KR100931824B1 - 반도체 양자점 집적광소자 - Google Patents
반도체 양자점 집적광소자 Download PDFInfo
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- KR100931824B1 KR100931824B1 KR1020070131158A KR20070131158A KR100931824B1 KR 100931824 B1 KR100931824 B1 KR 100931824B1 KR 1020070131158 A KR1020070131158 A KR 1020070131158A KR 20070131158 A KR20070131158 A KR 20070131158A KR 100931824 B1 KR100931824 B1 KR 100931824B1
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- 239000002096 quantum dot Substances 0.000 title claims abstract description 241
- 230000003287 optical effect Effects 0.000 title claims abstract description 151
- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- 238000001069 Raman spectroscopy Methods 0.000 claims abstract description 62
- 230000003321 amplification Effects 0.000 claims abstract description 49
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 49
- 230000008878 coupling Effects 0.000 claims abstract description 21
- 238000010168 coupling process Methods 0.000 claims abstract description 21
- 238000005859 coupling reaction Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 35
- 238000005253 cladding Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000002310 reflectometry Methods 0.000 claims description 10
- 230000000295 complement effect Effects 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 abstract description 16
- 230000008901 benefit Effects 0.000 abstract description 5
- -1 laser diodes Substances 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000001459 lithography Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 238000001093 holography Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
- H01S5/309—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer doping of barrier layers that confine charge carriers in the laser structure, e.g. the barriers in a quantum well structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1221—Detuning between Bragg wavelength and gain maximum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
- H01S5/2227—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties special thin layer sequence
- H01S5/2228—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties special thin layer sequence quantum wells
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Abstract
Description
Claims (12)
- 다수의 양자점을 갖는 하나 이상의 양자점 층이 형성된 반도체 기판 상에 상기 양자점 층을 활성층으로 하는 라만증폭용 양자점 레이저 다이오드(Raman pump) 및 상기 양자점 층을 활성층으로 하는 양자점 반도체 광증폭기(SOA)가 직렬 또는 병렬로 결합되며,상기 라만증폭용 양자점 레이저 다이오드는 상기 반도체 기판; 상기 반도체 기판 상부에 형성된 전도성인 제 1 크래드 층; 상기 제 1 크래드 층 상부에 형성되어 상기 하나 이상의 양자점 층을 포함하는 광도파로; 상기 광도파로 상부에 형성된 제 1 크래드 층과 상보적인 전도성을 갖는 제 2 크래드 층; 상기 제 2 크래드층 상부에 형성되어 금속과의 오믹 접촉(ohmic contact)을 이루는 오믹층; 및 금속층을 포함하고, 상기 광도파로 상부, 상기 광도파로 측면, 또는 상기 광도파로와 접하여 파장을 선택하는 브래그 격자가 구성되며,상기 양자점 반도체 광 증폭기는 상기 반도체 기판; 상기 반도체 기판 상부에 형성된 전도성인 제 1 크래드 층; 상기 제 1 크래드 층 상부에 형성되어 상기 하나 이상의 양자점 층을 포함하는 광도파로; 상기 광도파로 상부에 형성된 제 1 크래드 층과 상보적인 전도성을 갖는 제 2 크래드 층; 상기 제 2 크래드층 상부에 형성되어 금속과의 오믹 접촉(ohmic contact)을 이루는 오믹층; 및 금속층을 포함하여 구성되며,상기 직렬 또는 병렬로 결합은 상기 양자점 레이저 다이오드의 상기 광도파로와 상기 양자점 반도체 광 증폭기의 상기 광도파로의 직렬 또는 병렬 결합인 것을 특징으로 하는 양자점 집적광소자.
- 제 1항에 있어서,상기 라만증폭용 양자점 레이저 다이오드의 동작 파장은 상기 라만증폭용 양자점 레이저 다이오드의 활성층의 길이, 상기 라만증폭용 양자점 레이저 다이오드에 인가되는 전류 밀도, 또는 이들의 조합에 의해 조절되며,상기 양자점 반도체 광증폭기의 동작 파장은 상기 양자점 반도체 광증폭기의 활성층의 길이, 상기 양자점 반도체 광증폭기에 인가되는 전류 밀도, 또는 이들의 조합에 의해 조절되며,상기 라만증폭용 양자점 레이저 다이오드의 동작 파장 및 상기 양자점 반도체 광증폭기의 동작 파장은 각각 서로 독립적으로 조절되는 것을 특징으로 하는 양자점 집적광소자.
