KR100917712B1 - LED array module using aluminum metal substrate - Google Patents

Abstract

The present invention relates to an LED array module having excellent heat dissipation characteristics. The LED array module may include a substrate made of aluminum, an insulating layer formed on an upper surface of the substrate, a device mounting part formed by etching the insulating layer to the surface of the substrate, and then filling the etched region with a conductive material. A blue LED device mounted on the surface of the mounting portion, a metal wiring layer formed by depositing a patterned metal material on the upper surface of the insulating layer, and a heat radiation layer formed on the lower surface of the substrate. The fluorescent material is coated on the blue LED device.

 The p-type electrodes of the blue LED device are connected to a metal wiring layer, the n-type electrodes of the blue LED are connected to the device mounting part, and the device mounting part connected to the substrate functions as a common metal wire for n-type electrodes. Do this.

The LED device according to the present invention can be widely used as a lighting device that emits white light by reducing the manufacturing cost while having excellent heat dissipation characteristics.

LED, heat dissipation layer, aluminum, anodization

Description

LED array module using aluminum metal substrate

The present invention relates to an LED array module, and more particularly, by mounting and packaging LED elements on an aluminum metal substrate, and using the aluminum metal substrate as a common metal wiring for n-type electrodes of each LED element, heat dissipation characteristics are improved. The present invention relates to an LED array module that can be excellent as well as reduce manufacturing costs.

In general, optical or electronic devices generate considerable heat due to internal resistance or the like during their operation. Representative elements of the heat generating device is a computer CPU, etc., a device that generates strong heat over a local area is attached to a dedicated cooling cooler separately. However, since other elements attached to the substrate other than the CPU also generate heat during operation, the heat dissipation problem of the substrate itself to which the elements are attached is an important technology.

This problem, especially in the case of a light emitting device that has been used in a large number of applications recently, has become a more serious factor due to the introduction of the array structure. In general, in order to use a light emitting device as a lighting lamp, the brightness of the unit should be several thousand candelas per unit area. It is configured to get The most problem in forming an array in the prior art is to maximize the light emission availability by efficiently extracting the light generated from each light emitting element as light without converting the heat as much as possible, and to quickly generate heat even though It is emitted inside the chip or the substrate.

1 is a cross-sectional structure in which a light emitting device array is attached to a conventional printed circuit board (hereinafter, referred to as 'PCB'), and a surface protective film or other structures not directly related to the core of the present invention are omitted. One drawing. Specifically, in FIG. 1, a lead wire pattern 120, such as a copper wire, printed on a substrate 130 made of a printed circuit board is attached, and a light emitting device chip 110 is attached thereto. When the high brightness light emitting device is attached to the printed lead wires as described above, part of the heat 140 generated from the light emitting device itself is radiated to the upper part through the volume of the light emitting device, and the remaining rows 150 are the lead wire itself or the lead wire. Through the heat dissipation toward the lower PCB.

In the above structure, since the PCB itself 130 is made of a plastic material, since the heat dissipation property is not good, the heat 150 radiated through the substrate is also relatively small. Therefore, in particular, when a heat generating element is mounted on a substrate, the heat is hardly discharged, which causes a malfunction of the device, shortening of the lifespan, and the like, even in a high brightness light emitting device, a laser diode, or an array thereof.

One of the conventional methods used to solve these problems is a method of attaching a structure that considers heat dissipation and radiation efficiency to each device in manufacturing each device, and then attaching such individual devices to the printed circuit board of FIG. 1. to be. For example, in order to widen the surface area of the heat dissipation region, the structure may be changed to a concave-convex shape, or may be manufactured using a material having excellent heat absorption and heat dissipation.

However, by individually packaging each LED device constituting the LED array module, and attaching a separate heat dissipation structure for each device, it is disadvantageous in terms of manufacturing cost and manufacturing efficiency for the LED array module. In addition, since the packaging of individual devices must be made excessively large in order for sufficient heat dissipation, problems such as disadvantages of integration occur. Therefore, the situation is not actually satisfactory.

Meanwhile, the existing LED array module requires two wire bonding processes for each of the R, G, and B LEDs after mounting the LED chip on the flexible PCB board.

