KR100925122B1 - Manufacturing method of ceramic thick film substrate and the module using the same - Google Patents

Abstract

The present invention relates to a method for producing a ceramic thick film substrate.

According to the present invention, the ceramic thick film substrate may be manufactured without additional firing by impregnating the thermosetting resin in the ceramic powder and curing the same to form a composite. At this time, the amount of the resin is preferably 15 to 65 vol%. Therefore, the heat treatment process for sintering can be omitted and non-shrinkage can be achieved, which is very suitable for the implementation of microcircuits for fabricating highly integrated multilayer modules and for dissimilar material bonding for device incorporation. In addition, such a thick film substrate is in the form of a kind of composite to maintain the intrinsic dielectric properties of ceramics as well as its inherent brittleness is excellent in impact resistance. In addition, since the heat treatment process is excluded, the manufacturing cost of the highly integrated laminated module is reduced.

Plastic-free ceramics, resins, composites, LTCCs, screen printing, inkjet

Description

Manufacturing Method of Ceramic Thick Substrate and Module Using Them {MANUFACTURING METHOD OF CERAMIC THICK FILM SUBSTRATE AND THE MODULE USING THE SAME}

The present invention relates to a method for manufacturing a ceramic thick film substrate, and more particularly, to a method for manufacturing a ceramic thick film substrate which can achieve non-shrinkage by omitting a heat treatment process for baking by impregnating resin into ceramic powder to produce a thick film substrate. . The present invention also relates to a module in which electrode circuit printing and vias are formed on a plurality of non-plastic ceramic thick film substrates prepared as described above, and laminated heterogeneous material substrates.

Conventionally, alumina (Al ₂ O ₃ ) substrates, which are generally classified as High Temperature Cofired Ceramics (HTCC), are mainly used as thick film-type ceramic substrates and modules such as electronic component modules, packages, and substrate materials.

However, such alumina substrates, which are usually laminated with a plurality of thick film substrates, are capable of sintering only at high temperatures, so that despite the fact that the materials of electrodes printed on the laminated substrates are mostly metal materials that melt at such high temperatures, In order to simultaneously fire the laminated alumina substrates and the electrodes printed on each substrate, only high temperature baking electrodes such as tungsten had to be used. In addition, in order to prevent oxidation of the electrode, it must be sintered at a high temperature of 1500 ° C. or higher in a reducing atmosphere.

Therefore, the development of the high frequency applications of electronic components, such as the HTCC has emerged as a significant disadvantage of the resistance of the tungsten electrode, and also the process cost of high temperature atmosphere firing has become one of the important challenges. Therefore, recently, a low temperature cofired ceramic (LTCC) has been developed as a thick film layered modularization technology to solve this problem.

Since the LTCC has a relatively low sintering temperature, simultaneous firing is possible using low-temperature firing Cu and Ag as internal electrodes. That is, when Ag electrode is used, firing is possible in an air atmosphere of 900 ° C. or lower, and when Cu electrode is used, firing is possible at a reducing atmosphere near 950 ° C. As such, LTCC technology capable of simultaneously burning internal electrodes and low temperature is mainly used for integration, complexation, miniaturization, and modularization of components using thick film technologies such as ceramic electronic components and packages.

However, LTCC, which is manufactured by stacking a plurality of thick film substrates as a module, has recently undergone rapid miniaturization of a thin layer of a device, and thus requires a very small printed circuit line width and requires a via for the purpose of connecting circuits between layers. The number is also increasing. Therefore, in order to realize such a microcircuit, precision of a circuit printing process and an alignment process, uniformity of substrate shrinkage during firing, and the like must be satisfied at the same time. In particular, although the uniform shrinkage of the substrate during firing is an essential technology in the ceramics field, its control is limited, and the quality problem of the product due to the increase in the number of vias and the increase in the stress of the highly integrated module due to the weakening of the strength. Is occurring.

Accordingly, the present invention was devised to solve the above problems, and an object of the present invention is to produce a thick film substrate by impregnating a resin in ceramic powder, thereby eliminating the heat treatment process for sintering and achieving non-shrinkage and dissimilar material bonding. The present invention also provides a method for manufacturing a ceramic thick film substrate, and also provides a module manufactured by using the method.

