturing process is used to manufacture embodiments 60 or 61 of the present invention, and then attaching this embodiment to an active chip, chips or IC and then to a mounting substrate can be accomplished in various ways. It is important to note that there is. Rather, FIG. 9 is an attempt to only schematically show in general terms a portion of a number of mounting processes and connection materials that can be used, added, removed, exchanged, and varied between manufacturers. An important feature of the functionality of the present invention is that it is manufactured for common and differential conductive passages, which are arranged outside the AOC and differently grouped for each of the external conductive passages, one of the key elements of which the energy passages are normally conductive for energy transfer. It is rather simpler to determine the actual attachment device.

Referring now to FIG. 10, an externally mounted multiple low inductance capacitive element 8001 used in a prior art configuration having a prior art interposer having an exterior or bottom side of a prior art IC package disposed therein. It is shown using the assembly. The IC package exterior 8007 is a standard configuration, where the pin outputs come from a portion of the device to attach to the mounting board, PCB, or derivative card assembly, while other energy paths are associated with the ball grid sockets 8006 and pin outputs 8009. ), Or simply a socket 8006 when the conductive pin output 8009 is used by other passageways such as signal lines or other standard means used in the industry. The ball grid socket 8010 is typically configured for accommodating process solder and the like, rather than using an IC package (rather than an external zone of 8007) to supply energy to an internally mounted active chip or IC (not shown). It is typically constructed more closely around the interior region of 8002). The ball grid socket 8010 is disposed within the outline or outline 8003 of the interposer in the IC package 8007 and the internal region point of the IC as indicated. Within the outer contour, the ball grid socket 8010 for interconnect is typically for supplying power energy by the I / O passage 8005 of the IC package 8007. Prior art IC packages show that prior art interposers (not shown) disposed therein require an assembly of low inductance capacitive array chip elements 8001 at point 8002 to function properly. It is for the purpose.

In contrast, referring now to FIG. 11, an embodiment of a mounted inner IC package 8007 of the present invention in which the outer or bottom side of the IC package 8007 is shown as “ghosted” for convenience of description. Is using. As before, the outer contour 8003 indicates the set position of the IC and the interposer in the IC package 8007, and the outer circumference is surrounded by the ball grid socket 8010. The mounted multi-hole energy regulating structure element 60/61 or the like is shown as an interposer disposed between an integrated circuit or IC assembly (not shown) and a mounting substrate, or in this description, the mounting substrate used. Is a grouping or final layering of layers that make up the outer portion of the substrate package 8007. Interposers 60 and 61 or the like may be used to provide for additional physical shielding processing functionality used by active IC chips or chips connected to the interposer, as well as described in the disclosure. Note that it also provides simultaneous energy control. Shielding of this property is accomplished by an interposer that simply resides in the package, unless the active chip (not shown) has a portion of that embodiment extending beyond the perimeter of the interposer invention. The elements 60-61 include a hole 64 connected to the internal energy control electrode (s) 60C, and a hole 65 connected to the internal energy control electrode (s) 60D. Conductive holes 66 are connected to common conductive passages 6200 / 6200-IM, 6201, 6202 / 6202-IM, 6203, 6204 / 6204-IM, or any additional passage for similar uses utilized.

In all embodiments, a set of outer common conductive passages or layers, denoted by -IM, sandwich the fully stacked configuration sandwiched and are placed in the manufacturing process of the entire device, or perhaps in addition to the individual IC package or the IC package itself. Replacing at least one of the two outer common conductive passages, denoted -IM, by use of components of the mounting substrate that serve as other platforms, or by using external conductive passageways or large external conductive regions alone or with insulating materials alone It is optional but preferred that they are arranged between. The outer common conducting passage of the main set, which is not marked as IM but closely disposed outside of the set described above, is important for the device, which is sandwiched by a common conducting passage forming the basis of the side-positioned electrode. This is because the Faraday caged shield structure can only be optional if the final shield is replaced or replaced with an external conductive area that can be fitted to most of the described criteria so that it can be maintained fully for the desired energy control function. . However, in the case of shields marked with -IM, these shields are optional, but they electrically increase circuit regulation performance, further move outside the self-resonance point of the new interposer, and also improve those parts of the circuit installed within the AOC of the present invention. It is preferable at the point.

