KR100905558B1 - Apparatus for Etching - Google Patents

Abstract

The present invention provides an etching apparatus capable of independently forming circuit patterns formed on upper and lower portions of a printed circuit board by varying concentrations of etching liquids supplied to upper and lower portions of a printed circuit board, and forming fine circuit patterns. It is about.

Etch tank, etchant concentration controller, fruit water, hydrochloric acid

Description

Etching Equipment {Apparatus for Etching}

1 is a view showing an etching apparatus according to the prior art.

2 is a view showing an etching apparatus according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

2, 102a, 102b, 102c: etching tanks 4, 6, 8, 104, 106: etching bath

10, 110a, 110b: etching solution concentration controller

12, 112: fruit tank 14, 114: hydrochloric acid tank

The present invention relates to an etching apparatus, and in particular, by controlling the concentration of the etching solution supplied to the upper and lower portions of the printed circuit board, respectively, to form independently the circuit pattern formed on the upper and lower portions of the printed circuit board and fine circuit patterns It is related with the etching apparatus which can be formed.

The manufacture of printed circuit boards that drive electronics is a collection of numerous processes and as complex as the number of unit processes. In order to form a circuit which plays a key role for signal transmission in the manufacture of a printed circuit board, an etching process is necessary.

Recently, the size of via holes connecting the metal wires and the electronic devices is becoming smaller due to the tendency of light and thin, and thus a finer etching process is required.

Currently, printed circuit boards are manufactured by a subtract manufacturing method (Tending method), which forms a circuit form through exposure and development processes after laminating rolls are laminated on a substrate by heating and pressing a laminator roll. The copper foil substrate, which is partially coated with the etching resist, is etched through the etching solution to implement a circuit.

In this case, the shape of the circuit is determined by the spray pressure and amount during the etching process, the oscillation method, the shape and position of the nozzle, the concentration of the etching solution (CuCl ₂ ), the specific gravity, the fruit water (H ₂ O ₂ ), and the hydrochloric acid (HCl). .

1 is a view showing an etching apparatus according to the prior art.

Referring to FIG. 1, an etching apparatus according to the related art forms a circuit pattern on a printed circuit board using an etching tank 2 in which an etching solution CuCl ₂ is stored, and an etching solution stored in the etching tank 2. The etching tank 2 is formed by etching the surface of a printed circuit board on which a circuit pattern is formed by the first etching bath 4 and the second etching bath 6, the first etching bath 4, and the second etching bath 6. A third etching bath 8 for planarizing with the etching liquid stored in the etching liquid, an etching liquid concentration controller 10 for adjusting the etching liquid concentration in the etching tank 2, and hydrochloric acid (HCl) for adjusting the etching liquid concentration in the etching tank 2 ) And a hydrochloric acid tank (14) and a fruit tree (12) for providing fruit water (H ₂ O ₂ ).

A method of etching a printed circuit board using an etching apparatus having such a configuration will be described below.

When copper foil is laminated on both sides of the insulating layer, and a printed circuit board having a circuit shape formed by a dry film on the copper foil is introduced into the first etching bath 4, the manual valves 30a to 30n are opened and then a control unit (not shown). ) Drives the pumps 20a to 20g to supply the etching liquid stored in the etching tank 2 to the first etching bath 4, the second etching bath 6, and the third etching bath 8.

At this time, the etchant stored in the etching tank 2 is supplied to the first etching bath 4, the second etching bath 6, and the third etching bath 8 so as to be respectively supplied to the upper and lower portions of the printed circuit board.

Thereby, the etching liquid supplied from the etching tank 2 reacts with copper foil which the dry film is not laminated among copper foil laminated on both surfaces of a printed circuit board, and etches copper foil.

At this time, the etching solution reacted with the copper foil is stored in the etching tank 2 again through the drain 50.

When the etching solution reacted with the copper foil is stored in the etching tank 2, the etching solution concentration controller 10 detects the concentration of the etching solution stored in the etching tank 2, and then, in the hydrochloric acid tank 14, the concentration of the etching solution is kept constant. The stored hydrochloric acid and the fruit water stored in the fruit water tank 12 are mixed with the etching solution reacted with the copper foil.