In order to achieve the above object, as a method of manufacturing a ceramic thick film substrate according to an aspect of the present invention, a ceramic thick film substrate may be manufactured without firing by impregnating a resin in ceramic powder and curing it. At this time, the amount of the resin is preferably 15 to 65 vol%. In addition, the resin is a thermosetting resin, for example, polyacrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin (PPE), polyphenylene It may include any one or more of sulfide-based resin, cyanate ester resin and benzocyclobutene (BCB). Further, the ceramic powder and the particle size being preferably from 20 to 1000 nm, for example, _{Al 2 O 3, SiO 2,} BaTiO 3 based ceramics, SrTiO ₃ based ceramics, PbTiO ₃ based ceramics, ferrite, and Pb ( Zr, Ti) O ₃ -based ceramics may be any one or more. In addition, the ceramic powder may be filled on at least one of a ceramic substrate, a semiconductor substrate, a Cu foil, and a polymer film.

In addition, in the method for manufacturing a ceramic thick film substrate according to another aspect of the present invention, the method for producing an unfired ceramic substrate includes the steps of preparing a slurry or paste of ceramic powder and casting the same to prepare a ceramic sheet, and a thermosetting resin. And dissolving in a solvent to prepare a resin solution and casting it on top of the ceramic sheet to impregnate, and to complete the ceramic thick film substrate by forming a composite by heat-treating the impregnated resin and , The manufacturing method does not include a firing step.

In addition, in the method for manufacturing a ceramic thick film substrate according to another aspect of the present invention, the method for manufacturing an unfired ceramic substrate includes dispersing ceramic powder in a solvent to prepare a ceramic ink, and spraying the ceramic ink with an ink jet. Forming a ceramic film, preparing a resin solution by dissolving a thermosetting resin in a solvent, and impregnating it by spraying it on an upper portion of the ceramic film with an inkjet, and curing the impregnated resin to form a composite by heat treating the impregnated resin. It may comprise a step of completing a thick film substrate, the manufacturing method does not include a firing step.
In addition, a module using a ceramic thick film substrate according to another aspect of the present invention may be provided by stacking one or more non-plastic ceramic thick film substrates including one or more electrodes and a dielectric therein.

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As described above, according to the present invention, by manufacturing the thick film substrate by impregnating the resin in the ceramic powder, the heat treatment process for firing can be omitted and non-shrinkage can be achieved, which is very useful for implementing a microcircuit for manufacturing a highly integrated laminated module. Suitable. In addition, such a thick film substrate is in the form of a kind of composite to maintain the intrinsic dielectric properties of ceramics as well as its inherent brittleness is excellent in impact resistance. In addition, since the heat treatment process is excluded, the manufacturing cost of the highly integrated laminated module is reduced.

Hereinafter, the present invention will be described in detail.

According to a preferred embodiment of the present invention, a ceramic thick film substrate may be prepared by forming a high-density-filled ceramic powder, impregnating the resin, and curing the resin. As a result, the high temperature heat treatment for firing the ceramics is completely excluded from the manufacturing process so that the shrinkage of the ceramic substrate due to the heat treatment is not accompanied. 1 is a schematic view for explaining a method for manufacturing a ceramic thick film substrate according to the present invention.

As shown in FIG. 1, when the resin 3 is impregnated in the ceramic powder 1 maintained in a densely packed state, the resin 3 is formed by pores formed inside the ceramic powder 1 ( 2), and then ceramic thick film substrate is manufactured by curing the impregnated resin (3). The ceramics thus manufactured are in the form of a composite, which not only retains the dielectric properties (for example, low dielectric loss) inherent in the ceramics, but also reduces its inherent brittleness, thereby making it more resistant to impact.

At this time, the resin should be kept at a high ceramic fraction while minimizing the distribution of pores in the ceramic powder to a minimum, preferably 15-65vol%, more preferably 30-50vol%.

In addition, the resin is a thermosetting resin, polyacrylates (epoxy resin), epoxy resin (phenolic resin), phenolic resin (polyphenolic resin), polyamides resin (polyamides resin), polyimides resin (polyimides rein), Unsaturated polyesters resin, polyphenylene ether resin (PPE), polyphenylenesulfides resin, cyanate ester resin and benzocyclobutene: One or more selected from BCB) may be used, and not limited thereto, but any other conventional thermosetting resin may be used in the present invention.