If the common conductive container structure constituting the present invention is in equilibrium according to the results of the stacking sequence as described herein, any indicated by -IM over the main set of common conductive passageways added by mistake or contemplating The additional or redundant single common conductive shielding layer does not severely impair the energy regulation operation, and in this case an automated layering process may add one or more additional outer layers or layers as described above and It should be noted that the application performance can represent a substantial cost savings in the manufacturing process that cannot be important.

These errors are disclosed to be sufficiently considered by the applicant without detrimentally damaging the equilibrium of the present invention, which, as discussed, intentionally or accidentally, accommodates a minimally listed stack of common conductive passageways.

Within the variant of the invention there is at least five or more distinctly different energy control functions, i.e. the physical shielding treatment of various parts of the electrostatic minimizing, differentially conductive passageway consisting of energy parasitic components by almost the entire shielding enclosure. Electromagnetic elimination or minimization shielding function or mutual magnetic flux elimination or minimization for opposing closely spaced pairs of differentially conductive passages, the use of "0" voltage references generated by central common and shared passage electrodes, two distinct The sandwiched outer first set of common conductive passageways used as part of the common conductive shielding structure container and the passage labeled -IM, as opposed to the continuous transfer movement of the energy effect for some of the energy disposed within the AOC. As such, parallel transfer movement of some of the energy to provide a shielding treatment effect can occur. It occurs that a portion of the energy transfers in parallel, which means that other phase energy portions operating in opposing but harmonious manner with the energy are approximately half of the total energy or part found at any point within the AOC of the present invention. In the same way as in the prior art, which ½ generally operates in a counter-rejection or minimization form, or in general in series despite the use of some of the mutual magnetic flux removal or minimization techniques of opposing differentially conductive paths. An electrical and / or magnetic operation using parallel, unreinforced counterparts that operate in a manner that does not increase or generate harmful forces is intended to be placed on one side of a central common and shared conductive energy path. The prior art, due to its structure, makes little use of the simultaneous sandwiched electrostatic shielding functionality inherent in the new invention as described in this disclosure.

In all embodiments, whether shown or not, the number of passages in both the common conductive passage electrode and the differential conductive passage electrode can be doubled in a predetermined manner to create a combination of numerous conductive passage elements, and activated for a circuit source. Generally, the physical parallel relationship, which is considered to be an electrically parallel relationship for these elements in the being, is present in additional parallel in addition to producing an increased capacitance value.

Next, additional common conductive passages surrounding the combination of the plurality of conductive electrodes and the central conductive passages are used to provide an increased inherent common conductive passage, in all embodiments a surge dissipation region and a Faraday caged function. To optimize.

Fourth, at least one central common conductive shield paired with two additional conductively sandwiched or sandwiched common conductive passageways or shields is generally required and should be disposed opposite the central common conductive shield (dielectric material and Other elements, such as differential conductive electrode pairs, each disposed opposite the central common layer may be disposed between these shields as described above). Additional common conductive passages are used in conjunction with any of the embodiments shown, such as shields marked with -IM which do not have differential conductive passages adjacent to their location but have been fully considered by the applicant.

Finally, looking at a number of embodiments, the shape, thickness, or size can be varied depending on the desired electrical properties or applications, where the filter is at least a single conduction having an array relationship of common conductive electrode passageways and a conductive electrode passageway. It will be apparent that they will be used due to the physical structure derived from their attachment structure, possibly forming a homogeneous Faraday cage-like conductive shield structure.

While preferred main embodiments and preferred operations of the invention have been described in detail herein, they should not be construed as limited to the specific exemplary forms disclosed. Accordingly, it will be apparent to those skilled in the art that various modifications to the preferred embodiments of the present invention may be made without departing from the spirit or scope of the invention as described in the appended claims.