An object of the present invention to solve the above problems is to provide an LED array module having excellent heat dissipation using an aluminum metal substrate.

Another object of the present invention is to provide an LED array module that can dramatically simplify the manufacturing process and reduce manufacturing costs by providing a common metal wiring connected to an aluminum metal substrate for the n-type electrodes of each LED element.

A feature of the present invention for achieving the above technical problem relates to an LED array module that can simplify the manufacturing process while having excellent heat dissipation characteristics, the LED array module,

A substrate made of aluminum having electrical conductivity;

An insulating layer formed on an upper surface of the substrate;

An element mounting part formed by etching the insulating layer to the surface of the substrate and filling the etched region with a conductive material;

Red LED, green LED, and blue LED devices mounted on the surface of the device mounting unit;

A red LED metal wiring layer, a green LED wiring layer and a blue LED metal wiring layer formed by depositing a metal material on an upper surface of the insulating layer and patterning the pattern;

And a heat dissipation layer formed on the lower surface of the substrate,

The p-type electrodes of the red LED, the green LED, and the blue LED are connected to the metal wiring layer for the red LED, the metal wiring layer for the green LED, and the metal wiring layer for the blue LED, respectively, and the n-type of the red LED, the green LED, and the blue LED. Electrodes are connected to the device mounting part, and the device mounting part connected to the substrate becomes a common metal wire for n-type electrodes. Here, the connection wires may be used by using a bonding wire or a 0 Ohm jump line selectively or mixed. The red, blue and green LED elements mounted in the element mounting part of the LED array module having the above-described characteristics may be arranged in a line or in a triangular form.

LED array module according to another aspect of the present invention,

A substrate made of aluminum having electrical conductivity;

An insulating layer formed on an upper surface of the substrate;

An element mounting part formed by etching the insulating layer to the surface of the substrate and filling the etched region with a conductive material;

A blue LED device mounted on an upper surface of the device mounting part;

A metal wiring layer formed by depositing and patterning a metal material on an upper surface of the insulating layer;

Connection wirings connecting the p-type electrodes of the blue LED device to the metal wiring layer;

And a heat dissipation layer formed on a lower surface of the substrate, wherein a fluorescent material is coated on top of each blue LED element, and n-type electrodes of each blue LED element are connected to the device mounting part and connected to the substrate. The device mounting portion is a common metal wiring for the n-type electrodes.

The heat dissipation layer of the LED array module having the above-mentioned characteristics is preferably made of an aluminum anodized film formed by anodizing the lower surface of the substrate.

The insulating layer of the LED array module having the above-described characteristics may be formed of one of an aluminum nitride film (AlN), a benzocyclobutene (BCB) film, a silicon nitride film (SiN), and a polyimide film. It can also be formed.

The insulating layer and the heat dissipating layer of the LED array module having the above-described characteristics may be formed in one process of anodizing the substrate.

The LED array module according to the present invention uses a metal substrate and anodizes both surfaces to form an insulating layer and a heat dissipation layer, whereby heat generated from the LED elements by the driving of the LED elements is transferred to the substrate, and then the surface area. This wide aluminum anodization film can be efficiently released to the outside. Therefore, the LED array module according to the present invention can not only improve heat dissipation characteristics but also simplify the manufacturing process.

In addition, in the LED array module according to the present invention, by connecting the device mounting portion on which the devices are mounted with an electrically conductive aluminum substrate, by wiring the n-type electrode of the LED elements mounted on the device mounting portion with the device mounting portion, The aluminum substrate serves as a common metal wiring for the n-type electrode of the LED elements. As a result, the manufacturing process can be simplified.

According to the present invention, unlike individually packaging each LED device, by packaging directly on an aluminum substrate without packaging several LED devices, it is possible to transfer heat emitted from the LED to the outside well, The result is an LED that can extend the life of the LED and eliminate the cost of each package, resulting in low cost manufacturing.

The LED array module according to the present invention can be used as an element for lighting by providing white light.

First Example

Hereinafter, an LED array module according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view schematically illustrating an LED array module according to a first embodiment of the present invention, FIG. 3 is a cross-sectional view taken along the AA ′ direction of FIG. 2, and FIG. 4 is a BB ′ direction of FIG. 2. It is a cross-sectional view shown along the cutting.