Therefore, after the thermosetting resin is impregnated into the ceramic powder, it is heat-treated to a predetermined temperature and cured. In this case, the heat treatment temperature depends on the resin material properties, which can be determined in a specific temperature range. For example, heat treatment is performed at about 300 ° C. for BCB resin, about 140-200 ° C. for PPE resin, about 140-200 ° C. for cyanate ester resin, and about 140-180 ° C. for epoxy resin. Cures.

In addition, the ceramic powder has a particle size of 20-1000 nm, preferably 100-700 nm, very preferably 300-500 nm. In addition, in one embodiment of the present invention, the composition of the ceramic powder may be any one or more of Al ₂ O ₃ , SiO ₂ suitable as a substrate composition, in another embodiment the composition of the ceramic powder is functional In order to impart it, it may be of a high dielectric constant composition such as BaTiO ₃ -based ceramics, SrTiO ₃ -based ceramics, PbTiO ₃ -based ceramics, ferrite ceramics, and Pb (Zr, Ti) O ₃ -based ceramics. In addition, the present invention is not limited thereto and may include any dielectric composition suitable for the intended properties.

In addition, the ceramic powder may be formed on a ceramic substrate commonly used, on a semiconductor substrate such as Si, on a Cu foil, or on a polymer film such as a PET film that can be separated and removed.

In addition, according to a preferred embodiment of the present invention, the step of forming a sheet (ceramic) of the ceramic powder and impregnating a resin thereon may be carried out using a conventional screen printing (screen printing). In this case, the screen printing method includes all of the methods applied to form a conventional high-fill thick film, such as wet coating of a slurry, tape casting, and the like, but is not limited thereto. 2 is a schematic view for explaining a method for producing an unfired ceramic substrate using the screen printing method in this embodiment.

Referring to Figure 2, first, to prepare a slurry (slurry) or paste (paste) to be a ceramic powder and cast it using a screen printing method and dried (S201-S202). In this case, the slurry and / or paste may include any one or more binders of an epoxy resin, an acrylic resin, a polyurethane, and a polyester resin. In addition, the slurry and / or paste may be any of a nonionic surfactant, a cationic surfactant, an anionic surfactant, an alkyl ammonium salt copolymer, an alkylol ammonium salt copolymer, an ester nonionic, fish oil, and a polyacrylate. One or more dispersants may be included.

And, by dissolving a resin of a predetermined component in a solvent to prepare a solution and casting it on top of the cast ceramic powder sheet to be impregnated and dried (S203-S204), and then heat-treated at a temperature suitable for the resin properties to cure A thick film substrate is produced (S205-S206).

 In addition, according to another preferred embodiment of the present invention, the step of forming a sheet of the ceramic powder and impregnating the resin thereon may be performed using a conventional ink jet (ink jet). 3 is a schematic view for explaining a method for producing an unfired ceramic substrate using an inkjet in this embodiment.

Referring to FIG. 3, first, ceramic powder particles are dispersed in a solvent to prepare a ceramic ink composition (S301). In this case, the mother solvent of the ceramic ink may be an aqueous solution of a drying control agent which is at least one of diethylene glycol (DEG) and formamide (FA). In addition, in order to control the surface tension of the ceramic ink, a dispersing agent of any one or more of a nonionic surfactant, a cationic surfactant, an anionic surfactant, octyl alcohol, and an acrylic polymer may be added. In addition, the ceramic ink may further include any one or more binders of an epoxy resin, an acrylic resin, polyurethane, and a polyester resin. In addition, the ceramic particles are preferably in the range of 0.1-0.7 μm, the concentration of the particles is preferably in the range of 10-15 wt%, and the concentration of the dispersant is preferably 0-2 wt%.

Then, the ceramic ink is sprayed with an ink jet to form a uniform film (S302).

Then, a resin is prepared by dissolving a resin, which is a predetermined component, in a solvent, and the resin ink, which is a solution, is sprayed onto the uniform film by inkjet to be impregnated and dried (S303-S304).

Subsequently, when the substrate is cured by heat treatment at a temperature suitable for the resin properties, a thick film substrate is manufactured (S305-S306).