At this time, the hydrochloric acid stored in the hydrochloric acid tank 14 and the fruit water stored in the fruit water tank 12 are controlled by a controller (not shown) with the back pressure valves 40a and 40b opened. ) And hydrochloric acid and fruit water are supplied to the etching tank (2).

As a result, the concentration of the etching liquid stored in the etching tank 2 is kept constant.

At this time, the circuit pattern is formed on the upper and lower portions of the printed circuit board by the etching liquid supplied from the first etching bath 4 and the second etching bath 6.

Then, the surface of the printed circuit board on which the circuit pattern is formed is flattened by the third etching bath 8.

As described above, in the etching apparatus according to the related art, circuit patterns are formed on upper and lower portions of a printed circuit board in which copper foil is laminated on both surfaces of the insulating layer in the first etching bath 4 and the second etching bath 6, and the third In the etching bath 8, the surface of the printed circuit board on which the circuit pattern is formed is made flat.

However, such an etching apparatus according to the related art adjusts the concentration of the etchant stored in one etching tank 2 with one etchant concentration controller 10 to supply the upper and lower portions of the printed circuit board. Not only is it difficult to independently form circuit patterns formed on the upper and lower portions, but it is difficult to realize miniaturization of the circuit patterns.

Therefore, according to the present invention, by controlling the concentration of the etching solution supplied to the upper and lower portions of the printed circuit board, the etching can be formed independently of the circuit patterns formed on the upper and lower portions of the printed circuit board, and a fine circuit pattern can be formed. It is an object to provide a device.

In order to achieve the above object, the etching apparatus according to an embodiment of the present invention to form a circuit on the upper and lower portions of the printed circuit board by etching the lower and upper copper foil of the printed circuit board, respectively, with the first and second etching liquid. Etching bath; A post etching bath for flattening the lower and upper surfaces of the printed circuit board on which the circuit is formed, with the first and second etching solutions, respectively; A first etching tank for receiving and storing a mixed etching solution of a first etching solution and a second etching solution reacted with the copper foil from the etching bath and the post etching bath; A second etching tank in which the first etching solution is stored and supplied with the mixed etching solution from the first etching tank; A third etching tank in which the second etching solution is stored and supplied with the mixed etching solution from the first etching tank; Fruit tanks for storing fruit trees; A hydrochloric acid tank in which hydrochloric acid is stored; A first etchant concentration controller for detecting a concentration of the first etchant stored in the second etching tank and adjusting the concentration of the first etchant using the fruit water and hydrochloric acid; And a second etchant concentration controller that detects a concentration of the second etchant stored in the third etching tank and adjusts the concentration of the second etchant using the fruit water and hydrochloric acid.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

2 is a view showing an etching apparatus according to an embodiment of the present invention.

Referring to FIG. 2, an etching apparatus according to an exemplary embodiment of the present invention may include a first etching bath 104 and a second etching bath, each of which forms a circuit by etching a lower and upper copper foil of a printed circuit board with a first etching solution and a second etching solution. The etching bath 106, the post etching bath 108, the first etching bath 104, and the second etching bath 106 which planarize the lower and upper surfaces of the printed circuit board on which the circuit is formed with the first and second etching solutions, respectively. ) And a first etching tank 102a for receiving and storing a mixed etching solution of the first etching solution and the second etching solution reacted with the copper foil from the post etching tank 108, and the first etching solution is stored, and the mixed etching solution from the first etching tank. The second etching tank 102b receiving the supply, the second etching solution is stored, the third etching tank 102c receiving the mixed etching solution from the first etching tank, and the fruit water tank 112 in which the fruit water H ₂ O ₂ is stored. , Hydrochloric acid (HCl) stored in the hydrochloric acid tank 114, the second etching tank The first etchant concentration controller 110a which detects the concentration of the first etchant, and adjusts the concentration of the first etchant with the fruit water and hydrochloric acid, and detects the concentration of the second etchant stored in the third etching tank to detect the concentration of the second etchant. A second etchant concentration controller 110b for adjusting the concentration of the etchant is included.