2 to 4, the LED array module 20 according to the present embodiment is mounted on a substrate 200 having an electrical conductivity, an insulating layer 210, a device mounting unit 220, and the device mounting unit. LED elements 230, 231, and 232 of R, G, and B, metal wiring layers 240, 241, and 242 formed on an upper surface of the insulating layer, and bonding wires 250, 251, 252, 253, 254 connecting the LED elements and the metal wiring layer. ), And a heat dissipation layer 260 formed on the lower surface of the substrate. Hereinafter, each component described above will be described in detail.

The substrate 200 is made of a metal having electrical conductivity, and most preferably aluminum having excellent heat dissipation.

The insulating layer 210 is made of a material having electrical insulation and is formed on an upper surface of the substrate. The insulating layer 220 may be formed of one of an aluminum nitride layer (AlN), a benzocyclobutene (BCB) layer, a silicon nitride layer (SiN), and a polyimide layer.

The device mounting unit 220 is a region in which R, G, and B LED devices are mounted on a surface thereof, and the insulating layer 210 is etched to the surface of the substrate, and then the etched region is filled with a conductive material. In this case, the device mounting portion may be formed of Au or the like.

The LED devices are mounted on the device mounting unit 220, and each of the device mounting units includes a red (R) LED, a blue (B) LED, and a green (G) LED. The blue LED and the green LED are formed of a p-type electrode and an n-type electrode on an upper surface thereof, and a sapphire substrate that is an insulator on a lower surface thereof. It is. In this case, the red LED, the blue LED, and the green LED may be arranged in one element mounting unit as shown in FIG. 2, or may be arranged in a triangular form as shown in FIG. 5. As shown in FIG. 5, when the R, G, and B LEDs are arranged in a triangular shape, the white light expressability is excellent and the area for wire bonding becomes large.

The metal wiring layers include a metal wiring layer for a red LED, a metal wiring layer for a green LED, and a metal wiring layer for a blue LED. Each LED is wire-connected with a corresponding metal wiring layer, and wire-bonding or chip resistors having a value of 0 ohms may be used when wiring is connected. The metal wiring layers may be made of a metal material such as Cu, Ni, Au, and the like, and may be formed by depositing a metal material on the entire surface and patterning the same by using a photolithography process or by printing a metal material on the metal wiring layer region. By printing, a metal wiring layer can be completed.

The red LED has p-type electrodes and n-type electrodes formed on the top and bottom surfaces, respectively. Therefore, by mounting the red LED in the device mounting portion having electrical conductivity, the n-type electrode on the bottom surface of the red LED is directly electrically connected to the device mounting portion without a separate wiring connection process, the p-type electrode on the top surface of the red LED The silver wiring is connected to the metal wiring layer for the red LED.

Since the blue LED and the green LED have a vertical structure on the sapphire substrate, both the p-type electrode and the n-type electrode are formed on the upper surface, and the sapphire substrate, which is an insulator, is formed on the lower surface. Therefore, after mounting the blue LED and the green LED to the device mounting portion, the p-type electrodes of the blue LED and the green LED are connected to the metal wiring layer for the blue LED and the metal wiring layer for the green LED using the connection wiring, respectively, and the blue LED and The n-type electrodes of the green LEDs are each connected to the device mounting portion using connection wiring. Here, the connection wiring uses a bonding wire.

The device mounting part connected to the aluminum substrate is wired to connect the n-type electrodes of the red LED, the blue LED, and the green LED, thereby serving as a common metal wiring 222 for the n-type electrodes of all the LED elements.

 The heat dissipation layer 260 is formed of an aluminum anodized film formed by anodizing a lower surface of the substrate. Fine grooves having irregular shapes are formed on the surface of the heat dissipation layer during anodization of aluminum. As the surface area of the surface of the heat dissipation layer is enlarged by the minute grooves, heat emitted from the LED element can be effectively discharged to the outside.

When the wire bonding of the LED elements is completed, the LED array module is completed by molding the entire surface with a plastic material.