In addition, according to a preferred embodiment of the present invention, the non-fired ceramic substrate prepared as described above can be used to manufacture a conventional highly integrated module. That is, after the electrode circuit, the functional thermal conductive layer, etc. are printed on each of the plurality of non-fired ceramic substrates by using a screen printing method or an inkjet method, and vias are formed for electrical connection, the plurality of non-fired ceramic substrates are formed. Modules can be manufactured by stacking them. Further, in one embodiment, the module may be formed on a commonly used ceramic substrate, on a semiconductor substrate such as Si, on a Cu foil, or on a polymer film such as a detachable PET film.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. However, the embodiments described below are provided to help the overall understanding of the present invention, and the present invention is not limited to the following examples.

Example  One ( No firing  Alumina Thick  Produce)

In the present embodiment, the alumina slurry was prepared using a volume ratio of Al ₂ O ₃ powder (AES-11) and a polymer in a volume ratio of 99: 1. To this end, the epoxy was added to the solvent in a volume ratio of 1% to Al ₂ O ₃ and mixed until the epoxy was completely dissolved in the solvent. In addition, Al ₂ O ₃ powder having a volume ratio of 99% was added to the mixed solution, and mixed using a ball mill for 24 hours. As a solvent, an 8: 2 mixture of acetone and ethanol was used, and the mass ratio with the powder was mixed at a ratio of 1: 1.

The prepared alumina slurry was cast on the matte side of the Cu foil. The casting thickness was carried out varying from 130-200 μm and dried for about 5 minutes in an oven at 90 ° C. after casting.

Then, the epoxy was double cast on the cast alumina sheet. The epoxy solution was changed to 20-60wt% concentration with respect to the solvent, and the epoxy was cast with a blade spacing of 200 μm than the cast alumina sheet. After the double casting, it was dried in an oven at 90 ° C. for 10 minutes and cured in an oven at 170 ° C. for 30 minutes. The cured samples exhibited a dielectric constant of 4.7 and Df 0.009 at a frequency of 1 MHz. The shape of the sample in this example is shown in FIG. Moreover, especially when the hardening time is 1 hour at 170 degreeC (at this time, an alumina dielectric layer thickness is about 50 micrometers), the electron microscope photograph of the cross section of a dielectric layer sample is shown in FIG. Looking at this, it can be seen that the epoxy resin is sufficiently impregnated between the alumina powder to form a uniform composite.

Example  2 ( No firing  Alumina Thick  Produce)

In the present embodiment, the alumina slurry was prepared using an Al ₂ O ₃ powder (AES-11) and a polymer content ratio of 99: 1 in volume ratio. Epoxy was added to the solvent at a volume ratio of 1% to Al ₂ O ₃ , and then mixed until the epoxy was completely dissolved in the solvent. Al ₂ O ₃ powder having a volume ratio of 99% was added to the mixed solution, and mixed with a ball mill for 24 hours. Acetone and ethanol ratio of 8: 2 solvent was used, the mass ratio of the powder was mixed in a ratio of 1: 1.

Then, the prepared alumina slurry was cast on Cu foil. The casting thickness was carried out varying from 130-200 μm and dried for about 5 minutes in an oven at 90 ° C. after casting.

And, BCB resin (Cyclotene 3022-46) was double cast on the cast alumina sheet. The epoxy was cast by giving a blade spacing of 120 μm over the cast alumina sheet. After the double casting, it was dried in an oven at 90 ° C. for 30 minutes and cured in an oven at 300 ° C. for 30 minutes. The Cu foil was removed from the cured sample, and room temperature Ag electrodes were coated on both surfaces thereof, and the sample properties were measured. The dielectric constant was 3.5 and Df 0.0009 at 1 MHz.

Example  3-5 ( No firing  Alumina Thick  Produce)

Al ₂ O ₃ in the present embodiments Preparation of the paste using the powder was carried out in the composition of Table 1 below.