Claims (32)

A plurality of shielding electrodes having substantially the same size and shape having at least first, second and third shielding electrodes, At least a pair of electrodes having substantially the same size and shape, said plurality of shielding electrodes and first and second electrodes conductively isolated from each other, respectively; Materials with one or more and predetermined characteristics, A plurality of conductive vias having at least first, second and third conductive vias, The plurality of shielding electrodes and the pair of electrodes are spaced apart from each other by the material, Wherein the first electrode is sandwiched and shielded by the first and second shielding electrodes, and the second electrode is sandwiched and shielded by the second and third shielding electrodes, The first conductive via is conductively coupled to the first electrode, insulated from the first electrode and the plurality of shielding electrodes, And the third conductive via is conductively coupled to the plurality of shielding electrodes and insulated from the first and second electrodes. Materials with one or more predetermined characteristics, A plurality of shielding electrodes having substantially the same size and shape having at least first, second and third shielding electrodes, A plurality of electrodes of substantially the same size and shape having at least first and second electrodes that are conductively isolated from each other, Each shielding electrode of the plurality of shielding electrodes is larger than any one electrode of the plurality of electrodes, The first electrode is sandwiched and shielded by the first and second shielding electrodes, the second electrode is sandwiched and shielded by the second and third shielding electrodes, Wherein the first and second electrodes are aligned and oriented in such a way as to sandwich the second shielding electrode against each other; And the plurality of shielding electrodes and the plurality of electrodes are conductively isolated from each other and spaced apart by the at least material. A plurality of shielding electrodes having substantially the same size and shape having at least first, second and third shielding electrodes, A plurality of shielded electrodes of substantially the same size and shape having at least first and second shielding electrodes that are conductively isolated from one another; A material having one or more predetermined characteristics, Each shielding electrode of the plurality of shielding electrodes is larger than any one of the shielded electrodes of the plurality of shielded electrodes, The first shielded electrode is sandwiched between the first and second shielded electrodes, the second shielded electrode is sandwiched between the second and third shielded electrodes, And said plurality of shielding electrodes and said plurality of shielded electrodes are conductively isolated from each other and spaced apart by said at least material. The method of claim 1, wherein the plurality of shielding electrodes are conductively coupled to at least fourth vias of the plurality of conductive vias, And the at least fourth conductive vias are insulated from the paired electrodes. The method of claim 1, further comprising at least one pair of outer shield electrodes, The paired outer shielding electrodes at least sandwich the paired shielding electrodes, And the pair of outer shield electrodes are at least conductively coupled to the plurality of shield electrodes. The method of claim 5, further comprising a fourth conductive via of the plurality of conductive vias, wherein the fourth conductive via is conductively coupled to the paired outer shield electrode and the plurality of shielding electrodes, And the fourth conductive via is insulated from the paired electrode. The method of claim 2, further comprising at least one pair of outer shield electrodes, The paired outer shielding electrodes at least sandwich the plurality of shielding electrodes, And the pair of shielded outer electrodes and the plurality of shielded electrodes are conductively coupled to each other. The method of claim 7, further comprising a plurality of conductive vias having at least first, second, third and fourth conductive vias, The first conductive via is conductively coupled to the first electrode, insulated from the second electrode and the plurality of shielding electrodes, The second conductive via is conductively coupled to the second electrode, insulated from the first electrode and the plurality of shielding electrodes, The third and fourth conductive vias are conductively coupled to the paired outer shielding electrode and the plurality of shielding electrodes, And the third and fourth conductive vias are insulated from the first and second electrodes. The method of claim 3, further comprising a plurality of conductive vias having at least first, second, third, and fourth conductive vias and insulated from each other, The first conductive via is conductively coupled to the first electrode and insulated from at least the second electrode and the plurality of shielding electrodes, The second conductive via is conductively coupled to the second electrode, insulated from at least the first electrode and the plurality of shielding electrodes, The third and fourth conductive vias are at least insulated from the first and second electrodes, And said at least paired outer electrode, third conductive via, said fourth conductive via and said plurality of shielding electrodes are conductively coupled to each other. 