The LED array module according to another embodiment of the present invention may anodize the substrate to form an aluminum anodized film on all surfaces of the substrate, and the aluminum anodized films formed on both surfaces of the substrate may be formed of an insulating layer and a heat dissipating layer. Each may be used.

Hereinafter, an embodiment of a manufacturing process of the LED array module according to the first embodiment of the present invention will be described with reference to FIG. 6.

First, the aluminum substrate is surface treated to carry out foreign matter treatment and planarization on the surface, and then anodized to form an alumina layer, which is an anodized film, on the surface of the aluminum substrate (step 500). At this time, the anodized film formed on the upper surface of the substrate is used as the insulating layer, the anodized film formed on the lower surface of the substrate is used as the heat radiation layer.

After etching the area where the LED elements will be mounted on the surface of the insulating layer with a laser or a drill to expose the surface of the substrate (step 510), titanium (Ti) and (Au) are sputtered on the entire surface of the substrate. Deposition in order to form a sacrificial layer (step 520).

Next, after the photoresist is deposited on the surface of the sacrificial layer, the photoresist is exposed to light, thereby removing and exposing the photoresist of the region to be the metal wiring layer and the device mounting portion, and exposing copper (Cu) to the exposed region by 10 μm and nickel. After 2 mu m (Ni) and 3 mu m of gold (Au) are sequentially deposited or electroplated, the photoresist is removed to form a metal wiring layer and an element mounting part (step 530).

Next, Ti and Au deposited on the front surface are removed, silver paste is applied to a region to be a device mounting part, and then LED devices are mounted (step 540).

Next, after the wire bonding operation (step 550), the top surface is plastic molded (step 560) to protect the module from the outside.

On the other hand, in another embodiment of the manufacturing process of the LED array module according to the present invention, by forming a metal wiring layer using a printing method, the photoresist coating process, exposure process and photomask generation process associated with the photolithography process can be omitted. Can be.

2nd Example

Hereinafter, an LED array module according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

7 is a plan view schematically illustrating an LED array module according to a second embodiment of the present invention, FIG. 8 is a cross-sectional view taken along the AA ′ direction of FIG. 7, and FIG. 9 is a BB ′ direction of FIG. 7. 10 is a cross-sectional view taken along the line, and FIG. 10 is a cross-sectional view taken along the CC ′ direction of FIG. 7.

7 to 10, the LED array module 70 according to the present embodiment is mounted on a substrate 700 having an electrical conductivity, an insulating layer 710, a device mounting unit 720, and the device mounting unit. Blue LED elements 730, metal wiring layers 740 and 742 formed on the top surface of the insulating layer, bonding wires 750 and 751 connecting the LED elements and the metal wiring layer, and heat radiation formed on the bottom surface of the substrate. A layer 760 is provided, and a fluorescent material 780 is coated on top of the blue LED device. The LED array module having the above-described configuration provides white light by the fluorescent material. Hereinafter, each of the above-described components will be described in detail, and descriptions overlapping with those of the first embodiment will be omitted.

The substrate 700 and the insulating layer 710 are the same as those of the first embodiment.

The device mounting unit 720 is a region in which blue LED devices are mounted on a surface thereof, and its characteristics are the same as those of the first embodiment.

The blue LED devices are mounted in the device mounting unit 720. The blue LED is formed of a p-type electrode and an n-type electrode on an upper surface thereof, and a sapphire substrate which is an insulator on a lower surface thereof.

The p-type electrode of each LED is wired to the metal wiring layer, and the n-type electrode is wired to the device mounting part, and a bonding wire is used for wire connection.

The device mounting portion connected to the aluminum substrate performs a function as a metal wiring 723 for all n-type electrodes of all the blue LED elements by wiring the n-type electrodes of the blue LED elements.

The fluorescent material 780 including phosphorus is coated on the wire-connected blue LED device, thereby providing white light to the LED array module according to the present embodiment. Therefore, the LED array module according to the present embodiment can be used as the lighting element for providing white light.

Although the present invention has been described above with reference to preferred embodiments thereof, this is merely an example and is not intended to limit the present invention, and those skilled in the art do not depart from the essential characteristics of the present invention. It will be appreciated that various modifications and applications which are not illustrated above in the scope are possible. For example, in the embodiment of the present invention, the material of the substrate may be variously modified to improve heat dissipation performance. And differences relating to such modifications and applications will have to be interpreted as being included in the scope of the invention as defined in the appended claims.