Table 1

Example Al ₂ O ₃ Powder (g) PVB Binder (g) Dispersant (g) (BYK-111) Solvent (g) (γ-Butyrolactone) 3 83.15 0.22 0.83 15.80 4 80.41 1.10 0.80 17.69 5 75.81 2.20 0.76 21.23

The Al ₂ O ₃ paste made from the present example compositions was printed using a 400mesh screen on Cu foil, and Examples 4 and 5 showed good printing characteristics. Accordingly, the Al ₂ O ₃ layer printed under the conditions of Example 4 was dried for 30 minutes in an oven at 90 ℃. In addition, an epoxy solution prepared at a concentration of 60-80 wt% based on the solvent was prepared and printed on the Al ₂ O ₃ layer by using a 400 mesh screen. The printed sample was dried in an oven at 90 ° C. for 10 minutes and then cured in an oven at 170 ° C. for 30 minutes. An electron micrograph of the thick film thus formed is shown in FIG. 6. The upper epoxy residue of the sample was removed by a polishing process, and the upper electrode was formed to measure dielectric properties. As a result, dielectric constant of 5.4 and Df of 0.007 were displayed at 1 MHz.

Example  6 ( No firing  Alumina Thick  Produce)

In this embodiment Al ₂ O ₃ Particles (AKP-015) were dispersed in FA / H ₂ O solvent and ink compositions were prepared by milling. That is, FA and 25ml H ₂ O and then disperse the Al ₂ O ₃ particles in a dry 10-15g agent FA / H ₂ O mixed with 100ml 75ml, by the addition of zirconia balls (φ1mm) 200g thicky mixer (AR- 250) Milling at 2000 rpm for 6 minutes. The final composition obtained was a white suspension. The ink composition was sprayed onto the silicon wiper on which the Au lower electrode was formed in an evaporation method using an inkjet, and then it was confirmed that a uniform film was formed. A 20 wt% epoxy solution was prepared on the formed Al ₂ O ₃ layer and sprayed using an inkjet equipment, dried for 10 minutes in an oven at 90 ° C., and then cured for 30 minutes in an oven at 170 ° C. And it was confirmed that the composite thick film impregnated with epoxy was formed. After the Ag paste electrode was formed on the formed thick film, dielectric properties were measured, and the dielectric constant was 5.7 and Df was 0.005 at 1 MHz.

Example  7 ( No firing  Alumina Thick  Produce)

In this embodiment, Al ₂ O ₃ particles were prepared by milling after dispersing in a FA / H ₂ O solvent. That is, the DEG and 10-15 g in 25ml H ₂ O and dry mixing 75ml agent DEG / 100ml H ₂ O Al ₂ O ₃ After the particles were dispersed, 200 g of zirconia balls (φ1 mm) were added and milled for 6 minutes at 2000 rpm with a thicky mixer (AR-250). The final composition obtained was a white suspension. After spraying this ink composition to a silicon wiper using an inkjet, it was confirmed that a film was formed. The epoxy was impregnated and cured in the same manner as in Example 6 above the membrane.

Example  8 ( No firing  Alumina Thick  Produce)

In this embodiment, Al ₂ O ₃ of Example 6 Propellant was added for more efficient ink jet of the ink composition. That is, FA 25ml and H ₂ O after a drying agent FA / 100ml H ₂ O mixture was added to a 75ml BYK-111 0.0, 0.5, 1.0 , 1.5, 2.0 wt%, of 10g Al ₂ O ₃ The particles were dispersed and milled for 6 minutes using a thicky mixer (AR-250) 2000 rpm with 200 g of zirconia balls (φ1 mm) added thereto. The final composition obtained was a white suspension. After spraying this ink composition to the silicon wiper using the inkjet, it confirmed that a film was formed. The epoxy was impregnated and cured in the same manner as in Example 4 above the membrane.

Example  9 ( No firing  Alumina Thick  Manufacture and manufacture of modules using the same)

In this example, a paste was prepared using Al ₂ O ₃ powder under the conditions shown in Table 2 below, and an Al ₂ O ₃ thick film layer was printed on a Cu foil using a 400 mesh screen.

TABLE 2

Example Al ₂ O ₃ Powder (g) PVB Binder (g) Dispersant (g) (BYK-111) Solvent (g) (γ-Butyrolactone) 9 80.41 1.10 0.80 17.69

Then, the epoxy solution having a concentration of 70wt% relative to the solvent was reprinted, dried for 10 minutes in an oven at 90 ° C, and cured for 30 minutes in an oven at 170 ° C to form a first layer dielectric layer. The dielectric layer formed at this time was 25-30 μm thick.