7. A shield according to any one of claims 1, 4, 5 and 6, characterized in that each shielding electrode of the plurality of shielding electrodes is larger than any one of the paired electrodes. Energy regulation substrate. 10. An energy regulating substrate according to any one of claims 6, 8 and 9, wherein the plurality of conductive vias are a plurality of conductive holes. The energy regulating substrate according to any one of claims 1 to 9, wherein the energy regulating substrate has an odd number of electrodes. 10. The device of claim 1, further comprising a plurality of external electrodes having at least first, second, and third external electrodes spaced apart from one another. 11. The first external electrode is at least coupled to the first shielded electrode, The second external electrode is at least coupled to the second shielded electrode, The third external electrode is at least coupled to the plurality of shielding electrodes, And said first and second external electrodes are each at least conductively isolated from said third electrode and with respect to each other. The method of claim 1, wherein the material having at least one predetermined property is selected from the group consisting of a material having at least ferrite properties, a material having at least dielectric properties and a material having at least varistor properties. Energy control substrate, characterized in that the. 10. An energy regulating substrate according to any preceding claim, wherein a portion of the energy regulating substrate is operable to electrostatically shield an energy portion. 10. An energy regulating substrate according to any one of the preceding claims, wherein said energy regulating substrate is selected from the group consisting of an energy regulating network, a capacitive network and a common mode and differential mode filtering network. 10. An energy regulating substrate according to any one of the preceding claims, wherein the energy regulating substrate is arranged to form a voltage divider. 10. An energy regulating substrate according to any one of the preceding claims, wherein said energy regulating substrate is coupled to a circuit. 10. An energy regulating substrate according to any one of the preceding claims, wherein the energy regulating substrate is arranged to form one or more bypass capacitors. 10. An energy regulating substrate according to any one of the preceding claims, wherein the energy regulating substrate is arranged to form one or more feed through capacitors. 10. An energy regulating substrate according to any one of the preceding claims, wherein a portion of the energy regulating substrate is produced using a doping process. 10. The energy conditioning of any of the preceding claims wherein the energy conditioning substrate is coupled to a component selected from the group consisting of printed circuit boards, integrated circuit wafers, microprocessors and digital signal processors. Board. The energy regulating substrate according to any one of claims 1 to 9, wherein a part of the energy regulating substrate is operable as a shielding structure. 10. An energy regulating substrate according to any preceding claim, wherein a portion of the energy regulating substrate is operable to electrostatically shield an energy portion. 10. An energy regulating substrate according to any one of the preceding claims, wherein the portion of the energy regulating substrate is operable together as a low impedance passageway for the energy portion. 10. The method of any one of claims 1 to 9, wherein the energy control substrate comprises at least a first and second line to ground capacitor relationship, The capacitor relationship of the first line-to-line, At least one value of the capacitor relationship of the first or second line to ground is less than a value of the capacitance relationship of the first line to line. 10. An energy regulating substrate according to any preceding claim, wherein said energy regulating substrate is operable as an integrated circuit component. 10. The device of claim 1, wherein the energy control substrate is formed as an interposer disposed between one or more integrated circuit components and one or more substrates. And said integrated circuit component and said interposer are coupled to each other. 10. An energy regulating substrate according to any one of the preceding claims, wherein the energy regulating substrate is operable as part of an electronic package having integrated circuit components. 10. An energy regulating substrate according to any one of the preceding claims, wherein said energy regulating substrate is operable as part of a circuit. The plurality of energy regulating substrates of claim 23, wherein the plurality of energy regulating substrates are conductively connected by at least a common conductive material portion to at least each other's electrode edge portions of any one of the plurality of common electrodes of the energy regulating substrate. And at least an electrode edge portion of each common electrode of the two common electrodes. 7. The plurality of energy regulating substrates of claim 6, wherein the plurality of energy regulating substrates are conductively connected by at least a common conductive material portion to at least each other's electrode edge portions of any one of the plurality of common electrodes of the energy regulating substrate. And at least an electrode edge portion of each common electrode of the two common electrodes.