The etching apparatus according to the embodiment of the present invention, the second etching tank 102b and the third etching tank 102c and the first etching tank 104, the second etching to supply the first etching liquid and the second etching liquid Etching liquid supply pipes respectively provided between the tank 106 and the post etching tank 108, the second water supply pipes respectively provided between the second etching tank 102b and the third etching tank 102c and the fruit water tank 112, and The hydrochloric acid supply pipe, the first etching tank 104, the second etching tank 106, and the post etching tank 108 respectively provided between the second etching tank 102b and the third etching tank 102c and the hydrochloric acid tank 114. And second drains 150 respectively provided between the first etching tank 102a and the first drain 150, the first etching tank 102a and the second etching tank 102b, and the third etching tank 102c. 152).

In addition, the etching apparatus according to an embodiment of the present invention, a plurality of manual valves 130a to 130l installed in the etching solution supply pipe, a plurality of back pressure valves 140a to 140d installed in the permeate supply pipe and the hydrochloric acid supply pipe. ), A plurality of pumps 120a to 120h installed between the manual valves 130a to 130p and the manual valves 130a to 130p and between the fruit water tank 112 and the hydrochloric acid tank 114 and the rear pressure valves 140a to 140d, respectively. More).

In the first etching bath 104 and the second etching bath 106, copper foil is laminated on both surfaces of the insulating layer, and the first etching solution and the first etching bath are formed when a printed circuit board having a circuit form formed by a dry film is placed therein. 2 The etching solution is sprayed on the lower and upper portions of the printed circuit board, respectively, to etch the copper foil on which the dry film is not laminated to form a circuit.

When the printed circuit board on which the circuit is formed is introduced into the post etching bath 108, the first etching liquid and the second etching liquid are sprayed onto the lower and upper portions of the printed circuit board, respectively, to planarize the lower and upper surfaces of the printed circuit board.

In other words, the post etching bath 108 may form the first etching solution and / or the second etching solution when the circuit patterns are formed on the lower and upper portions of the printed circuit board in the first etching bath 104 and the second etching bath 106. Work to flatten the irregularities on the surface of the printed circuit board caused by the pooling.

When the first etching tank 102a is supplied with a mixed etching solution in which the first etching solution and the second etching solution are reacted with copper foil from the first etching tank 104, the second etching tank 106, and the post etching tank 108, the mixed etching solution is supplied. For example, the mixed etching solution is stored therein for more than a predetermined time, for example, after storing 5% to 50% of the capacity of the first etching tank 102a, and then, through the first drain 150, the second etching tank 102b and the third etching tank. The same amount of mixed etching solution is supplied to 102c.

To this end, the first drain 150 is provided with a valve driven by a controller (not shown) and a mixed etching solution measuring device for measuring the amount of the mixed etching solution stored in the first etching tank 102a.

Such a first etching tank 102a is formed of the second etching tank 102b and the first etching tank 104 without storing the mixed etching liquid supplied from the first etching tank 104, the second etching tank 106, and the post etching tank 108. It can also supply directly to 3 etching tank 102c.

The second etching tank 102b stores the first etching liquid for etching the copper foil under the printed circuit board, and pumps 120f to 120h to the controller (not shown) after the manual valves 130g to 130l are opened in the etching process. Is driven, the first etchant stored therein is supplied to the first etching bath 104, the second etching bath 106 and the post etching bath 108 through the etching solution supply pipe.

The third etching tank 102c stores the quenching liquid in a second for etching the copper foil on the upper portion of the printed circuit board, and the pump 120c to the controller (not shown) after the manual valves 130a to 130f are opened during the etching process. When 120e) is driven, the second etchant stored therein is supplied to the first etching bath 104, the second etching bath 106 and the post etching bath 108 through the etching solution supply pipe.

In this case, CuCl _{2, which} is the same as the first etching solution, is used, and the second etching solution has the same or different concentration as the first etching solution depending on the circuit patterns formed on the upper and lower portions of the printed circuit board.

The fruit water tank 112 stores the fruit water therein and adjusts the concentration of the mixed etching solution to the concentration of the first etching liquid or the second etching liquid through the second etching tank 102b and the third etching tank 102c through the fruit water supply pipe. ) Fruit trees.

The hydrochloric acid tank 114 stores hydrochloric acid therein and adjusts the concentration of the mixed etching liquid to the concentration of the first etching liquid or the second etching liquid through the second etching tank 102b and the third etching tank 102c through the hydrochloric acid supply pipe. Hydrochloric acid.