Then, vias of about 100-300 μm in diameter were formed in the dielectric layer using a laser punching machine. The formed vias formed electrodes in an inkjet method using via ink. Via ink was purchased using silver nano-particles of 20-80nm size, and was used. The ink was fixed at the via position by jetting equipment, and the ink was repeatedly sprayed while heating and drying the substrate of the equipment at 60 ° C. It was formed by. A test pattern was formed on the surface on which the via was formed by using the silver nanoelectrode forming ink. They were dried at room temperature and sintered vias and electrode patterns at 200 ° C. to form electrodes completely. The 3D stacked module was formed by repeating the same method as the first layer dielectric layer on the formed electrode to form a second layer dielectric layer.

Example  10 ( No firing  Alumina Thick  Manufacture and manufacture of modules using the same)

In the present embodiment, via electrodes were formed using silver nano paste on vias having a relatively large diameter of 200-300 μm in the dielectric layer formed by the method of Example 9, and the via electrodes were PCB electrode stacked electrodes (Tatsuda, Japan). ) Was purchased and used. The electrode was screen printed using a metal screen made of SUS material having a pattern formed at the same position as the via. After the vias were formed, the surface electrodes were printed by a general screen printing method. The electrode used at this time was used after adjusting a viscosity by mixing a solvent with the electrode for commercial vias (Tatsuda Co., Japan). After the electrodes were formed, they were dried at 80 ° C. for 10 minutes and sintered vias and electrode patterns at 200 ° C. to form electrodes completely. The same method as the first layer dielectric layer was repeated on the formed electrode to form the second layer dielectric layer. In the same manner as described above, the via and pattern electrodes were formed on the second dielectric layer using silver nano electrode paste, and the circuit and the electrode connection between the lower substrate and the upper pattern on which the second dielectric layer was formed were confirmed.

Example  11 ( No firing  Alumina Thick  Manufacture and manufacture of modules using the same)

As a result of forming a surface electrode on the LTCC substrate and forming a dielectric layer by the method of Example 9, it was confirmed that the dielectric layer was smoothly formed. Adhesion with the substrate was ensured even after the curing process of the dielectric layer at 170 ° C. After repeating the formation of the dielectric layer on the PET film in the same manner as in Example 9, the thickness of the formed dielectric layer reached 1mm or more and fully cured, it was confirmed that the separation of the PET film is possible.

The characteristics of the preferred embodiments of the present invention described above may vary somewhat within the usual error range depending on the powder characteristics such as the average particle size, distribution and specific surface area of the composition powder, the purity of the raw material, the amount of impurity added and the sintering conditions. It is only natural for those with ordinary knowledge in the field.

In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, anyone of ordinary skill in the art will be possible to various modifications, changes, additions, etc. within the spirit and scope of the present invention, such modifications, changes And additions should be regarded as within the scope of the claims.

1 is a schematic view for explaining a method for producing an unfired ceramic thick film substrate according to the present invention.

2 is a schematic view for explaining a method for producing an unfired ceramic thick film substrate using the screen printing method in the present embodiment.

3 is a schematic view for explaining a method for producing an unfired ceramic thick film substrate using an inkjet in this embodiment.

4 is a photograph of a thick film sample prepared in Example 1. FIG.

FIG. 5 is an electron micrograph of a cross section of a dielectric thick film sample prepared in Example 1. FIG.

6 is an electron micrograph of the thick film prepared in Example 5.

Claims (23)