Since the LED array module according to the present invention has excellent heat dissipation characteristics, the LED array module may be widely used as a lighting device or a backlight unit that provides white light.

1 is a cross-sectional view of a structure in which a light emitting device array is attached to a conventional printed circuit board.

2 is a plan view schematically illustrating an LED array module according to a first embodiment of the present invention. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2, and FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG. 2.

FIG. 5 is a cross-sectional view illustrating an exemplary embodiment in which LED elements are arranged in a triangular shape in a device mounting part of the LED array module according to the first embodiment of the present invention.

6 is a flowchart sequentially illustrating a process of manufacturing the LED array module according to the first embodiment of the present invention.

7 is a plan view schematically illustrating an LED array module according to a second embodiment of the present invention. 8 to 10 are cross-sectional views taken along the A-A 'direction, the B-B' direction, and the C-C 'direction of FIG. 7, respectively.

<Explanation of symbols for the main parts of the drawings>

20, 70: LED Array Module

200, 700: Substrate

210, 710: insulation layer

220, 720: device mounting part

230: Red LED device

231: Green LED Device

232, 732: Blue LED device

240: metal wiring layer for red LED

241: metal wiring layer for green LED

242: metal wiring layer for blue LED

250, 251, 252, 253, 254, 750, 751: bonding wire

260, 760: heat dissipation layer

Claims (9)

A substrate made of a single aluminum metal layer; An insulating layer formed on an upper surface of the substrate; An element mounting part formed by etching the insulating layer to the surface of the substrate and filling the etched region with a conductive material; A red LED, a green LED, and a blue LED mounted on the upper surface of the device mounting portion; A red LED metal wiring layer, a green LED metal wiring layer, and a blue LED metal wiring layer formed by depositing and patterning a metal material on an upper surface of the insulating layer; And And a heat dissipation layer formed on the lower surface of the substrate, The heat dissipation layer is an aluminum anodic oxide film formed by anodizing a lower surface of the substrate, and characterized in that the surface of the heat dissipation layer is provided with fine grooves of irregular shape formed by anodizing process, The p-type electrodes of the red LED, the green LED, and the blue LED are connected to the metal wiring layer for the red LED, the metal wiring layer for the green LED, and the metal wiring layer for the blue LED, respectively, and the n type of the red LED, the green LED, and the blue LED. The electrodes are connected to the device mounting portion, the device mounting portion connected to the substrate is an LED array module, characterized in that the common metal wiring for the n-type electrodes. The LED array module of claim 1, wherein the red, blue, and green LEDs mounted in the device mounting unit are arranged in a line or in a triangular form. The LED array module of claim 1, wherein the n-type electrode of the red LED is directly connected to the device mounting unit without a separate connection line. A substrate made of a single aluminum metal layer; An insulating layer formed on an upper surface of the substrate; An element mounting part formed by etching the insulating layer to the surface of the substrate and filling the etched region with a conductive material; An LED device mounted on an upper surface of the device mounting part; A metal wiring layer formed by depositing and patterning a metal material on an upper surface of the insulating layer; And And a heat dissipation layer formed on the lower surface of the substrate, The heat dissipation layer is an aluminum anodic oxide film formed by anodizing a lower surface of the substrate, and characterized in that the surface of the heat dissipation layer is provided with fine grooves of irregular shape formed by anodizing process, A fluorescent material is coated on top of each LED device, n-type electrodes of each LED device are connected to the device mounting part, p-type electrodes of the LED device are connected to the metal wiring layer, and a device mounting part connected to the substrate is provided. LED array module, characterized in that the metal wiring for the n-type electrodes. 5. The LED array module of claim 4, wherein the LED element is a blue LED. delete The LED array according to any one of claims 1 to 5, wherein the insulating layer is formed of one of an aluminum nitride film (AlN), a benzocyclobutene (BCB) film, a silicon nitride film (SiN), and a polyimide film. module. The LED array module according to any one of claims 1 to 5, wherein the insulating layer is formed by anodizing the substrate. delete

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