- 제 2항에 있어서,상기 라만증폭용 양자점 레이저 다이오드의 동작파장이 상기 양자점 반도체 광증폭기의 동작 파장보다 짧은 것을 특징으로 하는 양자점 집적광소자.
- 삭제
- 제 1항에 있어서,상기 라만증폭용 양자점 레이저 다이오드와 상기 양자점 반도체 광증폭기가 직렬로 결합되어 있는 것을 특징으로 하는 양자점 집적광소자.
- 제 5항에 있어서,상기 양자점 레이저 다이오드의 상기 광도파로상에 형성된 브래그 격자는 상기 라만증폭용 양자점 레이저 다이오드의 동작 파장을 반사하는 고 반사율의 브래그 격자이며, 상기 라만증폭용 양자점 레이저 다이오드와 상기 양자점 반도체 광증폭기를 직렬 결합시키는 광도파로 상에 형성된 것을 특징으로 하는 양자점 집적광소자.
- 제 6항에 있어서,상기 라만증폭용 양자점 레이저 다이오드를 기준으로 상기 고 반사율의 브래그 격자가 형성된 측과 대응된 측에 상기 라만증폭용 양자점 레이저 다이오드의 동작 파장의 빛을 반사하는 저 반사율의 브래그 격자가 형성되어 있는 것을 특징으로 하는 양자점 집적광소자.
- 제 1항에 있어서,상기 라만증폭용 양자점 레이저 다이오드와 상기 양자점 반도체 광증폭기의 입력부가 상기 광 도파로를 이용하여 병렬로 결합되어 있는 것을 특징으로 하는 양자점 집적광소자.
- 제 8항에 있어서,상기 병렬 결합은 Y-브랜치 (Y-Branch)에 의한 것을 특징으로 하는 양자점 집적광소자.
- 제 8항에 있어서,상기 병렬 결합은 방향성 결합기(directional coupler)에 의한 것을 특징으로 하는 양자점 집적광소자.
- 제 8항에 있어서,상기 병렬 결합은 광 분기/결합 다중화기(add-drop multiplexer)에 의한 것을 특징으로 하는 양자점 집적광소자.
- 제 8항 내지 제 11항에서 선택된 어느 한 항에 있어서,상기 라만증폭용 양자점 레이저 다이오드를 기준으로 상기 병렬로 결합된 측과 대응된 측에 상기 라만증폭용 양자점 레이저 다이오드의 동작 파장을 반사하는 고 반사율의 브래그 격자가 형성되어 있는 것을 특징으로 하는 양자점 집적광소자.
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KR20020076728A (ko) * | 2001-03-30 | 2002-10-11 | 주식회사 네오텍리서치 | 반도체양자점 광증폭모듈 및 이를 이용한 광전송 시스템 |
US20030063646A1 (en) | 2001-09-28 | 2003-04-03 | The Furukawa Electric Co., Ltd. | Semiconductor laser device, semiconductor laser module, and semiconductor laser control method |
KR20050086175A (ko) * | 2004-02-25 | 2005-08-30 | 삼성전자주식회사 | 반도체 광증폭기 및 이를 이용한 광증폭 장치 |
JP2007006500A (ja) | 2005-06-23 | 2007-01-11 | At & T Corp | Cwdm用のマルチバンド・ハイブリッドsoaラマン増幅器 |
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KR20020076728A (ko) * | 2001-03-30 | 2002-10-11 | 주식회사 네오텍리서치 | 반도체양자점 광증폭모듈 및 이를 이용한 광전송 시스템 |
US20030063646A1 (en) | 2001-09-28 | 2003-04-03 | The Furukawa Electric Co., Ltd. | Semiconductor laser device, semiconductor laser module, and semiconductor laser control method |
KR20050086175A (ko) * | 2004-02-25 | 2005-08-30 | 삼성전자주식회사 | 반도체 광증폭기 및 이를 이용한 광증폭 장치 |
JP2007006500A (ja) | 2005-06-23 | 2007-01-11 | At & T Corp | Cwdm用のマルチバンド・ハイブリッドsoaラマン増幅器 |
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