In the method of manufacturing a ceramic thick film substrate, The ceramic thick film substrate is a ceramic thick film substrate manufacturing method characterized in that the impregnated resin in the ceramic powder and then hardened it to be manufactured without firing. The method of claim 1, The amount of the resin is a manufacturing method of a ceramic thick film substrate, characterized in that 15 to 65 vol%. The method according to claim 1 or 2, The resin is a manufacturing method of a ceramic thick film substrate, characterized in that the thermosetting resin. The method of claim 3, The resin may be polyacrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin (PPE), polyphenylene sulfide resin, cyanate ester resin and benzo A method for producing a ceramic thick film substrate, characterized in that at least one of cyclobutene (BCB). The method according to claim 1 or 2, The particle size of the ceramic powder is 20 to 1000 nm manufacturing method of a ceramic thick film substrate. The method according to claim 1 or 2, The ceramic powder is a ceramic characterized in that the _{Al 2 O 3, SiO 2,} BaTiO 3 based ceramics, SrTiO ₃ based ceramics, PbTiO ₃ based ceramics, ferrite, and Pb at least any one of (Zr, Ti) O ₃ ceramics Method of manufacturing a thick film substrate. The method according to claim 1 or 2, The ceramic powder is filled on top of any one or more of a ceramic substrate, a semiconductor substrate, a Cu foil and a polymer film. In the method of manufacturing a ceramic thick film substrate, Preparing a slurry or paste made of ceramic powder and casting the ceramic sheet; Dissolving a thermosetting resin in a solvent to prepare a resin solution and casting the same on the ceramic sheet to impregnate the resin solution; And curing the impregnated resin to form a composite, thereby completing the ceramic thick film substrate, and the manufacturing method does not include a firing step. The method of claim 8, The amount of the resin in the composite is a method of manufacturing a ceramic thick film substrate, characterized in that 15 to 65 vol%. The method according to claim 8 or 9, The slurry or paste is a method for producing a ceramic thick film substrate, characterized in that it comprises a binder made of any one or more of an epoxy resin, an acrylic resin, a polyurethane resin and a polyester resin. The method according to claim 8 or 9, The slurry or paste comprises a dispersant comprising any one or more of a nonionic surfactant, a cationic surfactant, an anionic surfactant, an alkyl ammonium salt copolymer, an alkylol ammonium salt copolymer, an ester nonionic, fish oil and a polyacrylate. Method for producing a ceramic thick film substrate, characterized in that. The method according to claim 8 or 9, The ceramic sheet is formed on top of any one or more of a ceramic substrate, a semiconductor substrate, a Cu foil and a polymer film. In the method of manufacturing a ceramic thick film substrate, Dispersing the ceramic powder in a solvent to produce a ceramic ink; Spraying the ceramic ink with an inkjet to form a ceramic film; Preparing a resin solution by dissolving a thermosetting resin in a solvent, and impregnating by spraying the thermosetting resin on the ceramic film by inkjet; And curing the impregnated resin to form a composite, thereby completing the ceramic thick film substrate, and the manufacturing method does not include a firing step. The method of claim 13, The amount of the resin in the composite is a method of manufacturing a ceramic thick film substrate, characterized in that 15 to 65 vol%. The method according to claim 13 or 14, The ceramic ink is a manufacturing method of a ceramic thick film substrate, characterized in that it comprises an aqueous drying control agent of at least one of diethylene glycol (DEG) and formamide (FA). The method according to claim 13 or 14, The ceramic ink is a manufacturing method of a ceramic thick film substrate, characterized in that it comprises a dispersing agent of any one or more of a nonionic surfactant, a cationic surfactant, an anionic surfactant, octyl alcohol and an acrylic polymer. The method of claim 16, And the concentration of the dispersant is greater than 0 and less than or equal to 2 wt%. The method according to claim 13 or 14, The ceramic ink is a method for producing a ceramic thick film substrate, characterized in that it comprises any one or more binders of an epoxy resin, an acrylic resin, a polyurethane resin and a polyester resin. The method according to claim 13 or 14, The ceramic thick film substrate manufacturing method, characterized in that the ceramic particle concentration of the ceramic ink is 10 to 15 wt%. The method according to claim 13 or 14, The particle size of the ceramic powder is 0.1 to 0.7㎛ manufacturing method of a ceramic thick film substrate. The method according to claim 13 or 14, Wherein the ceramic film is formed on at least one of a ceramic substrate, a semiconductor substrate, a Cu foil, and a polymer film. A module in which at least one ceramic thick film substrate including at least one electrode and a dielectric is stacked therein, The ceramic thick film substrate is a module according to claim 1, 2, 8, 9, 13, and 14 made of a ceramic thick film substrate. The method of claim 22, The module is formed on top of any one or more of a ceramic substrate, a semiconductor substrate, a Cu foil and a polymer film.

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