The first etchant concentration controller 110a detects the concentration of the first etchant stored in the second etching tank 102b and then uses the permeate and hydrochloric acid to form the first etchant at the etching solution concentration required for etching the lower copper foil of the printed circuit board. Adjust the concentration.

The second etchant concentration controller 110b detects the concentration of the second etchant stored in the third etching tank 102c and then uses the permeate and hydrochloric acid to form the first etchant at the etching solution concentration required for etching the upper copper foil of the printed circuit board. Adjust the concentration.

In the etching apparatus according to the embodiment of the present invention described above, only the first etching liquid concentration controller 110a and the second etching liquid concentration controller 110b are provided in the second etching tank 102b and the third etching tank 102c, respectively. Although shown, the first etchant concentration controller 110a and the second etchant concentration controller 110b may be provided between the first etching tank 102a, the second etching tank 102b, and the third etching tank 102c, respectively. .

In other words, the first etchant concentration controller 110a is installed in the second drain 152 between the first etching tank 102a and the second etching tank 102b so that the second etching tank in the first etching tank 102a is provided. After detecting the concentration of the mixed etching solution supplied to the 102b, if the concentration of the mixed etching solution is different from that of the first etching solution, the first fruit with the adjusted concentration after adjusting the concentration of the first etching solution by mixing the fruit water and hydrochloric acid with the mixed etching solution. Etching liquid can be supplied to the 2nd etching tank 102b.

In addition, the second etchant concentration controller 110b is provided in the second drain 152 between the first etching tank 102a and the third etching tank 102c to form a third etching tank (in the first etching tank 102a). After detecting the concentration of the mixed etching solution supplied to 102c) and the concentration of the mixed etching solution is different from the concentration of the second etching solution, the second etching solution in which the fruit water and hydrochloric acid are mixed with the mixed etching solution to adjust the concentration of the second etching solution and then the concentration is adjusted. Can be supplied to the third etching tank 102c.

As described above, the etching apparatus according to the embodiment of the present invention uses two etching solution concentration controllers to control the concentration of the etching solution supplied to the upper and lower portions of the printed circuit board, respectively. Can be implemented.

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As described above, the present invention can independently implement circuit patterns formed on the upper and lower portions of the printed circuit board by controlling the etching liquid concentrations of the upper and lower portions of the printed circuit board using two etching liquid concentration controllers, respectively. It is possible to implement a fine circuit.

Claims (6)

An etching bath for etching the lower and upper copper foils of the printed circuit board with the first etching solution and the second etching solution, respectively, to form circuits on the upper and lower portions of the printed circuit board, respectively; A post etching bath for flattening the lower and upper surfaces of the printed circuit board on which the circuit is formed, with the first and second etching solutions, respectively; A first etching tank for receiving and storing a mixed etching solution of a first etching solution and a second etching solution reacted with the copper foil from the etching bath and the post etching bath; A second etching tank in which the first etching solution is stored and supplied with the mixed etching solution from the first etching tank; A third etching tank in which the second etching solution is stored and supplied with the mixed etching solution from the first etching tank; Fruit tanks for storing fruit trees; A hydrochloric acid tank in which hydrochloric acid is stored; A first etchant concentration controller for detecting a concentration of the first etchant stored in the second etching tank and adjusting the concentration of the first etchant using the fruit water and hydrochloric acid; And And a second etching solution concentration controller which detects the concentration of the second etching solution stored in the third etching tank and adjusts the concentration of the second etching solution by using the fruit water and hydrochloric acid. The method of claim 1, The first etching tank may include the first through a drain provided between the first etching tank and the second etching tank, and between the first etching tank and the third etching tank when the mixed etching liquid is filled therein. The etching apparatus characterized by supplying the same amount of mixed etching liquid to a 2 etching tank and a 3rd etching tank. The method of claim 1, The first etching tank is disposed between the first etching tank and the second etching tank when the mixed etching liquid is filled with 5% to 50% of the first etching tank capacity, and between the first etching tank and the third etching tank. Etching apparatus characterized by supplying the same amount of mixed etching liquid to the said 2nd and 3rd etching tank through the drain provided in each. The method of claim 1, And the first etching solution and the second etching solution are composed of the same component. The method of claim 4, wherein And the first etchant and the second etchant have different concentrations. The method of claim 4, wherein And the first etchant and the second etchant have the same concentration.

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